阅读说明：本技术 界面材料层及界面材料层的制作方法 (Interface material layer and manufacturing method thereof ) 是由 王磊 李培柳 于 2018-08-24 设计创作，主要内容包括：本发明一方面提供了一种界面材料层(10),包括基层(12)和与基层(12)连接的多个锥体结构(14),其中,锥体结构(14)的顶部(16)具有圆角(18)且底部(20)与基层(12)形成倒角(22)。本发明还提供了一种界面材料层(10)的制作方法。本发明的目的在于至少实现提升界面材料的抗冲击与抗拉伸的性能。(The invention provides an interface material layer (10) which comprises a base layer (12) and a plurality of cone structures (14) connected with the base layer (12), wherein the top parts (16) of the cone structures (14) are provided with round corners (18) and the bottom parts (20) form a chamfer (22) with the base layer (12). The invention also provides a manufacturing method of the interface material layer (10). The invention aims to at least improve the impact resistance and tensile resistance of the interface material.)

1. An interface material layer (10), comprising: a base layer (12) and a plurality of pyramidal structures (14) connected to the base layer (12), wherein the top (16) of the pyramidal structures (14) have rounded corners (18) and the bottom (20) forms a chamfer (22) with the base layer (12).

2. The interface material layer (10) of claim 1, wherein the pyramidal structures (14) have a central axis (L) perpendicular to the surface of the base layer (12), wherein a cross-section of the pyramidal structures (14) perpendicular to the central axis (L) decreases in a direction from the bottom (20) to the top (16).

3. The interface material layer (10) of claim 1, wherein the height of all of the pyramidal structures (14) is equal, and the spacing between adjacent pyramidal structures (14) is equal to form a dot-like array.

4. The interface material layer (10) of claim 1, wherein the base layer (12) is the same material as the pyramidal structure (14) and is integrally formed.

5. The interface material layer (10) of claim 1, wherein the base layer (12) is a different material than the pyramidal structures (14), and the pyramidal structures (14) are formed on the base layer (12).

6. A method of making an interface material layer (10), comprising: forming a base layer (12) having a plurality of pyramidal structures (14) on a surface thereof, wherein a top portion (16) of the pyramidal structures (14) has a rounded corner (18) and a bottom portion (20) forms a chamfer (22) with the base layer (12).

7. The method of manufacturing according to claim 6, further comprising:

stamping a mold using a dot matrix machine having a needle tip of the same shape as the plurality of pyramidal structures (14) to form a cavity of the plurality of pyramidal structures (14) in the mold; and

the material to be shaped is introduced into the mould and cured to form the substrate (12).

8. The method of manufacturing according to claim 6, further comprising:

spraying liquid drops of the same material as the base layer (12) on the surface of the base layer (12), and cooling and solidifying to form the plurality of cone structures (14).

9. The method of manufacturing according to claim 6, further comprising:

dispersing particles which are the same as the material of the base layer (12) on the surface of the base layer (12) and heating to melt the particles;

solidifying the fused particles fused with the surface of the base layer (12) to form the plurality of pyramidal structures (14).

10. The method of making as defined in claim 6, wherein the pyramidal structure (14) has a central axis (L) perpendicular to a surface of the substrate (12), and forming the substrate (12) further comprises: such that a cross-section of the pyramidal structure (14) perpendicular to the central axis (L) decreases in a direction from the bottom (20) to the top (16).

Technical Field

The invention relates to the field of material interface design, in particular to an interface material layer and a manufacturing method of the interface material layer.

Background

The interface material has different excellent performances of water resistance, hydrophobicity, high flexibility, high hardness, stable chemical property and the like, and is widely applied to various fields including biological, aerospace, chemical, navigation and other fields, such as application in flexible electronic devices, thin film batteries, biomedical engineering, protective interfaces and the like. In the natural environment, the working environment of the interface materials is complex and various, such as rain wash, hail impact, continuous impact friction of small particulate matters in the air and the like, and the interface materials are often subjected to the effects of impact load and tensile load.

However, the mechanical properties of the existing interface material in the aspects of impact resistance and tensile resistance are poor. The nanostructures on the surface of many interface materials can cause peeling failure due to excessive stress or strain during impact, and even some interface materials can cause failure due to excessive strain caused by lateral stretching. The current situation that most interface materials are short in service life and high in value is caused.

For example, the super-hydrophobic interface materials prepared at present often face the problem of surface nanostructure shedding. The reason for this problem is that the nano-structure on the surface of the super-hydrophobic material generates stress concentration when an external object impacts the surface of the super-hydrophobic material. Likewise, other interface materials also face such problems. Thus, there is a need to improve the impact and tensile properties of interface materials.

Disclosure of Invention

In view of the problems in the related art, an object of the present invention is to provide an interface material layer and a method for manufacturing the interface material layer, so as to at least improve the impact resistance and the stretch resistance of the interface material.

To achieve the above object, an aspect of the present invention provides an interface material layer, including: the base layer and a plurality of cone structures connected with the base layer, wherein the top of the cone structures is provided with a round angle and the bottom of the cone structures forms a chamfer angle with the base layer.

According to one embodiment of the invention, the pyramidal structures have a central axis perpendicular to the surface of the substrate, wherein the cross-section of the pyramidal structures perpendicular to the central axis decreases in the direction from the bottom to the top.

According to one embodiment of the invention, the height of all pyramidal structures is equal, and the spacing between adjacent pyramidal structures is equal to form a point-like array.

According to one embodiment of the invention, the base layer is made of the same material as the pyramidal structure and is integrally formed.

According to one embodiment of the invention, the base layer is of a different material than the pyramidal structures, and the pyramidal structures are formed on the base layer.

According to another aspect of the present invention, there is provided a method for manufacturing an interface material layer, including: and forming a base layer with a plurality of cone structures on the surface, wherein the top of each cone structure is provided with a round angle, and the bottom of each cone structure and the base layer form a chamfer angle.

According to an embodiment of the present invention, further comprising: punching the die by using a dot matrix machine with a needle point which has the same shape as the plurality of cone structures to form a plurality of cavities of the cone structures in the die; and adding the material to be molded into the mold and curing to form the base layer.

According to an embodiment of the present invention, further comprising: and spraying liquid drops which are the same as the base material on the surface of the base layer, and cooling and solidifying to form a plurality of cone structures.

According to an embodiment of the present invention, further comprising: dispersing particles which are the same as the base material on the surface of the base layer, and heating and melting the particles; solidifying the fused particles fused with the surface of the base layer to form a plurality of pyramidal structures.

According to one embodiment of the invention, the pyramidal structure has a central axis perpendicular to the surface of the base layer, and forming the base layer further comprises: so that the cross-section of the pyramidal structure perpendicular to the central axis decreases in the direction from the bottom to the top.

The invention has the beneficial technical effects that:

in the interface material layer and the method for manufacturing the interface material layer of the present invention, a plurality of pyramidal structures are provided on the surface of the interface material. When the material is stretched, the chamfer angle of the cone structure can effectively absorb external energy; when the material is impacted, the cone structure reduces the mechanical energy of an impact object by bending deformation. The stress concentration phenomenon on the interface is avoided, the impact resistance and the tensile resistance of the interface material are improved, and the service life of the interface material is prolonged.

In addition, the preparation method of the interface material layer provided by the invention has the advantages of lower required preparation conditions, short preparation period and high repeatability, thereby realizing large-scale production.

Drawings

FIG. 1 is a schematic cross-sectional view of one embodiment of the present invention;

FIG. 2 is a scanning electron microscope view of one embodiment of the present invention;

FIG. 3 is a scanning electron micrograph of a single pyramidal volume of the embodiment shown in FIG. 2;

FIG. 4 is a graph comparing experimental data for one embodiment of the present invention;

FIG. 5A is a scanning electron micrograph of one embodiment of the present invention;

FIG. 5B is a partially enlarged SEM image of the embodiment shown in FIG. 5A.

Detailed Description

The invention will be further elucidated with reference to the drawing. Fig. 1 and 2 illustrate an interface material layer 10 according to one embodiment of the present invention, which includes a base layer 12 and a plurality of pyramidal structures 14 connected to the base layer 12. Wherein the top 16 of the pyramidal structure 14 has rounded corners 18 and the bottom 20 forms a chamfer 22 with the base layer 12. In other words, pyramidal structure 14 is in smooth-transition connection with base layer 12.

In an embodiment of the present invention, and with particular reference to FIG. 3, the pyramidal structure 14 has a central axis L that is perpendicular to the surface of the substrate 12. That is, the pyramidal structures 14 are axisymmetrically distributed about a perpendicular line L from their apex to the surface of the base layer 12. The pyramidal structure 14 is a variable cross-section structure having a cross-section perpendicular to the central axis L that decreases in a direction from the base 20 to the tip 16. Thus, when the interface material layer 10 is viewed from a direction parallel to the central axis L, i.e., from a top view of the interface, a projection having a plurality of pyramidal structures 14 on the surface of the base layer 12 can be seen. Wherein preferably the projection of pyramidal structures 14 onto the surface of base layer 12 is circular or elliptical.

In a preferred embodiment of the invention, all pyramidal structures 14 are of equal height. The adjacent pyramidal structures 14 are equally spaced, thus forming a point-like array. It will be appreciated that the pyramidal structures 14 may be provided at different heights, and the spacing between adjacent pyramidal structures 14 may vary, depending on various manufacturing requirements, and the invention is not limited in this respect. The height of the pyramidal structures 14, the spacing between adjacent pyramidal structures 14, and the size of the cross-section of the pyramidal structures 14 may be adjusted, particularly by experimentation or simulation.

With continued reference to the embodiment shown in fig. 2 and 3, the base layer 12 and the pyramidal structures 14 are preferably formed of the same material and are preferably integrally formed. I.e. there is no boundary between the base layer 12 and the pyramidal structure 14. According to another embodiment, base layer 12 and pyramidal structures 14 can be of different materials, and pyramidal structures 14 are formed on base layer 12.

The new-structure film having the interface material layer 10 in the above-described embodiment of the present invention was compared with a conventional blank film through experiments:

wherein, the initial conditions are the same when the two are compared, the two are made of the same material, and the length and the width of the two are both set to be 30mm by 10 mm. Three groups of stretching experiments with different stretching objects are respectively carried out, wherein the stretching objects are respectively: a conventional blank film with a thickness of 1mm, a conventional blank film with a thickness of 2mm, and a new structure film with a thickness of 1 mm. Specifically, a data comparison plot 100 for three experiments is shown in fig. 4.

Experiment one: when a conventional blank film having a thickness of 1mm is stretched, the film is broken at a stretching area ratio of 140%. That is, when the area of the conventional blank film having a thickness of 1mm is extended to 140% of the original area, the film is broken. The tensile strength at break was about 8.3N.

Experiment two: when a conventional blank film having a thickness of 2mm is stretched, the film is broken at a stretching area ratio of 183%. That is, when the area of the conventional blank film having a thickness of 2mm is expanded to 183% of the original area, the film is broken. The tensile strength at break was higher than that of experiment one.

Experiment three: a film of a new structure having a thickness of 1mm was stretched, and when the stretched area ratio was 183%, the film was broken. That is, when the surface area of the 1mm thick new structure film is extended to 183% of the original area, the film is broken. When the break occurred, the tensile strength exceeded that of experiment two.

As can be seen from experiments, the interface material layer 10 of the present invention optimizes the tensile properties of the film.

In addition, the impact of the interface material layer 10 of the present invention on the impact resistance of the interface material was also tested. Three groups of films with the same composition material are arranged for the experiment under the impact of the steel ball. One group is that a layer of nano-structure layer is directly prepared on a film, and the nano-structure layer is split and falls off under the impact of a steel ball. The second group is that a layer of flexible square column structure is prepared on a film, a layer of nano-structure layer is prepared on the square column, and the bottom of the nano-structure layer is seriously dropped under the impact of a steel ball. The third group is that the interface material layer 10 provided by the invention is prepared on the film, and then a layer of nano-structure layer is prepared on the interface material layer 10, and the nano-structure layer is not damaged under the impact of the steel ball. The interface material layer 10 of the present invention optimizes the impact resistance of the film.

In one embodiment of the present invention, and with particular reference to fig. 5A and 5B, a layer of interface material 10 is disposed on the surface of the fibrous material. In practical applications, the fibers having the interface material 10 of the present invention disposed on the surface thereof have significantly improved stretch resistance and fracture resistance compared to the fibers of the blank surface. Therefore, the interface material layer of the present invention can also optimize the mechanical properties of the fiber material or the linear structure (material) such as tensile, compression bending and torsion resistance.

The interface material layer 10 of the present invention is suitable for both metallic and non-metallic materials. In a preferred embodiment of the present invention, the interface material layer 10 of the present invention may be provided in a pipe structure. For example, the interface material layer 10 is formed on the inner and outer walls of the pipe to improve the pressure resistance of the pipe. The chamfer 22 of the interface material layer 10 on the inner wall of the pipeline can partially absorb the mechanical energy of impact of fluid in the pipeline on the pipe wall, thereby enhancing the scouring resistance and the corrosion resistance of the pipeline.

In practical production applications, the interface material layer 10 of the present invention can be disposed on the surface of various materials, structures or their combination. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention.

Specifically, in one example, the pyramidal volume 14 in one embodiment of the present invention is modeled using mechanical software for simulation. And loading a bending load on the model, and observing an experimental result. The results of the simulation experiments show that the cone structure 14 does not generate stress concentration at the bottom 20 when subjected to complex loads, and the bottom 20 does not deform greatly.

The present invention also provides a method of making an interface material layer 10, including forming a base layer 12 having a plurality of pyramidal structures 14 on a surface thereof. Specifically, the top 16 of the pyramidal structure 14 has rounded corners 18 and the bottom 20 forms a chamfer 22 with the base layer 12.

In one embodiment of the present invention, the method further comprises stamping the mold using a dot matrix machine. The pin-pointing machine has a tip that is the same shape as the plurality of pyramidal structures 14 so that cavities of the plurality of pyramidal structures 14 can be formed in the mold. And adding the material to be molded into a mold, and curing to obtain the base layer 12 with a plurality of cone structures 14 on the surface.

In a preferred embodiment of the invention, the mould is embodied as a polymer plate. And (3) sticking the polymer plate to a dot matrix table of a dot matrix machine by using a double-faced adhesive tape, wherein the dot matrix machine is provided with a needle point in a circular shape. And setting the punching depth required to be produced in the dot matrix machine, and setting the interval of dot matrix of the dot matrix machine to start dot matrix. And after the dot matrix is finished, closing the dot matrix machine, and taking down the polymer plate for later use.

A film having the interface material layer 10 of the present invention was then prepared: taking down the polymer plate with the dot array, placing the polymer plate in a bearing box, preparing a solution of silicone rubber and a curing agent in a mass ratio of 50:1 to 2:1, and pouring the silicone rubber solution into the polymer plate. Removing bubbles in the silica gel solution by vacuum pumping, and heating and curing the polymer plate with the silica gel solution in a forced air oven for 0.5-24 hours at the heating temperature of 30-100 ℃. The curing is completed to obtain a silicone film having a plurality of pyramidal structures 14.

In other embodiments of the present invention, the mold may be a template, and the material to be formed includes a non-metal solution and a metal melt. Pouring the material to be molded into the template, and removing air bubbles in the material to be molded before curing. Wherein, the nonmetal comprises materials such as high polymer materials and fibers, and the mould also comprises various forms such as a casting mould.

In addition, the material to be formed may also comprise a solid material, and the die comprises a forging die. And forging the solid material to be formed by using a forging die to obtain the base layer 12 with a plurality of cone structures 14. It is understood that the material to be formed and the mold have various options and can be combined in various ways according to the actual production requirements. The above are only preferred embodiments of the present invention and do not limit the present invention.

In other embodiments of the present invention, droplets of the same material as the substrate 12 may be sprayed on the surface of the substrate 12 and solidified under reduced temperature, so as to form a plurality of pyramidal structures 14 on the substrate 12. For example, small droplets of the same metal may be melted and sprayed onto the surface of the metal material, followed by cooling and solidification. A plurality of cone structures 14 with chamfers are formed on the surface of the metal material, so that the mechanical property of the metal material is effectively improved.

In another embodiment of the present invention, particles of the same material as the base layer 12 may be dispersed on the surface of the base layer 12 and melted by heating. The fused particles that fuse with the surface of the base layer 12 are then solidified to form a plurality of pyramidal structures 14. For example, a plurality of pyramidal structures 14 can be formed on the surface of a metal material by dispersing small metal particles in a millimeter-micron scale on the surface of the metal material, melting at a high temperature, and then cooling and solidifying. It is understood that the mechanical properties of the inorganic non-metallic materials, including but not limited to polymer materials and fibers, can be improved by similar methods.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.