阅读说明：本技术 一种半固体胶的涂胶装置 (Glue spreading device for semi-solid glue ) 是由 赵浩江 薛闯 董吉洪 于 2019-12-06 设计创作，主要内容包括：本发明提供了一种半固体胶的涂胶装置,包括胶室底座、胶室密封盖、胶层厚度调整板、注胶组件、溢胶组件,所述胶室底座的一侧包括注胶凹槽和溢胶凹槽,所述胶室密封盖上设置两个凸台,所述两个凸台分别与注胶凹槽和溢胶凹槽配合并密封连接,形成注胶室和溢胶室；所述注胶组件通过胶室密封盖与注胶室连接,用于向注胶室内注胶,所述溢胶组件通过胶室密封盖与溢胶室连接,用于回收溢胶,所述胶室底座垂直于涂胶面的两个相对的外侧面设置可移动的胶层厚度调整板,所述胶层厚度调整板用于控制胶层的厚度。本发明的涂胶装置可手持操作,实现涂胶与溢胶清理同步进行的功能,而且还可以调节控制半固体胶涂胶厚度。(The invention provides a glue spreading device for semisolid glue, which comprises a glue chamber base, a glue chamber sealing cover, a glue layer thickness adjusting plate, a glue spreading assembly and a glue overflowing assembly, wherein one side of the glue chamber base comprises a glue spreading groove and a glue overflowing groove; the injecting glue subassembly is connected with the injecting glue room through gluey room sealed lid for to the indoor injecting glue of injecting glue, overflow gluey subassembly is connected with overflow gluey room through gluey room sealed lid for retrieve overflow glue, two relative lateral surfaces of gluey room base perpendicular to spreading surface set up mobilizable glue film thickness adjusting plate, glue film thickness adjusting plate is used for controlling the thickness of glue film. The gluing device can be operated by hands, realizes the function of synchronously gluing and cleaning overflowing glue, and can adjust and control the gluing thickness of semisolid glue.)

1. A glue spreading device for semisolid glue is characterized by comprising a glue chamber base, a glue chamber sealing cover, a glue layer thickness adjusting plate, a glue spreading assembly and a glue overflowing assembly,

one side of the glue chamber base comprises a glue injection groove and a glue overflow groove, two bosses are arranged on the glue chamber sealing cover and respectively matched and hermetically connected with the glue injection groove and the glue overflow groove to form a glue injection chamber and a glue overflow chamber;

the glue injection assembly is connected with the glue injection chamber through a glue chamber sealing cover and is used for injecting glue into the glue injection chamber,

the glue overflowing assembly is connected with the glue overflowing chamber through a glue chamber sealing cover and used for recovering the overflowing glue,

two opposite outer side surfaces of the glue chamber base, which are perpendicular to the glue injection surface, are provided with movable glue layer thickness adjusting plates, and the glue layer thickness adjusting plates are used for controlling the thickness of the glue layer.

2. The gluing device for the semi-solid glue according to claim 1, wherein a single row of penetrating glue injecting holes are formed in the glue chamber base corresponding to the glue injecting chamber, and a plurality of rows of glue overflowing holes are formed in the glue chamber base corresponding to the glue overflowing chamber.

3. The apparatus for spreading semi-solid glue of claim 2, wherein the diameter of said glue overflow hole is smaller than the diameter of said glue injection hole.

4. The gluing device of the semi-solid glue according to claim 1, wherein an included angle between the glue injection surface of the glue injection chamber and the glue overflow surface of the glue overflow chamber is 178-179 degrees.

5. The gluing device for the semi-solid glue according to claim 1, wherein the glue injection assembly comprises a glue injection barrel connected with a sealing cover of the glue chamber through a threaded hole, a piston rod of the glue injection barrel connected with the glue injection barrel, a push block connected with the piston rod of the glue injection barrel, a push rod connected with the push block, and a handle connected with the push rod.

6. The apparatus for spreading semi-solid glue according to claim 5, further comprising a handle bracket fixed to said glue chamber base, said handle bracket having a guide hole, said pushing rod passing through said guide hole.

7. The gluing device of claim 5, wherein there are three glue injection barrels and one glue overflow barrel.

8. The apparatus for spreading semi-solid glue according to claim 1, wherein said glue overflow assembly comprises an elbow fitting connected to the sealing lid of the glue chamber via a threaded hole, and a glue overflow barrel connected to the elbow fitting.

9. The gluing device of claim 6, wherein the sealing cover of the glue chamber is provided with an elastic buckle for fixing the glue overflow barrel.

10. The gluing device of the semi-solid glue according to claim 1, wherein the glue layer thickness adjusting plate is connected with the glue chamber base through a screw, a U-shaped hole is formed in the screw joint of the glue layer thickness adjusting plate, and the U-shaped hole is used for adjusting the thickness of the glue layer.

Technical Field

The invention relates to the technical field of glue coating, in particular to a glue coating device for semisolid glue.

Background

Gluing is one of the commonly used means of joining carbon fiber composite parts. The control of the thickness of the glue layer during gluing influences the bonding strength between parts, and the level of glue overflow cleaning operation influences the appearance of a product after bonding. The bonding between the carbon fiber composite parts is often a semi-solid glue with limited working time. Once the preparation is complete, these glues have to be applied for a limited time and left still. This requires that the thickness of the applied glue be controlled and the cleaning of the glue overflow be accomplished in a limited time. The traditional hand-held type gluing tool (such as a scraper blade, a brush and the like) can not realize gluing and excessive glue cleaning simultaneously in one gluing stroke, and the thickness of a glue layer is difficult to control. In order to solve the problems, the invention provides a handheld semi-solid glue applicator capable of controlling the thickness of a glue layer, which can simultaneously realize gluing and overflow glue collection in one gluing stroke and can control the thickness of the glue layer.

Disclosure of Invention

The invention aims to provide a glue spreading device for semisolid glue, which solves the problems that the glue layer thickness is difficult to control and the overflowing glue cannot be cleaned in time when the semisolid glue is manually spread at present.

In order to solve the technical problem, the invention provides a glue spreading device for semisolid glue, which comprises a glue chamber base, a glue chamber sealing cover, a glue layer thickness adjusting plate, a glue spreading assembly and a glue overflowing assembly, wherein one side of the glue chamber base comprises a glue spreading groove and a glue overflowing groove; the injecting glue subassembly is connected with the injecting glue room through gluey room sealed lid for to the indoor injecting glue of injecting glue, overflow gluey subassembly and overflow gluey room through gluey room sealed lid and be connected for retrieve overflow glue, two relative lateral surfaces of gluey room base perpendicular to injecting glue face set up mobilizable glue film thickness adjusting plate, glue film thickness adjusting plate is used for controlling the thickness of glue film.

Furthermore, a single row of through glue injection holes are formed in the glue chamber base corresponding to the glue injection chambers, and a plurality of rows of glue overflow holes are formed in the glue chamber base corresponding to the glue overflow chambers.

Further, the diameter of the glue overflow hole is smaller than that of the glue injection hole.

Furthermore, the included angle between the glue injection surface of the glue injection chamber and the glue overflow surface of the glue overflow chamber is 178-179 degrees.

Furthermore, the injecting glue subassembly includes the injecting glue bucket of being connected through the screw hole with the sealed lid of gluey room, with the injecting glue bucket piston rod that the injecting glue bucket is connected, the bulldozing piece of being connected with gluey bucket piston rod, the bulldozing pole of being connected with the bulldozing piece, and the handle of being connected with the bulldozing pole.

The rubber chamber is characterized by further comprising a handle support, the handle support is fixed on the rubber chamber base, a guide hole is formed in the handle support, and the pushing rod penetrates through the guide hole.

Furthermore, the number of the glue injection barrels is three, and the number of the glue overflow barrels is one.

Furthermore, overflow and glue the subassembly and include with the sealed elbow fitting that passes through the screw hole and be connected of gluey room, with the excessive gluey bucket of elbow fitting connection.

Furthermore, an elastic buckle is arranged on the sealing cover of the glue chamber and used for fixing the glue overflowing barrel.

Furthermore, the glue layer thickness adjusting plate is connected with the glue chamber base through screws, U-shaped holes are formed in the screw connection positions of the glue layer thickness adjusting plate, and the U-shaped holes are used for adjusting the thickness of the glue layer.

The invention has the beneficial effects that: compared with the prior art, the gluing device provided by the invention can be operated by hands, the function of synchronously gluing and overflowing glue cleaning is realized, and the thickness of semi-solid glue can be adjusted and controlled.

Drawings

Fig. 1 is a schematic structural diagram of a semi-solid glue spreading device provided by an embodiment of the invention.

Fig. 2 is an exploded view of a semi-solid glue spreading device provided by the embodiment of the invention.

FIG. 3 is a front view of a semi-solid glue spreading device provided by an embodiment of the present invention;

FIG. 4 is a cross-sectional view of a side A-A of a semi-solid glue applicator according to an embodiment of the present invention;

fig. 5 is a cross-sectional view of a side B-B of the semi-solid glue spreading device provided by the embodiment of the invention.

1. A handle; 2. a handle bracket; 3. a push block; 4. a rubber barrel piston; 5. a glue injection barrel;

6. a pipe bending joint; 7. elastic buckle; 8. a rubber chamber sealing cover; 9. a glue chamber base;

10. a glue layer thickness adjusting plate; 11. adjusting the screw; 12. a glue overflow barrel; 13. a push rod.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to make the description of the present disclosure more complete and complete, the following description is given for illustrative purposes with respect to the embodiments and examples of the present invention; it is not intended to be the only form in which the embodiments of the invention may be practiced or utilized. The embodiments are intended to cover the features of the various embodiments as well as the method steps and sequences for constructing and operating the embodiments. However, other embodiments may be utilized to achieve the same or equivalent functions and step sequences.