阅读说明：本技术 一种低温即可催化的助焊剂 (Soldering flux capable of catalyzing at low temperature ) 是由 张�浩 陈青 于 2020-04-23 设计创作，主要内容包括：本发明公开了一种低温即可催化的助焊剂,包括丁二酸、己二酸,三乙醇胺,表面活性剂,乙醇；所述表面活性剂为氟碳表面活性剂,原料总量以1000重量份计,各种原料及重量份为：丁二酸,200-300,己二酸,15-20,三乙醇胺50-100,表面活性剂,10-15,乙醇300-400,通过三乙醇胺的添加,降低助焊剂的催化点温度,从而大幅降低注塑工程的热量能耗。(The invention discloses a soldering flux which can be catalyzed at low temperature, comprising succinic acid, adipic acid, triethanolamine, a surfactant and ethanol; the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows: succinic acid, 200-300 parts, adipic acid, 15-20 parts, triethanolamine, 50-100 parts, surfactant, 10-15 parts, and ethanol, 300-400 parts, wherein the addition of triethanolamine lowers the catalytic point temperature of the soldering flux, thereby greatly reducing the heat energy consumption of the injection molding engineering.)

1. A low-temperature catalytic flux is characterized in that: comprises succinic acid, adipic acid, triethanolamine, surfactant and ethanol;

the total amount of the raw materials is 1000 parts by weight, and the raw materials comprise the following components in parts by weight:

succinic acid, 200-

The weight ratio of adipic acid, 15-20,

50-100 parts of triethanolamine, namely triethanolamine,

surfactant, 10-15

Ethanol 300-.

2. The flux of claim 1, wherein: the surfactant is a fluorocarbon surfactant.

Technical Field

The invention belongs to the field of soldering tin, and particularly relates to a soldering flux capable of being catalyzed at a low temperature.

Background

During ball planting engineering, the existing welding needs to be carried out at 220-250 ℃, the soldering flux can play a role, the balls are melted and welded, the overall heat energy consumption of the engineering is very high, and the danger coefficient is very high.

Since the surface of the metal workpiece to be welded is contaminated with oxides, dust, and the like, which inhibit the mutual diffusion of the metal of the workpiece base and the solder in an atomic state, it is necessary to remove the oxides and the like to clean the surface and expose the metal base, but the atoms on the surface of the metal base to be cleaned are immediately oxidized in the atmosphere, and the oxidation speed is higher at the welding temperature. The flux is added during the soldering process to help provide metal surfaces without oxide layers and to maintain the oxide-free state of these surfaces until the solder and metal surfaces complete the soldering process. Meanwhile, the chemical action of the flux is utilized to combine with the oxide on the surface of the welded metal to form a liquid-state table object at the welding temperature, so that the metal atoms on the surface of the welded metal part and the atoms of the molten solder are diffused mutually to achieve the purpose of soldering connection. The flux also promotes solder flow and spreading during soldering, and affects the balance of the solder surface tension in the direction of solder spreading by reducing surface irregularities.

In addition to chemical activity, an ideal flux also needs to have good thermal stability, adhesion, spreading force, electrolytic activity, environmental stability, chemical functional groups and their reaction characteristics, rheological characteristics, adaptability to general cleaning solutions and equipment, and the like. The above functions of the flux are achieved by the action of the components such as an activator, a solvent, a surfactant, etc. therein.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a low-temperature catalytic soldering flux.

The technical problem to be solved by the invention is to provide the soldering flux which can be catalyzed at low temperature.

The purpose of the invention can be realized by the following technical scheme:

a low-temperature catalytic soldering flux comprises succinic acid, adipic acid, triethanolamine, a surfactant and ethanol;

the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows:

the succinic acid is 200-300, and the content of the succinic acid is 200-300,

15-20 parts of adipic acid, namely,

50-100 parts of triethanolamine, namely triethanolamine,

10-15 parts of a surface active agent,

ethanol 300-.

The invention has the beneficial effects that:

the addition of triethanolamine reduces the temperature of the catalytic point of the soldering flux, thereby greatly reducing the heat energy consumption of the injection molding engineering.

Detailed Description

The technical scheme of the invention is further described as follows:

a low-temperature catalytic soldering flux comprises succinic acid, adipic acid, triethanolamine, a surfactant and ethanol;

the surfactant is a fluorocarbon surfactant, and the total amount of the raw materials is 1000 parts by weight, and the raw materials and the parts by weight are as follows:

succinic acid, 200-

The weight ratio of adipic acid, 15-20,

50-100 parts of triethanolamine, namely triethanolamine,

surfactant, 10-15

Ethanol 300-.

The low-temperature soldering flux is organic acid active substance soldering flux, the main active substances of the low-temperature soldering flux are succinic acid and a small amount of adipic acid, triethanolamine is used as an acid-base regulator, and a fluorocarbon surfactant is added.

Succinic acid, colorless crystals, melting point 185 deg.C, boiling point 235 deg.C (decomposed into anhydride).

Adipic acid: boiling point 265 deg.C, melting point 151 deg.C, 153 deg.C

Triethanolamine: the molecular formula is as follows: n (CH 2OH)3 physicochemical properties: colorless and viscous liquid at normal temperature, slightly ammoniacal smell, and easily soluble in water and ethanol. Copper, aluminum and alloys thereof can be corroded. Liquids and vapors corrode the skin and eyes. Can react with various acids to generate ester and amide salts. The boiling point is 360.0 ℃, the melting point is 21.2 ℃, and the surfactant also has the function of physical and chemical properties.

Although some compounded organic acid activator is added, because triethanolamine is added to adjust the pH value, after various substances are mixed, part of the substances react, and the substances have the activity of acid only at a certain temperature.

According to the main material properties, the welding temperature can be reduced, and the main active materials of succinic acid and adipic acid which do not participate in the reaction can volatilize. The triethanolamine is not completely volatilized, and the whole residual components are alkaline.

Finally, it should be noted that:

the method may be carried out and its application may be carried out by those skilled in the art with reference to the disclosure herein, and it is expressly intended that all such alternatives and modifications as would be apparent to those skilled in the art are deemed to be included within the invention. While the method and application of the present invention have been described in terms of preferred embodiments, it will be apparent to those of ordinary skill in the art that variations and modifications in the method and application of the invention as described herein may be made and equivalents employed without departing from the spirit and scope of the invention.

Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that: modifications and equivalents may be made thereto without departing from the spirit and scope of the invention, and the appended claims are intended to cover such modifications and equivalents as fall within the true spirit and scope of the invention.