阅读说明：本技术 集成式倍增检测装置 (Integrated form multiplication detection device ) 是由 薛兵 丁宇红 姜健 任维松 唐朝阳 沈辉 于 2019-11-13 设计创作，主要内容包括：本发明提供了一种集成式倍增检测装置，包括：电子倍增打拿极、信号电子收集极、盖板部件以及电压分配元器件；所述盖板部件包括：印刷电路单元；所述电子倍增打拿极、信号电子收集极设置于盖板部件面向真空的一侧；所述电压分配元器件设置于盖板部件面向真空一侧相对应的另一侧；所述电压分配元器件设置于印刷电路单元上。本发明能够在真空系统中，实现多次倍增放大微小离子流的问题。本发明能够让在真空中进行电子倍增的器件和其它放大器件集成在同一个印刷电路板的两面上；本发明突破现有技术中的缺陷，使用方便，且性价比较高。(The invention provides an integrated multiplication detection device, which comprises: the electron multiplier dynode, the signal electron collector, the cover plate component and the voltage distribution component; the cover member includes: a printed circuit unit; the electron multiplier dynode and the signal electron collector are arranged on one side of the cover plate component facing to vacuum; the voltage distribution component is arranged on the other side of the cover plate component corresponding to the vacuum side; the voltage distribution component is arranged on the printed circuit unit. The invention can realize the problem of multiply amplifying the micro ion current for many times in a vacuum system. The invention can integrate the device for electron multiplication and other amplifying devices in vacuum on two sides of the same printed circuit board; the invention breaks through the defects in the prior art, is convenient to use and has higher cost performance.)

1. An integrated multiplication detection apparatus, comprising: the electron multiplier dynode, the signal electron collector, the cover plate component and the voltage distribution component;

the cover member includes: a printed circuit unit;

the electron multiplier dynode and the signal electron collector are arranged on one side of the cover plate component facing to vacuum;

the voltage distribution component is arranged on the other side of the cover plate component corresponding to the vacuum side;

the voltage distribution component is arranged on the printed circuit unit.

2. The integrated doubling detection device of claim 1, further comprising: a vacuum unit;

the printed circuit unit includes: a printed circuit board;

the electron multiplying dynode and the signal electron collector are assembled on the printed circuit board;

the number of circuit layers of the printed circuit board is one or more;

one or more blind buried holes are arranged on the printed circuit board.

3. The integrated multiplication detector of claim 1 wherein the number of circuit layers of the printed circuit board is multiple.

4. The integrated dynode of claim 2, wherein the electron multiplying dynode comprises any one or more of:

-pressing a sheet metal member;

-a printed circuit metal layer pattern member;

the pressed metal sheet component is connected with the printed circuit board;

the pressed sheet metal member includes: pressed metal sheets arranged at intervals;

the printed circuit metal layer pattern member is disposed on a surface of the printed circuit board.

5. The integrated double detection apparatus of claim 1, wherein the pressed metal sheet is made of any one of the following materials:

-a metallic material having a secondary electron emission coefficient greater than a set threshold;

-a material coated with a metal having a secondary electron emission coefficient greater than a set threshold value.

6. The integrated doubling detection device of claim 1, further comprising: ion conversion dynode;

the ion conversion dynode is positioned at the front end of the electron multiplication dynode;

the ion conversion dynode is positioned on one side of the cover plate component facing to vacuum;

the ion conversion dynode can detect positive ions or negative ion flows.

7. The integrated multiplication detector of claim 1 wherein the voltage distribution components include a voltage divider resistor and a high voltage connector;

the printed circuit metal layer pattern member includes: a ground shield member.

8. The integrated multiplication detector apparatus of claim 7 further comprising: a mass spectrometry unit;

the mass spectrometry unit is positioned on one side of the cover plate component facing to vacuum;

at least one part of ions passing through the mass spectrometry unit are beaten to the ion conversion dynode to be converted into secondary electrons, and a mass spectrogram is obtained through multiplication, amplification and recording, so that mass spectrogram information is obtained.

9. The integrated doubling detection device of claim 8, wherein the mass spectrometry unit comprises: an ion trap mass analyser.

10. The integrated dyadic detection device of claim 9, wherein the ion trap mass analyzer is fabricated using a printed circuit board.

Technical Field

The invention relates to the field of physical instruments, in particular to an integrated multiplication detection device, and especially relates to an instrument device for detecting micro-particle flow in a vacuum system.

Background

Many instruments are required to detect the minute flow of charged particles generated in a vacuum apparatus. For example, in a mass spectrometer, ions are separated according to their mass-to-charge ratio and then hit a detector to form a current signal. Often the signal of this electron flow is small and, even if amplified by a high power amplifier, will be buried in the electronic noise. Generally, one can use an electron multiplier as a detector to convert the initial particle flow into an electron flow, multiply the electron flow stage by stage to amplify the electron flow by several hundred thousand to several million times, and then send the electron flow to an amplifier for amplification, thereby successfully detecting the signal. A conventional electron multiplier consists of a series of dynodes. The voltage on the capacitor is generated by a high-voltage power supply through a divider resistor, and the potential of the dynode gradually rises from the inlet to the outlet of electrons. The electrons are attracted by the electric field and hit the first dynode. On the dynode, one electron can shoot two to four secondary electrons, and then the secondary electrons are attracted by the electric field again to be accelerated to shoot on a second dynode; thus on the second dynode, each electron is multiplied again by 2 to 4; each electron is then attracted by the field again, striking a third dynode, again multiplied. For example, if the multiplication rate of each multiplication is 3, then after 10 multiplications, an incident electron will generate an output of 310 electrons. That is to say the overall multiplication ratio of this multiplier reaches 59000. The dynodes are typically made of sheet metal and mounted on ceramic supports to form the entire multiplier. The multiplier of the mass spectrometer also has a conversion electrode which converts the incident ions 2 first into secondary electrons 6 which are then multiplied step by the multiplier, outputting a current signal. Some multipliers are designed as a glass tube, on the inner wall of which a lead film is formed by heat precipitation. Since the lead film is highly resistive, a potential gradient is formed in the tube after a high voltage is applied across the tube. The electrons enter from one end, impact on the inner wall continuously, multiply and move to the other end, and finally form millions of times of electron current at the other end of the tube. The multiplier of this configuration is also called a channel multiplier (english name: Channeltron). The channel electron multiplier has the characteristics of small size and low manufacturing cost. Of course, the glass structure has the characteristic of fragility, and has the defect of low saturation current.

Patent document CN109712864A discloses a simplified mass spectrometer comprising: the grid electrode plate is arranged between the first printed circuit board and the second printed circuit board; parallel conductive strips are oppositely arranged on the first printed circuit board and the second printed circuit board, grid electrodes are arranged on the grid electrode plate, and the parallel conductive strips which are oppositely arranged and the grid electrodes form a compound parallel ion trap; the simplified mass spectrometer also includes a housing connected to the vacuum pump, the housing interior containing multiple juxtaposed ion traps in a vacuum chamber via the vacuum pump. The patent still does not have the function of electron multiplication, that is, the particle flow signal cannot be further amplified in advance in the vacuum chamber when a tiny signal is detected.

Disclosure of Invention

In view of the defects in the prior art, the present invention provides an integrated multiplication detecting device.

The invention provides an integrated multiplication detection device, which is characterized by comprising: the electron multiplier dynode, the signal electron collector, the cover plate component and the voltage distribution component; the cover member includes: a printed circuit unit; the electron multiplier dynode and the signal electron collector are arranged on one side of the cover plate component facing to vacuum; the voltage distribution component is arranged on the other side of the cover plate component corresponding to the vacuum side; the voltage distribution component is arranged on the printed circuit unit.

Preferably, the method further comprises the following steps: a vacuum unit; the printed circuit unit includes: a printed circuit board; the electron multiplying dynode and the signal electron collector are connected with the printed circuit board; the number of circuit layers of the printed circuit board is one or more; one or more blind buried vias are provided on the printed circuit board to connect different circuit layers.

Preferably, the number of circuit layers of the printed circuit board is multiple.

Preferably, the electron multiplying dynode comprises any one or more of the following components: -pressing a sheet metal member; -a printed circuit metal layer pattern member; the pressed metal sheet component is connected with the printed circuit board; the pressed sheet metal member includes: pressed metal sheets arranged at intervals; the printed circuit metal layer pattern member is disposed on a surface of the printed circuit board.

Preferably, the pressed metal sheet is made of any one of the following materials: -a metallic material having a secondary electron emission coefficient greater than a set threshold; -a material coated with a metal having a secondary electron emission coefficient greater than a set threshold value.

Preferably, the method further comprises the following steps: ion conversion dynode; the ion conversion dynode is positioned at the front end of the electron multiplication dynode; the ion conversion dynode is positioned on one side of the cover plate component facing to vacuum; the ion conversion dynode can detect positive ions or negative ion flows.

Preferably, the voltage distribution component comprises a divider resistor and a high-voltage connector; the printed circuit metal layer pattern member includes: a ground shield member; so as to avoid the interference of the electric signals of the high-voltage power supply and the vacuum particle flow device on the electric signals of the electron collector.

Preferably, the method further comprises the following steps: a mass spectrometry unit; the mass spectrometry unit is positioned on one side of the cover plate component facing to vacuum; at least one part of ions passing through the mass spectrometry unit are beaten to the ion conversion dynode to be converted into secondary electrons, and a mass spectrogram is obtained through multiplication, amplification and recording, so that mass spectrogram information is obtained.

Preferably, the mass spectrometry unit comprises: an ion trap mass analyser.

Preferably, the ion trap mass analyser is made using a printed circuit board.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention can realize the problem of multiply amplifying the micro ion current for many times in a vacuum system;

2. the invention can integrate the device for electron multiplication and other amplifying devices in vacuum on two sides of the same printed circuit board;

3. the invention breaks through the defects in the prior art, is convenient to use and has higher cost performance.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural diagram of the present invention.

FIG. 2 is a schematic diagram of the basic components of electron multiplication in the present invention.

Fig. 3 is a printed wiring board pattern of the present invention.

FIG. 4 is a schematic view of the connection of the electron multiplying plate of the present invention.

FIG. 5 is a more simplified electron multiplication diagram of the present invention.

FIG. 6 is an outer circuit pattern of the printed circuit board of the present invention.

In the figure:

cover plate 1 fourth printed circuit board dynode 13.4

Dynode 2 Nth printed circuit board dynode 13.N

Separating ions 15 of the dynode 3 after mass spectrometric detection

First multiplier 3.6 via hole 16

Second multiplier 3.7 pad 21

Third time adding piece 3.8 bonding pad 21.1

Quadruple added slice 3.9 bonding pad 23

First printed pattern dynode 31 secondary electron 25

Second printed pattern dynode 32 divider resistor 27

Third printed pattern dynode 33 pad 28

Fourth printed pattern dynode 34 coupling device 29

Amplifying circuit 30 made of sheet metal and outside dynode 3.N

Vacuum system 11 weld leg 31

Physical experiment device 12 lateral circuit connection 32

First printed circuit board dynode 13.1 current signal 4

Second printed circuit board dynode 13.2 shield ring 70

Third printed circuit board dynode 13.3

Detailed Description

The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.

As shown in fig. 1 to 6, an integrated multiplication detecting apparatus according to the present invention includes: the electron multiplier dynode, the signal electron collector, the printed circuit unit, the cover plate component and the voltage distribution component; the cover member includes: a printed circuit unit; the electron multiplier dynode and the signal electron collector are arranged on one side of the cover plate component facing to vacuum; the voltage distribution component is arranged on the other side of the cover plate component corresponding to the vacuum side; the voltage distribution component is arranged on the printed circuit unit.

The invention aims to solve the problem of realizing multiple multiplication and amplification of micro ion current in a vacuum system, namely, a device capable of carrying out electron multiplication in vacuum is designed and integrated with other amplifying devices on two sides of the same printed circuit board.

Preferably, the method further comprises the following steps: a vacuum unit; the printed circuit unit includes: a printed circuit board; the electron multiplying dynode and the signal electron collector are connected with the printed circuit board; the number of circuit layers of the printed circuit board is one or more; one or more blind buried vias are provided on the printed circuit board to connect different circuit layers.

Preferably, the number of circuit layers of the printed circuit board is multiple.

Preferably, the electron multiplying dynode comprises any one or more of the following components: -pressing a sheet metal member; -a printed circuit metal layer pattern member; the pressed metal sheet component is connected with the printed circuit board; the pressed sheet metal member includes: pressed metal sheets arranged at intervals; the printed circuit metal layer pattern member is disposed on a surface of the printed circuit board.

Preferably, the pressed metal sheet is made of any one of the following materials: -a metallic material having a secondary electron emission coefficient greater than a set threshold; -a material coated with a metal having a secondary electron emission coefficient greater than a set threshold value.

Preferably, the method further comprises the following steps: ion conversion dynode; the ion conversion dynode is positioned at the front end of the electron multiplication dynode; the ion conversion dynode is positioned on one side of the cover plate component facing to vacuum; the ion conversion dynode can detect positive ions or negative ion flows.

Preferably, the voltage distribution component comprises a divider resistor and a high-voltage connector; the printed circuit metal layer pattern member includes: a ground shield member; so as to avoid the interference of the electric signals of the high-voltage power supply and the vacuum particle flow device on the electric signals of the electron collector.

Preferably, the method further comprises the following steps: a mass spectrometry unit; the mass spectrometry unit is positioned on one side of the cover plate component facing to vacuum; at least one part of ions passing through the mass spectrometry unit are beaten to the ion conversion dynode to be converted into secondary electrons, and a mass spectrogram is obtained through multiplication, amplification and recording, so that mass spectrogram information is obtained.

Preferably, the mass spectrometry unit comprises: an ion trap mass analyser.

Preferably, the ion trap mass analyser is made using a printed circuit board. The invention provides a device for multiplying and amplifying a signal of a weak particle flow, which is integrated on a vacuum system cover plate or a part of a cover plate flange of a device for generating the particle flow; the method is characterized by comprising the following steps: the device comprises a multilayer printed circuit board, wherein a plurality of electron multiplying dynodes and signal electron collectors are arranged on a printed circuit on one side of a vacuum; the printed circuit on the other side is provided with a voltage distribution component and an amplifying circuit component; the printed circuit board is provided with a plurality of air-tight vias to connect the circuits on both sides.

An important feature of the present invention is that the material of the dynode comprises a metallic material having a high secondary electron emission coefficient. The material can be a metal sheet formed by pressing beryllium copper, nickel beryllium or silver magnesium alloy, or a metal material with high secondary electron emission coefficient, such as beryllium copper, nickel beryllium or silver magnesium alloy, plated on the surface of other metals, such as a copper-coated surface of a printed circuit.

Specifically, in one embodiment, as shown in fig. 1, a multiplying device includes: the vacuum system 11, the vacuum system 11 is composed of a chamber and a cover plate 1, and the details of the sealing member (such as a rubber pad) are omitted here. In the vacuum system, a physical experiment apparatus 12 is installed, which becomes a source for generating a stream of minute particles. It may for example be an ion trap mass spectrometer. The ion 15 after mass detection is ejected from one of the slits.

On the vacuum side, i.e. the inner side, of the cover plate, a number of dynodes are mounted. The dynode 2 is an ion-to-electron conversion dynode that receives ions ejected from the ion trap and generates secondary electrons 25. The secondary electrons 25 are accelerated by the electric field and strike the first printed circuit board dynode 13.1, producing a plurality of secondary electron emissions. These secondary electrons pass successively through successive dynodes 13.2, … …. N and a separating dynode 3, multiply many times, and finally the multiplied electrons are received by a collector 14. The dynodes are connected together by vias 16 in the printed circuit board and by electronic components outside the printed circuit board to provide voltage to them and to provide received electronic signals to an external amplifier circuit 30 for signal amplification and processing.

As shown in fig. 2, the basic components of the multiplication amplifying apparatus include: a printed circuit board 1, and electrodes 2 and dynodes 13.N, 3.N mounted thereon for converting ions to electrons. Wherein the dynode 13.N is directly formed by copper-clad patterns on a printed circuit board, and 3.N is a dynode made of a metal sheet. The ion-to-electron converting electrode 2 and the dynode 3.N (further shown in perspective in the upper left corner) are both soldered directly to the printed wiring board 1 via their two legs 31.

The holding surface of the holding electrode is bent to a certain angle, which is favorable for controlling the emission direction of secondary electrons, so that the generated secondary electrons can be better accepted by the next holding electrode.

The metal sheet dynode can be formed by bending a metal sheet, the material of the metal sheet can be beryllium copper, nickel beryllium, copper magnesium and other alloy materials with high secondary electron emission coefficients, and the metal sheet dynode can also be formed by plating the materials with high secondary electron emission coefficients on the surface of a common metal material. The printed dynode 13.N formed by the copper-clad pattern of the printed circuit board should be plated with an alloy material having a high secondary electron emission coefficient, such as beryllium copper, nickel beryllium, copper magnesium, etc., on the surface of the ordinary copper foil, so as to contribute to the emission of secondary electrons.

As shown in fig. 2 and 3, the printed circuit board 1 is preferably a multilayer printed circuit board having at least three layers, i.e., an upper layer, a middle layer and a lower layer. The intermediate layer forms lateral circuit connections 32 that help form the hermetic vias. The upper half of fig. 3 shows the pattern of the inner layer and the lower half shows the pattern of the outer layer. In the inner layer pattern the pads 21, 21.1 are used for soldering the ion-to-electron conversion electrodes. And the pads 23 are intended for soldering the sheet metal dynode 3. N. These pads are connected to the outer pads by intermediate layer wires 32. And the pad of the outer layer is connected to the voltage dividing resistor 27 through the wiring of the outer layer. The figure shows 3 printed dynodes 13.1, 13.2, 13.3 and three pairs of pads 23 for sheet metal dynode mounting, for a total of 6 multiplication. In practical applications, the number of stages may be increased or decreased as appropriate. Fig. 4 shows surface mounted voltage divider resistors 27 that divide the high voltage of a multiplier power supply into individual segment voltages that are applied to the various dynodes. In fig. 3, 25 is an electron acceptor by which multiplied electrons are accepted and provided through vias and pads 28 to an operational amplifier 30 through a coupling device 29 for small signal amplification. The device of this embodiment of the present invention thus provides both electron multiplication and small signal amplification, all integrated into the vacuum cover plate made from the printed circuit board.

As shown in fig. 2, the half dynode 13.N is directly formed by the copper-clad pattern of the printed circuit board, but a first double-adding piece 3.6, a second double-adding piece 3.7, a third double-adding piece 3.8 and a fourth double-adding piece 3.9 made of beryllium copper or the like may be welded on the copper surface of the printed circuit board as shown in fig. 5. Since the metal sheet can be bent into a necessary shape, the dynode on the welding can better control the emission direction of the secondary electrons, which is beneficial to improving the receiving efficiency of the secondary electrons.

In another embodiment, the secondary electron acceptance efficiency can be sufficiently ensured by controlling the distance and displacement of the opposing electrodes. In a multiplying device, all the sheet metal dynodes 3.N are replaced by printed circuit pattern dynodes made of another printed wiring board, as shown in FIG. 5. This printed wiring board 63 is soldered to the main printed wiring board 1 by a set of pins 64 to supply a voltage to the various dynodes thereon. The first pattern dynode 31, the second pattern dynode 32, the third pattern dynode 33 and the fourth pattern dynode 34 are arranged in a face-to-face staggered manner with the pattern dynodes 13.1, 13.2, 13.3 and 13.4 on the main printed circuit board. Due to the design, the workload of welding a plurality of metal sheets to obtain electrodes during assembly is saved, and the cost is further reduced.

In summary, the specific embodiments of the present invention include different arrangements of the dynode, and the dynode may be formed by beryllium copper, nickel beryllium, and other metal sheets, and soldered on the printed circuit board, or directly formed by a copper-clad surface on the printed circuit board. In order to improve the secondary electron gain, the surfaces of the copper-clad layers are plated with beryllium copper, nickel beryllium or silver magnesium alloy materials.

It is worth emphasizing that: the airtightness of the printed wiring board 1 must be ensured, and it is preferable that the electrical connection between these lead pads of the inner and outer layers is connected by the intermediate layer turning manner. That is, the pads on the inner and outer surfaces are not aligned but are connected by copper leads in an intermediate layer, as is clearly shown in fig. 2 and 3.

The dynode 3.N and the conversion electrode 2 for converting ions into electrons are welded on the printed circuit board by soldering tin suitable for vacuum, such as silver-tin alloy welding rod, and after the welding is finished, the residual soldering flux and redundant tin slag are removed by cleaning with organic solvent. The soldering tin is prevented from splashing on the surface of the dynode during the welding process.

In order to detect ions, the invention also comprises a dynode for converting ions into electrons in a special case, and the dynode is also arranged on the vacuum side of the printed circuit board by welding.

On the atmosphere side, the voltage distribution device mounted on the printed circuit board includes a voltage dividing resistor and the like, and may also include a high-voltage connector for connecting a high-voltage power supply. Meanwhile, the signal amplifying circuit arranged on the printed circuit board on one side of the atmosphere comprises a resistor, a capacitor and an operational amplification discrete or integrated circuit. In addition, the printed circuit patterns of the inner and outer layers contain electrode rings for shielding high voltage and small signals. Fig. 6 is an outer circuit pattern of the printed circuit board of fig. 3. In addition to the original surface mounting of the resistor, capacitor and amplifier chips and their connection pads, a shielding ring 70 is added to isolate the high voltage circuit from the small signal circuit. The pattern of the shielding ring is designed according to the actual circuit requirements, and can be arranged at the outer side (the atmosphere side), the inner side (the vacuum side) or both sides.

In order to ensure the gas tightness of the cover plate, the substrate material of the printed circuit board is preferably made of a material suitable for vacuum equipment. If the vacuum system is a medium vacuum system, for example in the order of 10-3 mbar, the printed wiring board may be made of a printed circuit board of a plexiglas material such as FR 4. If used in the high or ultra-high vacuum range, ceramic-based or PTFE-based printed circuit board materials should be used.

The main idea of the invention is to design an integrated device for particle flux multiplication and small signal amplification, but it is not excluded to integrate the device for signal particle flux generation with it, such as: the ion trap of fig. 1, if it can be made of a printed circuit board, can be further integrated or soldered to the printed circuit board 1 to form an integrated body.

The printed wiring board pattern given in fig. 3 is a schematic diagram provided only for explaining the present invention. Those skilled in the art can design more complex patterns of printed circuit boards to suit the corresponding multiplication rates and the corresponding electric field environments, and can also add some signal shielding functions.

The integration, electron multiplication and signal amplification of the printed circuit board are beneficial to reducing the cost and improving the production efficiency. The specific design of such apparatus may be varied widely to suit the needs of the various appliance apparatus and many more variations may be made by those skilled in the art, but this is not excluded from the scope of the invention.

The invention can realize the problem of multiply amplifying the micro ion current for many times in a vacuum system; the invention can integrate the device for electron multiplication and other amplifying devices in vacuum on two sides of the same printed circuit board; the invention breaks through the defects in the prior art, is convenient to use and has higher cost performance.

Those skilled in the art will appreciate that, in addition to implementing the system and its various devices, units provided by the present invention as pure computer readable program code, the system and its various devices, units provided by the present invention can be fully enabled to implement the same functions by logically programming the method steps in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Therefore, the system and various devices, units and units thereof provided by the invention can be regarded as a hardware component, and the devices, units and units included in the system for realizing various functions can also be regarded as structures in the hardware component; means, elements, units for performing various functions may also be regarded as structures within both software and hardware components for performing the method.

The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.