阅读说明：本技术 感光性树脂组合物、树脂膜和电子装置 (Photosensitive resin composition, resin film, and electronic device ) 是由 川浪卓士 池田拓司 于 2018-06-13 设计创作，主要内容包括：本发明提供一种感光性树脂组合物,其包含：特定结构的硅烷化合物、碱溶性树脂和感光剂,该特定结构的硅烷化合物具有仲胺结构和在分子的两个末端的特定的含硅结构。并且,本发明提供一种树脂膜,其通过使该感光性树脂组合物固化而形成。并且,本发明提供一种电子装置,其包括该树脂膜。作为碱溶性树脂,优选为聚酰胺树脂。作为感光剂,优选为重氮醌化合物。(The present invention provides a photosensitive resin composition, which comprises: a silane compound of a specific structure having a secondary amine structure and specific silicon-containing structures at both ends of the molecule, an alkali-soluble resin, and a photosensitizer. The present invention also provides a resin film formed by curing the photosensitive resin composition. Also, the present invention provides an electronic device comprising the resin film. As the alkali-soluble resin, a polyamide resin is preferable. As the photosensitizer, a diazoquinone compound is preferable.)

1. A photosensitive resin composition, comprising:

a silane compound represented by the following general formula (1);

an alkali-soluble resin; and

a light-sensitive agent,

in the above general formula (1), R¹Represents an organic group having 1 to 30 carbon atoms, wherein R is¹Except for the group containing an aromatic ring in (A),

R²and R³Each independently represents an organic group having 1 to 30 carbon atoms,

a independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms, A may be the same or different, at least one of A is one selected from the group consisting of a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms,

each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms, and B may be the same or different from each other, and at least one of B is one selected from the group consisting of a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.

2. The photosensitive resin composition according to claim 1, wherein:

the R in the general formula (1)¹Is an alkylene group having 1 to 30 carbon atoms.

3. The photosensitive resin composition according to claim 1 or 2, wherein:

the alkali-soluble resin is one or more selected from the group consisting of a phenol resin, a hydroxystyrene resin, a cyclic olefin resin, a polyamide resin, a polyimide resin, and a polybenzoxazole resin.

4. The photosensitive resin composition according to claim 3, wherein:

the alkali-soluble resin comprises the polyamide resin,

the polyamide resin comprises a structural unit represented by the following formula (PA1),

5. the photosensitive resin composition according to any one of claims 1 to 4, wherein:

the silane compound is contained in an amount of 0.01 to 30 parts by mass per 100 parts by mass of the alkali-soluble resin.

6. The photosensitive resin composition according to any one of claims 1 to 5, wherein:

the photosensitizer is a diazoquinone compound.

7. The photosensitive resin composition according to any one of claims 1 to 6, wherein:

for forming a permanent film used as an interlayer film, a surface protective film or a dam member.

8. A resin film characterized in that:

formed by curing the photosensitive resin composition according to any one of claims 1 to 7.

9. An electronic device, characterized in that:

comprising the resin film of claim 8.

Technical Field

The invention relates to a photosensitive resin composition, a resin film and an electronic device.

Background

In the field of photosensitive resin compositions, various techniques have been developed so far for obtaining a cured film which does not cause pattern peeling or floating at the time of development and has good adhesion to a base substrate after heat curing treatment and after chemical treatment. As such a technique, for example, the technique described in patent document 1 can be cited.

Patent document 1 describes that the use of a silane compound having a specific structure can suppress peeling and bleeding during alkali development of a photosensitive resin composition on a metal substrate. Further, patent document 1 describes that a cured film obtained by thermally curing a photosensitive resin composition exhibits good adhesion to a metal substrate.

Disclosure of Invention

Technical problem to be solved by the invention

The present inventors have studied the adhesion between an aluminum (Al) pad provided for input/output of a substrate of an electronic device and a copper (Cu) circuit as a circuit and a permanent film when the photosensitive resin composition described in patent document 1 is used as the permanent film of the electronic device. The permanent film is a cured film obtained by: a resin film formed of a photosensitive resin composition is subjected to prebaking, exposure, and development, and is patterned into a desired shape, and then subjected to postbaking to cure the resin film.

The results of the above studies make clear: the photosensitive resin composition described in patent document 1 does not exhibit adhesion to the Al pad if the temperature of the prebaking is not high, for example, 120 ℃. Therefore, the photosensitive resin composition may be disadvantageously peeled off from the Al pad.

On the other hand, it is clear that: when the temperature of the prebaking is high, for example, 120 ℃ or higher, the adhesion between the copper circuit and the photosensitive resin composition described in patent document 1 becomes excessively large before development. Therefore, when the photosensitive resin composition is developed to form a via hole exposing the Cu circuit, the photosensitive resin composition cannot be completely removed by the development, and the residue of the photosensitive resin composition is generated in the via hole. Further, if a residue is generated, there is a problem that the electrical reliability of the electronic device is lowered.

As described above, it was clarified that: the adhesion between the photosensitive resin composition after prebaking and the Al pad and the generation of residues of the photosensitive resin composition during development are in a trade-off relationship depending on the prebaking temperature.

Here, the present inventors have studied the adhesion between a cured film of a photosensitive resin composition after post-baking and a metal such as an Al pad or a copper circuit when the photosensitive resin composition described in patent document 1 is used as a permanent film of an electronic device. As a result, it was found that: the photosensitive resin composition described in patent document 1 has insufficient adhesion to metals such as Al pads and copper circuits. Thus, when a fine relief pattern or the like is formed on the photosensitive resin composition and the contact area between the cured film of the photosensitive resin composition and the metal is very small, the cured film may peel off.

Specific examples of the permanent film of the electronic device include an insulating film of the electronic device.

The present inventors have studied the chemical resistance of an insulating film in the case of forming a 2-layer insulating film when the photosensitive resin composition described in patent document 1 is used as an insulating film of an electronic device.

Here, a method of forming 2 insulating films will be described as an example. In the manufacturing process of an electronic device, after a1 st insulating film is formed, a through hole is formed by pre-baking, exposing and developing the interlayer insulating film, and after post-baking, a metal wiring is formed through the through hole. Next, a2 nd insulating film is formed on the 1 st insulating film and the metal wiring. Here, as a method for forming the 2 nd layer insulating film, a method of applying a varnish of a photosensitive resin composition is used. The varnish of the photosensitive resin composition contains a solvent such as N-methylpyrrolidone (NMP).

As a result of the above-described examination, if the photosensitive resin composition described in patent document 1 is used to form the 1 st insulating film, NMP dissolves the 1 st insulating film and cracks may occur when the 2 nd insulating film is formed.

As described above, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method for improving the adhesion between a photosensitive resin composition after prebaking and an Al pad and suppressing the generation of residue of the photosensitive resin composition at the time of development in a well-balanced manner. The present invention also aims to improve the adhesion between the cured film of the post-baked photosensitive resin composition and a metal such as Al, and to improve the chemical resistance of the post-baked photosensitive resin composition.

Means for solving the problems

The present inventors have studied raw material components of a photosensitive resin composition capable of improving the adhesion to an Al pad even when prebaking is performed at a low temperature in order to exhibit an improvement in the adhesion between the photosensitive resin composition after prebaking and the Al pad and a suppression of the generation of residues of the photosensitive resin composition at the time of development in a good balance. As a result, it was found that: by using a silane compound having a specific structure as a raw material component, the adhesion between the prebaked photosensitive resin composition and the Al pad can be improved even when the prebaking is performed at a low temperature of less than 120 ℃.

And, it was clarified that: by using the silane compound having the above-mentioned specific structure, the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as Al can be improved.

Moreover, it is clear that: by using the silane compound having the specific structure, the chemical resistance of the photosensitive resin composition after post-baking can be improved.

As described above, the present inventors found that: the silane compound having a specific structure enables the adhesion between the photosensitive resin composition after prebaking and the Al pad to be improved and the generation of residues of the photosensitive resin composition to be suppressed during development to be exhibited in good balance, and also enables the adhesion between the cured film of the photosensitive resin composition after postbaking and a metal such as Al to be improved and the chemical resistance of the photosensitive resin composition after postbaking to be improved, thereby completing the present invention.

According to the present invention, there is provided a photosensitive resin composition comprising:

a silane compound represented by the following general formula (1);

an alkali-soluble resin; and

a photosensitizer.

(in the above general formula (1), R¹Represents an organic group having 1 to 30 carbon atoms.

Wherein R is¹Except for organic groups containing aromatic rings.

R²And R³Each independently represents an organic group having 1 to 30 carbon atoms.

A independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be the same as or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.

Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be the same as or different from each other. At least one of B is selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

Further, the present invention provides a resin film formed by curing the photosensitive resin composition.

Also, according to the present invention, an electronic device including the resin film described above can be provided.

Effects of the invention

The invention can provide a photosensitive resin composition which can show the improvement of the adhesion between a pre-baked photosensitive resin composition and an Al pad and the inhibition of the generation of residues of the photosensitive resin composition during development in a good balance, can also improve the adhesion between a cured film of the post-baked photosensitive resin composition and a metal such as Al, and can improve the chemical resistance of the post-baked photosensitive resin composition.

Drawings

The above and other objects, features and advantages will become more apparent from the following description of preferred embodiments and the accompanying drawings attached hereto.

Fig. 1 is a sectional view showing an example of an electronic device according to the present embodiment.

Detailed Description

The present embodiment will be described below with reference to the accompanying drawings as appropriate. In all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.

In the present specification, the silane compound represented by the general formula (1) may be expressed as "a silane compound having a specific structure" or the like.

The photosensitive resin composition of the present embodiment includes: a silane compound of a specific structure; an alkali-soluble resin; and a photosensitizer.

The present inventors have studied raw material components of a photosensitive resin composition capable of improving the adhesion to an Al pad even when prebaking is performed at a low temperature in order to obtain a photosensitive resin composition which exhibits an improved adhesion between the photosensitive resin composition after prebaking and the Al pad and which suppresses generation of residues of the photosensitive resin composition at the time of development in a well-balanced manner. As a result, it was found that: by using a silane compound having a specific structure as a raw material component, the adhesion between the prebaked photosensitive resin composition and the Al pad can be improved even when the prebaking is performed at a low temperature of less than 120 ℃. The detailed mechanism is not clear, but the following reason is presumed.

First, the molecule of the silane compound having the specific structure described above has a structure represented by-SiA at each of 2 terminals of the structure of the molecule₃or-SiB₃The group shown. It is assumed that the silane compound having the specific structure and the alkali-soluble resin that is a component of the photosensitive resin composition form a crosslinked structure through these groups. Here, the silane compound having the above-mentioned specific structure has 2 lone-pair electrons derived from a nitrogen atom of a secondary amine, and is considered to interact strongly with an Al atom as compared with a conventional silane compound. The crosslinked structure contains a nitrogen atom of a secondary amine. Thus, it is considered that the crosslinked structure of the silane compound containing the above-described specific structure strongly interacts with Al atoms.

Therefore, it is presumed that the photosensitive resin composition of the present embodiment can sufficiently improve the adhesion between the photosensitive resin composition and Al even when prebaking is performed at a low temperature of less than 120 ℃.

The present inventors have studied raw material components of a photosensitive resin composition that can improve the adhesion between a cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad when the photosensitive resin composition is used as a permanent film of an electronic device. As a result, it was found that: by using the silane compound having the above-mentioned specific structure as a raw material component, the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad can be improved. The detailed mechanism is not clear, but the reason is presumed as follows.

As described above, it is presumed that the silane compound having the above-described specific structure forms a crosslinked structure with the alkali-soluble resin. Here, it is considered that the molecular structure of the specific silane compound functions as a flexible skeleton in the photosensitive resin composition. Accordingly, it is considered that the flexible skeleton can relax the internal stress of the photosensitive resin composition after post-baking. Therefore, it is considered that the destruction of the interface of the contact surface between the photosensitive resin composition and the metal due to the increase of the internal stress when the photosensitive resin composition is post-baked is suppressed.

Further, the present inventors have studied raw material components of a photosensitive resin composition that can improve the chemical resistance of the photosensitive resin composition after post-baking. As a result, it was found that: by using the silane compound having the above-mentioned specific structure as a raw material component, the chemical resistance of a cured film of the photosensitive resin composition after post-baking can be improved. The detailed mechanism is not clear, but the reason is presumed as follows.

As described above, it is presumed that the silane compound having the above-described specific structure forms a crosslinked structure with the alkali-soluble resin. Therefore, it is considered that the crosslinking density of the photosensitive resin composition is increased, and the molecules of the chemical can be inhibited from entering the photosensitive resin composition.

As described above, it is presumed that, by containing a silane compound having a specific structure in the photosensitive resin composition of the present embodiment, even when the prebaking is performed at a low temperature of less than 120 ℃, the adhesion between the prebaked photosensitive resin composition and the Al pad can be sufficiently improved. Furthermore, since the prebaking at a low temperature of less than 120 ℃ can be realized, the generation of residues of the photosensitive resin composition at the time of development can be suppressed.

Further, it is presumed that the photosensitive resin composition of the present embodiment contains a silane compound having a specific structure, and thus the adhesion between the cured film of the photosensitive resin composition after post-baking and a metal such as an Al pad can be improved.

Further, by containing a silane compound having a specific structure in the photosensitive resin composition of the present embodiment, the chemical resistance of the photosensitive resin composition after post-baking can be improved.

First, each raw material component of the photosensitive resin composition of the present embodiment will be explained.

(silane Compound)

The silane compound is represented by the following general formula (1), for example, preferably represented by the following general formula (2), and more preferably represented by the following general formula (3). Thus, the silane compound easily forms a crosslinked structure, and the internal stress can be appropriately relaxed. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.

(in the above general formula (1), R¹Represents an organic group having 1 to 30 carbon atoms. Wherein R is¹Except for organic groups containing aromatic rings.

R²And R³Each independently represents an organic group having 1 to 30 carbon atoms.

A independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be the same as or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.

Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be the same as or different from each other. At least one of B is selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

(in the above general formula (2), R¹Represents an organic group having 1 to 30 carbon atoms. Wherein R is¹Except for organic groups containing aromatic rings.

R²Represents an organic group having 1 to 30 carbon atoms.

A independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be the same as or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.

Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be the same as or different from each other. At least one of B is selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

(in the above general formula (3), R¹Represents an organic group having 1 to 30 carbon atoms. Wherein R is¹Except for organic groups containing aromatic rings.

A independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. A may be the same as or different from each other. At least one of A is one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms.

Each B independently represents a hydroxyl group or an organic group having 1 to 30 carbon atoms. B may be the same as or different from each other. At least one of B is selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. )

R in the above general formulae (1) to (3)¹～R³The organic group has 1 to 30 carbon atoms, and is preferably an organic group having 1 to 10 carbon atoms, more preferably an organic group having 1 to 7 carbon atoms, still more preferably an organic group having 1 to 5 carbon atoms, and particularly preferably an organic group having 1 to 3 carbon atoms. This can further increase the crosslinking density. Therefore, the chemical resistance of the cured film of the photosensitive resin composition can be improved.

Constituent R in the above general formulae (1) to (3)¹～R³The organic group of (a) may contain atoms other than hydrogen and carbon in the structure of the organic group, for example.

Specific examples of the atoms other than hydrogen and carbon include an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a fluorine atom, a chlorine atom, and the like. As atoms other than hydrogen and carbon, one or two or more of the above-mentioned specific examples may be contained.

R in the above general formulae (1) to (3)¹Specific examples thereof include alkylene groups.

The alkylene group may be, for example, a linear alkylene group or a branched alkylene groupA cyclic alkylene group. Specific examples of the linear alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. Specific examples of the branched alkylene group include-C (CH)₃)₂-、-CH(CH₃)-、-CH(CH₂CH₃)-、-C(CH₃)(CH₂CH₃)-、-C(CH₃)(CH₂CH₂CH₃)-、-C(CH₂CH₃)₂-isoalkylmethylene; -CH (CH)₃)CH₂-、-CH(CH₃)CH(CH₃)-、-C(CH₃)₂CH₂-、-CH(CH₂CH₃)CH₂-、-C(CH₂CH₃)₂-CH₂An isoalkylethylene group and the like.

As R¹For example, an alkylene group is preferable, and a linear alkylene group is more preferable. Whereby R¹Has a flexible structure so that internal stress can be appropriately relaxed. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved. Further, the conformational restriction is reduced around the nitrogen atom derived from the secondary amine of the silane compound, and the nitrogen atom can more appropriately interact with a metal atom such as Al. Therefore, even when the prebaking is performed at a low temperature of less than 120 ℃, the adhesion between the prebaked photosensitive resin composition and the Al pad can be sufficiently improved.

R in the above general formulae (1) to (3)¹Organic groups containing aromatic rings are excluded. This makes it possible to suppress an increase in internal stress during the post-baking because there is no aromatic ring as a rigid structure. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.

Specific examples of the aromatic ring include: a benzene ring; fused aromatic rings such as naphthalene ring, anthracene ring, pyrene ring, etc.; heteroaromatic rings such as pyridine ring and pyrrole ring.

R in the above general formulae (1) to (2)²R in the above general formula (1)³Specific examples thereof include alkylene groups and arylene groups.

The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group. Specific examples of the branched alkylene group include-C (CH)₃)₂-、-CH(CH₃)-、-CH(CH₂CH₃)-、-C(CH₃)(CH₂CH₃)-、-C(CH₃)(CH₂CH₂CH₃)-、-C(CH₂CH₃)₂-isoalkylmethylene; -CH (CH)₃)CH₂-、-CH(CH₃)CH(CH₃)-、-C(CH₃)₂CH₂-、-CH(CH₂CH₃)CH₂-、-C(CH₂CH₃)₂-CH₂An isoalkylethylene group and the like.

Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthracenylene group, and a group in which 2 or more arylene groups are bonded to each other.

As R²And R³For example, an alkylene group is preferable. This can suppress an increase in internal stress during the post baking. Therefore, the adhesion between the cured film of the photosensitive resin composition and the metal can be improved.

Each of a in the above general formulae (1) to (3) is independently a hydroxyl group or an organic group having 1 to 30 carbon atoms, preferably a hydroxyl group or an organic group having 1 to 10 carbon atoms, more preferably a hydroxyl group or an organic group having 1 to 3 carbon atoms, and still more preferably a hydroxyl group or an organic group having 1 to 2 carbon atoms. From this, it is considered that the molecular chain of the silane compound is easily incorporated into the crosslinked structure.

As a in the above general formulae (1) to (3), at least one selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms is sufficient, preferably 2 or more selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms, and more preferably 3 of a are selected from a hydroxyl group and an alkoxy group having 1 to 30 carbon atoms. It is thus presumed that the molecular chains of the silane compound are bonded to each other and are liable to undergo oligomerization. Therefore, a more appropriate shape of the flexible molecular chain can be formed.

A plurality of a in the above general formulae (1) to (3) may be the same as or different from each other. The plurality of a is preferably, for example, the same as each other. Thereby, the molecular chain of the silane compound is uniformly introduced into the crosslinked structure. Therefore, local concentration of internal stress can be suppressed.

Specific examples of a other than the alkoxy group having 1 to 30 carbon atoms in the general formulae (1) to (3) include: an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, or a decyl group; alkenyl groups such as allyl, pentenyl and vinyl; alkynyl groups such as ethynyl; alkylene groups such as methylene and ethylene; aryl groups such as tolyl, xylyl, phenyl, naphthyl, and anthracenyl; aralkyl groups such as benzyl and phenethyl; cycloalkyl groups such as adamantyl, cyclopentyl, cyclohexyl, and cyclooctyl; and alkylaryl groups such as tolyl and xylyl.

B in the above general formulae (1) to (3) may be the same as a. Similarly, a plurality of B and a may be the same as or different from each other.

Specific examples of the silane compound represented by the general formula (1) of the present embodiment include N, N ' -bis [3- (trimethoxysilyl) propyl ] ethylenediamine, N ' -bis- (3-triethoxysilylpropyl) ethylenediamine, N ' -bis [3- (methyldimethoxysilyl) propyl ] ethylenediamine, N ' -bis [3- (methyldiethoxysilyl) propyl ] ethylenediamine, N ' -bis [3- (dimethylmethoxysilyl) propyl ] ethylenediamine, N- [3- (methyldimethoxysilyl) propyl ] -N ' - [3- (trimethoxysilyl) propyl ] ethylenediamine, N ' -bis [3- (trimethoxysilyl) propyl ] diaminopropane, N ' -bis (3- (trimethoxysilyl) propyl) ethylenediamine, N ' -bis (3- (trimethoxysilyl) propyl) ethylenediamine, N ' -bis (3- (trimethoxysilyl) propyl) ethylenediamine, N ' -, N, N '-bis [3- (trimethoxysilyl) propyl ] diaminohexane, N' -bis [3- (trimethoxysilyl) propyl ] diethylenetriamine, and the like.

As the silane compound represented by the above general formula (1), a reaction product of 3-methacryloxypropyltrimethoxysilane and N-2- (aminoethyl) -3-aminopropyltrimethoxysilane can also be used. As a commercial product of this reaction product, KBM-425 manufactured by shin-Etsu chemical Co., Ltd.

The lower limit of the content of the silane compound in the photosensitive resin composition is, for example, preferably 0.01 part by mass or more, more preferably 1.0 part by mass or more, further preferably 2.0 parts by mass or more, further preferably 2.5 parts by mass or more, and particularly preferably 3.0 parts by mass or more, relative to 100 parts by mass of an alkali-soluble resin described later. Thereby, the alkali-soluble resin can be appropriately crosslinked by the silane compound. Therefore, the adhesion between the prebaked photosensitive resin composition and the Al pad can be improved, and the chemical resistance of the postbaked photosensitive resin composition can be improved.

The upper limit of the content of the silane compound in the photosensitive resin composition is preferably 30 parts by mass or less, more preferably 15 parts by mass or less, and still more preferably 10 parts by mass or less, with respect to 100 parts by mass of the alkali-soluble resin, for example. Thus, the silane compound exerts a flexible action without impairing the mechanical strength of a resin film formed from the photosensitive resin composition. Therefore, the adhesion between the photosensitive resin composition after post-baking and a metal such as Al can be improved.

(alkali-soluble resin)

The alkali-soluble resin is not limited and may be selected according to physical properties such as mechanical properties and optical properties required for the resin film. Specific examples of the alkali-soluble resin include a phenol resin, a hydroxystyrene resin, a cyclic olefin resin, a polyamide resin, a polyimide resin, and a polybenzoxazole resin. As the alkali-soluble resin, for example, a polyamide resin or a polybenzoxazole resin is preferably used, and a polyamide resin is more preferably used. Thus, the alkali-soluble resin and the silane compound can preferably form a crosslinked structure.

As the alkali-soluble resin, one or two or more of the above-described specific examples may be contained.

Specific examples of the phenolic resin include: novolak-type phenol resins such as phenol novolak resins, cresol novolak resins, bisphenol novolak resins, and phenol-diphenol novolak resins; a reaction product of a phenol compound such as a novolak-type phenol resin, a resol-type phenol resin, or a cresol novolak resin with an aldehyde compound; and a reaction product of a phenol compound such as a phenol aralkyl resin and a dimethanol compound. The phenol resin may include one or two or more of the above specific examples.

The phenol compound used as the reactant of the phenol compound and the aldehyde compound or the reactant of the phenol compound and the dimethanol compound is not limited.

Specific examples of such a phenol compound include: cresols such as phenol, o-cresol, m-cresol and p-cresol; xylenols such as 2, 3-xylenol, 2, 4-xylenol, 2, 5-xylenol, 2, 6-xylenol, 3, 4-xylenol, and 3, 5-xylenol; ethyl phenols such as o-ethylphenol, m-ethylphenol and p-ethylphenol; alkylphenols such as isopropyl phenol, butyl phenol and p-tert-butyl phenol; polyhydric phenols such as resorcinol, catechol, hydroquinone, pyrogallol, and phloroglucinol; biphenyl-based phenols such as 4, 4' -biphenol. As the phenol compound, one or two or more of the above specific examples can be used.

The aldehyde compound used as the reactant of the phenol compound and the aldehyde compound is not limited as long as it is a compound having an aldehyde group.

Specific examples of such aldehyde compounds include formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde, and salicylaldehyde. As the aldehyde compound, one or two or more of the above-mentioned specific examples can be used.

The dimethanol compound used as the reactant for the phenol compound and the dimethanol compound is not limited.

Specific examples of such a dimethanol compound include: dimethanol compounds such as 1, 4-benzenedimethanol, 1, 3-benzenedimethanol, 4 '-biphenyldimethanol, 3' -biphenyldimethanol, 2, 6-naphthalenedimethanol, and 2, 6-bis (hydroxymethyl) -p-cresol; bis (haloalkyl) compounds such as 1, 4-bis (methoxymethyl) benzene, 1, 3-bis (methoxymethyl) benzene, 4 ' -bis (methoxymethyl) biphenyl, 3 ' -bis (methoxymethyl) biphenyl, and methyl 2, 6-naphthalenedicarboxylate, or bis (haloalkyl) compounds such as 1, 4-bis (chloromethyl) benzene, 1, 3-bis (chloromethyl) benzene, 1, 4-bis (bromomethyl) benzene, 1, 3-bis (bromomethyl) benzene, 4 ' -bis (chloromethyl) biphenyl, 3 ' -bis (chloromethyl) biphenyl, 4 ' -bis (bromomethyl) biphenyl, 3,4 ' -bis (bromomethyl) biphenyl, and 3,3 ' -bis (bromomethyl) biphenyl, And biphenyl aralkyl compounds such as 4,4 '-bis (methoxymethyl) biphenyl and 4, 4' -bis (methoxymethyl) biphenyl. As the dimethanol compound, one or two or more of the above-mentioned specific examples can be used.

The hydroxystyrene resin is not limited, and specifically, a polymerization reactant or a copolymerization reactant obtained by polymerizing or copolymerizing one or more species selected from the group consisting of hydroxystyrene, hydroxystyrene derivatives, styrene and styrene derivatives can be used.

The cyclic olefin resin is not particularly limited, and for example, a polymerization product or a copolymerization product obtained by polymerizing or copolymerizing one or two or more kinds selected from norbornene and norbornene derivatives can be used.

Specific examples of the norbornene derivative include norbornadiene, bicyclo [2.2.1] -hept-2-ene (conventional name: 2-norbornene), 5-methyl-2-norbornene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-allyl-2-norbornene, 5- (2-propenyl) -2-norbornene, 5- (1-methyl-4-pentenyl) -2-norbornene, 5-ethynyl-2-norbornene, 5-benzyl-2-norbornene, 5-norbornen-2-ene, and the like, 5-phenethyl-2-norbornene, 2-acetyl-5-norbornene, methyl 5-norbornene-2-carboxylate, 5-norbornene-2, 3-dicarboxylic anhydride and the like.

In addition, the cyclic olefin resin may have a structural unit other than the cyclic olefin monomer (for example, the norbornene derivative described above). For example, a copolymer of a cyclic olefin monomer and maleic anhydride may be used. By copolymerizing maleic anhydride with a cyclic olefin resin, the alkali solubility can be significantly improved.

The polyamide resin of the present embodiment preferably uses, for example, an aromatic polyamide containing an aromatic ring in a structural unit of the polyamide, and more preferably contains a structural unit represented by the following formula (PA 1). Thus, the molecular chains of the polyamide resin are hydrogen-bonded to each other via the amide groups to form a compact structure, and intrusion of molecules of chemicals into the photosensitive resin composition can be suppressed. Therefore, the chemical resistance after the post-baking can be improved.

In the present embodiment, the aromatic ring represents: a benzene ring; fused aromatic rings such as naphthalene ring, anthracene ring, pyrene ring, etc.; heteroaromatic rings such as pyridine ring and pyrrole ring. From the viewpoint of forming the above-described compact structure, the polyamide resin of the present embodiment preferably contains a benzene ring as an aromatic ring.

The polyamide resin containing the structural unit represented by the above formula (PA1) is a precursor of a polybenzoxazole resin. The polyamide resin containing the structural unit represented by the above formula (PA1) can be dehydrated and ring-closed to form a polybenzoxazole resin by, for example, heat treatment at a temperature of 150 to 380 ℃ for 30 minutes to 50 hours. Here, the structural unit of the formula (PA1) becomes a structural unit represented by the following formula (PBO1) by dehydration ring closure.

In the case where the alkali-soluble resin of the present embodiment is a polyamide resin containing a structural unit represented by the above formula (PA1), for example, the photosensitive resin composition may be subjected to the above heat treatment to dehydrate and close the ring, thereby forming a polybenzoxazole resin. That is, the photosensitive resin composition subjected to the heat treatment described above contains a polybenzoxazole resin as an alkali-soluble resin.

When the alkali-soluble resin is a polyamide resin containing a structural unit represented by the above formula (PA1), the resin film or the electronic device described later may be subjected to the above-described heat treatment to dehydrate and close the ring, thereby forming a polybenzoxazole resin. In the case of forming a polybenzoxazole resin, the tensile elongation at break can be increased. This is advantageous in that the strength of the resin film and the electronic device can be improved.

As the polyamide resin, for example, a polyamide resin containing a structural unit represented by the following general formula (PAM) can be used.

The polyamide resin containing a structural unit represented by the following general formula (PAM) is a precursor of a polyimide resin. The polyamide resin containing a structural unit represented by the following general formula (PAM) can be subjected to, for example, heat treatment at a temperature of 150 ℃ to 380 ℃ for 30 minutes to 50 hours, thereby performing ring closure by dehydration to form a polyimide resin. Here, the structural unit of the following formula (PAM) becomes a structural unit represented by the following formula (PI1) by dehydration ring closure.

In the case where the alkali-soluble resin is a polyamide resin containing a structural unit represented by the following formula (PAM), the polyimide resin can be formed by subjecting the photosensitive resin composition to heat treatment to dehydrate and ring-close. That is, the photosensitive resin composition subjected to heat treatment may contain a polyimide resin as an alkali-soluble resin.

When the alkali-soluble resin is a polyamide resin containing a structural unit represented by the following formula (PAM), for example, a polyimide resin may be formed by dehydration ring closure by heat treatment after an electronic device described later is manufactured.

In the general formula (PAM), R^BAnd R^CEach independently represents an organic group having 1 to 30 carbon atoms.

In the general formula (PI1), R^BAnd R^CThe same as in the above general formula (PAM).

R in the general formula (PAM) or the general formula (PI1)^BAnd R^CSpecifically, an organic group having an aromatic ring is preferable.

Specifically, the organic group having an aromatic ring preferably includes a benzene ring, a naphthalene ring, or an anthracene ring, and more preferably includes a benzene ring.

For example, the lower limit of the alkali-soluble resin content in the photosensitive resin composition is preferably 30 parts by mass or more, more preferably 40 parts by mass or more, further preferably 50 parts by mass or more, further preferably 60 parts by mass or more, and particularly preferably 70 parts by mass or more, assuming that the total solid content of the photosensitive resin composition is 100 parts by mass. Thus, the photosensitive resin composition can exhibit appropriate photosensitivity. Therefore, the generation of residue of the photosensitive resin composition during development can be suppressed. Therefore, it is possible to improve the adhesion between the photosensitive resin composition after prebaking and the Al pad and to suppress the generation of residues of the photosensitive resin composition during development with a further good balance.

For example, the upper limit of the alkali-soluble resin content in the photosensitive resin composition is preferably 90 parts by mass or less, more preferably 85 parts by mass or less, and still more preferably 80 parts by mass or less, assuming that the total solid content of the photosensitive resin composition is 100 parts by mass. Thus, the alkali-soluble resin can form a cross-linked structure appropriately by the silane compound, and the chemical resistance of the photosensitive resin composition after post-baking can be improved.

In the present embodiment, the total solid content of the photosensitive resin composition means the total of the components contained in the photosensitive resin composition excluding the surfactant and the solvent.

(method for producing Polyamide resin)

The polyamide resin of the present embodiment is polymerized, for example, as follows.

First, the diamine monomer and the dicarboxylic acid monomer are polycondensed by the polymerization step (S1), thereby polymerizing the polyamide. Next, the low molecular weight component is removed in the low molecular weight component removal step (S2), and a polyamide resin containing polyamide as a main component is obtained.

(polymerization step (S1))

In the polymerization step (S1), the diamine monomer is polycondensed with the dicarboxylic acid monomer. The method of polycondensation for polymerizing the polyamide is not limited, and specific examples thereof include melt polycondensation, acid chloride method, direct polycondensation, and the like.

In addition, instead of the dicarboxylic acid monomer, a compound selected from tetracarboxylic dianhydride, trimellitic anhydride, dicarboxyl dichloride, or active ester type dicarboxylic acid may be used. Specific examples of the method for obtaining an active ester-type dicarboxylic acid include a method in which a dicarboxylic acid is reacted with 1-hydroxy-1, 2, 3-benzotriazole, and the like.

The diamine monomer and the dicarboxylic acid monomer used for polymerization of the polyamide resin will be described below. One diamine monomer and one dicarboxylic acid monomer may be prepared separately, or two or more thereof may be used in combination.

The diamine monomer used for polymerization is not limited, and for example, a diamine monomer having an aromatic ring in the structure is preferably used, and a diamine monomer having a phenolic hydroxyl group in the structure is more preferably used. Here, as the diamine monomer having a structure containing a phenolic hydroxyl group, for example, a diamine monomer represented by the following general formula (DA1) is preferable. By producing a polyamide resin from such a diamine monomer as a raw material, the conformation of the polyamide resin is controlled, and the molecular chains of the polyamide resin can form a more compact structure with each other. Therefore, the molecules of the chemical can be prevented from entering the photosensitive resin composition, and the chemical resistance after post-baking can be improved.

For example, when a diamine monomer represented by the following general formula (DA1) is used, the polyamide resin contains a structural unit represented by the following general formula (PA 2). That is, the polyamide resin of the present embodiment preferably contains a structural unit represented by the following general formula (PA2), for example.

(in the above general formula (DA1), R⁴Is a group formed by one or two or more atoms selected from a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom, and a bromine atom. R⁵～R¹⁰Each independently represents hydrogen or an organic group having 1 to 30 carbon atoms. )

(in the above general formula (PA2), R⁴、R⁵～R¹⁰The same as the above general formula (DA 1). )

R in the above general formulae (DA1) and (PA2)⁴Is a group formed by one or two or more atoms selected from a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom, and a bromine atom.

In addition, R⁴Is a 2-valent group. Here, the group having a valence of 2 represents an atomic valence. Namely, represents R⁴The number of bonding bonds to other atoms is 2.

R in the above formulae (DA1) and (PA2)⁴In the case of containing carbon atoms, R⁴For example, the group has 1 to 30 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and still more preferably 1 to 3 carbon atoms.

R in the above formulae (DA1) and (PA2)⁴In the case of containing carbon atoms, as R⁴Specific examples thereof include alkylene, arylene, alkylene substituted with halogen, arylene substituted with halogen, and the like.

The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. Specific examples of the linear alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, and a heptylene groupOctyl, nonyl, decyl, trimethylene, tetramethylene, pentamethylene, hexamethylene and the like. Specific examples of the branched alkylene group include: -C (CH)₃)₂-、-CH(CH₃)-、-CH(CH₂CH₃)-、-C(CH₃)(CH₂CH₃)-、-C(CH₃)(CH₂CH₂CH₃)-、-C(CH₂CH₃)₂-isoalkylmethylene; -CH (CH)₃)CH₂-、-CH(CH₃)CH(CH₃)-、-C(CH₃)₂CH₂-、-CH(CH₂CH₃)CH₂-、-C(CH₂CH₃)₂-CH₂An isoalkylethylene group and the like.

Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthracenylene group, and a group in which 2 or more arylene groups are bonded to each other.

Specifically, the alkylene group and the arylene group substituted with halogen may be each a group obtained by substituting a hydrogen atom in the alkylene group or the arylene group with a halogen atom such as a fluorine atom, a chlorine atom, or a bromine atom. Among these, a group obtained by substituting a hydrogen atom with a fluorine atom is preferably used.

R in the above formulae (DA1) and (PA2)⁴In the case where no carbon atom is contained, as R⁴Specific examples thereof include groups composed of oxygen atoms or sulfur atoms.

R in the above general formulae (DA1) and (PA2)⁵～R¹⁰Each independently is hydrogen or an organic group having 1 to 30 carbon atoms, and for example, is preferably hydrogen or an organic group having 1 to 10 carbon atoms, more preferably hydrogen or an organic group having 1 to 5 carbon atoms, still more preferably hydrogen or an organic group having 1 to 3 carbon atoms, and yet still more preferably hydrogen or an organic group having 1 to 2 carbon atoms. This is advantageous in that the molecular chains of the polyamide resin are hydrogen-bonded to each other via amide bonds, and the molecules of the chemical can be prevented from entering the photosensitive resin composition.

R in the above general formulae (DA1) and (PA2)⁵～R¹⁰Specific examples of the organic group having 1 to 30 carbon atoms include: an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, or a decyl group; alkenyl groups such as allyl, pentenyl and vinyl; alkynyl groups such as ethynyl; alkylene groups such as methylene and ethylene; aryl groups such as tolyl, xylyl, phenyl, naphthyl, and anthracenyl; aralkyl groups such as benzyl and phenethyl; cycloalkyl groups such as adamantyl, cyclopentyl, cyclohexyl, and cyclooctyl; and alkylaryl groups such as tolyl and xylyl.

Specific examples of the diamine monomer represented by the general formula (DA1) include 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, 4 '-methylenebis (2-amino-3, 6-dimethylphenol), 4' -methylenebis (2-aminophenol), 1-bis (3-amino-4-hydroxyphenyl) ethane, and 3,3 '-diamino-4, 4' -dihydroxydiphenyl ether. By using these diamine monomers, the aromatic rings of the polyamide resin can be closely arranged with each other. Therefore, the molecules of the chemical can be prevented from entering the photosensitive resin composition, and the chemical resistance can be improved. Further, as the diamine monomer, one or two or more of the above specific examples may be used in combination.

The structural formulae of these diamine monomers are shown below.

The dicarboxylic acid monomer used for polymerization is not limited, and for example, a dicarboxylic acid monomer having an aromatic ring in its structure is preferably used.

As the dicarboxylic acid monomer containing an aromatic ring, for example, a dicarboxylic acid monomer represented by the following general formula (DC1) is preferably used.

In addition, for example, in the case of using a dicarboxylic acid monomer represented by the following general formula (DC1), the polyamide resin contains a structural unit represented by the following general formula (PA 3). That is, the polyamide resin of the present embodiment preferably contains a structural unit represented by the following general formula (PA3), for example.

(in the above general formula (DC1), R¹¹Is a group formed by one or two or more atoms selected from a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom, and a bromine atom. R¹²～R¹⁹Each independently represents hydrogen or an organic group having 1 to 30 carbon atoms. )

(in the above general formula (PA3), R¹¹、R¹²～R¹⁹The same as the above general formula (DC 1). )

R in the above general formula (DC1)¹¹Is a group formed by one or two or more atoms selected from a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom, and a bromine atom.

In addition, R¹¹Is a 2-valent group. Here, the group having a valence of 2 represents an atomic valence. Namely, represents R¹¹The number of bonding bonds to other atoms is 2.

R in the above formula (DC1)¹¹In the case of containing carbon atoms, R¹¹For example, the group has 1 to 30 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and still more preferably 1 to 3 carbon atoms.

R in the above formulae (DC1) and (PA3)¹¹In the case of containing carbon atoms, as R¹¹Specific examples thereof include alkylene, arylene, alkylene substituted with halogen, arylene substituted with halogen, and the like.

The alkylene group may be, for example, a linear alkylene group or a branched alkylene group. As straight-chainSpecific examples of the alkylene group include methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, trimethylene, tetramethylene, pentamethylene, and hexamethylene. Specific examples of the branched alkylene group include: -C (CH)₃)₂-、-CH(CH₃)-、-CH(CH₂CH₃)-、-C(CH₃)(CH₂CH₃)-、-C(CH₃)(CH₂CH₂CH₃)-、-C(CH₂CH₃)₂-isoalkylmethylene; -CH (CH)₃)CH₂-、-CH(CH₃)CH(CH₃)-、-C(CH₃)₂CH₂-、-CH(CH₂CH₃)CH₂-、-C(CH₂CH₃)₂-CH₂An isoalkylethylene group and the like.

Specific examples of the arylene group include a phenylene group, a biphenylene group, a naphthylene group, an anthracenylene group, and a group in which 2 or more arylene groups are bonded to each other.

Specifically, the alkylene group and the arylene group substituted with halogen may be each a group obtained by substituting a hydrogen atom in the alkylene group or the arylene group with a halogen atom such as a fluorine atom, a chlorine atom, or a bromine atom. Among these, a group obtained by substituting a hydrogen atom with a fluorine atom is preferably used.

R in the above formulae (DC1) and (PA3)¹¹In the case where no carbon atom is contained, as R¹¹Specific examples thereof include groups composed of oxygen atoms or sulfur atoms.

R in the above formulae (DC1) and (PA3)¹²～R¹⁹Each independently is hydrogen or an organic group having 1 to 30 carbon atoms, and is preferably hydrogen or an organic group having 1 to 10 carbon atoms, more preferably hydrogen or an organic group having 1 to 5 carbon atoms, still more preferably hydrogen or an organic group having 1 to 3 carbon atoms, and yet more preferably hydrogen.

As R in the above general formulae (DC1) and (PA3)¹²～R¹⁹Has 1 to 30 carbon atomsSpecific examples of the following organic groups include: an alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, or a decyl group; alkenyl groups such as allyl, pentenyl and vinyl; alkynyl groups such as ethynyl; alkylene groups such as methylene and ethylene; aryl groups such as tolyl, xylyl, phenyl, naphthyl, and anthracenyl; aralkyl groups such as benzyl and phenethyl; cycloalkyl groups such as adamantyl, cyclopentyl, cyclohexyl, and cyclooctyl; and alkylaryl groups such as tolyl and xylyl.

Specific examples of the dicarboxylic acid monomer include diphenyl ether 4,4 '-dicarboxylic acid, isophthalic acid, terephthalic acid, and 4, 4' -biphenyldicarboxylic acid. As the dicarboxylic acid monomer, diphenyl ether 4,4 '-dicarboxylic acid or isophthalic acid among the above-mentioned specific examples is preferably used, and diphenyl ether 4, 4' -dicarboxylic acid is more preferably used.

In addition, it is preferable to modify the amino group present at the terminal of the polyamide resin simultaneously with the polymerization step (S1) or after the polymerization step (S1). The modification can be performed, for example, by reacting a specific acid anhydride or a specific monocarboxylic acid with a diamine monomer or a polyamide resin. Therefore, the polyamide resin of the present embodiment is preferably modified with a specific acid anhydride or a specific monocarboxylic acid at the terminal amino group. The specific acid anhydride and the specific monocarboxylic acid each have one or more functional groups selected from an alkenyl group, an alkynyl group and a hydroxyl group. The specific acid anhydride or the specific monocarboxylic acid preferably contains, for example, a nitrogen atom. This can improve the adhesion between the photosensitive resin composition after the preliminary baking and the photosensitive resin composition after the post-baking and a metal such as Al.

Specific examples of the specific acid anhydride include maleic anhydride, citraconic anhydride, 2, 3-dimethylmaleic anhydride, 4-cyclohexene-1, 2-dicarboxylic anhydride, exo-3, 6-epoxy-1, 2,3, 6-tetrahydrophthalic anhydride, 5-norbornene-2, 3-dicarboxylic anhydride, methyl-5-norbornene-2, 3-dicarboxylic anhydride, itaconic anhydride, chlorendic anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, and 4-hydroxyphthalic anhydride. As the specific acid anhydride, one or two or more of the above specific examples may be used in combination.

In addition, when the amino group present at the terminal of the polyamide resin is modified by a specific acid anhydride having a ring shape, the specific acid anhydride having a ring shape is subjected to ring opening. Here, after the polyamide resin is modified, an imide ring may be formed by ring-closing a structural unit derived from a specific acid anhydride having a ring shape. Examples of the method for performing the ring closure include heat treatment.

Specific examples of the specific monocarboxylic acid include 5-norbornene-2-carboxylic acid, 4-hydroxybenzoic acid and 3-hydroxybenzoic acid. As the specific monocarboxylic acid, one or a combination of two or more of the specific examples described above may be used.

Further, the carboxyl group present at the terminal of the polyamide resin may also be modified simultaneously with the polymerization step (S1) or after the polymerization step (S1). The modification can be performed, for example, by reacting a specific nitrogen atom-containing heteroaromatic compound with a dicarboxylic acid monomer or a polyamide resin. Therefore, the polyamide resin of the present embodiment is preferably modified with a specific nitrogen atom-containing heteroaromatic compound having a terminal carboxyl group. The specific nitrogen atom-containing heteroaromatic compound has at least one functional group selected from the group consisting of 1- (5-1H-triazolyl) methylamino, 3- (1H-pyrazolyl) amino, 4- (1H-pyrazolyl) amino, 5- (1H-pyrazolyl) amino, 1- (3-1H-pyrazolyl) methylamino, 1- (4-1H-pyrazolyl) methylamino, 1- (5-1H-pyrazolyl) methylamino, (1H-tetrazol-5-yl) amino, 1- (1H-tetrazol-5-yl) methyl-amino, and 3- (1H-tetrazol-5-yl) phen-amino. This can increase the number of lone-pair electrons in the photosensitive resin composition. Therefore, the adhesion between the photosensitive resin composition after the preliminary baking and the photosensitive resin composition after the post-baking and a metal such as Al can be improved.

Specific examples of the specific nitrogen atom-containing heteroaromatic compound include 5-aminotetrazole.

(Low molecular weight component removal step (S2))

After the polymerization step (S1), a low-molecular-weight component removal step (S2) is performed to remove low-molecular-weight components, thereby obtaining a polyamide resin containing a polyamide as a main component.

The organic layer containing the mixture of the low-molecular-weight component and the polyamide resin is concentrated by filtration or the like, and then dissolved again in an organic solvent such as water/isopropyl alcohol. Thus, the precipitate is filtered, and a polyamide resin from which low-molecular components have been removed can be obtained.

The polyamide resin is preferably a polyamide resin obtained by condensing a diamine monomer represented by the general formula (DA1) and a dicarboxylic acid monomer represented by the general formula (DC 1). That is, the polyamide resin preferably has the structural units represented by the general formulae (PA2) and (PA3), and more preferably has the structural units represented by the general formulae (PA2) and (PA3) alternately.

(photosensitizer)

As the photosensitizer, a photoacid generator that generates an acid by absorbing light energy can be used.

Specific examples of the photoacid generator include: diazoquinone (diazoquinone) compounds; a diaryl iodonium salt; 2-nitrobenzyl ester compounds; an N-imino sulfonate compound; an imide sulfonate compound; 2, 6-bis (trichloromethyl) -1,3, 5-triazine compounds; dihydropyridine compounds, and the like. Among these, diazoquinone compounds are preferably used. This can improve the sensitivity of the photosensitive resin composition. Therefore, the accuracy of the pattern can be improved, and the appearance can be improved. The photoacid generator may include one or two or more of the above specific examples.

When the photosensitive resin composition is a positive type, a triarylsulfonium salt may be used in combination as the sensitizer in addition to the above-mentioned specific examples; onium salts such as sulfonium-borate salts, and the like. This can further improve the sensitivity of the photosensitive resin composition.

As the diazoquinone compound, for example, one or two or more compounds shown below can be used.

(n is an integer of 1 to 5.)

In each of the diazoquinone compounds described above, Q is a structure represented by the following formula (a), the following formula (b), and the following formula (c), or a hydrogen atom. Wherein at least one of Q of the diazoquinone compounds has a structure represented by the following formula (a), the following formula (b) and the following formula (c).

The diazoquinone compound Q preferably contains the following formula (a) or the following formula (b). This can improve the transparency of the photosensitive resin composition. Therefore, the appearance of the photosensitive resin composition can be improved.

The lower limit of the content of the photosensitizer in the photosensitive resin composition is, for example, preferably 1 part by mass or more, more preferably 3 parts by mass or more, and still more preferably 5 parts by mass or more, when the alkali-soluble resin is set to 100 parts by mass. Thus, the photosensitive resin composition can exhibit appropriate sensitivity.

The upper limit of the content of the photosensitizer in the photosensitive resin composition is preferably 30 parts by mass or less, and more preferably 20 parts by mass or less, for example, when the alkali-soluble resin is 100 parts by mass. Thus, the photosensitive resin composition is appropriately cured, and can exhibit adhesion to metals such as Al and Cu after the pre-baking and the post-baking.

The photosensitive resin composition of the present embodiment may further contain additives such as a bonding assistant, a silane coupling agent, a solvent, a thermal crosslinking agent, a surfactant, an antioxidant, a dissolution accelerator, a filler, and a sensitizer.

The representative components are described in detail below.

(Tight-lock auxiliary)

The photosensitive resin composition of the present embodiment may contain, for example, an adhesion promoter. Specifically, a triazole compound can be used as the adhesion promoter.

Specific examples of the triazole compound include 4-amino-1, 2, 4-triazole, 4H-1,2, 4-triazol-3-amine, 4-amino-3, 5-di-2-pyridyl-4H-1, 2, 4-triazole, 3-amino-5-methyl-4H-1, 2, 4-triazole, 4-methyl-4H-1, 2, 4-triazol-3-amine, 3, 4-diamino-4H-1, 2, 4-triazole, 3, 5-diamino-4H-1, 2, 4-triazole, 1,2, 4-triazol-3, 4, 5-triamine, 3-pyridyl-4H-1, 1,2, 4-triazoles such as 2, 4-triazole, 4H-1,2, 4-triazole-3-carboxamide, 3, 5-diamino-4-methyl-1, 2, 4-triazole, 3-pyridyl-4-methyl-1, 2, 4-triazole, and 4-methyl-1, 2, 4-triazole-3-carboxamide. As the triazole compound, one or two or more of the above specific examples may be used in combination.

Further, as the adhesion promoter, a compound having an imide structure is preferably used. The following examples can be used imide compounds.

(silane coupling agent)

The photosensitive resin composition of the present embodiment may contain, for example, a silane coupling agent. As the silane coupling agent, a silane coupling agent having a structure different from that of the silane compound may be used in combination with the silane compound.

Specific examples of the silane coupling agent having a structure different from that of the silane compound include: acylaminosilanes such as a condensate of cyclohexene-1, 2-dicarboxylic acid anhydride and 3-aminopropyltriethoxysilane, and a condensate of 3,3 ', 4, 4' -diphenylketotetracarboxylic dianhydride and 3-aminopropyltriethoxysilane; vinylsilanes such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy silanes such as 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane; styryl silanes such as p-styryl trimethoxysilane; methacrylic silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane and 3-methacryloxypropyltriethoxysilane; acrylic silanes such as 3-acryloxypropyltrimethoxysilane; aminosilanes such as N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1, 3-dimethyl-butylene) propylamine, and N-phenyl-3-aminopropyltrimethoxysilane; isocyanurate silane; an alkylsilane; ureido silanes such as 3-ureidopropyltrialkoxysilane; mercaptosilanes such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate silanes such as 3-isocyanatopropyltriethoxysilane; a titanium-based compound; aluminum chelates; aluminum/zirconium-based compounds, and the like. As the silane coupling agent, one or two or more of the above specific examples can be blended.

When the photosensitive resin composition of the present embodiment contains a silane coupling agent, the content is, for example, 0.1 part by mass or more and 5 parts by mass or less, and preferably 0.5 part by mass or more and 3 parts by mass or less, with respect to 100 parts by mass of the alkali-soluble resin.

(solvent)

The photosensitive resin composition of the present embodiment can be used, for example, as a varnish in which raw material components other than a solvent are dissolved in a solvent.

The solvent is not limited, and specifically, the following may be mentioned: amide solvents such as N-methyl-2-pyrrolidone (NMP), 3-methoxy-N, N-dimethylpropionamide, N-dimethylformamide, N-dimethylpropionamide, N-diethylacetamide, 3-butoxy-N, N-dimethylpropionamide, and N, N-dibutylformamide; urea solvents such as N, N-dimethylacetamide, Tetramethylurea (TMU), 1, 3-dimethyl-2-imidazolidinone, tetrabutylurea, N '-dimethylpropyleneurea, 1, 3-dimethoxy-1, 3-dimethylurea, N' -diisopropyl-O-methylisourea, O, N '-triisopropylisourea, O-tert-butyl-N, N' -diisopropylisourea, O-ethyl-N, N '-diisopropylisourea, and O-benzyl-N, N' -diisopropylisourea; ether solvents such as Propylene Glycol Monomethyl Ether (PGME), propylene glycol monoethyl ether, ethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol, ethylene glycol diethyl ether, diethylene glycol dibutyl ether, dipropylene glycol monomethyl ether, and 1, 3-butanediol-3-monomethyl ether; acetate solvents such as Propylene Glycol Monomethyl Ether Acetate (PGMEA), methyl lactate, ethyl lactate, butyl lactate, and methyl-1, 3-butanediol acetate; alcohol solvents such as tetrahydrofurfuryl alcohol, benzyl alcohol, 2-ethylhexanol, butanediol, and isopropanol; ketone solvents such as cyclopentanone, cyclohexanone, diacetone alcohol and 2-heptanone; lactone solvents such as γ -butyrolactone (GBL) and γ -valerolactone; carbonate solvents such as ethylene carbonate and propylene carbonate; sulfone solvents such as dimethyl sulfoxide (DMSO) and sulfolane; ester solvents such as methyl pyruvate, ethyl pyruvate, and methyl-3-methoxypropionate; aromatic hydrocarbon solvents such as mesitylene, toluene, and xylene. The solvent may contain one or two or more of the above-mentioned specific examples.

The solvent is used so that the solid content concentration of the photosensitive resin composition is, for example, 5 to 60 mass%, preferably 10 to 50 mass%.

The photosensitive resin composition of the present embodiment is advantageous from the viewpoint that cracks are not generated even when a plurality of interlayer insulating films are formed using N-methyl-2-pyrrolidone as a solvent, for example, because of its high chemical resistance.

(thermal crosslinking agent)

The photosensitive resin composition of the present embodiment may contain a thermal crosslinking agent capable of reacting with the alkali-soluble resin by heat. This improves the mechanical properties called tensile elongation at break of the cured product after post-baking the photosensitive resin composition.

Specific examples of the thermal crosslinking agent include: compounds having a hydroxymethyl group such as 1, 2-benzenedimethanol, 1, 3-benzenedimethanol, 1, 4-benzenedimethanol (p-xylylene), 1,3, 5-benzenetricarbol, 4-biphenyldimethanol, 2, 6-pyridinedimethanol, 2, 6-bis (hydroxymethyl) -p-cresol, and 4, 4' -methylenebis (2, 6-dialkoxymethylphenol); phenols such as pentahydroxybiphenyl (phenyloglucide); compounds having an alkoxymethyl group such as 1, 4-bis (methoxymethyl) benzene, 1, 3-bis (methoxymethyl) benzene, 4 ' -bis (methoxymethyl) biphenyl, 3 ' -bis (methoxymethyl) biphenyl, methyl 2, 6-naphthalenedicarboxylate, and 4,4 ' -methylenebis (2, 6-dimethoxymethylphenol); methylol melamine compounds typified by hexamethylolmelamine, hexabutylmelamine, and the like; alkoxy melamine compounds such as hexamethoxymelamine; alkoxymethylacetylene urea compounds such as tetramethoxymethylacetylene urea; methylol urea compounds such as methylol benzoguanamine compounds and dimethylol ethylene urea; cyano compounds such as dicyanoaniline, dicyanophenol, and cyanobenzenesulfonic acid; isocyanate compounds such as 1, 4-phenylene diisocyanate and 3,3 '-dimethyldiphenylmethane-4, 4' -diisocyanate; epoxy group-containing compounds such as ethylene glycol diglycidyl ether, bisphenol a diglycidyl ether, triglycidyl isocyanurate, bisphenol a epoxy resin, bisphenol F epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, phenol novolac resin, and the like; maleimide compounds such as N, N '-1, 3-phenylenedimaleimide and N, N' -methylenebismaleimide. As the thermal crosslinking agent, one or two or more of the above specific examples may be used in combination.

The upper limit of the content of the thermal crosslinking agent in the photosensitive resin composition is, for example, preferably 15 parts by mass or less, more preferably 12 parts by mass or less, and still more preferably 10 parts by mass or less, assuming that the total solid content of the photosensitive resin composition is 100 parts by mass.

The lower limit of the content of the thermal crosslinking agent in the photosensitive resin composition is, for example, preferably 0.1 part by mass or more, more preferably 1 part by mass or more, further preferably 5 parts by mass or more, and further preferably 7 parts by mass or more, based on 100 parts by mass of the total solid content of the photosensitive resin composition.

(surfactant)

The photosensitive resin composition of the present embodiment may further contain a surfactant.

The surfactant is not limited, and specific examples thereof include: polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether and polyoxyethylene oleyl ether; polyoxyethylene aryl ethers such as polyoxyethylene octyl phenyl ether and polyoxyethylene nonyl phenyl ether; nonionic surfactants such as polyoxyethylene dialkyl esters including polyoxyethylene dilaurate and polyoxyethylene distearate; the surfactant is commercially available under the names of EFTOP EF301, EFTOP EF303, EFTOP EF352 (produced by New autumn farm chemical Co., Ltd.), MEGAFAC F171, MEGAFAC F172, MEGAFAC F173, MEGAFAC F177, MEGAFAC F444, MEGAFACF470, MEGAFAC F471, MEGAFAC F475, MEGAFAC F482, MEGAFAC F477 (produced by DIC), FLUORAD FC-430, FLUORAD FC-431, NOVEC FC4430, NOVEC FC4432 (produced by 3M Japan), SURLON-381, SURLON S-382, SURLON S-383, SURLON S-393, SURLON SC-101, SURLON SC-102, SURLON SC-103, SURLON-104, SURLON-105, SURLON-106, SURLON-AGC SEIMI CHEMICAL, and the like; organosiloxane copolymer KP341 (manufactured by shin-Etsu chemical Co., Ltd.); (meth) acrylic acid-based copolymers Polyflow No.57 and 95 (available from Kyoeisha chemical Co., Ltd.), and the like.

Among these, fluorine-based surfactants having perfluoroalkyl groups are preferably used. As the fluorine-based surfactant having a perfluoroalkyl group, one or more selected from the group consisting of MEGAFAC F171, MEGAFAC F173, MEGAFAC F444, MEGAFAC F470, MEGAFAC F471, MEGAFAC F475, MEGAFAC F482, MEGAFAC F477 (produced by DIC corporation), SURLON S-381, SURLON S-383, SURLON S-393 (produced by AGC SEIMI CHEMICALCO., LTD.), NOVEC FC4430 and NOVEC FC4432 (produced by 3M Japan) among the above-mentioned specific examples are preferably used.

As the surfactant, a silicone surfactant (for example, polyether-modified dimethyl siloxane) can be preferably used. Specific examples of the silicone surfactant include SH series, SD series, and ST series available from Dow Corning Toray, BYK series available from BYK Japan, KP series available from shin-Etsu chemical industries, DISFOAM (registered trademark) series available from Nissan oil Co., Ltd, and TSF series available from Toshiba Silicones.

When the photosensitive resin composition of the present embodiment contains a surfactant, the amount thereof is appropriately adjusted, for example, within a range of 1ppm to 1000ppm, preferably 1ppm to 100ppm, with respect to the entire composition.

(antioxidant)

The photosensitive resin composition of the present embodiment may further contain an antioxidant. As the antioxidant, one or more selected from the group consisting of a phenol-based antioxidant, a phosphorus-based antioxidant and a thioether-based antioxidant can be used. The antioxidant can inhibit oxidation of a resin film formed from the photosensitive resin composition.

Examples of the phenol-based antioxidant include pentaerythritol-tetrakis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], 3, 9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy ] -1, 1-dimethylethyl }2,4,8, 10-tetraoxaspiro [5,5] undecane, octadecyl-3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, 1, 6-hexanediol-bis [3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], 1,3, 5-trimethyl-2, 4, 6-tris (3, 5-di-tert-butyl-4-hydroxybenzyl) benzene, 2, 6-di-tert-butyl-4-methylphenol, 2, 6-di-tert-butyl-4-ethylphenol, 2, 6-diphenyl-4-octadecyloxyphenol, stearyl (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, bis (3, 5-tert-butyl-4-hydroxyphenyl) propionyloxy) ethylene glycol di (3, 5-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy) propionate), bis [ (3, 5-di-tert-butyl-4-methyl) ethylene glycol-4, 5-methyl) propionate ], bis (3, 5-tert-butyl-4-hydroxy-4-2, 5-hydroxy-ethyl) benzene, 5-butylidenedicarboxyethyl) propionate, 5-bis (3, 6-di-tert-butyl-4-butylidenedicarboxyethyl) benzene, 5-tert-butylidehyde, 2, 5-butylideneditert-butylidehyde, 2, 5-butylidenediethylcresol, 5-tert-butylidehyde, 2, 5-butylideneditert-butylidenediethylcresol, 5-butylidehyde, 2, 5-butylidebutoxyethyl-4-butylidehyde, 2, 5-4-butylideneditert-butylidehyde, 5-butylidehyde, 2, 5-tert-butylidehyde, 2, 6-tert-4-butylidebutoxyethyl-2, 6-butylideneditert-butylidebutoxyethyl-tert-butylideyl-butyl-butylideyl-methyl-4-butyloxy) benzene, 2, 5-butyliden-tert-butylphenyl, 5-tert-butyl-methyl-butyl-4-butyl-4-methyl-tert-4-butyl-methyl-butyl-4-butyl-4-tert-methyl-4-butyl-methyl-butyl-4-butyl-4-butyl-4-butyl-4-methyl-4-butyl-4-tert-hydroxy-4-butyl-hydroxy-4-butyl-4-methyl-butyl-4-methyl-4-hydroxy-butyl-methyl-4-methyl-4-methyl-butyl-methyl-butyl-4-butyl-4-hydroxy-4-butyl-4-butyl-tert-butyl-4-hydroxy-butyl-methyl-tert-butyl-4-butyl-hydroxy-4-hydroxy-4-butyl-hydroxy-4-hydroxy-4-butyl-methyl-hydroxy-4-butyl-hydroxy-butyl-4-butyl-hydroxy-butyl-hydroxy-4-butyl-hydroxy-4-hydroxy-butyl-4-hydroxy-methyl-butyl-4-hydroxy-butyl.

Examples of the phosphorus-based antioxidant include bis (2, 6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, tris (2, 4-di-tert-butylphenyl phosphite), tetrakis (2, 4-di-tert-butyl-5-methylphenyl) -4, 4' -biphenylene diphosphite, 3, 5-di-tert-butyl-4-hydroxybenzylphosphonate-diethyl ester, bis- (2, 6-diisopropylphenylphenyl) pentaerythritol diphosphite, 2-methylenebis (4, 6-di-tert-butylphenyl) octyl phosphate, tris (mixed mono-and di-nonylphenyl phosphite), bis (2, 4-di-tert-butylphenyl) pentaerythritol diphosphite, and mixtures thereof, Bis (2, 6-di-tert-butyl-4-methoxycarbonylethyl-phenyl) pentaerythritol diphosphite, bis (2, 6-di-tert-butyl-4-octadecyloxycarbonylethylphenyl) pentaerythritol diphosphite, and the like.

Examples of the thioether-based antioxidant include dilauryl-3, 3 '-thiodipropionate, bis (2-methyl-4- (3-n-dodecyl) thiopropionyloxy) -5-tert-butylphenyl) sulfide, distearyl-3, 3' -thiodipropionate, pentaerythritol-tetrakis (3-lauryl) thiopropionate, and the like.

(Filler)

The photosensitive resin composition of the present embodiment may contain a filler, for example. The filler is suitably selected according to the mechanical and thermal properties required for the resin film made of the photosensitive resin composition.

Specific examples of the filler include an inorganic filler and an organic filler.

Specific examples of the inorganic filler include: fused silica, fused spherical silica, crystalline silica, secondary aggregation silica, fine powder silica and other silica; metal compounds such as aluminum oxide, silicon nitride, aluminum nitride, boron nitride, titanium oxide, silicon carbide, aluminum hydroxide, magnesium hydroxide, and titanium white; talc; clay; mica; glass fibers, and the like. As the inorganic filler, one or two or more of the above-mentioned specific examples may be used in combination.

Specific examples of the organic filler include silicone powder and polyethylene powder. As the organic filler, one or two or more of the above-mentioned specific examples may be used in combination.

(preparation of photosensitive resin composition)

The method for producing the photosensitive resin composition of the present embodiment is not limited, and a known method can be used depending on the components contained in the photosensitive resin composition.

For example, the compound can be prepared by mixing and dissolving the above components in a solvent. Thus, a photosensitive resin composition as a varnish can be obtained.

(use)

The photosensitive resin composition of the present embodiment is used for forming a resin film for an electronic device such as a permanent film or a resist. Among these, the use of a permanent film is preferable from the viewpoint of exhibiting, in a good balance, an improvement in adhesion between the photosensitive resin composition after prebaking and the Al pad and a suppression of generation of residues of the photosensitive resin composition at the time of development, an improvement in adhesion between a cured film of the photosensitive resin composition after postbaking and a metal, and an improvement in chemical resistance of the photosensitive resin composition after postbaking.

In the present embodiment, the resin film refers to a dried film or a cured film of the photosensitive resin composition. That is, the resin film of the present embodiment is a film obtained by drying or curing a photosensitive resin composition.

The permanent film is composed of a resin film obtained by the following method: the photosensitive resin composition is subjected to prebaking, exposure, and development, and is patterned into a desired shape, followed by postbaking to be cured. The permanent film can be used for a protective film, an interlayer film, a dam material (dam material), and the like of an electronic device.

In addition, the conditions for the preliminary baking in the production of the permanent film may be, for example, heat treatment at a temperature of 90 ℃ to 130 ℃ and 3 minutes to 1 hour. The post-baking may be performed, for example, by heat treatment at a temperature of 150 ℃ to 350 ℃ and for 45 minutes to 2 hours.

The above-mentioned resist is composed of, for example, a resin film obtained by the following method: the photosensitive resin composition is applied to an object masked with a resist by a method such as spin coating, roll coating, flow coating, dip coating, spray coating, or blade coating, and the solvent is removed from the photosensitive resin composition.

Fig. 1 shows an example of an electronic device according to the present embodiment.

The electronic device 100 of the present embodiment may be an electronic device having the resin film described above. Specifically, at least one of the passivation film 32, the insulating layer 42, and the insulating layer 44 in the electronic device 100 may be a resin film. Here, the resin film is preferably the above-described permanent film.

The electronic device 100 is, for example, a semiconductor chip. In this case, for example, the electronic device 100 is mounted on the wiring board via the bumps 52, thereby obtaining a semiconductor package. The electronic device 100 includes: a semiconductor substrate on which semiconductor elements such as transistors are provided; and a plurality of wiring layers (not shown) provided on the semiconductor substrate. An interlayer insulating film 30 and an uppermost layer wiring 34 provided on the interlayer insulating film 30 are provided on the uppermost layer in the multilayer wiring layers. The uppermost layer wiring 34 is made of, for example, aluminum (Al). A passivation film 32 is provided on the interlayer insulating film 30 and on the uppermost layer wiring 34. An opening is provided in a part of the passivation film 32 to expose the uppermost layer wiring 34.

A rewiring layer 40 is provided on the passivation film 32. The rewiring layer 40 includes: an insulating layer 42 provided on the passivation film 32; a rewiring 46 provided on the insulating layer 42; and an insulating layer 44 provided on the insulating layer 42 and on the rewiring 46. An opening connected to the uppermost wiring 34 is formed in the insulating layer 42. The rewiring 46 is formed on the insulating layer 42 and in the opening provided in the insulating layer 42, and is connected to the uppermost wiring 34. An opening connected to the redistribution trace 46 is provided in the insulating layer 44.

In the opening provided in the insulating layer 44, a bump 52 is formed, for example, via a ubm (under bump metallization) layer 50. The electronic device 100 is connected to a wiring board or the like via bumps 52, for example.

The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a range in which the object of the present invention can be achieved are included in the present invention.