Input/output circuit for solid-state relay and solid-state relay

文档序号:1415514 发布日期:2020-03-10 浏览:19次 中文

阅读说明:本技术 一种用于固态继电器的输入输出电路及固态继电器 (Input/output circuit for solid-state relay and solid-state relay ) 是由 郭建章 赵笃良 刘理想 龚晶晶 任强 张超群 杨俊� 韦跃武 文仁俊 于 2018-08-30 设计创作,主要内容包括:本发明公开了一种用于固态继电器的输入输出电路及固态继电器,该继电器具有负载能力强、可靠性高、绝缘电阻高、过负载能力强、可靠性高、耐盐雾能力强;具有控制速度快,驱动能量需求少;外形尺寸设计为21.8mm×12.8mm×10mm,使本发明所提供的固态继电器具有结构紧凑,体积小巧,重量轻,重量小于8g;在体积和重量条件限制下,保证了输出电阻小、自身功耗低、以及输出功率大。(The invention discloses an input/output circuit for a solid-state relay and the solid-state relay, wherein the relay has the advantages of strong load capacity, high reliability, high insulation resistance, strong overload capacity, high reliability and strong salt mist resistance; the control speed is high, and the driving energy requirement is low; the overall dimension is designed to be 21.8mm multiplied by 12.8mm multiplied by 10mm, so that the solid-state relay provided by the invention has the advantages of compact structure, small volume, light weight and weight less than 8 g; under the limitation of volume and weight, the small output resistance, low self power consumption and large output power are ensured.)

1. An input circuit for a solid state relay, characterized by: the input circuit comprises a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a first diode D1, a second diode D2, a third diode D3, a first triode V1, a second triode V4 and a transformer T1, wherein the first resistor R1 and the resistor R2 are connected between the positive electrode and the negative electrode of an input power supply in series, and the first diode D1 is connected between the first resistor R1 and the positive electrode of the input power supply in series; a base of the first transistor V1 is connected to one end of the first resistor R1 connected to the second resistor R2, the first capacitor C1 is connected in series between a cathode of the first diode D1 and a base of the first transistor V1, the second capacitor C2 is connected in series between a base of the first transistor V1 and an emitter of the first transistor V1, and the third capacitor C3 is connected in series between a collector of the first transistor V1 and an emitter of the first transistor V1; the emitter of the first triode V1 is also connected with the negative electrode of the power supply through the third resistor R3; the collector of the first triode V1 is connected with one end of the primary coil of the transformer T1, and the other end of the primary coil of the transformer T1 is connected with the cathode of the first diode D1; one end of the secondary winding of the transformer T1 is connected to the anode of the second diode D2, the fourth resistor R4 and the fourth capacitor C4 are connected in parallel between the cathode of the second diode D2 and the other end of the secondary winding of the transformer T1, the cathode of the second diode D2 is also connected to the base of the second transistor V2 and the anode of the third diode D3, the cathode of the third diode D3 is connected to the emitter of the second transistor V2, and the collector of the second transistor V2 is connected to the other end of the secondary winding of the transformer T1; the emitter of the second triode V2 is used as the positive output end of the input circuit, and the collector of the second triode V2 is used as the negative output end of the input circuit.

2. An output circuit for a solid state relay, characterized by: the output circuit comprises a third triode V3, a fourth triode V4, a first voltage-stabilizing diode D4 and a second voltage-stabilizing diode D5, wherein the anode and the cathode of the first voltage-stabilizing diode D4 are respectively used as input ends of the input circuit, and the second voltage-stabilizing diode D5 is connected in parallel to two ends of the first voltage-stabilizing diode D4; the cathode of the second zener diode D5 is connected to the gate of the third transistor V3 and the gate of the fourth transistor V4, the anode of the second zener diode D5 is connected to the source of the third transistor V3 and the source of the fourth transistor V4, and the drain of the third transistor V3 and the drain of the fourth transistor V4 are used as the output terminals of the output circuit.

3. A solid state relay characterized by: the relay comprises a base (1) and a housing (2), wherein the base (1) and the housing (2) form a sealed cavity, and an input assembly and an output assembly are installed in the sealed cavity; the input assembly comprises a circuit board A (3) provided with the input circuit of claim 1, a first copper core iron nickel cobalt sealed alloy leading-out terminal (4), a second copper core iron nickel cobalt sealed alloy leading-out terminal (5) and a third copper core iron nickel cobalt sealed alloy leading-out terminal (6), wherein the anode of a first diode D1 arranged on the circuit board A (3) is connected with the first copper core iron nickel cobalt sealed alloy leading-out terminal (4), the second copper core iron nickel cobalt sealed alloy leading-out terminal (5) is connected to the negative power supply electrode on the circuit board A (3), and the third copper core iron nickel cobalt sealed alloy leading-out terminal (6) is connected to the collector electrode of a second triode V2 arranged on the circuit board A (3); the anode and the cathode of an input power supply are loaded on the input circuit through the first copper core iron nickel cobalt glass sealed alloy leading-out end (4) and the second copper core iron nickel cobalt glass sealed alloy leading-out end (5) respectively; the output assembly comprises a circuit board B (7) provided with the output circuit of claim 2, a fourth copper core iron nickel cobalt sealed alloy leading-out terminal (8) and a fifth copper core iron nickel cobalt sealed alloy leading-out terminal (9), the fourth copper core iron nickel cobalt sealed alloy leading-out terminal (8) and the fifth copper core iron nickel cobalt sealed alloy leading-out terminal (9) are respectively connected to a drain electrode of a third triode V3 and a drain electrode of a fourth triode V4 which are arranged on the circuit board B (7), and a source electrode of the third triode V3 and a source electrode of the fourth triode V4 are also connected to the third copper core iron nickel cobalt sealed alloy leading-out terminal (6).

4. A solid state relay according to claim 3, wherein: the first copper core iron nickel cobalt glass sealed alloy leading-out end (4), the second copper core iron nickel cobalt glass sealed alloy leading-out end (5), the third copper core iron nickel cobalt glass sealed alloy leading-out end (6), the fourth copper core iron nickel cobalt glass sealed alloy leading-out end (8) and the fifth copper core iron nickel cobalt glass sealed alloy leading-out end (9) are arranged on the base (1) respectively.

5. A solid state relay according to claim 3 or 4, wherein: first copper core iron nickel cobalt glass seals the alloy and draws forth end (4) second copper core iron nickel cobalt glass seals the alloy and draws forth end (5), third copper core iron nickel cobalt glass seals the alloy and draws forth end (6) fourth copper core iron nickel cobalt glass seals the alloy and draws forth end (8) and fifth copper core iron nickel cobalt glass seals the alloy and draws forth end (9) and extend the periphery of base (1) one end is overlapped respectively and is equipped with first insulator (10), second insulator (11), third insulator (12), fourth insulator (13) and fifth insulator (14).

6. A solid state relay according to claim 3 or 4, wherein: the length of the seal cavity is less than 21.8mm, the width of the seal cavity is less than 12.8mm, and the height of the seal cavity is less than 10 mm.

7. The solid-state relay according to claim 5, wherein: the length of the seal cavity is less than 21.8mm, the width of the seal cavity is less than 12.8mm, and the height of the seal cavity is less than 10 mm.

Technical Field

The present invention relates to an input circuit, an output circuit, and a solid-state relay, and more particularly, to an input circuit and an output circuit for a solid-state relay, and a solid-state relay including the input circuit and the output circuit.

Background

As an important branch of the Relay field, a Solid State Relay (SSR) is a contactless switch composed of a microelectronic circuit, discrete electronic devices, and power electronic power devices. The isolation of the control terminal from the load terminal is coupled with a photoelectric coupling or a pulse signal. The input end of the solid-state relay uses a tiny control signal to directly drive a heavy-current load.

The working principle of the solid-state relay is as follows: the single-phase SSR is a four-end active device, wherein two input control ends and two output ends are optically isolated, and the output ends can be changed from an off state to an on state after a direct current or pulse signal is added to the input ends to a certain current value.

The existing solid-state relay utilizes an input circuit to process power supply voltage and then is coupled to an output circuit to drive a load, the on-time and the off-time of the solid-state relay are faster than those of an electromagnetic relay, and a single chip microcomputer, an MCU and other devices can be directly driven by utilizing the solid-state relay.

However, the input resistance, the output resistance and the output power of the input and output circuit of the existing solid-state relay are small, so that the power consumption of the solid-state relay is improved, and the load driving capability of the solid-state relay is reduced.

Disclosure of Invention

In order to solve the problems of the prior art, an object of the present invention is to provide an input circuit for a solid-state relay, which has good stability.

It is a further object of the present invention to provide an output circuit for a solid state relay.

It is a further object of the present invention to provide a solid-state relay composed of the input circuit and the output circuit provided by the present invention, which has a small output resistance and a large output power, thereby reducing its own power consumption.

The input circuit for the solid-state relay comprises a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a first diode D1, a second diode D2, a third diode D3, a first triode V1, a second triode V4 and a transformer T1, wherein the first resistor R1 and the resistor R2 are connected in series between the positive electrode and the negative electrode of an input power supply, and the first diode D1 is connected in series between the first resistor R1 and the positive electrode of the input power supply; a base of the first transistor V1 is connected to one end of the first resistor R1 connected to the second resistor R2, the first capacitor C1 is connected in series between a cathode of the first diode D1 and a base of the first transistor V1, the second capacitor C2 is connected in series between a base of the first transistor V1 and an emitter of the first transistor V1, and the third capacitor C3 is connected in series between a collector of the first transistor V1 and an emitter of the first transistor V1; the emitter of the first triode V1 is also connected with the negative electrode of the power supply through the third resistor R3; the collector of the first triode V1 is connected with one end of the primary coil of the transformer T1, and the other end of the primary coil of the transformer T1 is connected with the cathode of the first diode D1; one end of the secondary winding of the transformer T1 is connected to the anode of the second diode D2, the fourth resistor R4 and the fourth capacitor C4 are connected in parallel between the cathode of the second diode D2 and the other end of the secondary winding of the transformer T1, the cathode of the second diode D2 is also connected to the base of the second transistor V2 and the anode of the third diode D3, the cathode of the third diode D3 is connected to the emitter of the second transistor V2, and the collector of the second transistor V2 is connected to the other end of the secondary winding of the transformer T1; the emitter of the second triode V2 is used as the positive output end of the input circuit, and the collector of the second triode V2 is used as the negative output end of the input circuit.

A capacitor is connected in series between the base electrode-emitter electrode and the emitter electrode-collector electrode of the first triode V1 in the input circuit, the junction capacitor of the first triode V1 is neutralized, the working stability of the first diode is guaranteed, the voltage loaded on the transformer is stable, and the feedback is reduced. In addition, in the input circuit, a three-point oscillation circuit is formed by the capacitor C1, the capacitor C2, the capacitor C3, the primary side of the transformer T1 and the triode V1, so that the signal transmission and isolation functions are achieved, and the voltage division circuit is formed by the R1 and the R2.

The output circuit for the solid-state relay comprises a third triode V3, a fourth triode V4, a first voltage-stabilizing diode D4 and a second voltage-stabilizing diode D5, wherein the anode and the cathode of the first voltage-stabilizing diode D4 are respectively used as input ends of an input circuit, and the second voltage-stabilizing diode D5 is connected in parallel to two ends of the first voltage-stabilizing diode D4; the cathode of the second zener diode D5 is connected to the gate of the third transistor V3 and the gate of the fourth transistor V4, the anode of the second zener diode D5 is connected to the source of the third transistor V3 and the source of the fourth transistor V4, and the drain of the third transistor V3 and the drain of the fourth transistor V4 are used as the output terminals of the output circuit.

In addition, the diode D2 of the output circuit, the resistor R4 and the capacitor C4 form a rectification voltage stabilizing circuit for wave shaping and voltage stabilization of the isolation signal, the diode D3 and the diode V2 form a quick bleeder circuit, gate-source charges of the field effect transistors V3 and V4 can be discharged in the turn-off process, and the voltage stabilizing diodes D4 and D4 are used for protection in the structure and the production process, so that the qualification rate of products is improved, and breakdown in application is prevented.

The solid-state relay provided by the invention comprises a base and a housing, wherein the base and the housing form a sealed cavity, and an input assembly and an output assembly are arranged in the sealed cavity; the input assembly comprises a circuit board A provided with the input circuit, a first copper core iron nickel cobalt glass sealed alloy leading-out end, a second copper core iron nickel cobalt glass sealed alloy leading-out end and a third copper core iron nickel cobalt glass sealed alloy leading-out end, wherein the anode of a first diode D1 arranged on the circuit board A is connected with the first copper core iron nickel cobalt glass sealed alloy leading-out end, the second copper core iron nickel cobalt glass sealed alloy leading-out end is connected to the negative electrode of a power supply on the circuit board A, and the third copper core iron nickel cobalt glass sealed alloy leading-out end is connected to the collector electrode of a second triode V2 arranged on the circuit board A; the anode and the cathode of an input power supply are loaded on the input circuit through the first copper core iron nickel cobalt glass sealed alloy leading-out end and the second copper core iron nickel cobalt glass sealed alloy leading-out end respectively; the output assembly comprises a circuit board B provided with the output circuit, a fourth copper core iron nickel cobalt glass sealed alloy leading-out end and a fifth copper core iron nickel cobalt glass sealed alloy leading-out end, the fourth copper core iron nickel cobalt glass sealed alloy leading-out end and the fifth copper core iron nickel cobalt glass sealed alloy leading-out end are respectively connected to a drain electrode of a third triode V3 and a drain electrode of a fourth triode V4 which are arranged on the circuit board B, and a source electrode of the third triode V3 and a source electrode of the fourth triode V4 are also connected to the third copper core iron nickel cobalt glass sealed alloy leading-out end.

The solid-state relay combines the input circuit and the output circuit provided by the invention, so that the relay can provide smaller output resistance, reduce the self power consumption and provide larger output power. In addition, the solid-state relay provided by the invention has the advantages of strong load capacity, high reliability, high insulation resistance, strong overload capacity, high reliability and strong salt spray resistance; meanwhile, the system has the characteristics of high control speed, low driving energy requirement, compatibility with a computer digital control system and strong environmental adaptability.

Specifically, the first copper core iron nickel cobalt glass sealed alloy leading-out end, the second copper core iron nickel cobalt glass sealed alloy leading-out end, the third copper core iron nickel cobalt glass sealed alloy leading-out end, the fourth copper core iron nickel cobalt glass sealed alloy leading-out end and the fifth copper core iron nickel cobalt glass sealed alloy leading-out end are respectively arranged on the base.

Specifically, first copper core iron nickel cobalt glass seals the alloy and draws forth the end, second copper core iron nickel cobalt glass seals the alloy and draws forth the end, third copper core iron nickel cobalt glass seals the alloy and draws forth the end with fifth copper core iron nickel cobalt glass seals the alloy and draws forth the end and extend the periphery of base one end is overlapped respectively and is equipped with first insulator, second insulator, third insulator, fourth insulator and fifth insulator. The insulator plays an insulating role and ensures the electrical performance of the whole solid-state relay.

Specifically, the length of the sealed cavity is less than 21.8mm, the width of the sealed cavity is less than 12.8mm, and the height of the sealed cavity is less than 10 mm. The overall dimension is designed to be 21.8mm multiplied by 12.8mm multiplied by 10mm, so that the solid-state relay provided by the invention has the advantages of compact structure, small volume, light weight and weight less than 8 g; under the limitation of volume and weight, the small output resistance, low self power consumption and large output power are ensured.

The invention has the beneficial effects that: the load capacity is strong, the reliability is high, the insulation resistance is high, the overload capacity is strong, the reliability is high, and the salt spray resistance is strong; the control speed is high, and the driving energy requirement is low; the overall dimension is designed to be 21.8mm multiplied by 12.8mm multiplied by 10mm, so that the solid-state relay provided by the invention has the advantages of compact structure, small volume, light weight and weight less than 8 g; under the limitation of volume and weight, the small output resistance, low self power consumption and large output power are ensured.

Drawings

FIG. 1 is a combination diagram of an input circuit and an output circuit provided by the present invention;

fig. 2 is a bottom view of the solid state relay provided by the present invention;

fig. 3 is a schematic structural diagram of a solid-state relay input assembly provided by the present invention;

fig. 4 is a schematic structural diagram of a solid-state relay output assembly provided by the present invention;

FIG. 5 is an assembly view of the solid state relay input and output assemblies provided in the present invention;

fig. 6 is a sealing structure diagram of the solid-state relay provided by the present invention;

in the figure: 1-a base, 2-a cover, 3-a circuit board A, 4-a first copper core iron nickel cobalt glass sealed alloy leading-out end, 5-a second copper core iron nickel cobalt glass sealed alloy leading-out end, 6-a third copper core iron nickel cobalt glass sealed alloy leading-out end, 7-a circuit board B, 8-a fourth copper core iron nickel cobalt glass sealed alloy leading-out end, 9-a fifth copper core iron nickel cobalt glass sealed alloy leading-out end, 10-a first insulator, 11-a second insulator, 12-a third insulator, 13-a fourth insulator, 14-a fifth insulator, 15-a first aluminum copper transition piece, 16-a second aluminum copper transition piece, 17-380 phi aluminum wire, 18-phi 50 mu m silicon aluminum wire, 19-a first connecting piece, 20-a second connecting piece, 21-a third connecting piece, 22-a sixth copper core iron nickel cobalt glass sealed alloy leading-out end, 23-sixth insulator.

Detailed Description

The present invention will be described in detail with reference to the following embodiments in order to make the objects, features and advantages thereof more comprehensible. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.

As shown in fig. 1-6, the solution claimed herein comprises an input circuit for a solid state relay, an output circuit for a solid state relay, and a solid state relay comprising the input circuit and the output circuit.

As shown in fig. 1-6, the solid-state relay provided by the present invention includes a base 1 and a cover 2, wherein the cover 2 and the base 1 are hermetically sealed to form a sealed cavity; an input assembly and an output assembly are arranged in the sealed cavity. The input assembly comprises a circuit board A3 provided with an input circuit, a first copper core iron nickel cobalt glass sealed alloy leading-out end 4, a second copper core iron nickel cobalt glass sealed alloy leading-out end 5 and a third copper core iron nickel cobalt glass sealed alloy leading-out end 6, wherein the circuit board A3 is a double-sided copper-clad glass cloth laminated board, one end of the first copper core iron nickel cobalt glass sealed alloy leading-out end 4, one end of the second copper core iron nickel cobalt glass sealed alloy leading-out end 5 and one end of the third copper core iron nickel cobalt glass sealed alloy leading-out end 6 are fixed on the circuit board A3 in a welding mode, the other end extends out of the base 1, and the length of the extension of the other end of the base 1 is 1 mm. The input circuit arranged on the circuit board A3 comprises a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a first diode D1, a second diode D2, a third diode D3, a first triode V1, a second triode V4 and a transformer T1, wherein the first resistor R1 and the resistor R2 are connected in series between the positive electrode and the negative electrode of an input power supply, and the first diode D1 is connected in series between the first resistor R1 and the positive electrode of the input power supply; the base electrode of the first triode V1 is connected with one end of the first resistor R1 connected with the second resistor R2, the first capacitor C1 is connected between the cathode of the first diode D1 and the base electrode of the first triode V1 in series, the second capacitor C2 is connected between the base electrode of the first triode V1 and the emitter electrode of the first triode V1 in series, and the third capacitor C3 is connected between the collector electrode of the first triode V1 and the emitter electrode of the first triode V1 in series; the emitter of the first triode V1 is also connected with the negative electrode of the input power supply through a third resistor R3; the collector of the first triode V1 is connected with one end of the primary coil of the transformer T1, and the other end of the primary coil of the transformer T1 is connected with the cathode of the first diode D1; one end of the secondary coil of the transformer T1 is connected to the anode of the second diode D2; a fourth resistor R4 and a fourth capacitor C4 are connected in parallel between the cathode of the second diode D2 and the other end of the secondary coil of the transformer T1, the cathode of the second diode D2 is also connected with the base of the second triode V2 and the anode of the third diode D3, the cathode of the third diode D3 is connected with the emitter of the second triode V2, and the collector of the second triode V2 is connected with the other end of the secondary coil of the transformer T1; the emitter of the second triode V2 is used as the positive output end of the input circuit, and the collector of the second triode V2 is used as the negative output end of the input circuit. The first copper core iron nickel cobalt glass sealed alloy leading-out end 4 is connected with the anode of the first diode D1, the second copper core iron nickel cobalt glass sealed alloy leading-out end 5 is connected to the negative end of the input power supply of the input circuit, and the input power supply is loaded between the positive electrode and the negative electrode of the input circuit through the first copper core iron nickel cobalt glass sealed alloy leading-out end 4 and the second copper core iron nickel cobalt glass sealed alloy leading-out end 5.

The output subassembly of installation is including laying output circuit's circuit board B7, fourth copper core iron nickel cobalt glass sealed alloy and drawing forth end 8, fifth copper core iron nickel cobalt glass sealed alloy and drawing forth end 9, first aluminium copper transition piece 15 and second aluminium copper transition piece 16 in this solid state relay, wherein, circuit board B7 is two-sided copper-clad aluminium oxide plate, the end 8 is drawn forth to fourth copper core iron nickel cobalt glass sealed alloy and the one end of fifth copper core iron nickel cobalt glass sealed alloy is drawn forth end 9 is fixed in on circuit board A3 through welded mode, the other end extends base 1, the length that extends base 1 is 1 mm. The output circuit distributed on the circuit board B7 comprises a third triode V3, a fourth triode V4, a first voltage stabilizing diode D4 and a second voltage stabilizing diode D5, wherein the source electrode of the third triode V3 is connected with a first aluminum-copper transition sheet 15 through three phi 380-mum aluminum wires 17, the source electrode of the third triode V3 is further connected with the anode of the first voltage stabilizing diode D4 through a phi 50-mum silicon-aluminum wire 18, the drain electrode of the third triode V3 is connected with a fourth copper-core iron-nickel-cobalt-glass-sealed alloy leading-out end 8 through a first connecting sheet 19, and the grid electrode of the third triode V3 is connected with the cathode of the first voltage stabilizing diode D4 through a phi 50-mum silicon-aluminum wire 18. The source electrode of a fourth triode V4 is connected with a second aluminum-copper transition piece 16 through three phi 380 mu m aluminum wires 17, the source electrode of a fourth triode V4 is connected with the cathode of a second voltage-stabilizing tube D5 through a phi 50 mu m silicon-aluminum wire 18, the drain electrode of the fourth triode V4 is connected with a fifth copper core iron nickel cobalt glass-sealed alloy leading-out end 9 through a second connecting piece 20, and the grid electrode of the fourth triode V4 is connected with the cathode of a second voltage-stabilizing diode D5 through a phi 50 mu m silicon-aluminum wire 18. The source of the third transistor V3 and the source of the fourth transistor V4 are also connected to a third copper-core kovar pigtail 6 via a third tab 21. Wherein, the aluminum copper transition piece is used for bonding and connecting an aluminum wire with the diameter of 380 mu m. The connecting piece is made of oxygen-free copper material, has strong current-carrying capacity and is used for electrical connection.

In addition, the relay provided by the invention also comprises a sixth copper core iron nickel cobalt glass sealed alloy leading-out end 22, wherein the leading-out end has no electrical connection relation, one end of the leading-out end is welded on the circuit board B7, the other end of the leading-out end extends out of the base 1, the length of the leading-out end extending out of the base 1 is 1mm, and the leading-out end plays a role in supporting and stabilizing the circuit board B7.

The double-sided copper-clad glass cloth laminated board is positioned above the double-sided copper-clad aluminum oxide board, is assembled in a welding mode, and can be specifically installed on the base 1. The first triode V1 and the second triode V2 may be PNP triodes or NPN triodes, or the first triode V1 may be NPN, and the second triode V2 may be PNP; the third triode V3 and the fourth triode V4 adopt field effect transistors, and the specific third triode V3 and the specific fourth triode V4 adopt a P-channel enhanced VDMOS, so that the output resistance is reduced, the power consumption is reduced, the P-channel enhanced VDMOS belongs to a voltage type device, larger output current can be controlled only by smaller current, and high-power output and strong load capacity are realized. And the reliability of the product is ensured by adopting a multi-chip assembly process in the product manufacturing. The shell is processed by nickel plating, and the leading-out end is processed by gold plating, so that the salt spray resistance of the product is enhanced. The requirement of high insulation resistance is met by isolating the transformer and the ceramic copper-clad plate.

The size of the sealed cavity formed by the base 1 and the housing 2 is as follows: the length is less than 21.8mm, the width is less than 12.8mm, and the height is less than 10 mm. In addition, in the solid-state relay provided by the invention, a first copper core iron nickel cobalt glass sealed alloy leading-out terminal 4, a second copper core iron nickel cobalt glass sealed alloy leading-out terminal 5, a third copper core iron nickel cobalt glass sealed alloy leading-out terminal 6, a fourth copper core iron nickel cobalt glass sealed alloy leading-out terminal 8, a fifth copper core iron nickel cobalt glass sealed alloy leading-out terminal 9 and a sixth copper core iron nickel cobalt glass sealed alloy leading-out terminal 22 are respectively sleeved with a first insulator 10, a second insulator 11, a third insulator 12, a fourth insulator 13, a fifth insulator 14 and a sixth insulator 23 on the periphery of one end of the base 1 from which the first copper core iron nickel cobalt glass sealed alloy leading-out terminal extends. The insulator has an insulating function, and the first insulator 10, the second insulator 11, the third insulator 12, the fourth insulator 13, the fifth insulator 14 and the sixth insulator 23 are glass insulators or ceramic insulators.

In addition, the solid-state relay mark provided by the invention adopts laser marking on the top of the housing 2, and when marking is carried out, the highest working temperature is 105 ℃, the lowest working temperature is-55 ℃, the impact resistance is 1500g/0.5ms, the vibration resistance is 30g/(10 Hz-2000 Hz), the isolation capacitance is less than 10pF, the medium withstand voltage is more than 1000V, and the insulation resistance is more than 2000M omega. In addition, the base 1 and the housing 2 of the solid-state relay provided by the invention are sealed in an airtight mode, so that the problems of large and heavy volume, poor impact resistance and poor reliability of the conventional solid-state relay integral milling structure are avoided, and the use requirements in the fields of aerospace, military ships, missiles, armored weapons and the like cannot be met.

The solid-state relay provided by the invention determines the parameters of each component on the input circuit and the output circuit according to the using environment, wherein the output current of the solid-state relay provided by the invention is not less than 5Ad.c. when the solid-state relay outputs bidirectional configuration, and the output current of the solid-state relay is not less than 10Ad.c. when the solid-state relay outputs direct current configuration; the output voltages of the subminiature high-power solid-state relay in bidirectional configuration and direct-current configuration are both 80 Vd.c.; overload current is 80Ad.c. when the subminiature high-power solid-state relay is configured with direct current; the microminiature high-power solid-state relay is input from two ports, the input voltage is 5Vd.c., and the input current is 7m Ad.c.

The solid-state relay provided by the invention adopts an airtight seal, multilayer and multi-chip assembly structure, and has the advantages of small volume, light weight, strong load capacity, high reliability, high insulation resistance, strong overload capacity, high reliability and strong salt mist resistance; meanwhile, the system has the characteristics of high control speed, low driving energy requirement, compatibility with a computer digital control system and strong environmental adaptability.

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