阅读说明：本技术 一种用于近场耦合无源互调测试的基片集成缝隙波导测试板 (Substrate integrated slot waveguide test board for near-field coupling passive intermodulation test ) 是由 贺永宁 张可越 于 2019-10-11 设计创作，主要内容包括：本发明公开了一种用于近场耦合无源互调测试的基片集成缝隙波导测试板，包括自下而上依次设置的接地面层和介质基板；其中，介质基板上设置有一体化成型的基片集成波导段、第一阻抗匹配过渡段、第二阻抗匹配过渡段、输入端和输出端，输入端和输出端分别设置在基片集成波导段的前后两侧，输入端通过第一阻抗匹配过渡段与基片集成波导段相连接，输出端通过第二阻抗匹配过渡段与基片集成波导段相连接，基片集成波导段上设置有高温绝缘膜，且在基片集成波导段的中部以及高温绝缘膜的对应位置处均开设有矩形缝隙。本发明在PIM测试过程中可以实现待测结构的在线更换，也有利于对影响PIM产物的多物理场因素进行精准控制，提高PIM诊断效率。(The invention discloses a substrate integrated slot waveguide test board for near-field coupling passive intermodulation test, which comprises a grounding layer and a dielectric substrate which are sequentially arranged from bottom to top; the dielectric substrate is provided with an integrated substrate integrated waveguide section, a first impedance matching transition section, a second impedance matching transition section, an input end and an output end, wherein the input end and the output end are respectively arranged at the front side and the rear side of the substrate integrated waveguide section, the input end is connected with the substrate integrated waveguide section through the first impedance matching transition section, the output end is connected with the substrate integrated waveguide section through the second impedance matching transition section, the substrate integrated waveguide section is provided with a high-temperature insulating film, and rectangular gaps are formed in the middle of the substrate integrated waveguide section and in the corresponding positions of the high-temperature insulating film. The method can realize the online replacement of the structure to be tested in the PIM test process, is also beneficial to accurately controlling the multi-physical-field factors influencing the PIM product, and improves the PIM diagnosis efficiency.)

1. A substrate integrated slot waveguide test board for near-field coupling passive intermodulation test is characterized by comprising a grounding layer (1) and a dielectric substrate (2) which are sequentially arranged from bottom to top; wherein the content of the first and second substances,

the medium substrate (2) is provided with an integrated substrate integrated waveguide section (3), a first impedance matching transition section (4), a second impedance matching transition section (5), an input end (6) and an output end (7), the input end (6) and the output end (7) are respectively arranged on the front side and the rear side of the substrate integrated waveguide section (3), the input end (6) is connected with the substrate integrated waveguide section (3) through the first impedance matching transition section (4), the output end (7) is connected with the substrate integrated waveguide section (3) through the second impedance matching transition section (5), the substrate integrated waveguide section (3) is provided with a high-temperature insulating film (10), and rectangular gaps (11) are respectively arranged in the middle of the substrate integrated waveguide section (3) and corresponding positions of the high-temperature insulating film (10).

2. The substrate-integrated slot waveguide test board for the near-field coupling passive intermodulation test according to claim 1, characterized in that the left and right ends of the substrate-integrated waveguide segment (3) are covered with polyimide films (8), and the copper foil (9) is fastened to the outer side of the corresponding polyimide film (8).

3. The substrate-integrated slot waveguide test board for near-field coupling passive intermodulation test according to claim 2, characterized in that the copper foil (9) is taped to the outside of the corresponding polyimide film (8).

4. The substrate-integrated slot waveguide test board for near-field coupled passive intermodulation test according to claim 1, characterized in that the high temperature insulating film (10) is made of polyimide with a thickness of 0.5 mm.

5. The substrate-integrated slot waveguide test board for near-field coupling passive intermodulation test according to claim 1, characterized in that the first impedance matching transition (4) and the second impedance matching transition (5) are symmetrically disposed on the front and back sides of the substrate-integrated waveguide section (3).

6. The substrate-integrated slot waveguide test board for near-field coupled passive intermodulation test of claim 5, characterized in that the input end (6) and the output end (7) are symmetrically arranged on the front and back sides of the substrate-integrated waveguide segment (3).

Technical Field

The invention belongs to the technical field of passive intermodulation testing, and particularly relates to a substrate integrated slot waveguide test board for near-field coupling passive intermodulation testing.

Background

When multiple carriers pass through a passive device, due to the nonlinear effect of the device, a derived interference signal of the original signal frequency combination is generated, and the corresponding interference signal is called an intermodulation product. Passive intermodulation is a difficult problem to be solved urgently in the wireless communication technology at present, the passive intermodulation problem is a reliability problem, and the passive intermodulation problem relates to a plurality of factors such as materials, processes, assembly, environment and the like, and is very difficult to test and analyze. In addition, the traditional experimental test scheme aiming at passive intermodulation has the defects that the process is difficult to control, the repeatability of a test result is poor, and the regularity of data is weak.

PIM (Passive intermodulation) is a distortion problem based on microscopic or local nonlinear nature, but the research goal is a device or system level circuit. Common device-level PIM research objects mostly focus on antennas, filters, coaxial connectors, duplexers, and the like. The traditional PIM test method is to excite and evaluate the nonlinearity of a device with a high-power carrier signal after the device is assembled. The limitation of this test method is that it is not possible to accurately locate and determine the potential PIM source, so that only the entire component can be scrapped in engineering applications, increasing the development and manufacturing costs of highly linear components. If the PIM evaluation can be performed on each raw material or semi-finished product which may cause PIM risk in the microwave component development process, and the physical and environmental factors are strictly controlled, the development, detection and debugging period is shortened.

Disclosure of Invention

The invention provides a substrate integrated slot waveguide test board for near-field coupling passive intermodulation test by utilizing the near-field coupling characteristic of slot waveguide and combining with the manufacturing process of a radio frequency planar printed circuit. The test board can realize the online replacement of the structure to be tested in the PIM test process, is also favorable for accurately controlling the multiple physical field factors influencing the PIM product, and improves the PIM diagnosis efficiency.

The invention is realized by adopting the following technical scheme:

a substrate integrated slot waveguide test board for near-field coupling passive intermodulation test comprises a ground layer and a dielectric substrate which are sequentially arranged from bottom to top; wherein the content of the first and second substances,

the dielectric substrate is provided with an integrated substrate integrated waveguide section, a first impedance matching transition section, a second impedance matching transition section, an input end and an output end, wherein the input end and the output end are respectively arranged at the front side and the rear side of the substrate integrated waveguide section, the input end is connected with the substrate integrated waveguide section through the first impedance matching transition section, the output end is connected with the substrate integrated waveguide section through the second impedance matching transition section, the substrate integrated waveguide section is provided with a high-temperature insulating film, and rectangular gaps are respectively formed in the middle of the substrate integrated waveguide section and the corresponding position of the high-temperature insulating film.

The invention has the further improvement that the end parts of the left side and the right side of the substrate integrated waveguide section are covered with polyimide films, and the copper foils are buckled on the outer sides of the corresponding polyimide films.

The invention is further improved in that the copper foil is buckled on the outer side of the corresponding polyimide film through an adhesive tape.

A further improvement of the invention is that the high temperature insulating film is made of polyimide with a thickness of 0.5 mm.

The invention is further improved in that the first impedance matching transition section and the second impedance matching transition section are symmetrically arranged at the front side and the rear side of the substrate integrated waveguide section.

The invention is further improved in that the input end and the output end are symmetrically arranged at the front side and the rear side of the substrate integrated waveguide segment.

The invention has at least the following beneficial technical effects:

the substrate integrated slot waveguide test board for near-field coupling passive intermodulation test can reduce the research and development and maintenance cost of products by utilizing the method for evaluating the material nonlinearity and the contact nonlinearity in the microwave component by utilizing the substrate integrated slot waveguide, and is beneficial to the test of a large number of samples because the substrate integrated waveguide design technology is relatively mature, the processing period is short, and the cost is low. The PIM testing method based on the near-field coupling provides powerful guidance for low PIM process control in a product line, is beneficial to positioning and diagnosis of PIM sources in a production link, and improves the product yield.

Drawings

FIG. 1 is a schematic diagram of a near field coupled PIM test method using SISW;

FIG. 2 is a cross-sectional block diagram of a SISW disclosed in the present invention;

FIG. 3 is an exploded view of a SISW disclosed herein;

FIG. 4 is a top view of a SISW disclosed herein;

FIG. 5 is a schematic view of a PIM test of a conductive cloth;

FIG. 6 is a schematic view of a PIM test for foam;

FIG. 7 is a schematic view of a PIM test for wireless reflective surface woven wire mesh lapping;

FIG. 8 is a test waveform for three DUTs.

Description of reference numerals:

1-grounding surface layer, 2-dielectric substrate, 3-substrate integrated waveguide section, 4-first impedance matching transition section, 5-second impedance matching transition section, 6-input end, 7-output end, 8-polyimide film, 9-copper foil, 10-high temperature insulating film, 11-rectangular gap, 12-conductive cloth, 13-conductive foam and 14-wireless reflecting surface woven wire mesh.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples.

As shown in fig. 1 to 7, the substrate integrated slot waveguide test board for near-field coupling passive intermodulation test provided by the present invention comprises a ground plane layer 1 and a dielectric substrate 2, which are sequentially arranged from bottom to top; the dielectric substrate 2 is provided with an integrated substrate integrated waveguide section 3, a first impedance matching transition section 4, a second impedance matching transition section 5, an input end 6 and an output end 7, the input end 6 and the output end 7 are respectively arranged on the front side and the rear side of the substrate integrated waveguide section 3, the input end 6 is connected with the substrate integrated waveguide section 3 through the first impedance matching transition section 4, the output end 7 is connected with the substrate integrated waveguide section 3 through the second impedance matching transition section 5, the substrate integrated waveguide section 3 is provided with a high-temperature insulating film 10, and rectangular gaps 11 are respectively arranged in the middle of the substrate integrated waveguide section 3 and at the corresponding positions of the high-temperature insulating film 10.

In addition, the left and right side ends of the substrate integrated waveguide section 3 are covered with polyimide films 8, and copper foils 9 are fastened to the outer sides of the corresponding polyimide films 8 through adhesive tapes.

Fig. 1 shows a schematic diagram of a near-field coupled PIM test method using SISW, in which a high power carrier is coupled to a DUT through a slot, a nonlinear signal is excited in the DUT and then coupled back into the test loop, so that variations in the PIM signal caused by the DUT can be observed on a PIM analyzer. This method effectively isolates the carrier from the DUT, and the edges adjust the physical characteristics of the DUT, such as size, roughness, or contact pressure.

Fig. 3 is an exploded view of a SISW as disclosed in the present invention, and it can be seen that the SISW replaces the via holes in the conventional substrate-integrated waveguide with copper foil tape, and the polyimide film 8 is used as isolation between the copper foil 9 and the substrate-integrated waveguide segment 3, so that the additional metal contact can be avoided from affecting the PIM test result and interfering with the evaluation of the DUT nonlinearity.

The test method is based on the conventional PIM test method, and a substrate integrated slot waveguide test board is added into a test loop to realize the near-field coupling PIM test function. In order to avoid PIM risk brought by the through hole of the substrate integrated waveguide and reduce residual intermodulation of the whole testing device, copper foil and adhesive tape are adhered to the side wall of the SISW to replace the through hole.

In order to avoid additional metal contact caused by contact between the copper foil and the substrate integrated waveguide section, a polyimide film is used as isolation in the middle. The specific test steps are as follows:

1) placing high temperature insulation on the substrate integrated slot waveguide to prevent DUT and SISW contact from introducing additional contact non-linearity, disturbing the test results;

2) the SISW is connected to a vector network analyzer, the DUT is placed above the gap, and whether the test environment is safe is judged through the variation of the return loss and the insertion loss of the test device. Wherein the specific placement position may be adjusted according to the physical shape of the DUT. If the return loss is less than-15 dB and the insertion loss is close to 0dB, the next step is carried out;

3) by connecting the SISW to a PIM test loop, the high power carrier is coupled through a slot to the DUT, exciting a non-linear signal on the DUT and then coupling back into the test loop, so that changes in the PIM signal caused by the DUT can be observed at the PIM analyzer.

During testing, a Device Under Test (DUT) is placed over a slot of a SISW test board, the insertion loss between two ports of the slot waveguide is close to 0dB in a test frequency band, and the surface current density sensed on the DUT can be changed by fine tuning the vertical distance between the DUT and the SISW.