阅读说明：本技术 一种热敏打印头及其制造方法 (Thermal printing head and manufacturing method thereof ) 是由 陈龙翰 程双阳 赵艳秋 于 2019-12-28 设计创作，主要内容包括：本发明公开了一种热敏打印头,包括基板、蓄热层、打印部和驱动部,蓄热层附在基板表面。打印部设在蓄热层上方一侧,打印部包括若干电极带、设在电极带上的电阻体以及覆盖在电极带和电阻体外部的保护层。电阻体包括若干个发热部,发热部与电极带导通。驱动部设在蓄热层上并位于打印部的侧边,驱动部包括可与焊锡形成合金的若干导电条、附在导电条上的阻焊层、倒焊在导电条上的驱动IC以及包覆在驱动IC外部的防护层。本发明还公开了上述热敏打印头的制造方法。本发明采用可与焊锡形成合金的金属制成的导电条来替换现有热敏打印头中的部分金电路,大大降低了生产成本,驱动IC采用倒装焊接代替现有的金线焊接,焊接速度快,大大提高了生产效率。(The invention discloses a thermal printing head, which comprises a substrate, a heat accumulation layer, a printing part and a driving part, wherein the heat accumulation layer is attached to the surface of the substrate. The printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts, a resistor body arranged on the electrode belts and a protective layer covering the electrode belts and the resistor body. The resistor body comprises a plurality of heating parts which are conducted with the electrode belts. The drive division is established on heat accumulation layer and is located the side of printing the portion, and the drive division includes can form a plurality of conducting strips of alloy, attaches the solder mask on the conducting strip, the drive IC and the cladding at the outside inoxidizing coating of drive IC of back welding on the conducting strip with soldering tin. The invention also discloses a manufacturing method of the thermal printing head. The invention adopts the conductive strips made of metal which can form alloy with the soldering tin to replace part of gold circuits in the prior thermal printing head, thereby greatly reducing the production cost, adopting the flip-chip welding to replace the prior gold wire welding for the drive IC, having high welding speed and greatly improving the production efficiency.)

1. A thermal print head, comprising:

a substrate;

the heat storage layer is attached to the surface of the substrate;

the printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts which are attached to the heat storage layer and are arranged at intervals along the length direction of the substrate, a resistor body arranged above the electrode belts and a protective layer covering the plurality of electrode belts and the resistor body, the resistor body comprises a plurality of heating parts which are arranged at intervals along the length direction of the substrate, and the heating parts are in one-to-one corresponding conduction connection with the electrode belts;

the drive division is established heat accumulation layer top is located the side of printing the portion, the drive division including establishing heat accumulation layer top and can form a plurality of busbar of alloy with soldering tin, attach solder mask on the busbar, lay and the back-weld along base plate length direction drive IC and the cladding on the busbar are in the outside inoxidizing coating of drive IC, a plurality of busbar are laid along base plate length direction interval, the busbar with the electrode zone one-to-one conducting connection.

2. A thermal printhead according to claim 1, wherein: the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

3. A thermal printhead according to claim 1, wherein: the conducting bar is of a single-layer structure, the thickness of the conducting bar ranges from 0.1nm to 30um, and the conducting bar is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

4. A thermal printhead according to claim 1, wherein: the conducting bar is of a multilayer structure and comprises a connecting layer and a welding layer attached to the connecting layer.

5. A thermal printhead according to claim 4, wherein: the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

6. A thermal printhead according to claim 4, wherein: the thickness of the connecting layer is 0.1 nm-20 um, and the material is one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

7. A thermal printhead according to claim 1, wherein: the electrode belt surpasses in the base plate width direction the protective layer has a joint portion, the length of joint portion is 0.1nm ~ 4mm, the width is 0.1nm ~ 200 um.

8. A thermal printhead according to claim 1, wherein: the material of heat accumulation layer and protective layer is glass glaze, the thickness on heat accumulation layer is 10um ~ 500um, the thickness of protective layer is 1um ~ 25 um.

9. A thermal printhead according to claim 1, wherein: the resistance body is the semicircle column that the radius is 0.1um ~ 12um, and the material of resistance body is ruthenium or ruthenium compound.

10. A thermal printhead according to claim 1, wherein: the base plate be ceramic substrate, the material of solder mask is green oil, the material of inoxidizing coating is epoxy.

11. A method of manufacturing a thermal print head, comprising the steps of:

s1, coating a heat storage layer on the substrate and sintering;

s2, firing electrode layers on the heat storage layer and etching the electrode layers into a plurality of electrode strips distributed at intervals along the length direction of the substrate;

s3, firing the resistor bodies distributed along the length direction of the substrate on the electrode belts;

s4, firing a protective layer on the outer sides of the electrode strips and the resistor body, and respectively reserving joint parts at the same side edges of all the electrode strips;

s5, plating a conductive layer above the heat storage layer and etching the conductive layer into a plurality of conductive strips which are in one-to-one corresponding conductive connection with the joint parts;

and S6, coating a solder mask layer on the surface of the conductive strip and reserving a drive IC welding station, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.

12. A method of manufacturing a thermal print head according to claim 11, wherein: the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

13. A method of manufacturing a thermal print head according to claim 11, wherein: the conducting bar is of a single-layer structure, the thickness of the conducting bar ranges from 0.1nm to 30um, and the conducting bar is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

14. A method of manufacturing a thermal print head according to claim 13, wherein: the conducting bar is of a double-layer structure and comprises a connecting layer and a welding layer attached to the connecting layer.

15. A method of manufacturing a thermal print head according to claim 14, wherein: the thickness of the connecting layer is 0.1 nm-20 um, and the material is one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

16. A method of manufacturing a thermal print head according to claim 14, wherein: the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

Technical Field

The invention relates to the technical field of thermal printing devices, in particular to a thermal printing head and a manufacturing method thereof.

Background

The thermal head is a main component of a thermal printer, which selectively heats a thermal paper at a certain position, thereby generating a pattern. Heating is provided by a small electric heater on the printhead that is in contact with the heat sensitive material. The form of the heater schedule dots or bars is logically controlled by the printer and, when activated, produces a pattern on the thermal paper corresponding to the heating elements. The same logic that controls the heating elements also controls the feeding of the paper, thus enabling the printing of a pattern on the entire label or sheet.

Patent No. CN 1114613 a discloses a thermal print head, which includes a print head substrate, a conductor pattern formed on the print head substrate, a row of heating dots electrically connected to the conductor pattern on the print head substrate, an integrated circuit driving array mounted on the print head substrate and spaced apart from the heating dots, a resin casing for sealing outside the integrated circuit driving array, and a protective layer provided outside the printed circuit and the heating dots. In the scheme of the patent, all circuit materials are made of gold, and the integrated circuit and the substrate are packaged by gold wires, so that the manufacturing cost of the whole thermosensitive printing head is high due to high manufacturing cost of gold; meanwhile, the integrated circuit and the substrate are packaged by gold wires, the gold wires need to be welded one by one, the welding speed is low, and the production efficiency is low.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a thermal print head and a method for manufacturing the same, which solves the technical problems of the prior thermal print head in the background art that gold wires are used as circuit materials and packaging materials, the manufacturing cost is high, and the IC soldering speed is slow.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

a thermal print head comprising:

a substrate.

And the heat storage layer is attached to the surface of the substrate.

The printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts attached to the heat storage layer and arranged at intervals along the length direction of the substrate, a resistor body arranged above the electrode belts and a protective layer covering the plurality of electrode belts and the outside of the resistor body. The resistor body comprises a plurality of heating parts which are arranged at intervals along the length direction of the substrate, and the heating parts are in one-to-one correspondence conduction connection with the electrode belts.

The drive division is established heat accumulation layer top is located the side of printing the portion, the drive division including establishing heat accumulation layer top and can form a plurality of conducting bars of alloy, attach with soldering tin solder mask on the conducting bar, lay and the back-weld along base plate length direction drive IC and the cladding on the conducting bar are in drive IC outside inoxidizing coating. The conductive strips are arranged at intervals along the length direction of the substrate and are in one-to-one corresponding conduction connection with the electrode belts.

Furthermore, the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

In one embodiment, the conductive strip has a single-layer structure, a thickness of 0.1nm to 30um, and is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

In another embodiment, the conductive strip has a double-layer structure, and includes a connection layer and a welding layer attached to the connection layer.

Wherein, the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

The thickness of the connecting layer is 0.1 nm-20 um, and the connecting layer is made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

Further, the electrode belt surpasses in the base plate width direction the protective layer has a joint portion, the length of joint portion is 0.1nm ~ 4mm, and the width is 0.1nm ~ 200 um.

Further, the material of heat accumulation layer and protective layer is glass glaze, the thickness on heat accumulation layer is 10um ~ 500um, the thickness of protective layer is 1um ~ 25 um.

Furthermore, the resistor body is a semi-cylinder with the radius of 0.1 um-12 um, and the material of the resistor body is ruthenium or a ruthenium compound.

Further, the base plate be ceramic substrate, the material of solder mask is green oil, the material of inoxidizing coating is epoxy.

The invention also discloses a manufacturing method of the thermal printing head, which comprises the following steps:

and S1, coating a heat storage layer on the substrate and sintering.

And S2, firing electrode layers on the heat storage layer and etching the electrode layers into a plurality of electrode strips which are arranged at intervals along the length direction of the substrate.

And S3, firing the resistors arranged along the length direction of the substrate on the electrode belts.

And S4, firing a protective layer on the outer sides of the electrode strips and the resistor body, and respectively reserving joint parts at the same side edge of all the electrode strips.

And S5, plating a conductive layer above the heat storage layer and etching the conductive layer into a plurality of conductive strips which are in one-to-one corresponding conductive connection with the joint parts.

And S6, coating a solder mask layer on the surface of the conductive strip and reserving a drive IC welding station, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.

Furthermore, the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

In one embodiment, the conductive strip has a single-layer structure, a thickness of 0.1nm to 30um, and is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

In another embodiment, the conductive strip has a double-layer structure, and includes a connection layer and a welding layer attached to the connection layer.

The thickness of the connecting layer is 0.1 nm-20 um, and the connecting layer is made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

Wherein, the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

The invention has the following beneficial effects: the thermal printing head structure is characterized in that two or more than two metals are spliced to serve as a conductor, a noble metal serves as a heating body to connect the conductor, and a conductive strip made of copper, nickel, tin or alloys of the copper, the nickel and the tin which can form alloys with soldering tin is adopted to replace part of gold circuits in the existing thermal printing head, so that the production cost is greatly reduced; the drive IC adopts flip-chip bonding to replace the existing gold wire bonding, the bonding speed is high, and the production efficiency is greatly improved.

Drawings

Fig. 1 is a plan view of a thermal print head according to a first embodiment.

Fig. 2 is a schematic cross-sectional view taken along the direction I-I in fig. 1.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Fig. 4 is a partially enlarged view of a portion B in fig. 2.

Fig. 5 is a partially enlarged schematic view of a portion C in fig. 2.

Fig. 6 is a plan view of the joint portion.

FIG. 7 is a schematic cross-sectional view of a thermal print head according to a second embodiment.

Fig. 8 is a partially enlarged view of portion D of fig. 7.

Fig. 9 is a partially enlarged schematic view of a portion E in fig. 7.

Description of the main component symbols: 1. a ceramic substrate; 2. a heat storage layer; 31. an electrode belt; 310. a joint portion; 32. a resistor body; 33. a protective layer; 41. a conductive strip; 411. a connecting layer; 412. welding the layers; 42. a solder resist layer; 43. a driver IC; 44. a protective layer; l, joint length; w, joint width; in the X direction: a length direction of the ceramic substrate; y: the width direction of the ceramic substrate.

Detailed Description

The invention is further described with reference to the following drawings and detailed description.