阅读说明：本技术 一种薄膜热敏打印头及其制造方法 (Thin film thermal sensitive printing head and manufacturing method thereof ) 是由 陈龙翰 程双阳 赵艳秋 于 2019-12-28 设计创作，主要内容包括：本发明公开了一种薄膜热敏打印头,包括基板、蓄热层、电阻层、导电层、保护层、防氧化层、驱动IC和保护层。蓄热层包括设在基板上的隆起部和基体部。电阻层覆盖在基板和蓄热层外侧,电阻层具有若干个发热部。导电层设在电阻层外侧,导电层包括可与焊锡形成合金的若干电极,导电层在隆起部的顶部位置蚀刻并露出电阻层的发热部。保护层设在发热部外侧。防氧化层覆盖基板第二部分上方的导电层。驱动IC沿基板长度方向布设并与基板第二部分上的导电层倒焊互连。本发明还公开了上述薄膜热敏打印头的制造方法。本发明采用可与焊锡形成合金的金属制成的电极来替换现有热敏打印头中的铝电路,驱动IC采用倒装焊接代替现有的金线焊接,成本低,焊接速度快。(The invention discloses a film thermal printing head, which comprises a substrate, a heat storage layer, a resistance layer, a conductive layer, a protective layer, an anti-oxidation layer, a drive IC and a protective layer. The heat storage layer includes a ridge portion and a base portion provided on the substrate. The resistance layer covers the outer sides of the substrate and the heat storage layer and is provided with a plurality of heating parts. The conducting layer is arranged outside the resistance layer, the conducting layer comprises a plurality of electrodes capable of forming alloy with the soldering tin, and the conducting layer is etched at the top of the raised part and exposes the heating part of the resistance layer. The protective layer is arranged outside the heating part. The oxidation-resistant layer covers the conductive layer above the second portion of the substrate. The driving IC is arranged along the length direction of the substrate and is in flip-chip interconnection with the conductive layer on the second part of the substrate. The invention also discloses a manufacturing method of the film thermal printing head. The invention adopts the electrode made of metal which can form alloy with soldering tin to replace the aluminum circuit in the prior thermal printing head, and the drive IC adopts the flip-chip welding to replace the prior gold wire welding, thereby having low cost and high welding speed.)

1. A thin film thermal printhead, comprising:

a substrate divided into adjacent first and second portions;

a heat storage layer including a ridge portion provided on the first portion of the substrate and a base portion provided on the second portion of the substrate;

the resistance layer covers the outer sides of the substrate and the heat storage layer and is provided with a plurality of heating parts arranged at intervals along the length direction of the substrate;

the conducting layer is arranged outside the resistance layer and comprises a plurality of electrodes which are arranged at intervals along the length direction of the substrate and can form alloy with soldering tin, the conducting layer is etched at the top of the raised part and exposes the heating parts of the resistance layer, and the electrodes are in one-to-one correspondence conduction connection with the heating parts;

a protective layer arranged outside the heating part and completely covering the conductive layer above the first part of the substrate;

the anti-oxidation layer covers the outer side of the conductive layer above the second part of the substrate;

the driving IC is arranged along the length direction of the substrate and is in reverse welding interconnection with the conductive layer above the second part of the substrate;

and the protective layer is coated on the outer side of the drive IC.

2. The thin film thermal printhead of claim 1, wherein: the conducting layer is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

3. The thin film thermal printhead of claim 1, wherein: the conducting layer is made of one of copper, tin, copper alloy and tin alloy.

4. The thin film thermal printhead of claim 1, wherein: a first connecting layer is arranged between the conducting layer and the resistance layer, and a second connecting layer is arranged between the protection layer and the conducting layer.

5. The thin film thermal printhead of claim 4, wherein: the thickness of the first connecting layer and the second connecting layer is 0.1 nm-20 um, and the first connecting layer and the second connecting layer are made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

6. The thin film thermal printhead as claimed in any one of claims 3 to 5, wherein: the thickness of the conducting layer is 0.1 nm-30 um.

7. The thin film thermal printhead of claim 1, wherein: the material of heat accumulation layer is glass glaze, and thickness is 10um ~ 500 um.

8. The thin film thermal printhead of claim 1, wherein: the resistance layer is made of tantalum compounds and has a thickness of 0.1 nm-3 um.

9. The thin film thermal printhead of claim 1, wherein: the protective layer is made of wear-resistant compound and has the thickness of 5 nm-15 um.

10. The thin film thermal printhead of claim 1, wherein: the base plate is an alumina ceramic plate, the anti-oxidation layer is a green oil layer, and the protective layer is made of epoxy resin.

11. A method of manufacturing a thin film thermal printhead, comprising the steps of:

s1, coating a heat storage layer on the surface of the first part of the substrate and sintering to form a raised part, and coating a heat storage layer on the surface of the second part of the substrate and sintering to form a base part;

s2, plating a resistance layer on the outer sides of the substrate and the heat storage layer;

s3, plating a conductive layer capable of forming alloy with soldering tin on the outer side of the resistance layer, etching the conductive layer to obtain a plurality of electrodes arranged at intervals along the length direction of the substrate, etching the electrodes at the top of the raised part and exposing the heating part of the resistance layer;

s4, plating a protective layer on the conductive layer and the outer side of the heating part above the first part of the substrate;

and S5, coating an anti-oxidation layer on the outer side of the conductive layer above the second part of the substrate, reserving a welding station of the drive IC, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.

12. The method of manufacturing a thin film thermal print head according to claim 11, wherein: the conducting layer is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

13. The method of manufacturing a thin film thermal print head according to claim 11, wherein: the conducting layer is made of one of copper, tin, copper alloy and tin alloy.

14. The method of manufacturing a thin film thermal print head according to claim 13, wherein: the outer side of the resistance layer is plated with a first connecting layer used for increasing the bonding force between the conductive layer and the resistance layer, and the outer side of the conductive layer is plated with a second connecting layer used for increasing the bonding force between the protective layer and the conductive layer.

15. The method of manufacturing a thin film thermal print head according to claim 14, wherein: the thickness of the first connecting layer and the second connecting layer is 0.1 nm-20 um, and the first connecting layer and the second connecting layer are made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

16. A method of manufacturing a thin film thermal print head according to any one of claims 12 to 15, wherein: the thickness of the conducting layer is 0.1 nm-30 um.

Technical Field

The invention relates to the technical field of thermal printing devices, in particular to a thin-film thermal printing head and a manufacturing method thereof.

Background

The thermal head is a main component of a thermal printer, which selectively heats a thermal paper at a certain position, thereby generating a pattern. Heating is provided by a small electric heater on the printhead that is in contact with the heat sensitive material. The form of the heater schedule dots or bars is logically controlled by the printer and, when activated, produces a pattern on the thermal paper corresponding to the heating elements. The same logic that controls the heating elements also controls the feeding of the paper, thus enabling the printing of a pattern on the entire label or sheet.

The film technology is mainly used for ceramic base plate of aluminium oxide material, and the base plate is coated with a layer of enamel-coating layer made of glass material, then the enamel-coating layer is coated with a layer of micron-grade resistance material, and then a layer of metal electrode is plated. Aluminum is generally adopted as a material of a metal electrode in the existing film process, and because the aluminum cannot be used for soldering tin, when IC binding is carried out, a drive IC and an aluminum circuit need to be soldered through a gold wire, so that the cost is high, and the soldering speed is slow.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a thin film thermal print head with low cost and high soldering speed and a method for manufacturing the same, so as to solve the technical problems of high cost and low soldering speed in the background art of using gold wires to connect an IC and an aluminum circuit.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

a thin film thermal printhead comprising:

a substrate divided into adjacent first and second portions.

And a heat storage layer including a ridge portion provided on the first portion of the substrate and a base portion provided on the second portion of the substrate.

And the resistance layer covers the outer sides of the substrate and the heat storage layer and is provided with a plurality of heating parts arranged at intervals along the length direction of the substrate.

The conducting layer is arranged on the outer side of the resistance layer and comprises a plurality of electrodes which are arranged at intervals along the length direction of the substrate and can form alloy with soldering tin, the conducting layer is etched at the top of the raised part and exposes the heating parts of the resistance layer, and the electrodes are in one-to-one correspondence conduction connection with the heating parts.

And the protective layer is arranged outside the heating part and completely covers the conductive layer above the first part of the substrate.

And the anti-oxidation layer covers the outer side of the conductive layer above the second part of the substrate.

And the driving IC is arranged along the length direction of the substrate and is in flip-chip interconnection with the conductive layer above the second part of the substrate.

And the protective layer is coated on the outer side of the drive IC.

In one embodiment, the conductive layer is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

In another embodiment, the conductive layer is made of one of copper, tin, copper alloy, and tin alloy.

In order to increase the bonding force between the conductive layer, the resistance layer and the protective layer, a first connecting layer is arranged between the conductive layer and the resistance layer, and a second connecting layer is arranged between the protective layer and the conductive layer.

The thickness of the first connecting layer and the thickness of the second connecting layer are both 0.1 nm-20 um, and the first connecting layer and the second connecting layer are made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

Further, the thickness of the conducting layer is 0.1 nm-30 um.

Furthermore, the material of heat accumulation layer is glass glaze, and thickness is 10um ~ 500 um.

Furthermore, the resistance layer is made of tantalum compound and has a thickness of 0.1 nm-3 um.

Furthermore, the protective layer is made of wear-resistant compound and has a thickness of 5 nm-15 um.

Further, the substrate is an alumina ceramic plate, the anti-oxidation layer is a green oil layer, and the protective layer is made of epoxy resin.

The invention also discloses a manufacturing method of the film thermal printing head, which comprises the following steps:

and S1, coating the surface of the first part of the substrate with a heat storage layer and sintering to form a raised part, and coating the surface of the second part of the substrate with a heat storage layer and sintering to form a base part.

And S2, plating a resistance layer outside the substrate and the heat storage layer.

And S3, plating a conductive layer capable of forming alloy with soldering tin on the outer side of the resistance layer, etching the conductive layer to obtain a plurality of electrodes arranged at intervals along the length direction of the substrate, and etching the electrodes at the top of the raised part to expose the heating part of the resistance layer.

And S4, plating a protective layer on the conductive layer above the first part of the substrate and the outer side of the heating part.

And S5, coating an anti-oxidation layer on the outer side of the conductive layer above the second part of the substrate, reserving a welding station of the drive IC, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.

In one embodiment, the conductive layer is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

In another embodiment, the conductive layer is made of one of copper, tin, copper alloy, and tin alloy.

The outer side of the resistance layer is plated with a first connecting layer used for increasing the bonding force between the conductive layer and the resistance layer, and the outer side of the conductive layer is plated with a second connecting layer used for increasing the bonding force between the protective layer and the conductive layer.

The thickness of the first connecting layer and the thickness of the second connecting layer are both 0.1 nm-20 um, and the first connecting layer and the second connecting layer are made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

Further, the thickness of the conducting layer is 0.1 nm-30 um.

The invention has the following beneficial effects: the thin-film thermosensitive printing head is made up by using electrodes made of copper, nickel and tin or their alloy which can be alloyed with soldering tin to replace aluminium circuit in existent thermosensitive printing head and using drive IC to adopt reverse welding mode to replace existent gold wire welding so as to greatly reduce production cost, and its welding speed is high and production efficiency is high.

Drawings

Fig. 1 is a plan view of a thin film thermal print head according to a first embodiment.

Fig. 2 is a schematic cross-sectional view taken along the direction I-I in fig. 1.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Fig. 4 is a partially enlarged view of a portion B in fig. 2.

Fig. 5 is a partially enlarged schematic view of a portion C in fig. 2.

Fig. 6 is a schematic cross-sectional view of a thin film thermal print head according to a second embodiment.

Fig. 7 is a partially enlarged view of portion D of fig. 6.

Fig. 8 is a partially enlarged schematic view of a portion E in fig. 6.

Fig. 9 is a partially enlarged schematic view of portion F of fig. 6.

Description of the main component symbols: 1. a substrate; 11. a first portion; 12. a second portion; 21. a raised portion; 22. a base portion; 3. a resistive layer; 31. a heat generating portion; 4. a conductive layer; 41. an electrode; 5. a protective layer; 6. an oxidation-resistant layer; 7. a driver IC; 8. a protective layer; 91. a first tie layer; 92. a second connection layer; in the X direction: the length direction of the substrate; y direction: the width direction of the substrate.

Detailed Description

The invention is further described with reference to the following drawings and detailed description.