Full-spectrum LED lamp bead

文档序号:1420274 发布日期:2020-03-13 浏览:13次 中文

阅读说明:本技术 一种全光谱led灯珠 (Full-spectrum LED lamp bead ) 是由 周建华 于 2019-12-13 设计创作,主要内容包括:本发明公开了一种全光谱LED灯珠,包括发光芯片、用于放置所述发光芯片的支架、以及用于封装所述发光芯片且能供所述发光芯片发出的光透过射出的荧光胶;所述发光芯片包括蓝光芯片和紫光芯片,所述蓝光芯片的波段为440nm~470nm,所述紫光芯片的波段为400nm~420nm;所述荧光胶由硅胶或环氧树脂胶混合荧光粉构成,所述荧光粉包括红色荧光粉、黄绿色荧光粉和蓝色荧光粉,所述红色荧光粉的激发波段为615nm~660nm,所述黄绿色荧光粉的激发波段为520nm~540nm,所述蓝色荧光粉的激发波段为445nm~455nm。本发明具有能耗低、显色指数高、亮度高,而且对人类健康和环境更加有益,更接近于太阳光的优点。(The invention discloses a full-spectrum LED lamp bead, which comprises a light-emitting chip, a bracket for placing the light-emitting chip, and fluorescent glue which is used for packaging the light-emitting chip and can be penetrated and emitted by light emitted by the light-emitting chip; the light-emitting chip comprises a blue light chip and a purple light chip, the wave band of the blue light chip is 440 nm-470 nm, and the wave band of the purple light chip is 400 nm-420 nm; the fluorescent glue is formed by mixing silica gel or epoxy resin glue with fluorescent powder, the fluorescent powder comprises red fluorescent powder, yellow-green fluorescent powder and blue fluorescent powder, the excitation wave band of the red fluorescent powder is 615-660 nm, the excitation wave band of the yellow-green fluorescent powder is 520-540 nm, and the excitation wave band of the blue fluorescent powder is 445-455 nm. The invention has the advantages of low energy consumption, high color rendering index, high brightness, and being more beneficial to human health and environment and closer to sunlight.)

1. A full-spectrum LED lamp bead is characterized by comprising a light-emitting chip, a bracket for placing the light-emitting chip, and fluorescent glue for packaging the light-emitting chip and enabling light emitted by the light-emitting chip to penetrate and be emitted;

the light-emitting chip comprises a blue light chip and a purple light chip, the wave band of the blue light chip is 440 nm-470 nm, and the wave band of the purple light chip is 400 nm-420 nm;

the fluorescent glue is formed by mixing silica gel or epoxy resin glue with fluorescent powder, the fluorescent powder comprises red fluorescent powder, yellow-green fluorescent powder and blue fluorescent powder, the excitation wave band of the red fluorescent powder is 615-660 nm, the excitation wave band of the yellow-green fluorescent powder is 520-540 nm, and the excitation wave band of the blue fluorescent powder is 445-455 nm.

2. The full-spectrum LED lamp bead of claim 1, wherein the wavelength band of the violet chip is 400 nm-410 nm.

3. The full-spectrum LED lamp bead of claim 1, wherein the wavelength band of the violet chip is 410nm to 420 nm.

4. The full-spectrum LED lamp bead of claim 1, wherein the fluorescent glue has a double-layer structure, the fluorescent glue is sequentially disposed from inside to outside with a first fluorescent glue layer and a second fluorescent glue layer, the first fluorescent glue layer is mixed with red fluorescent powder, the second fluorescent glue layer is mixed with yellow-green fluorescent powder and blue fluorescent powder, and a particle size of the red fluorescent powder is larger than particle sizes of the yellow-green fluorescent powder and the blue fluorescent powder.

5. The full-spectrum LED lamp bead of claim 4, wherein said fluorescent glue is formed by a two-time glue-filling process.

6. The full-spectrum LED lamp bead of claim 4, wherein said red phosphor is deposited on the bottom of said first phosphor layer.

7. The full-spectrum LED lamp bead as claimed in claim 4 or 6, wherein said yellow-green phosphor and blue phosphor are deposited on the bottom of said second phosphor layer.

8. The full-spectrum LED lamp bead of claim 1, wherein said light emitting chip is a flip or flip chip.

Technical Field

The invention belongs to the technical field of LED illumination, and particularly relates to a full-spectrum LED lamp bead.

Background

Led (lighting emitting diode) lighting technology is popular due to its characteristics of high light emitting efficiency, good shock and vibration resistance, high reliability, long service life, and easy adjustment, and has become a lighting technology widely used at present. However, the conventional LED light source belongs to a point light source with a narrow spectrum, the peak wavelength of the conventional LED light source is 450 to 460nm, and the difference from the sunlight spectrum is very large, and the structure of human eyes is special and the long-term living environment of human beings determines that the human eyes have the highest perception degree during sunlight reading and observation, and the light emission spectrum of the conventional LED light source needs to be close to the sunlight spectrum in order to make human eyes feel comfortable in a certain lighting environment.

The current white light LED mainly utilizes the blue light technology to cooperate with fluorescent powder to form white light. The first method is to coat a layer of yellow fluorescent powder excited by blue light on a blue LED chip, and the blue light emitted by the chip and the yellow light emitted by the fluorescent powder are complementary to form white light. One of the principle disadvantages of this scheme is that the emission spectrum of Ce3+ ion in the phosphor has no continuous spectrum property, the color rendering is poor, the color rendering index is about 65-75, and the requirement of low color illumination is difficult to satisfy; the second method is that the blue light LED chip is coated with green and red fluorescent powder, the blue light emitted by the chip is compounded with the green light and the red light emitted by the fluorescent powder to obtain white light, the color rendering property is better, the color rendering index is about 75-85 generally, and the color rendering property is improved compared with the product. The two methods have small spectrum difference and have the advantages of simple and convenient process and low cost, but the prepared white light LED has low color rendering index and low light quality, and the phenomena of low luminous efficiency and high energy consumption caused by increasing the driving current density for improving the luminous intensity are avoided. With the demand for high quality lighting, this approach is clearly not well recognized.

In recent years, a method for preparing a white light LED by exciting RGB fluorescent powder by a purple light chip is widely concerned and researched, and the white light LED prepared by the method has the advantages of high color rendering index, good color reducibility and stable and reliable product. The currently applied RGB fluorescent powder is mainly Y2O 3S: eu2+, bamgallo 17: eu2+, ZnS: cu +, Al3+, etc., but the blue powder system used therein mainly includes phosphate, silicate, halogen silicate, and the prepared blue phosphor has the disadvantages of poor matching with the violet chip and low luminous intensity.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the full-spectrum LED lamp bead is low in energy consumption, high in color rendering index and high in brightness, is beneficial to human health and environment, and is closer to sunlight.

In order to solve the technical problem, the invention provides a full-spectrum LED lamp bead which comprises a light-emitting chip, a bracket for placing the light-emitting chip, and fluorescent glue which is used for packaging the light-emitting chip and can be used for light emitted by the light-emitting chip to penetrate and emit;

the light-emitting chip comprises a blue light chip and a purple light chip, the wave band of the blue light chip is 440 nm-470 nm, and the wave band of the purple light chip is 400 nm-420 nm;

the fluorescent glue is formed by mixing silica gel or epoxy resin glue with fluorescent powder, the fluorescent powder comprises red fluorescent powder, yellow-green fluorescent powder and blue fluorescent powder, the excitation wave band of the red fluorescent powder is 615-660 nm, the excitation wave band of the yellow-green fluorescent powder is 520-540 nm, and the excitation wave band of the blue fluorescent powder is 445-455 nm.

In a preferred embodiment of the present invention, the wavelength band of the violet chip is 400nm to 410 nm.

In a preferred embodiment of the present invention, the wavelength band of the violet chip is 410nm to 420 nm.

As a preferable scheme of the present invention, the fluorescent glue has a double-layer structure, the fluorescent glue is sequentially provided with a first fluorescent glue layer and a second fluorescent glue layer from inside to outside, the first fluorescent glue layer is mixed with red fluorescent powder, the second fluorescent glue layer is mixed with yellow-green fluorescent powder and blue fluorescent powder, and a particle size of the red fluorescent powder is larger than particle sizes of the yellow-green fluorescent powder and the blue fluorescent powder.

As the preferable scheme of the invention, the fluorescent glue is formed by a two-time glue pouring process.

As a preferable embodiment of the present invention, the red phosphor is deposited on the bottom of the first phosphor layer.

As a preferable embodiment of the present invention, the yellow-green phosphor and the blue phosphor are deposited on the bottom of the second phosphor layer.

In a preferred embodiment of the present invention, the light emitting chip is a flip chip or a flip chip.

Compared with the prior art, the full-spectrum LED lamp bead has the beneficial effects that:

(1) the invention matches the blue light chip and the purple light chip in specific wave bands, such as: the blue light chip with the wave band of 440 nm-470 nm is matched with the purple light chip with the wave band of 400 nm-420 nm, so that the blue light and the purple light are excited by the fluorescent glue mixed with the red fluorescent powder, the yellow-green fluorescent powder and the blue fluorescent powder to obtain white light which is closer to the full spectrum of sunlight, the spectral components are rich, and the color rendering index can reach 98-100;

(2) the purple light chip is used as a part of the excitation light source, so that the phenomenon of reduction of the luminous efficiency caused by the fact that the blue light chip is independently used as the excitation light source to improve the luminous intensity and increase the density of the driving current can be reduced, and the energy consumption is reduced;

(3) because the chip is matched with the purple light chip with a specific waveband, ultraviolet rays can be supplemented indoors properly, more vitamin D can be generated in a human body, the incidence rate of cold can be reduced by 30%, the visual sensitivity can be improved, real color can be distinguished for people, and visual fatigue can be reduced;

(4) the fluorescent glue adopts a double-layer structure, so that blue light and purple light are refracted out by sequentially transmitting the first fluorescent glue layer mixed with red fluorescent powder with larger particle size and the second fluorescent glue layer mixed with yellow, green and blue fluorescent powder with smaller particle size, the influence between the fluorescent powder with different particle sizes and different color lights can be reduced, and the problem of the uniformity of the fluorescent powder is solved; and because the particle size of red phosphor powder is great, and the area of contact with the chip is less, and refracted blue light and purple light are less, and the blue light and the purple light that pass through are more, and the ruddiness that convert is less, so guaranteed that first fluorescence glue film can transmit blue light and purple light to second fluorescence glue film with great luminous flux, reduce the light decay, improve luminous efficiency, and luminance is high and with low costs.

(5) According to the invention, the red fluorescent powder is deposited at the bottom of the first fluorescent glue layer, and the yellow-green fluorescent powder and the blue fluorescent powder are deposited at the bottom of the second fluorescent glue layer, so that the influences of factors such as scattering and absorption of the fluorescent powder can be reduced, and the light efficiency is further improved.

Drawings

Fig. 1 is a schematic structural diagram of a full-spectrum LED lamp bead provided by the present invention.

In the figure: 1. light-emitting chip, 11, blue light chip, 12, purple light chip, 2, support, 3, fluorescent glue, 31, first fluorescent glue layer, 32, second fluorescent glue layer.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, it should be understood that the terms "central", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., used herein are used in the orientation or positional relationship indicated in the drawings, which are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be understood that the terms "mounted," "connected," and "connected" are used broadly and are defined as, for example, either fixedly connected, detachably connected, or integrally connected, unless otherwise explicitly stated or limited; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, in a preferred embodiment of the present invention, a full-spectrum LED lamp bead includes a light emitting chip 1, a support 2 for placing the light emitting chip 1, and a fluorescent glue 3 for encapsulating the light emitting chip 1 and allowing light emitted by the light emitting chip 1 to be emitted through the fluorescent glue;

the light-emitting chip 1 comprises a blue light chip 11 and a purple light chip 12, wherein the wave band of the blue light chip 11 is 440-470 nm, and the wave band of the purple light chip 12 is 400-420 nm;

the fluorescent glue 3 is formed by silica gel or epoxy resin glue mixed fluorescent powder, the fluorescent powder comprises red fluorescent powder, yellow-green fluorescent powder and blue fluorescent powder, the excitation wave band of the red fluorescent powder is 615-660 nm, the excitation wave band of the yellow-green fluorescent powder is 520-540 nm, and the excitation wave band of the blue fluorescent powder is 445-455 nm.

In the following, taking two sets of violet chip 12 and blue chip 11 with different wavebands as the excitation light sources and one set of violet chip 12 alone as the excitation light source, the comparative experiment is performed under the same other conditions, and the following results are obtained:

watch 1

Figure BDA0002316516450000051

According to the first table, the light flux Φ and the light effect η of the test 1 and the test 2 are better than those of the test 3, and the purple light chip 12 is used as the excitation light source of the test 3 alone, so that although the color rendering index Ra can be ensured to be more than 98, the light flux Φ and the light effect η still have certain defects.

Therefore, the blue light chip 11 and the purple light chip 12 are matched in specific wave bands, such as: the blue light chip 11 with the wave band of 440 nm-470 nm is matched with the purple light chip 12 with the wave band of 400 nm-420 nm, so that the white light obtained by the excitation of the blue light and the purple light through the fluorescent glue 3 mixed with the red fluorescent powder, the yellow-green fluorescent powder and the blue fluorescent powder is closer to the full spectrum of sunlight, the spectral components are rich, and the color rendering index can reach 98-100; moreover, the purple light chip 12 is used as a part of the excitation light source, so that the phenomenon that the luminous efficiency is reduced when the blue light chip 11 is independently used as the excitation light source to improve the luminous intensity and increase the driving current density can be reduced, and the energy consumption is reduced; in addition, because the chip is matched with the purple light chip 12 with a specific waveband, ultraviolet rays can be supplemented indoors properly, more vitamin D is generated in a human body, the incidence rate of cold can be reduced by 30%, the visual sensitivity can be improved, the real color can be distinguished for people, and the visual fatigue is reduced.

Illustratively, to obtain a better color rendering index Ra, the wavelength band of the violet chip 12 is preferably 400nm to 410nm, see table one above.

For example, to obtain better luminous flux Φ and luminous efficiency η, the wavelength band of the violet chip 12 is preferably 410nm to 420nm, see table one above.

Illustratively, the fluorescent glue 3 is a double-layer structure and is formed by two glue filling processes, the fluorescent glue 3 is sequentially provided with a first fluorescent glue layer 31 and a second fluorescent glue layer 32 from inside to outside, the first fluorescent glue layer 31 is mixed with red fluorescent powder, the second fluorescent glue layer 32 is mixed with yellow-green fluorescent powder and blue fluorescent powder, and the particle size of the red fluorescent powder is larger than that of the yellow-green fluorescent powder and that of the blue fluorescent powder. Therefore, the fluorescent glue 3 of the embodiment adopts a double-layer structure, so that blue light and purple light are refracted out by sequentially penetrating the first fluorescent glue layer 31 mixed with red fluorescent powder with larger particle size and the second fluorescent glue layer 32 mixed with yellow, green and blue fluorescent powder with smaller particle size, the influence between the fluorescent powder with different particle sizes and different color lights can be reduced, and the problem of the uniformity of the fluorescent powder is solved; moreover, the red phosphor has a large particle size, a small contact area with the chip, less refracted blue light and purple light, more transmitted blue light and purple light, and less converted red light, so that the first phosphor layer 31 can transmit the blue light and the purple light to the second phosphor layer 32 with a large luminous flux, the light attenuation is reduced, the light efficiency is improved, the brightness is high, and the cost is low.

It should be noted that another reason for using the mixed red phosphor as the first phosphor layer 31 is that: in the conventional phosphor mixture ratio, the amount of the red phosphor is relatively small, and the absorption of the blue light efficiency is relatively small, so that the yellow-green phosphor in the second phosphor layer 32 can better excite the efficiency of the blue light chip.

Illustratively, the red phosphor is deposited on the bottom of the first phosphor layer 31, and the yellow-green phosphor and the blue phosphor are deposited on the bottom of the second phosphor layer 32. The design can reduce the influence of factors such as scattering and absorption of the fluorescent powder, and further improve the light efficiency.

Illustratively, the light emitting chip 1 is a flip chip or a flip chip.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

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