Water cooling system for upper polishing disc
阅读说明:本技术 一种上抛光盘水冷却系统 (Water cooling system for upper polishing disc ) 是由 王腾 阴俊沛 杨帅军 蒲以松 于 2019-12-10 设计创作,主要内容包括:本发明涉及一种上抛光盘水冷却系统,包括:上抛光盘;设置于上抛光盘一侧的旋转轴;沿着旋转轴的延伸方向层叠套设于旋转轴上的第一水冷盘和第二水冷盘,第一水冷盘嵌设于上抛光盘上,第二水冷盘上设置有多个进水口,第一水冷盘设置有出水口,出水口与设置于旋转轴内的出水通道连通,第一水冷盘和第二水冷盘之间通过导流管连通。解决上抛光盘在抛光过程中温度升高以及径向温度分布不均的问题,且第一水冷盘嵌入上抛光盘,增加了水冷盘与上抛光盘的接触面积,且第一水冷盘内的腔体是一没有被分隔的整体结构,相对于传统的冷却盘内设置较多分割筋结构,本发明增大了冷却盘的腔体体积,使能容纳的冷却水相应增加,大大增加了冷却效果。(The invention relates to a water cooling system for an upper polishing disk, which comprises: an upper polishing disk; a rotating shaft arranged at one side of the upper polishing disk; the water-cooling disc structure comprises a first water-cooling disc and a second water-cooling disc, wherein the first water-cooling disc and the second water-cooling disc are sleeved on a rotating shaft in a stacking mode along the extending direction of the rotating shaft, the first water-cooling disc is embedded in an upper polishing disc, a plurality of water inlets are formed in the second water-cooling disc, a water outlet is formed in the first water-cooling disc, the water outlet is communicated with a water outlet channel formed in the rotating shaft, and the first water-cooling disc is communicated with the second. The problem that the temperature of the upper polishing disc rises and the radial temperature distribution is uneven in the polishing process is solved, the first water-cooling disc is embedded into the upper polishing disc, the contact area between the water-cooling disc and the upper polishing disc is increased, the cavity in the first water-cooling disc is of an integral structure which is not separated, and compared with the traditional cooling disc in which a plurality of partition rib structures are arranged, the cavity volume of the cooling disc is increased, the contained cooling water is correspondingly increased, and the cooling effect is greatly improved.)
1. An upper polishing disk water cooling system, comprising:
an upper polishing disk;
a rotating shaft disposed at one side of the upper polishing disk;
the water-cooling polishing device comprises a rotating shaft, and is characterized in that a first water-cooling disc and a second water-cooling disc which are sleeved on the rotating shaft in a stacking mode along the extending direction of the rotating shaft, the first water-cooling disc is embedded on the upper polishing disc, a plurality of water inlets are formed in the second water-cooling disc, a water outlet is formed in the first water-cooling disc, the water outlet is communicated with a water outlet channel formed in the rotating shaft, and the first water-cooling disc is communicated with the second water-cooling disc through a flow guide pipe.
2. The upper polishing disk water cooling system of claim 1, wherein an orthographic projection of the second water-cooled disk on the upper polishing disk falls within an orthographic projection of the first water-cooled disk on the upper polishing disk, and a thickness of the first water-cooled disk is less than a thickness of the second water-cooled disk.
3. The upper polishing disk water cooling system as set forth in claim 1, wherein the second water-cooling disk has a first surface far from the first water-cooling disk, the area of the first surface corresponding to the flow guide tube is convex in a direction far from the first water-cooling disk to form a bulge, and the distance between the end of the flow guide tube facing the first surface and the first surface is less than a preset distance.
4. The water cooling system for the upper polishing disc as recited in claim 1, further comprising a fixing disc sleeved on the rotating shaft, wherein the fixing disc is located on a side of the second water-cooling disc away from the first water-cooling disc to fix the first water-cooling disc and the second water-cooling disc.
5. The water cooling system for an upper polishing disk as recited in claim 4, wherein the fixed disk has through holes corresponding to the plurality of water inlets, and each water inlet extends outward and passes through the through hole to form a water inlet passage exposed from the fixed disk.
6. The water cooling system for the upper polishing disk as recited in claim 5, wherein the water inlet channel and the water outlet channel are provided with temperature sensors at their outlets, and the water inlet channel is provided with a throttle valve for adjusting the flow rate of the cooling water according to the information of the temperature sensors.
7. The upper polishing disk water cooling system of claim 1, wherein the flow conduit between the first water-cooled disk and the second water-cooled disk is located at an edge of the first water-cooled disk.
8. The upper polishing pad water cooling system of claim 1, wherein the first water-cooled pad is embedded in the upper polishing pad to a depth of 1/2 times a thickness of the first water-cooled pad.
9. The water cooling system for the upper polishing disk as recited in claim 1, further comprising a third water-cooling disk disposed between the first water-cooling disk and the second water-cooling disk, wherein flow guiding pipes are disposed between the first water-cooling disk and the third water-cooling disk and between the third water-cooling disk and the first water-cooling disk, and the flow guiding pipes between the third water-cooling disk and the first water-cooling disk are disposed at an edge of the first water-cooling disk.
10. The upper polishing disc water cooling system of claim 9, wherein the first water-cooled disc, the third water-cooled disc and the second water-cooled disc sequentially increase in thickness.
Technical Field
The invention relates to the technical field of silicon wafer polishing, in particular to a water cooling system of an upper polishing disk.
Background
Chemical Mechanical Polishing (CMP) is a planarization technology combining chemical corrosion and mechanical grinding, and has the working principle that a silicon wafer to be polished is placed in a polishing head, a polishing pad is adhered to the surface of an upper polishing disc, a certain pressure is applied to the silicon wafer through the polishing head so that the silicon wafer is pressed on the surface of the polishing pad, and the silicon wafer is planarized by means of the relative motion between the silicon wafer and the polishing pad and by means of abrasive particles in polishing liquid. During polishing, a large amount of heat is generated due to friction between the silicon wafer and the polishing pad, so that the temperature of the polishing pad and the upper polishing pad is increased. If the temperature of the upper polishing disk is too high and the temperatures of all parts are seriously uneven, the upper polishing disk generates micro deformation under the action of thermal stress, and the flatness of the surface of the silicon wafer is influenced. Therefore, the temperature of the working area of the upper polishing disk needs to be controlled within a certain range so as to improve the processing quality of the silicon wafer.
Considering that the polishing head moves in a radius range from the center of the polishing pad to the outer edge of the polishing pad during polishing, a middle area from the center of the polishing pad to the outer edge of the polishing pad is always ground, resulting in a higher temperature in this area than in other areas, and thus causing an uneven radial temperature distribution. Although traditional upward polishing dish water cooling method is whole to being cooled down to last polishing dish, nevertheless because business turn over rivers movement path is longer, still can exist the inhomogeneous condition of polishing dish temperature distribution, the temperature that the centre of a circle of the last polishing dish was to the radius within range of the outward flange of polishing dish differs greatly all the time, and traditional water-cooling structure adopts and cuts apart a plurality of fan-shaped regions that form through cutting apart the muscle structure and carries out the drainage to the cooling water, the distribution of cutting apart the muscle has reduced the volume that the cavity of cooling water was held to the cooling structure greatly, the cooling water that can hold also correspondingly reduces, the cooling effect has been weakened.
Disclosure of Invention
In order to solve the technical problems, the invention provides a water cooling system for an upper polishing disk, which solves the problems of temperature rise and radial temperature distribution nonuniformity of the upper polishing disk in the polishing process.
In order to achieve the purpose, the invention adopts the technical scheme that: an upper polishing disk water cooling system comprising:
an upper polishing disk;
a rotating shaft disposed at one side of the upper polishing disk;
the water-cooling polishing device comprises a rotating shaft, and is characterized in that a first water-cooling disc and a second water-cooling disc which are sleeved on the rotating shaft in a stacking mode along the extending direction of the rotating shaft, the first water-cooling disc is embedded on the upper polishing disc, a plurality of water inlets are formed in the second water-cooling disc, a water outlet is formed in the first water-cooling disc, the water outlet is communicated with a water outlet channel formed in the rotating shaft, and the first water-cooling disc is communicated with the second water-cooling disc through a flow guide pipe.
Optionally, an orthographic projection of the second water-cooled disc on the upper polishing disc falls into an orthographic projection of the first water-cooled disc on the upper polishing disc, and the thickness of the first water-cooled disc is smaller than that of the second water-cooled disc.
Optionally, the second water-cooling disc has a first surface far away from the first water-cooling disc, a region of the first surface corresponding to the flow guide pipe protrudes in a direction far away from the first water-cooling disc to form a bulge, and a distance between one end of the flow guide pipe facing the first surface and the first surface is smaller than a preset distance.
Optionally, the fixing plate is sleeved on the rotating shaft, and the fixing plate is located on one side, away from the first water-cooling plate, of the second water-cooling plate so as to fix the first water-cooling plate and the second water-cooling plate.
Optionally, the fixed disk is provided with through holes corresponding to the water inlets one to one, and each water inlet extends outwards and penetrates through the through hole to form a water inlet passage exposed out of the fixed disk.
Optionally, inhalant canal with the exit of exhalant canal all is provided with temperature sensor, be provided with on the inhalant canal and be used for the basis the choke valve of temperature sensor's information regulation cooling water flow.
Optionally, the draft tube between the first water-cooling disc and the second water-cooling disc is located at the edge of the first water-cooling disc.
Optionally, the depth of the first water-cooling disc embedded into the upper polishing disc is 1/2 of the thickness of the first water-cooling disc.
Optionally, the water cooling device further comprises a third water cooling disc arranged between the first water cooling disc and the second water cooling disc, flow guide pipes are arranged between the first water cooling disc and the third water cooling disc and between the third water cooling disc and the first water cooling disc, and the flow guide pipes between the third water cooling disc and the first water cooling disc are located on the edge of the first water cooling disc.
Optionally, the thicknesses of the first water-cooling disc, the third water-cooling disc and the second water-cooling disc are sequentially increased.
The invention has the beneficial effects that: the water-cooling dish through range upon range of setting cools off last polishing dish, the problem of polishing dish radial temperature inequality in the polishing process is gone up in the solution, and polishing dish in the embedding of first water-cooling dish, the area of contact of water-cooling dish with last polishing dish has been increased, and the cavity in the first water-cooling dish is one and not by divided overall structure, set up the setting of more segmentation muscle structure for traditional cooling dish, the cavity volume has been increased, the cooling water that can hold corresponds the increase, greatly increased the cooling effect.
Drawings
FIG. 1 is a first schematic diagram of a water cooling system for an upper polishing pad in an embodiment of the present invention;
FIG. 2 is a schematic view of a second water cooling system for the upper polishing pad in an embodiment of the present invention;
FIG. 3 is a third schematic diagram of a water cooling system for the upper polishing pad in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In order to solve the problem that the radial temperature of the upper polishing disk is uneven when the temperature of a working area is higher than that of other areas in the polishing process of the upper polishing disk, the embodiment provides a water cooling system of the upper polishing disk, which adopts a composite structure of the upper polishing disk and the water cooling disk, the upper polishing disk is cooled through the water cooling disk, and the first water cooling disk is embedded into the upper polishing disk, so that the contact area between the first water cooling disk and the upper polishing disk is increased, particularly the contact area between the edge of the upper polishing disk and the first water cooling disk is increased, and the integral cooling effect of the upper polishing disk is greatly enhanced; further, the condition that the temperature distribution of the upper polishing disc is uneven is reduced, and in the embodiment, the first water-cooling disc and the second water-cooling disc which are stacked are adopted, so that the length of a path of the water inlet and outlet flow is shortened relative to a cooling structure of a cooling water pipeline spirally distributed on the upper polishing disc. The setting of muscle is not cut apart in the first water-cooling dish in this embodiment, and the cavity that is used for holding the cooling water in the first water-cooling dish is complete whole promptly, has increased the capacity of cooling water, has increased the cooling effect.
Specifically, as shown in fig. 1, fig. 2 and fig. 3, the present embodiment provides a water cooling structure for an
an
a rotating
the polishing device comprises a first water-
As shown in fig. 1 and fig. 2, cooling water enters from a water inlet on the second water-cooled
The
The first water-
The
It should be noted that the area of the first water-
In this embodiment, the difference between the radii of the first water-cooled
The thickness of the first water-
In this embodiment, the second water-
The arrangement of the
The preset distance can be set according to actual needs, and in this embodiment, the ratio of the preset distance to the thickness of the second water-
In a specific implementation manner of this embodiment, a distance between an end of the
The distance between the first water-
In this embodiment, the cooling structure of the
The fixed
In this embodiment, the
In this embodiment, the
By adopting the technical scheme, the connection stability between the second water-
In this embodiment, temperature sensors are disposed at outlets of the
The temperature sensors at the outlets of the
In this embodiment, the
The
The number of the
In this embodiment, the depth of the first water-cooled
The first water-
In this embodiment, the water cooling structure of the
The second water-
In this embodiment, the thicknesses of the first water-
By adopting the technical scheme, cooling water rapidly enters the first water-
It should be noted that, the thicknesses of the first water-
The third water-
The arrangement of the
The preset distance can be set according to actual needs, and in this embodiment, the ratio of the preset distance to the thickness of the second water-
In a specific embodiment of this embodiment, a distance between an end of the
The first distance between the first water-
In a specific implementation manner of this embodiment, the first distance and the second distance are the same.
It should be noted that, in order to enable the cooling water to be quickly injected into the first water-cooled
It should be noted that the number of the
In this embodiment, the first water-
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
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