阅读说明：本技术 清洗保护膜残留胶印的方法及用于清洗残留胶印的装置 (Method for cleaning residual offset printing of protective film and device for cleaning residual offset printing ) 是由 熊启龙 于 2020-04-10 设计创作，主要内容包括：本申请属于掩模版生产技术领域,尤其涉及一种清洗保护膜残留胶印的方法及用于清洗残留胶印的装置。本申请的清洗保护膜残留胶印的方法,通过将掩膜版水平固定,可防止掩膜版在清洗时晃动导致掩膜版损伤；再通过提供干冰清洗机,便能通过-78.5℃的干冰微细颗粒冲击作用到掩膜版上的残胶上,干冰迅速汽化,会升华过程吸收大量能量。先使残胶迅速冷冻、脆化并断裂,使残胶从粘弹态变成固态,残胶脆性增大后,粘性将减小,表面吸附力会降低。残胶断裂后,表面积会增大,在干冰的持续冲击下形成低温冷冻剥离、干冰持续压力吹扫剥离及干冰微颗粒冲击剥离等,最终残胶随干冰气流被剥离清除,且不会损伤掩膜版石英基板及表面图形。(The application belongs to the technical field of mask production, and particularly relates to a method for cleaning residual offset printing of a protective film and a device for cleaning the residual offset printing. According to the method for cleaning the residual offset printing of the protective film, the mask is horizontally fixed, so that the mask is prevented from being damaged due to shaking during cleaning; and then by providing a dry ice cleaning machine, the dry ice fine particles at the temperature of-78.5 ℃ can impact and act on the residual glue on the mask plate, the dry ice is quickly vaporized, and a large amount of energy can be absorbed in the sublimation process. The residual gum is rapidly frozen, embrittled and broken to change the residual gum from a viscoelastic state to a solid state, after the brittleness of the residual gum is increased, the viscosity is reduced, and the surface adsorption force is reduced. After the residual glue is broken, the surface area is increased, low-temperature freezing stripping, dry ice continuous pressure blowing stripping, dry ice microparticle impact stripping and the like are formed under the continuous impact of dry ice, finally the residual glue is stripped and removed along with dry ice airflow, and the quartz substrate and the surface pattern of the mask plate cannot be damaged.)

1. The method for cleaning the offset printing of the residual protective film is used for cleaning the residual adhesive on the mask plate and is characterized in that: the method comprises the following steps:

horizontally fixing the mask plate, and separating an aluminum frame on the mask plate, wherein the residual glue is remained on the mask plate after the aluminum frame is separated;

providing a dry ice cleaning machine, wherein a nozzle of the dry ice cleaning machine is arranged towards the residual glue;

and starting the dry ice cleaning machine, and moving the nozzle to clean the residual glue until the residual glue is cleaned.

2. The method for cleaning offset printing of residual protective film according to claim 1, wherein: the nozzle orientation the cull setting specifically does: the axis of the nozzle and the upper surface of the mask plate form an included angle.

3. The method for cleaning offset printing of residual protective film according to claim 2, wherein: and the included angle between the axis of the nozzle and the upper surface of the mask plate is 5-30 degrees.

4. The method for cleaning offset printing of residual protective film according to claim 1, wherein: the nozzle is a titanium alloy nozzle.

5. The method for cleaning offset printing of residual protective film according to claim 1, wherein: the nozzle orientation the cull setting still includes: the working distance between the air outlet of the nozzle and the residual glue to be cleaned is 10-50 mm.

6. The method for cleaning offset printing of residual protective film according to claim 1, wherein: moving the nozzle to clean the residual glue is specifically: the moving speed of the nozzle is 5 mm/s-50 mm/s.

7. The method for cleaning offset printing of residual protective film according to claim 1, wherein: the washing is accomplished the cull still includes: detecting whether the residual glue is remained on the mask plate;

if yes, continuing to clean until the residual glue on the mask plate is cleaned;

if not, the cleaning is not continued.

8. The method for cleaning offset printing of residual protective film according to claim 1, wherein: the horizontal fixing of the mask is specifically as follows: and providing a plurality of clamps, and respectively clamping and fixing the edges of the mask and fixing the mask.

9. A device for rinsing remain offset printing for rinse the cull on the mask version, its characterized in that: the mask plate is arranged on the plurality of fixtures, and a nozzle of the dry ice cleaning machine faces towards the mask plate.

10. The apparatus for cleaning offset residual printing according to claim 9, wherein: the nozzle is a titanium alloy nozzle.

Technical Field

The application belongs to the technical field of mask production, and particularly relates to a method for cleaning residual offset printing of a protective film and a device for cleaning the residual offset printing.

Background

A reticle (Photomask), also known as a reticle or MASK, is a pattern transfer tool or template used in microelectronic fabrication processes. The required microscopic pattern is made on the glass chromium plate through the procedures of exposure, development, etching and the like, and the method is mainly applied to microelectronic lithography. The material for making mask is chromium plate, which is hard mask material, and is chromium film base plate formed through depositing chromium-chromium oxide film on smooth and high-finish glass base plate via DC magnetically controlled sputtering and coating one layer of photoresist. Finally, the chromium film layer is manufactured into a required pattern on the glass substrate through the procedures of exposure, development, etching, demoulding and the like.

When the mask is used (exposed), due to the focusing effect of light, the dust with the same height as the chromium layer pattern can generate a shading effect as the pattern, so that corresponding defects are generated on a terminal product when the pattern is transferred. And the dust with the height different from that of the chromium layer graph has greatly reduced influence on the manufactured product due to the defocusing effect of light. Therefore, the quartz mask is generally adhered with a protective film to protect the chromium layer pattern from being influenced by dust. However, according to different requirements of actual use, the protective film also needs to be taken down, but the residual glue is remained on the mask plate by the protective film, and the residual glue is not easy to remove.

Disclosure of Invention

An object of the application is to provide a method for cleaning residual offset printing of a protective film, and the technical problem that the residual adhesive on a mask in the prior art is not easy to remove is solved.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: a method for cleaning residual offset printing of a protective film is used for cleaning residual offset printing on a mask plate and comprises the following steps:

s01: horizontally fixing the mask plate, and separating an aluminum frame on the mask plate, wherein the residual glue is remained on the mask plate after the aluminum frame is separated;

s02: providing a dry ice cleaning machine, wherein a nozzle of the dry ice cleaning machine is arranged towards the residual glue;

s03: and starting the dry ice cleaning machine, and moving the nozzle to clean the residual glue until the residual glue is cleaned.

In one embodiment, the nozzle is arranged towards the cull specifically as follows: the axis of the nozzle and the upper surface of the mask plate form an included angle.

In one embodiment, an included angle between the axis of the nozzle and the upper surface of the mask is 5-30 degrees.

In one embodiment, the nozzle is a titanium alloy nozzle.

In one embodiment, the disposing the nozzle toward the cull further comprises: the working distance between the air outlet of the nozzle and the residual glue to be cleaned is 10-50 mm.

In one embodiment, moving the nozzle to clean the residual glue is specifically: the moving speed of the nozzle is 5 mm/s-50 mm/s.

In one embodiment, said cleaning said cull further comprises: detecting whether the residual glue is remained on the mask plate;

if yes, continuing to clean until the residual glue on the mask plate is cleaned;

if not, the cleaning is not continued.

In one embodiment, the horizontally fixing the mask is specifically as follows: and providing a plurality of clamps, and respectively clamping and fixing the edges of the mask and fixing the mask.

The beneficial effect of this application: according to the method for cleaning the residual offset printing of the protective film, the mask is horizontally fixed, so that the mask is prevented from being damaged due to shaking during cleaning; and then by providing a dry ice cleaning machine, the dry ice fine particles at the temperature of-78.5 ℃ can impact and act on the residual glue on the mask plate, the dry ice is quickly vaporized, and a large amount of energy can be absorbed in the sublimation process. The residual gum is rapidly frozen, embrittled and broken to change the residual gum from a viscoelastic state to a solid state, after the brittleness of the residual gum is increased, the viscosity is reduced, and the surface adsorption force is reduced. After the residual glue is broken, the surface area is increased, low-temperature freezing stripping, dry ice continuous pressure blowing stripping, dry ice microparticle impact stripping and the like are formed under the continuous impact of dry ice, finally the residual glue is stripped and removed along with dry ice airflow, and the quartz substrate and the surface pattern of the mask plate cannot be damaged.

The embodiment of the application further provides a device for cleaning residual offset printing for cleaning the residual glue on the mask plate, including the operation panel, locate a plurality of anchor clamps on the operation panel and locate the dry ice cleaning machine on the operation panel, the mask plate is located a plurality of on the anchor clamps, the nozzle orientation of dry ice cleaning machine the mask plate sets up.

In one embodiment, the nozzle is a titanium alloy nozzle.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a method for cleaning residual offset printing of a protective film according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1 are exemplary and intended to be used to illustrate the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The protective film generally has three layers, which are a resin film, an aluminum frame and a sealant in sequence from top to bottom. The frame glue is divided into two types: the first type is that polyethylene foam is used as a supporting material of frame glue, and acrylic glue is coated on the upper and lower surfaces of the frame glue to be bonded with a bonding surface. The second type is wholly in the shape of an adhesive tape, the adhesive tape has high internal viscosity, and the outside is adhered to the surface of the mask plate and the surface of the aluminum frame. And the second type can reduce the viscosity of the frame glue by a heating mode. The adhesive strength of the two rubber frames is high. The protective film is removed by a physical method, the aluminum frame is lifted down by a tool, and a large amount of residual glue which is difficult to remove is remained on the surface of the mask plate. Generally, a cleaning method of dissolving an organic solvent and then wiping is adopted, the method uses more organic solvent, the adhesive force of the residual frame glue is very strong, and wiping and cleaning are very time-consuming and labor-consuming. Therefore, the residual offset printing method for cleaning the protective film can be used for efficiently removing the residual offset.

As shown in fig. 1, an embodiment of the present application provides a method for cleaning an offset printing of a residual of a protection film, which is used for cleaning the offset printing of the residual of a mask, and includes the following steps: s01: horizontally fixing the mask, specifically, fixing the mask by using a tool, separating an aluminum frame on the mask, detaching the aluminum frame by using a special tool, and after the aluminum frame is separated, remaining residual glue, namely the frame glue residue, is left on the mask; s02: providing a dry ice cleaning machine, wherein a nozzle of the dry ice cleaning machine is arranged towards the residual glue, and preferably, cleaning can be started from the edge area of the mask, which is not limited only herein; s03: starting the dry ice cleaning machine, moving the nozzle to clean the residual glue until the cleaning is finished,

in one embodiment, the nozzle can be a movable nozzle on the dry ice cleaning machine, the nozzle can also be moved by moving the dry ice cleaning machine, of course, the dry ice cleaning machine and the nozzle can also be fixed, and the nozzle can be moved to clean the residual glue in all directions by adopting a mode of moving the clamp.

According to the method for cleaning the residual offset printing of the protective film, the mask is horizontally fixed, so that the mask is prevented from being damaged due to shaking during cleaning; and then by providing a dry ice cleaning machine, the dry ice can impact the residual glue on the mask plate through dry ice fine particles at the temperature of-78.5 ℃, the dry ice can be quickly vaporized, and a large amount of energy can be absorbed in the sublimation process. During this process, the vaporized dry ice rapidly freezes, embrittles, and fractures the gum residue, changing it from a viscoelastic state to a solid state. When the brittleness of the residual gum is increased, the viscosity is reduced, and the surface adsorption force is reduced. And when the residual glue is further broken, the surface area is increased, low-temperature freezing stripping, dry ice continuous pressure blowing stripping, dry ice microparticle impact stripping and the like are formed under the continuous impact of dry ice, and finally the residual glue is stripped and removed along with dry ice airflow without damaging the quartz substrate and the surface pattern of the mask.

In one embodiment, the positioning of the nozzle towards the cull is embodied as: the axis of the nozzle and the upper surface of the mask plate form an included angle. The axis of the nozzle is arranged to form an included angle with the upper surface of the mask plate, specifically, the nozzle is inclined, so that the residual glue can be prevented from being knocked away by dry ice airflow sprayed by the nozzle, and the splashed residual glue is prevented from blocking the nozzle.

In one embodiment, the included angle between the axis of the nozzle and the upper surface of the mask is 5-30 degrees. The included angle is set to be between 5 degrees and 30 degrees, so that the residual glue can be further blown away, and the splashing residual glue is prevented from influencing normal work.

In one embodiment, the nozzle is a titanium alloy nozzle. The titanium alloy has the characteristics of high strength, good corrosion resistance, high heat resistance and the like, and particularly, the titanium alloy can still maintain the mechanical property at low temperature and ultralow temperature, so that the nozzle can keep a better working state for a long time.

In one embodiment, disposing the nozzle toward the cull further comprises: the working distance between the air outlet of the nozzle and the residual glue to be cleaned is 10 mm-50 mm. The working distance between the air outlet of the nozzle and the residual glue to be cleaned is limited, so that the residual glue can be rapidly frozen, embrittled and broken by the dry ice airflow, and the cleaning effect of the dry ice cleaning machine is guaranteed.

In one embodiment, moving the nozzle to clean the residual glue is embodied as: the moving speed of the nozzle is 5 mm/s-50 mm/s. By setting the moving speed of the nozzle to less than 50mm/s, the nozzle is made to move at a speed of less than 50mm/s

In one embodiment, the cleaning the residual glue further comprises: detecting whether residual glue remains on the mask plate; if yes, continuing to clean until the residual glue on the mask plate is cleaned; if not, the cleaning is not continued.

In one embodiment, the horizontally fixing of the mask is specifically as follows: and providing a plurality of clamps, wherein the plurality of clamps respectively clamp and fix the edge of the mask and fix the mask. Through setting up a plurality of anchor clamps, can be fixed the mask version, prevent that the mask version can remove after the air current that receives the nozzle, and then guarantee the mask version can be washd completely to guarantee cleaning performance.

The embodiment of the application further provides a device for cleaning residual offset printing, which is used for cleaning residual glue on a mask plate, and comprises an operation table, a plurality of fixtures arranged on the operation table and a dry ice cleaning machine arranged on the operation table, wherein the mask plate is arranged on the fixtures, and a nozzle of the dry ice cleaning machine is arranged towards the mask plate. Through setting up anchor clamps on operation panel and the operation panel for anchor clamps can fix the mask version, and rethread dry ice cleaning machine washs the cull on the mask version, makes

In one embodiment, the nozzle is a titanium alloy nozzle. The titanium alloy has the characteristics of high strength, good corrosion resistance, high heat resistance and the like, and particularly, the titanium alloy can still maintain the mechanical property at low temperature and ultralow temperature, so that the nozzle can keep a better working state for a long time.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.