Method for embedding an integrated circuit into a 3D printed object and 3D printing system
阅读说明:本技术 用于将集成电路嵌入到3d打印对象中的方法和3d打印系统 (Method for embedding an integrated circuit into a 3D printed object and 3D printing system ) 是由 尼基塔·韦希科夫 于 2019-08-22 设计创作,主要内容包括:提供一种用于将集成电路(IC)嵌入到3D打印对象中的方法。所述方法包括提供长丝,所述长丝具有用于3D打印对象的材料,以及嵌入于所述长丝材料内的集成电路。使用所述长丝形成所述3D打印对象的至少一部分。提供一种用于实施所述方法的3D打印系统。所述3D打印系统包括长丝施配器,其用于存储和施配所述3D打印长丝。平台提供用于在打印所述对象时支撑所述对象的工作台面。提供用于控制3D打印机的打印操作并且用于用其中嵌入有所述IC的所述长丝3D打印所述对象的处理器。提供用于在所述IC嵌入于所述3D打印对象中时配置所述IC的配置电路。(A method for embedding an Integrated Circuit (IC) into a 3D printed object is provided. The method includes providing a filament having a material for 3D printing an object, and an integrated circuit embedded within the filament material. Forming at least a portion of the 3D printed object using the filament. A 3D printing system for implementing the method is provided. The 3D printing system includes a filament dispenser for storing and dispensing the 3D printed filaments. The platform provides a countertop for supporting the object while printing the object. A processor is provided for controlling a printing operation of a 3D printer and for 3D printing the object with the filament having the IC embedded therein. A configuration circuit is provided for configuring the IC when embedded in the 3D printed object.)
1. A method for embedding an integrated circuit into a 3D printed object, the method comprising:
providing a filament comprising a material for 3D printing an object, and an integrated circuit embedded within the filament; and
forming the 3D printed object using the filament.
2. The method of claim 1, wherein providing the filament further comprises
Melting the material to a liquid state;
embedding one or more integrated circuits within the molten material; and
extruding the molten liquid material into a wire shape.
3. The method of claim 1, wherein forming a 3D printed object using the filament further comprises 3D printing an object such that the embedded integrated circuit is embedded within the object during the 3D printing.
4. The method of claim 1, wherein the integrated circuit is characterized as a tag for identifying the object, and further comprising configuring the tag for use in forming the object.
5. The method of claim 1, wherein providing the filament further comprises providing the filament including the material for 3D printed objects, the integrated circuit coupled to an antenna, the integrated circuit and the antenna being embedded within the filament.
6. The method of claim 1, wherein the antenna comprises one of a wire loop or one or more wire segments.
7. The method of claim 1, wherein the antenna comprises two wires, each wire having a first end coupled to the integrated circuit and a second end coupled to a magnet, and during forming the 3D printed object using the filament, the filament melts to a relatively low viscosity around the magnets and antenna such that magnetic attraction between the magnets causes the magnets to couple together and form a loop antenna.
8. The method of claim 1, wherein the antenna is 3D printed on the object using conductive ink.
9. A3D printing system, comprising:
a filament dispenser for storing and dispensing a 3D printed filament, the 3D printed filament comprising material for a 3D printed object, and one or more integrated circuits embedded within the filament;
a platform for providing a countertop for supporting the object while printing the object;
a processor for controlling a printing operation of the 3D printer;
a printer head positioned relative to the platform and coupled to receive the 3D printing filament from the filament dispenser, the printer head for directing deposition of the material for 3D printing the object and at least one of the integrated circuits embedded within the filament under control of the processor; and
an Integrated Circuit (IC) configuration circuit to configure the at least one IC when embedded in the 3D printed object.
10. A method for embedding an integrated circuit into a 3D printed object, the method comprising:
melting a plastic material into a liquid state;
embedding one or more integrated circuits within the molten plastic material;
forming the molten liquid plastic material into a strand-shaped filament;
providing the filament for a 3D printed object, at least one of the integrated circuits being embedded within the 3D printed object when the 3D printed object is printed; and
configuring the at least one integrated circuit while printing the 3D printed object.
Technical Field
The present disclosure relates generally to three-dimensional (3D) printing, and more particularly, to a method and 3D printing system for embedding integrated circuits into 3D printed objects.
Background
The use of 3D printing is becoming more common and more readily available. The product prototype can be built more quickly with 3D printing, allowing for faster time to market. Through 3D printing, designers and creators have new tools for testing ideas and for authoring works and other objects. However, 3D printing may also result in relatively easy copying of other people's products. For example, a successful product that a company requires time and expense to design and produce may be copied and sold by a competitor simply using 3D printing techniques.
As protection against copying, an identification tag may be embedded in the 3D printed object. There are various types of identification tags. One type is known as Radio Frequency Identification (RFID), which involves the use of wirelessly auditable Integrated Circuit (IC) tags. Another type of tag uses Near Field Communication (NFC) for short-range wireless communication. There is a need for a method for embedding a tag into a 3D printed object that is easy and does not interfere too much with the normal 3D printing process. Furthermore, the tag should not be made easily removable from the object.
Therefore, there is a need for a way of embedding ICs in 3D printed products that achieves at least some of the above objectives.
Disclosure of Invention
According to a first aspect of the present invention, there is provided a method for embedding an integrated circuit into a 3D printed object, the method comprising:
providing a filament comprising a material for 3D printing an object, and an integrated circuit embedded within the filament; and
forming the 3D printed object using the filament.
In one or more embodiments, the material is characterized as plastic.
In one or more embodiments, providing the filament further comprises
Melting the material to a liquid state;
embedding one or more integrated circuits within the molten material; and
extruding the molten liquid material into a wire shape.
In one or more embodiments, forming a 3D printed object using the filament further comprises 3D printing the object such that the embedded integrated circuit is embedded within the object during the 3D printing.
In one or more embodiments, the integrated circuit features a tag for identifying the object, and the method further comprises configuring the tag for use in forming the object.
In one or more embodiments, the integrated circuit communicates configuration information with the configuration circuit using wireless communication.
In one or more embodiments, providing the filament further comprises providing the filament including the material for the 3D printed object, the integrated circuit coupled to an antenna, the integrated circuit and the antenna being embedded within the filament.
In one or more embodiments, the antenna comprises one of a wire loop or one or more wire segments.
In one or more embodiments, the antenna comprises two wires, each wire having a first end coupled to the integrated circuit and a second end coupled to a magnet, and during formation of the 3D printed object using the filaments, the filaments fuse to a relatively low viscosity surrounding the magnets and antenna such that magnetic attraction between the magnets causes the magnets to couple together and form a loop antenna.
In one or more embodiments, the antenna is 3D printed on the object using conductive ink.
According to a second aspect of the present invention, there is provided a 3D printing system comprising:
a filament dispenser for storing and dispensing a 3D printed filament, the 3D printed filament comprising material for a 3D printed object, and one or more integrated circuits embedded within the filament;
a platform for providing a countertop for supporting the object while printing the object;
a processor for controlling a printing operation of the 3D printer;
a printer head positioned relative to the platform and coupled to receive the 3D printing filament from the filament dispenser, the printer head for directing deposition of the material for 3D printing the object and at least one of the integrated circuits embedded within the filament under control of the processor; and
an Integrated Circuit (IC) configuration circuit to configure the at least one IC when embedded in the 3D printed object.
In one or more embodiments, the at least one integrated circuit is one of a Near Field Communication (NFC) integrated circuit or a Radio Frequency Identification (RFID) integrated circuit.
In one or more embodiments, the material used for 3D printing the object is plastic.
In one or more embodiments, the 3D printing system additionally includes an antenna coupled to each of the one or more integrated circuits embedded within the filament.
In one or more embodiments, the antenna includes a conductor loop.
In one or more embodiments, the antenna comprises two wires, each wire having a first end coupled to the integrated circuit and a second end coupled to a magnet, the magnetic attraction between the magnets coupled together forming a loop antenna.
According to a third aspect of the invention, there is provided a method for embedding an integrated circuit into a 3D printed object, the method comprising:
melting a plastic material into a liquid state;
embedding one or more integrated circuits within the molten plastic material;
forming the molten liquid plastic material into a strand-shaped filament;
providing the filament for a 3D printed object, at least one of the integrated circuits being embedded within the 3D printed object when the 3D printed object is printed; and
configuring the at least one integrated circuit while printing the 3D printed object.
In one or more embodiments, embedding one or more integrated circuits within the molten plastic material further comprises coupling each of the one or more integrated circuits to an antenna, the integrated circuits and the antenna being embedded within the filament.
In one or more embodiments, the antenna comprises one of a wire loop or one or more wire lengths.
In one or more embodiments, the antenna comprises two wire lengths, and the method further comprises coupling a magnetic coupler to an end of each of the one or more wire lengths.
These and other aspects of the invention are apparent from and will be elucidated with reference to the embodiments described hereinafter.
Drawings
The present invention is illustrated by way of example and is not limited by the accompanying figures, in which like references indicate similar elements. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale.
Fig. 1 illustrates a conceptual diagram of a 3D printing system according to an embodiment.
Fig. 2 shows a portion of a 3D printed filament according to an embodiment.
Fig. 3 illustrates a top view of a 3D printed object formed from the filament of fig. 2, according to an embodiment.
Fig. 4 shows a portion of a 3D printed filament according to an embodiment.
Fig. 5 illustrates a top view of a 3D printed object formed from the filament of fig. 4, according to an embodiment.
Fig. 6 shows a conceptual diagram of an apparatus for forming a 3D printed filament according to an embodiment.
Detailed Description
In general, a method and a 3D printing system for embedding an IC into a 3D printed object are provided. In one embodiment, a filament to provide material for a 3D printed object includes an integrated circuit embedded within the filament. The filament is used in a 3D printing system to form an object and embeds an IC when 3D printing the object. In one embodiment, the IC is configured to be used as a tag for identifying a manufacturing source, such as an object. The IC may have an antenna attached and included in the filament. The IC and antenna may be extruded together when printing the object. The method and 3D printing system may be used to more easily provide objects with embedded ICs, do not complicate the manufacture of the objects, and may be less costly than other methods of embedding ICs.
According to an embodiment, there is provided a method for embedding an integrated circuit into a 3D printed object, the method comprising: providing a filament having a material for a 3D printed object, and an integrated circuit embedded within the filament; and forming the 3D printed object using the filament. The material may be characterized as plastic. The step of providing filaments may additionally comprise melting the material to a liquid state; embedding one or more integrated circuits within the molten material; and extruding the molten liquid material into a wire shape. The step of forming the 3D printed object using the filament may additionally comprise 3D printing the object such that the embedded integrated circuit is embedded within the object during 3D printing. The integrated circuit may be characterized as a tag for identifying an object, and the method may additionally include configuring the tag for use in forming the object. The integrated circuit may communicate configuration information with the configuration circuit using wireless communication. The step of providing a filament may additionally comprise providing a filament comprising a material for a 3D printed object, an integrated circuit coupled to the antenna, the integrated circuit and the antenna being embedded within the filament. The antenna may comprise one of a wire loop or one or more wire segments. The antenna may comprise two wires, each wire having a first end coupled to the integrated circuit and a second end coupled to the magnet, and wherein during formation of the 3D printed object using the filament, the filament may melt to a relatively low viscosity around the magnet and the antenna such that magnetic attraction between the magnets causes the magnets to couple together and form a loop antenna. The antenna 3D may be printed on the object using conductive ink.
In another embodiment, there is provided a 3D printing system, comprising: a filament dispenser for storing and dispensing a 3D printed filament, the 3D printed filament comprising material for a 3D printed object, and one or more integrated circuits embedded within the filament; a platform for providing a countertop for supporting an object while printing the object; a processor for controlling a printing operation of the 3D printer; a printer head positioned relative to the platform and coupled to receive a 3D printing filament from the filament dispenser, the printer head for directing, under control of the processor, deposition of material for 3D printing the object and at least one of the integrated circuits embedded within the filament; and an Integrated Circuit (IC) configuration circuit to configure the at least one IC when embedded in the 3D printed object. The at least one integrated circuit may be one of a Near Field Communication (NFC) integrated circuit or a Radio Frequency Identification (RFID) integrated circuit. The material used for the 3D printed object may be plastic. The 3D printing system may additionally include an antenna coupled to each of the one or more integrated circuits embedded within the filament. The antenna may include a conductor loop. The antenna may comprise two wires, each wire having a first end coupled to the integrated circuit and a second end coupled to a magnet, wherein the magnetic attraction between the magnets coupled together forms a loop antenna.
In yet another embodiment, a method for embedding an integrated circuit into a 3D printed object is provided, which may include: melting a plastic material into a liquid state; embedding one or more integrated circuits within a molten plastic material; forming molten liquid plastic material into a strand-shaped filament; providing a filament for a 3D printed object, wherein at least one of the integrated circuits is embedded within the 3D printed object when the 3D printed object is printed; and configuring the at least one integrated circuit while printing the 3D printed object. The step of embedding the one or more integrated circuits within the molten plastic material may additionally include coupling each of the one or more integrated circuits to an antenna, the integrated circuit and the antenna being embedded within the filament. The antenna may comprise one of a wire loop or one or more wire lengths. The antenna may comprise two wire lengths, and wherein the method may additionally comprise coupling a magnetic coupler to an end of each of the one or more wire lengths.
Fig. 1 illustrates a conceptual diagram of a
The
Generally, there are a number of different materials that may be used in the
A plurality of
The IC may provide any type of functionality. The functionality may include, for example, identification, authentication, and measurement of physical properties, such as temperature or spatial orientation. Furthermore, the functionality may comprise a transmitter circuit for transmitting the respective measurement values. One limitation on the type of IC is determined by size. The size of each IC cannot be larger than the size of the
As described above, the plurality of
The tag may require configuration prior to use. Typically, the tag is not configured when embedded within
Fig. 2 shows a portion of a 3D printed
Fig. 3 illustrates a top view of a 3D printed object 46 being formed with the
Different 3D printed materials require different ranges of temperatures for 3D printing. For most commonly used materials, the temperature may range between 165 ℃ and 250 ℃. This temperature range is outside the operating temperature range set for most ICs. However, exposure to this temperature is for a relatively short time, and is not while the IC is in operation and should not damage most ICs.
Fig. 4 shows a portion of a 3D printed
Fig. 5 illustrates a top view of a 3D printed object 66 formed with
Fig. 6 shows a very schematic view of an
Various embodiments, or portions of embodiments, may be implemented in hardware, or as instructions on a non-transitory machine-readable storage medium, including any mechanism for storing information in a form readable by a machine, such as a personal computer, hand-held computer, file server, smart phone, or other computing device. Non-transitory machine-readable storage media may include volatile and non-volatile memory, such as Read Only Memory (ROM), Random Access Memory (RAM), magnetic disk storage media, optical storage media, NVM, and so forth. The non-transitory machine-readable storage medium does not include a transitory signal.
Although the invention is described herein with reference to specific embodiments, various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of present invention. Any advantages, or solutions to problems that are described herein with regard to specific embodiments are not intended to be construed as a critical, required, or essential feature or element of any or all the claims.
Furthermore, the terms "a" or "an," as used herein, are defined as one or more than one. In addition, the use of introductory phrases such as "at least one" and "one or more" in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles "a" or "an" limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an". The same holds true for the use of definite articles.
Unless otherwise stated, terms such as "first" and "second" are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other priority of such elements.
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