阅读说明：本技术 一种pcb板及电子设备 (PCB and electronic equipment ) 是由 李金龙 王迎新 任永会 易毕 曹化章 于 2018-08-13 设计创作，主要内容包括：本发明公开了一种PCB板及电子设备，其中，该PCB板包括：电源过孔，设置有至少两个；导体连接件，电连接每个所述电源过孔中远离芯片的端部；本发明的PCB板及电子设备，通过导体连接件电连接PCB板上的电源过孔，使得电源过孔的残桩上的干扰信号会通过导体连接件相互抵消。另外一方面，由于导体连接件会形成一个小的电源通路平面，导体连接件相当于消除了电源过孔的残桩，因此由电源过孔的残桩形成的天线效应会通过导体连接件进行屏蔽。就此，可以通过导体连接件使得PCB板上的差分对之间的串扰减小到1mv以内，从而无需再对电源过孔进行背钻，而且，还可使得电源走线层得到充分利用，并且提高了布线密度，降低了走线层数，节省成本。(The invention discloses a PCB and an electronic device, wherein the PCB comprises: at least two power supply through holes are arranged; the conductor connecting piece is electrically connected with the end part of each power supply through hole far away from the chip; according to the PCB and the electronic equipment, the conductor connecting piece is electrically connected with the power supply through hole in the PCB, so that interference signals on the stub of the power supply through hole can be mutually offset through the conductor connecting piece. On the other hand, since the conductor connector forms a small power path plane, the conductor connector is equivalent to eliminating the stub of the power via, and thus the antenna effect formed by the stub of the power via is shielded by the conductor connector. Just so, can make the crosstalk between the difference on the PCB board reduce to within 1mv through the conductor connecting piece to need not to carry out the back drilling to the power via hole again, moreover, still can make power routing layer obtain make full use of, and improved wiring density, reduced the number of piles of walking, save the cost.)

1. A PCB board, comprising:

at least two power supply through holes are arranged;

and the conductor connecting piece is electrically connected with the end part of each power supply through hole far away from the chip.

2. The PCB board of claim 1, wherein the conductor connector is secured to an end of each of the power vias distal from the chip.

3. The PCB board of claim 2, wherein the conductor connecting piece is provided with a through hole at the electric connection part with the power supply through hole, and the inner wall of the through hole is flush with the inner wall of the corresponding power supply through hole.

4. The PCB board of claim 1, wherein an end of the power via distal from the chip is located in the substrate.

5. The PCB board of claim 1, wherein the power vias are filled with a conductor medium.

6. The PCB board of claim 1, comprising:

at least two different sizes of the power vias.

7. The PCB of claim 1, wherein the conductor connector is in the form of a block.

8. The PCB board of claim 1, wherein the conductor connector comprises: a conductive copper foil.

9. An electronic device comprising the PCB of any one of claims 1-8.

Technical Field

The invention relates to the field of printed circuit boards, in particular to a PCB and electronic equipment.

Background

With the advent of informatization, the transmission speed of signals has increased, and the speed of high-speed serializer/deserializer SerDes has increased from 25Gbps to 56Gbps and is advancing toward 112 Gbps. As the signal rate increases, the capability of the chip gradually reaches a limit, and thus the signal margin becomes smaller.

Ball grid array BGA packaging of printed circuit boards PCB is increasingly adopted by chip manufacturers due to the characteristics of large number of I/O pins, small parasitic parameters, etc. Power pins and ground pins are provided on the BGA to power the chip. Meanwhile, some high-speed SerDes differential pairs are arranged on the chip, and power supply through holes or grounding holes are needed to be isolated among the high-speed differential pairs in consideration of the requirement of signal integrity. After the high-speed differential pairs are isolated by using the power supply via holes, as the stub is formed at the part of the power supply via hole, which is positioned below the power supply wiring layer, under the action of the antenna effect of the stub, crosstalk resonance can be generated between the differential pairs positioned at the two sides of the power supply via hole, so that crosstalk is increased sharply. At present, the method for reducing the influence of the antenna effect is to back drill the power supply through hole, so that the stub of the power supply through hole is shortened as much as possible. However, the method using the back drill has three disadvantages that the number of I/O pins increases as the size of the chip decreases, so that the center distance between adjacent pins decreases, which makes it difficult to process the chip package with a small Pitch, where the Pitch is the center distance between two adjacent vias; secondly, after the power supply via hole is drilled in the back, the power supply routing layers penetrated by the drill cutter cannot meet the chip power supply requirement due to the fact that the size of the drill cutter is increased and the power supply through-current is reduced; and thirdly, the signal routing layer and the grounding layer penetrated by the drill bit cannot be routed in the back drilling area due to the requirements of processing capacity and signal integrity, so that the routing density is reduced.

Disclosure of Invention

The invention mainly aims to provide a PCB and electronic equipment, which solve the problems that in the prior art, a power supply through hole needs to be back-drilled, chip processing is difficult due to back drilling, power supply through current is reduced, wiring density is low and the like.

According to a first aspect of the present invention, there is provided a PCB board comprising: at least two power supply through holes are arranged; and the conductor connecting piece is electrically connected with the end part of each power supply through hole far away from the chip.

Optionally, the conductor connector is fixed to an end of each of the power vias, the end being far away from the chip.

Optionally, a through hole is formed in the conductor connecting piece at the position electrically connected with the power supply via hole, and the inner wall of the through hole is flush with the inner wall of the corresponding power supply via hole.

Optionally, an end of the power via away from the chip is located in the substrate.

Optionally, the power supply via hole is filled with a conductor medium.

Optionally, the method includes: at least two different sizes of the power vias.

Optionally, the conductor connecting piece is arranged in a block shape.

Optionally, the conductor connector comprises: a conductive copper foil.

According to a second aspect of the present invention, there is provided an electronic device comprising a PCB board as described above.

The invention has the following beneficial effects: the power supply through holes in the PCB are electrically connected through the conductor connecting pieces, so that interference signals on stubs of the power supply through holes can be mutually offset through the conductor connecting pieces. On the other hand, since the conductor connector forms a small power path plane, the conductor connector is equivalent to eliminating the stub of the power via, and thus the antenna effect formed by the stub of the power via is shielded by the conductor connector. In this regard, cross talk between differential pairs on a PCB board may be reduced to within 1mv by the conductor connectors. Compared with the prior art, the crosstalk is reduced from 10mv to 0.9mv, and the signal index requirement can be completely met. Therefore, the power supply via hole does not need to be back-drilled, the power supply wiring layer can be fully utilized, the wiring density is improved, the wiring layer number is reduced, and the cost is saved.

Drawings

FIG. 1 is a 45 degree angle view of the top surface of a PCB board according to a first embodiment of the present invention;

FIG. 2 is a 45 degree angle view of the bottom surface of the PCB board according to the first embodiment of the present invention;

FIG. 3 is an x-axis cross-sectional view of a PCB board according to a first embodiment of the present invention;

FIG. 4 is a y-axis cross-sectional view of a PCB board according to a first embodiment of the present invention;

FIG. 5 is a graph illustrating the effect of cross talk when using a conductor connector and when not using a conductor connector according to a second embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a PCB board according to a third embodiment of the present invention;

FIG. 7 is a graph illustrating the effect of crosstalk when using a conductor connector and when not using a conductor connector according to a third embodiment of the present invention;

FIG. 8 is a schematic structural diagram of a PCB board according to a fourth embodiment of the present invention;

fig. 9 is a graph showing the effect of crosstalk comparison between the fourth embodiment of the present invention using a conductor connector and a conductor connector without the conductor connector.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.

In order to facilitate an understanding of the embodiments of the present invention, the structure of the present invention will be described in detail with reference to several specific embodiments.

A first embodiment of the present invention provides a PCB including: at least two power supply through holes are arranged; and the conductor connecting piece is electrically connected with the end part of each power supply through hole far away from the chip.

In this regard, the power vias on the PCB board are electrically connected by the conductor connectors so that interference signals on stubs of the power vias cancel each other out by the conductor connectors. On the other hand, since the conductor connector forms a small power path plane, the conductor connector is equivalent to eliminating the stub of the power via, and thus the antenna effect formed by the stub of the power via is shielded by the conductor connector. In this regard, cross talk between differential pairs on a PCB board may be reduced to within 1mv by the conductor connectors. Compared with the prior art, the crosstalk is reduced from 10mv to 0.9mv, and the signal index requirement can be completely met. Therefore, the power supply via hole does not need to be back-drilled, the power supply wiring layer can be fully utilized, the wiring density is improved, the wiring layer number is reduced, and the cost is saved.

Specifically, fig. 1 is a 45-degree angle view of a top surface of a PCB board according to a first embodiment of the present invention; FIG. 2 is a 45 degree angle view of the bottom surface of the PCB board according to the first embodiment of the present invention; FIG. 3 is an x-axis cross-sectional view of a PCB board according to a first embodiment of the present invention; fig. 4 is a y-axis cross-sectional view of a PCB board according to a first embodiment of the present invention.

A first embodiment of the present invention provides a PCB including a substrate, the substrate including: the power supply wiring layer and the ground layer are characterized in that a signal via hole, at least two power supply via holes and a ground hole are formed in the substrate, the signal via hole, the power supply via holes and the ground hole are all arranged in a cylindrical shape, electroplating is carried out on the power supply via holes, so that a conductive copper foil is formed on the hole wall of each power supply via hole, each power supply via hole is electrically connected with the power supply wiring layer through the conductive copper foil, and the top end of each power supply via hole is electrically connected with a chip.

Optionally, the conductor connecting piece is arranged in a block shape. Of course, in the present embodiment, the shape of the conductor connecting member is not limited, and only needs to satisfy the requirements of the present embodiment.

In this embodiment, the end of each power via away from the chip is electrically connected to the same conductor connector.

Specifically, as shown in fig. 1 to 4, a substrate is provided with a power via 201, a power via 202, a signal via 101, a signal via 102, a signal via 301, a signal via 302, a ground via 401, a ground via 402, a ground via 403, a ground via 404, a ground via 405, and a ground via 406, and the substrate includes a power routing layer 502 and a 7-layer ground layer, that is: the total number of layers of this PCB board is 8, and wherein, this 7 layers of stratum includes: ground layer 501, ground layer 503, ground layer 504, ground layer 505, ground layer 506, ground layer 507, and ground layer 508; in fig. 1, the end portions of the power vias 201 and 202 exposed out of the substrate are top ends top, which are electrically connected to corresponding chips; in fig. 2, the end portions of the power vias 201 and 202 exposed out of the substrate are bottom ends bottom, and the bottom ends of the power vias 201 and 202 are electrically connected to the same conductor connector 601, that is: the end of the power via 201 remote from the chip and the end of the power via 202 remote from the chip are both electrically connected to the same conductor connection 601.

The power vias 201 and 202 are electrically connected by the conductor connectors 601 so that interference signals on the stubs of the power vias 201 and 202 cancel each other out through the conductor connectors 601. On the other hand, since the conductor connector 601 forms a small power path plane, the conductor connector 601 is equivalent to eliminating the stub of the power via 201 and the stub of the power via 202, and thus the antenna effect formed by the stub of the power via 201 and the stub of the power via 202 is shielded by the conductor connector 601. In this regard, the through conductor connector 601 reduces crosstalk between differential pairs (signal vias 101 and 102) and (ground vias 301 and 302) on the PCB board to within 1 mv. Compared with the prior art, the crosstalk is reduced from 10mv to 0.9mv, and the signal index requirement can be completely met. Therefore, back drilling of the power supply via holes 201 and 202 is not needed, the power supply wiring layer 502 is fully utilized, wiring density is improved, the number of wiring layers is reduced, and cost is saved.

In the embodiment, the outer diameters of the power vias 201 and 202 are both D1, and the value of D1 depends on the thickness of the substrate, that is: depending on the thickness of the PCB board, the thickness of the hole wall of the power via 201 and the thickness of the hole wall of the power via 202 are both greater than 18um required by the printed circuit association IPC specification, the center distance between the power via 201 and the power via 202 is D2, and the value of D2 is the same as the center distance between adjacent pins in the device package. The power vias 201 and 202 are connected by conductor connectors 601. It should be noted that in the present embodiment, the conductor connector 601 is electrically connected only to the power via, and not to other components, so that the conductor connector 601 is electrically connected only to the power via 201 and the power via 202.

Optionally, the conductor connector 601 is fixed to the end of the power vias 201 and 202 away from the chip, and the conductor connector 601 is electrically connected to the end of the power vias 201 and 202 away from the chip. Such as: the conductor connector 601 is plated on the end of the power vias 201 and 202 away from the chip.

Further, in an initial stage of generating the PCB, the PCB board before the hole is not drilled includes: a ground layer 501, a power routing layer 502, a ground layer 503, a ground layer 504, a ground layer 505, a ground layer 506, a ground layer 507, a ground layer 508 and a conductor connector 601, and then, drilling holes at predetermined positions on the PCB before the drilling holes to form a power via 201, a power via 202, a signal via 101, a signal via 102, a signal via 301, a signal via 302, a ground hole 401, a ground hole 402, a ground hole 403, a ground hole 404, a ground hole 405 and a ground hole 406 on the PCB; when drilling the power supply via hole 201, if the conductor connector 601 is penetrated, a through hole corresponding to the power supply via hole 201 is formed on the conductor connector 601, and the inner wall of the through hole is flush with the inner wall of the power supply via hole 201; when the conductor connector 601 is inserted during drilling of the power supply via hole 202, a through hole corresponding to the power supply via hole 202 is formed in the conductor connector 601, and the inner wall of the through hole is flush with the inner wall of the power supply via hole 202.

Then, electroplating operation is carried out according to the preset electroplating position, so that the electroplated copper foil is formed at the preset electroplating position. In the present embodiment, it is necessary to fix and electrically connect the end of the power via 202 away from the chip and the end of the power via 201 away from the chip to the conductor connector 601 by electroplating.

In another embodiment, after the electroplating is completed, the through holes may be filled with a conductor medium, so that the conductor connector 601 has a solid configuration.

Alternatively, if the substrate is not penetrated when the end of the power via 201 away from the conductor connector 601 is drilled toward the conductor connector 601, and the substrate is not penetrated when the end of the power via 202 away from the conductor connector 601 is drilled toward the conductor connector 601, the conductor connector 601 is disposed inside the substrate, and of course, the conductor connector 601 still electrically connects the end of the power via 201 away from the chip and the end of the power via 202 away from the chip.

In another embodiment, the power vias 201 and 202 may be filled with a conductor dielectric. Of course, the conductor dielectric may be filled only in the power via 201 or the power via 202, which is not limited in this embodiment, and only needs to satisfy the requirements of the present invention.

Optionally, the conductor medium is filled in the power supply via hole, so that the power supply via hole is arranged in a solid manner. Namely: if the power via 201 is filled with a conductor dielectric, the power via can be filled to a solid state with a sufficient amount of the conductor dielectric. In this regard, the current flux of the power via is increased. Of course, in another embodiment, the power via is filled with a proper amount of conductor medium, but not filled until the power via is disposed in a solid manner, which can also improve the current flow of the power via to some extent.

In another embodiment, at least two power vias with different sizes are disposed on the substrate. Namely: the sizes of the power vias 201 and 202 are different, which helps to improve the applicability of the PCB. Of course, the same dimensions for the power vias 201 and 202 are also suitable for this embodiment.

Optionally, the conductor connector 601 includes: a conductive copper foil. In this embodiment, the conductor connector 601 is made of a conductor material, and the material, structure, and manufacturing process of the conductor connector are not limited in this embodiment, as long as the conductor connector meets the requirements of this embodiment.

In order to better explain the structure of the PCB of the present embodiment, the PCB of the present embodiment is explained below with reference to three specific application examples.

According to fig. 1 to 4, the second embodiment is based on the first embodiment and is configured as follows: the substrate is provided with a power supply via hole 201 and a power supply via hole 202, the end part of the power supply via hole 201 far away from the chip and the end part of the power supply via hole 202 far away from the chip are both electrically connected with the same conductor connecting piece 601, the total number of layers of the PCB is 20, the material is M6G, the outgoing line layers of the signal via holes of two pairs of differential signals are both L18 layers, and the power supply via hole 201(202) between the two pairs of differential signals is connected with the power supply wiring layer 502 on the L3 layer. The Pitch of the ball grid array BGA package is 1.0mm, the plate thickness is 2.4mm, the D1 is 0.25mm, the finished aperture is 0.2mm, and the D2 is 1.0 mm. Fig. 5 is a graph showing the effect of crosstalk comparison between the two pairs of differential vias when the conductor connector is used and when the conductor connector is not used according to the second embodiment of the present invention, according to fig. 5, db (oringinal) in fig. 5 indicates crosstalk between the two pairs of differential vias when the conductor connector 601 is not used, and db (thisp patent) in fig. 5 indicates crosstalk between the two pairs of differential vias after the conductor connector 601 is used, so that the following conclusions can be clearly drawn from fig. 5: the crosstalk described above can be greatly improved by this conductor connection 601.

Fig. 6 is a schematic structural diagram of a PCB board according to a third embodiment of the present invention, and according to fig. 6, the third embodiment is configured on the basis of the first embodiment as follows: the substrate is provided with a power supply via hole 201 and a power supply via hole 202, the end part of the power supply via hole 201, far away from the chip, and the end part of the power supply via hole 202, far away from the chip are both electrically connected with the same conductor connecting piece 601, the total number of layers of the PCB is 20, the material is M6G, the outgoing line layers of the signal via holes of the two pairs of differential signals are all L18 layers, and the power supply via hole between the two pairs of differential signals is connected with a power supply wiring layer 502 positioned on the L3 layer. The Pitch of BGA was 1.0mm, the plate thickness was 2.4mm, the D1 was 0.25mm, the finished hole diameter was 0.2mm, and the D2 was 2.0 mm. Fig. 7 is a graph showing the effect of crosstalk comparison between the conductor connector and the conductor connector not used according to the third embodiment of the present invention, according to fig. 7, db (oringinal) in fig. 7 indicates crosstalk between two pairs of differential vias when the conductor connector 601 is not used, and db (thisp patent) indicates crosstalk between two pairs of differential vias after the conductor connector 601 is used, so that the following can be clearly concluded from fig. 7: the crosstalk described above can be greatly improved by this conductor connection 601.

Fig. 8 is a schematic structural diagram of a PCB according to a fourth embodiment of the present invention, and according to fig. 8, the fourth embodiment is based on the first embodiment, and the following settings are performed: in this embodiment, the PCB board is provided with three power vias: the power supply comprises power supply through holes 201, power supply through holes 202 and power supply through holes 203, wherein the end portions, far away from the chip, of the power supply through holes 201, the end portions, far away from the chip, of the power supply through holes 202 and the end portions, far away from the chip, of the power supply through holes 203 are all electrically connected with the same conductor connecting piece 601, the total number of layers of the PCB is 20, the material is M6G, the outgoing line layers of the signal through holes of the two pairs of differential signals are all L18 layers, and the power supply through holes between the two pairs of differential signals are connected with the power. The Pitch of BGA was 0.6mm, the plate thickness was 2.4mm, the D1 was 0.15mm, the finished hole diameter was 0.1mm, and the D2 was 1.0 mm. Fig. 9 is a graph showing the effect of crosstalk comparison between the conductor connector 601 and the conductor connector 601 not used according to the fourth embodiment of the present invention, and according to fig. 9, db (oringinal) in the graph of fig. 9 indicates crosstalk between two pairs of differential vias when the conductor connector 601 is not used, and db (thisp patent) indicates crosstalk between two pairs of differential vias after the conductor connector 601 is used, so the following conclusions can be clearly drawn from fig. 9: the crosstalk described above can be greatly improved by this conductor connection 601.

In addition, a fifth embodiment of the present invention further provides an electronic device, which includes the PCB board of any one of the first to fourth embodiments, and optionally, the electronic device further includes a processor and a memory; the memory is used for storing computer instructions and the processor is used for operating the computer program stored by the memory.

The electronic equipment is electrically connected with the power supply via hole on the PCB through the conductor connecting piece, so that interference signals on the stub of the power supply via hole can be mutually offset through the conductor connecting piece. On the other hand, since the conductor connector forms a small power path plane, the conductor connector is equivalent to eliminating the stub of the power via, and thus the antenna effect formed by the stub of the power via is shielded by the conductor connector. In this regard, cross talk between differential pairs on a PCB board may be reduced to within 1mv by the conductor connectors. Compared with the prior art, the crosstalk is reduced from 10mv to 0.9mv, and the signal index requirement can be completely met. Therefore, the power supply via hole does not need to be back-drilled, the power supply wiring layer can be fully utilized, the wiring density is improved, the wiring layer number is reduced, and the cost is saved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.