阅读说明：本技术 电机用模制智能电源模块 (Molded intelligent power module for motor ) 是由 牛志强 徐范锡 鲁军 陈松 洪完基 沈国兵 曾小光 玛丽·简·艾琳 于 2019-09-04 设计创作，主要内容包括：本发明提供一种电机用模制智能电源模块(IPM),其具有第一、第二、第三和第四芯片基座,第一、第二、第三、第四、第五和第六晶体管,连接构件,低电压集成电路,高电压集成电路,多根引线和成型封装。第一晶体管固定在第一芯片基座。第二晶体管固定在第二芯片基座。第三晶体管固定在第三芯片基座。第四、第五和第六晶体管固定在第四芯片基座。低电压和高电压集成电路固定在连接构件。成型封装封入第一、第二、第三和第四芯片基座,第一、第二、第三、第四、第五和第六晶体管,连接构件以及低电压和高电压集成电路。该智能电源模块具有较之于比传统型智能电源模块更低的结壳热阻(R<Sub>th</Sub>JC)。(The invention provides a molded Intelligent Power Module (IPM) for a motor, which comprises a first chip base, a second chip base, a third chip base, a fourth chip base, a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a connecting component, a low-voltage integrated circuit, a high-voltage integrated circuit, a plurality of leads and a molded package. The first transistor is fixed on the first chip base. The second transistor is fixed on the second chip base. The third transistor is fixed at the third chip base. Fourth, fifth and sixth crystalsThe tube is fixed to the fourth chip base. The low-voltage and high-voltage integrated circuits are fixed to the connection member. The mold package encloses the first, second, third and fourth die pads, the first, second, third, fourth, fifth and sixth transistors, the connecting member and the low and high voltage integrated circuits. The smart power module has a lower crusting thermal resistance (R) than conventional smart power modules th JC)。)

1. A molded smart power module for a motor, comprising:

first, second, third and fourth die pads;

a first transistor fixed on the first chip base;

a second transistor fixed to the second chip pad;

a third transistor fixed to the third chip pad;

a fourth, fifth and sixth transistor fixed to the fourth chip pad;

a connecting member;

a low voltage integrated circuit fixed to the connection member; the low voltage integrated circuit electrically connects the first, second and third transistors;

a high voltage integrated circuit fixed to the connection member, the high voltage integrated circuit electrically connecting the fourth, fifth and sixth transistors;

a plurality of first leads;

a plurality of second leads;

a first dummy bar; and

a mold package enclosing the first, second, third and fourth chip pads, the first, second, third, fourth, fifth and sixth transistors, the connecting member, the low voltage integrated circuit and the high voltage integrated circuit;

wherein the plurality of first leads and the plurality of second leads are partially insert molded into the package;

wherein a plurality of first leads extend from a first side surface of the molded package;

wherein a plurality of second leads extend from a second side surface of the molded package opposite the first side surface;

wherein, the first dummy bar is embedded with most part of the molding package;

wherein the first dummy bar is electrically floated; and is

Wherein the end face of the first dummy bar is exposed to the first end face of the molding package perpendicular to the first side surface of the molding package.

2. A molded smart power module for an electric motor as recited in claim 1 further comprising first, second and third boost diodes; wherein the molded package encloses the first, second and third boost diodes.

3. A molded smart power module for an electrical machine as recited in claim 2, wherein the plurality of leads includes a first ground lead, a second ground lead and a single power lead;

wherein the connecting member electrically and mechanically connects the first ground lead and the second ground lead;

the low-voltage integrated circuit is electrically connected with the single power supply lead through a first bonding wire; and

the high voltage integrated circuit is electrically connected to the single power supply lead via a second bond wire.

4. A molded smart power module for an electrical machine as recited in claim 2, further comprising a second dummy bar,

wherein the molding package is sealed in the second dummy bar;

the second end face of the second dummy bar is exposed to the second end face of the molded package, which is opposite to the first end face of the molded package;

the first dummy bar is electrically insulated from the second dummy bar; and is

The first dummy bar and the second dummy bar are electrically insulated from the connecting member and the first, second, third and fourth chip bases.

5. The molded smart power module for an electric motor of claim 4, wherein the first die pad is a first die attach pad;

wherein the second chip base is a second die bonding pad;

wherein the third chip base is a third die bonding pad; and is

The fourth chip base is a fourth die bonding pad.

6. A molded smart power module for an electrical machine according to claim 2 further comprising a link,

wherein the molding package is sealed in the connecting rod large part;

the connecting rod end face is exposed at the second end face of the molded package, which is opposite to the first end face of the molded package;

wherein the dummy bar is electrically insulated from the connecting rod; and is

The dummy bar is electrically insulated from the connecting member and the first, second, third and fourth chip bases; and wherein the tie bars are electrically and mechanically coupled to the connection pads.

7. A molded smart power module for an electrical machine as recited in claim 6 wherein said first, second, third and fourth chip mounts are formed as metal pads patterned on a direct bond copper substrate type substrate comprising a copper bottom layer, an insulating middle layer and a copper top layer; and is

The copper top layer of the directly bonded copper substrate-based substrate comprises a connection pad, a first pad of a first chip base, a second pad of a second chip base, a third pad of a third chip base and a fourth pad of a fourth chip base.

8. A molded smart power module for an electrical machine as recited in claim 7 wherein the first chip base is electrically connected to the first phase lead via a first bond wire;

the second chip base is electrically connected with the second phase lead through a second bonding wire;

the third chip base is electrically connected with a third phase lead through a third bonding wire.

9. A molded smart power module for an electrical machine as recited in claim 7 wherein said first chip pad is electrically connected to said first phase lead;

wherein the first phase lead is directly soldered to an edge portion of the first chip pad;

the second chip base is electrically connected with the second phase lead;

wherein the second phase lead is directly soldered to the edge portion of the second chip pad;

the third chip base is electrically connected with a third phase lead; and is

Wherein the third phase lead is soldered directly to an edge portion of the third chip pad.

10. A molded smart power module for an electrical machine as recited in claim 2, wherein the first curved edge of the third chip base and the second curved edge of the fourth chip base have the same center of curvature, and wherein the radius of curvature of the first curved edge is greater than the radius of curvature of the second curved edge.

11. A molded smart power module for an electric motor, comprising:

first, second, third and fourth die pads;

a first transistor fixed on the first chip base;

a second transistor fixed to the second chip pad;

a third transistor fixed to the third chip pad;

a fourth, fifth and sixth transistor fixed to the fourth chip pad;

a plurality of leads; and

a mold package enclosing the first, second, third and fourth die pads, the first, second, third, fourth, fifth and sixth transistors;

wherein the first, second, third and fourth chip bases are used as metal pads, and a pattern is formed on a direct bond copper substrate type substrate comprising a copper bottom layer, an insulating intermediate layer and a copper top layer, wherein a plurality of leads are formed via a single-gauge metal or a double-gauge metal.

12. The molded smart power module for an electric motor of claim 11 further comprising:

a connecting member;

a low voltage integrated circuit fixed to the connection member, the low voltage integrated circuit electrically connecting the first, second and third transistors;

a high voltage integrated circuit fixed to the connection member, the high voltage integrated circuit electrically connecting the fourth, fifth and sixth transistors;

wherein the connecting member, the low voltage integrated circuit and the high voltage integrated circuit are embedded in the molded package.

13. A molded smart power module for an electrical machine as recited in claim 12, wherein the direct bond copper substrate comprises a first side and a second side perpendicular to the first side;

wherein the first side is longer than the second side;

wherein the connecting member is disposed adjacent to and separated from the first edge of the substrate directly bonded to the copper substrate;

wherein the connection member is formed of a single-gauge metal or a double-gauge metal.

14. A molded smart power module for an electrical machine as defined in claim 11, wherein the direct bond copper substrate further comprises connection pads for electrically connecting the connection bars.

15. A molded smart power module for an electrical machine as recited in claim 14, wherein the first chip base is electrically connected to the first phase lead via a first bond wire;

the second chip base is electrically connected with the second phase lead through a second bonding wire; and is

The third chip base is electrically connected with a third phase lead through a third bonding wire.

16. A molded smart power module for an electrical machine as recited in claim 15, wherein the connecting rods are mechanically connected to the connection pads via solder paste.

17. A molded smart power module for an electrical machine as recited in claim 15 wherein said fourth chip carrier is electrically connected to said input leads; and the input lead is soldered directly to the edge portion of the fourth chip pad.

18. A molded smart power module for an electrical machine as recited in claim 11 wherein said first die pad is electrically connected to said first phase lead;

wherein the first phase lead is directly soldered to an edge portion of the first chip pad;

the second chip base is electrically connected with the second phase lead;

the second phase lead is directly soldered to an edge portion of the second chip pad;

the third chip base is electrically connected with a third phase lead; and is

The third phase lead is soldered directly to an edge portion of the third chip pad.

19. A molded smart power module for an electrical machine according to claim 11 further comprising a first fast recovery diode secured to the first chip base;

a second fast recovery diode fixed to the second chip base;

a third fast recovery diode fixed to the third chip base; and is

And fourth, fifth and sixth fast recovery diodes mounted on the fourth die pad.

20. A molded smart power module for an electric motor as recited in claim 11 further comprising first, second and third boost diodes; wherein the molded package encloses the first, second and third boost diodes.