Detection method and detection equipment for three-dimensional size of part special-shaped surface microstructure
阅读说明：本技术 一种零件异形表面微结构三维尺寸的检测方法及检测设备 (Detection method and detection equipment for three-dimensional size of part special-shaped surface microstructure ) 是由 牛增渊 霍德鸿 丁辉 陈任寰 于 2019-11-25 设计创作，主要内容包括：本发明涉及一种零件异形表面微结构三维尺寸的检测方法及检测设备,该检测方法的步骤为,S1、对异形表面微结构拍照；S2、对异形表面微结构进行二维尺寸的测量；S3、对异形表面微结构进行扫描并记录扫描后的距离数据；S4、对步骤S3中的距离数据进行处理,得到高度或深度；检测设备包括机架、工作台面、XY水平移动平台、竖直支架以及Z轴移动组件,在竖直支架上设有CCD相机组件,在Z轴移动组件上设有测距组件。通过拍照技术对异形表面微结构的平面尺寸进行精确测量,通过一维光学测距传感器对异形表面微结构的高度或深度进行精确测量,从而实现了对零件异形表面微结构三维尺寸的高精度测量；实现自动对焦,提高设备的自动化程度。(The invention relates to a detection method and detection equipment for three-dimensional size of a part special-shaped surface microstructure, wherein the detection method comprises the following steps of S1, photographing the special-shaped surface microstructure; s2, measuring the two-dimensional size of the special-shaped surface microstructure; s3, scanning the special-shaped surface microstructure and recording the distance data after scanning; s4, processing the distance data in the step S3 to obtain the height or the depth; the detection equipment comprises a frame, a working table surface, an XY horizontal moving platform, a vertical support and a Z-axis moving assembly, wherein a CCD camera assembly is arranged on the vertical support, and a distance measuring assembly is arranged on the Z-axis moving assembly. The plane size of the special-shaped surface microstructure is accurately measured through a photographing technology, and the height or the depth of the special-shaped surface microstructure is accurately measured through a one-dimensional optical ranging sensor, so that the high-precision measurement of the three-dimensional size of the special-shaped surface microstructure of the part is realized; automatic focusing is realized, and the automation degree of the equipment is improved.)
1. A method for detecting the three-dimensional size of a special-shaped surface microstructure of a part is characterized by comprising the following steps,
s1, photographing the special-shaped surface microstructure of the part through a photographing technology;
s2, measuring the two-dimensional size of the special-shaped surface microstructure of the part through a software technology;
s3, scanning the special-shaped surface microstructure of the part through a one-dimensional optical ranging sensor and recording the distance data after scanning;
and S4, processing the distance data in the step S3, and obtaining the height or the depth of the special-shaped surface microstructure through the fluctuation information generated on the distance data.
2. The method for detecting the three-dimensional size of the microstructure on the special-shaped surface of the part as claimed in claim 1, wherein the step of calculating the distance difference in step S4 is,
s41, firstly, taking a first point scanned by the one-dimensional optical ranging sensor as a distance reference;
and S42, forming corresponding coordinates by taking the distance measured subsequently as a zero point with the distance reference, and recording.
3. The detection equipment for the three-dimensional size of the special-shaped surface microstructure of the part is based on the detection method of claim 1 or 2 and comprises a rack (1), a workbench surface (2) arranged on the rack (1), an XY horizontal moving platform (3) arranged on the workbench surface (2), a vertical support (4) arranged on the workbench surface (2) and a Z-axis moving assembly (5) arranged on the vertical support (4), and is characterized in that a CCD camera assembly (6) for detecting the two-dimensional size is arranged on the vertical support (4), and a distance measurement assembly (7) for detecting the height or depth size is arranged on the Z-axis moving assembly (5).
4. The apparatus for inspecting the three-dimensional size of the microstructure on the special-shaped surface of a part according to claim 3, wherein the CCD camera assembly (6) comprises a camera mounting bracket (61) arranged on the vertical bracket (4) and a CCD camera (62) arranged on the camera mounting bracket (61); and a lamp assembly for illumination is arranged on the camera mounting bracket (61) beside the CCD camera (62).
5. The device for detecting the three-dimensional size of the microstructure on the special-shaped surface of the part as claimed in claim 4, wherein the lamp assembly comprises a lamp support (63) and a lamp (64) arranged on the lamp support (63), the lamp support (63) is annular and sleeved on the CCD camera (62), and a plurality of lamps (64) are arranged and surround the CCD camera (62).
6. The apparatus for detecting the three-dimensional size of the microstructure on the special-shaped surface of a part as claimed in claim 3, wherein the ranging assembly (7) comprises a ranging mounting bracket (71) and a one-dimensional optical ranging sensor (72) arranged on the ranging mounting bracket (71).
7. The device for detecting the three-dimensional size of the microstructure on the special-shaped surface of the part as claimed in claim 3, wherein the Z-axis moving assembly (5) comprises a linear guide rail (51) arranged on the vertical support (4) and a driving motor (52), the distance measuring assembly (7) is arranged on the linear guide rail (51), and the driving motor (52) drives the distance measuring assembly (7) to move on the linear guide rail (51).
8. The apparatus for inspecting the three-dimensional size of the microstructure on the special-shaped surface of a part according to claim 3, wherein the XY horizontal moving platform (3) comprises an X-axis moving assembly (31) arranged on the worktable surface (2) and a Y-axis moving assembly (32) arranged on the X-axis moving assembly (31).
9. The device for detecting the three-dimensional size of the microstructure on the special-shaped surface of the part according to claim 8, wherein the X-axis moving assembly (31) comprises an X-axis fixed table (311) fixed on the table top (2) of the work table, an X-axis slide rail (312) arranged on the X-axis fixed table (311), an X-axis moving table (313) arranged on the X-axis slide rail (312), and an X-axis linear motor (314) for driving the X-axis moving table (313) to move.
10. The apparatus for detecting the three-dimensional size of the microstructure on the special-shaped surface of the part according to claim 8, wherein the Y-axis moving assembly (32) comprises a Y-axis fixed stage (321) fixed on the X-axis moving assembly (313), a Y-axis slide rail (322) arranged on the Y-axis fixed stage (321), a Y-axis moving stage (323) arranged on the Y-axis slide rail (322), and a Y-axis linear motor (324) for driving the Y-axis moving stage (323) to move.
Technical Field
The invention relates to the technical field of high-precision detection equipment, in particular to a method and equipment for detecting the three-dimensional size of a part special-shaped surface microstructure.
Background
With the development of science and technology, parts develop towards small micro-size, and correspond to some precision equipment, some small micro-parts have complicated special-shaped surface structures, and parts with special-shaped surface microstructures (functional surfaces) are widely applied to various high-end equipment, such as medical nail abutting seats, optical aspheric surface micro-lens arrays and the like. Taking the medical nail pushing seat as an example, one end of the nail pushing seat is hinged with the nail pressing plate and the nail channel, the nail pressing plate extrudes the suture needles in the nail channel to penetrate through the skin on two sides of the wound until the special-shaped groove microstructures on the surface of the nail pushing seat, and the special-shaped groove microstructures on the surface of the nail pushing seat bend the suture needles to suture the wound. The quality of wound suture depends on the fit and matching precision of the nail abutting seat, the nail pressing plate and the nail channel, such as the distance precision of the hinge joint of the nail abutting seat and the nail pressing plate to the special-shaped groove microstructure on the surface of the nail abutting seat, the depth precision of the special-shaped groove microstructure on the surface of the nail abutting seat and the like. Therefore, it is necessary to detect the three-dimensional size of the nail abutment with high precision, which is required to be on the order of micron precision to ensure the quality of wound closure.
The current detection method usually adopts a commercial three-dimensional profile measuring instrument based on the optical interference principle to measure the three-dimensional dimension. Unlike parts with regular surface microstructures, the surface groove microstructures of parts such as nail abutting seats are special-shaped structures (generally, spherical and planar structures). Due to the characteristics of large curvature and the like of the special-shaped groove microstructure, the reflection angle of light rays irradiating the surface of the special-shaped microstructure is too large, so that the three-dimensional profile measuring instrument based on the surface light interference principle cannot receive effective reflection light rays, the depth of the special-shaped groove microstructure cannot be accurately measured, and a high-precision three-dimensional profile dimension measuring result of a part with the special-shaped surface microstructure cannot be obtained.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method and equipment for detecting the three-dimensional size of the special-shaped surface microstructure of a part, so that the high-precision measurement of the three-dimensional size of the special-shaped surface microstructure of the part is realized, and meanwhile, the automation of the measurement is realized.
The technical scheme adopted by the invention for solving the technical problems is as follows: a method for detecting the three-dimensional size of a special-shaped surface microstructure of a part comprises the following steps,
s1, photographing the special-shaped surface microstructure of the part through a photographing technology;
s2, measuring the two-dimensional size of the special-shaped surface microstructure of the part through a software technology;
s3, scanning the special-shaped surface microstructure of the part through a one-dimensional optical ranging sensor and recording the distance data after scanning;
and S4, processing the distance data in the step S3, and obtaining the height or the depth of the special-shaped surface microstructure through the fluctuation information generated on the distance data.
More specifically, the step of calculating the distance difference in step S4 is to,
s41, firstly, taking a first point scanned by the one-dimensional optical ranging sensor as a distance reference;
and S42, forming corresponding coordinates by taking the distance measured subsequently as a zero point with the distance reference, and recording.
Based on the detection method, the detection equipment comprises a rack, a workbench surface arranged on the rack, an XY horizontal moving platform arranged on the workbench surface, a vertical support arranged on the workbench surface and a Z-axis moving assembly arranged on the vertical support, wherein a CCD camera assembly for detecting the two-dimensional size is arranged on the vertical support, and a distance measurement assembly for detecting the height or depth size is arranged on the Z-axis moving assembly.
More specifically, the CCD camera assembly includes a camera mounting bracket disposed on the vertical bracket and a CCD camera disposed on the camera mounting bracket; and a lamp assembly for illumination is arranged on the camera mounting bracket beside the CCD camera.
Further specifically, the lamp assembly comprises a lamp support and a lamp arranged on the lamp support, the lamp support is annular and is sleeved on the CCD camera, and the lamps are arranged in a plurality and surround the CCD camera.
Further specifically, the distance measuring assembly comprises a distance measuring mounting bracket and a one-dimensional optical distance measuring sensor arranged on the distance measuring mounting bracket.
Further specifically, Z axle removes subassembly including setting up linear guide and the driving motor on vertical support, the range finding subassembly set up on linear guide, driving motor drive range finding subassembly move on linear guide.
Further specifically, the XY horizontal moving platform includes an X-axis moving assembly disposed on the working table and a Y-axis moving assembly disposed on the X-axis moving assembly.
Further specifically, the X-axis moving assembly includes an X-axis fixed table fixed on the table top of the table, an X-axis slide rail disposed on the X-axis fixed table, an X-axis moving table disposed on the X-axis slide rail, and an X-axis linear motor driving the X-axis moving table to move.
Further specifically, the Y-axis moving assembly includes a Y-axis fixed table fixed on the X-axis moving assembly, a Y-axis slide rail disposed on the Y-axis fixed table, a Y-axis moving table disposed on the Y-axis slide rail, and a Y-axis linear motor driving the Y-axis moving table to move.
The invention has the beneficial effects that: by using the method and the equipment, the plane size of the special-shaped surface microstructure is accurately measured by a photographing technology, and the height of the special-shaped surface microstructure is accurately measured by a one-dimensional optical ranging sensor, so that the high-precision measurement of the three-dimensional size of the special-shaped surface microstructure of the part is realized; meanwhile, automatic scanning of height or depth measurement is achieved through the XY horizontal moving platform, automatic focusing of the one-dimensional optical ranging sensor is achieved through the Z-axis moving assembly, the automation degree of equipment is improved, and the speed and the quality of detection are increased.
Drawings
FIG. 1 is a schematic flow diagram of the detection method of the present invention;
FIG. 2 is a schematic diagram of the structure of the detecting device of the present invention;
FIG. 3 is a schematic structural view of the XY horizontal moving stage of the present invention;
FIG. 4 is a schematic diagram of the structure of the CCD camera assembly of the present invention;
FIG. 5 is a schematic structural view of a ranging assembly of the present invention;
FIG. 6 is a schematic structural view of a nail abutting seat of a component to be detected according to the present invention.
In the figure: 1. a frame; 2. a work table; 3. an XY horizontal moving platform; 4. a vertical support; 5. a Y-axis moving assembly; 6. a CCD camera assembly; 7. a ranging assembly; 8. a clamp; 9. a nail abutting seat; 31. an X-axis moving assembly; 32. a Y-axis moving assembly; 311. an X-axis fixed stage; 312. an X-axis slide rail; 313. an X-axis moving stage; 314. an X-axis linear motor; 315. a first stopper; 321. a Y-axis fixed table; 322. a Y-axis slide rail; 323. a Y-axis moving stage; 324. a Y-axis linear motor; 325. a second stopper; 51. a linear guide rail; 52. a drive motor; 61. a camera mounting bracket; 62. a CCD camera; 63. a lamp bracket; 64. a light fixture; 71. a ranging mounting bracket; 72. a one-dimensional optical ranging sensor; 91. hinging the interface; 92. a nail abutting groove; 93. an inner groove.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a method for detecting three-dimensional size of a special-shaped surface microstructure of a part includes the steps of,
s1, photographing the special-shaped surface microstructure of the part through a photographing technology, wherein the special-shaped surface needs to be vertically faced to a CCD camera as much as possible in the photographing process.
S2, measuring the two-dimensional size of the special-shaped surface microstructure of the part through a software technology, and obtaining the two-dimensional size information of the special-shaped surface microstructure through correction calculation of a software internal program according to the photo information and the distance between the CCD camera and the part.
S3, scanning the special-shaped surface microstructure of the part through the one-dimensional optical ranging sensor and recording the scanned distance data, setting two-dimensional size information of a position, required to be detected, of the special-shaped surface microstructure in software according to the specific functional size of the part, required to be detected, rapidly determining the position, required to be detected, on a plane through the actual two-dimensional size information obtained in the step S2, and detecting the position through the one-dimensional optical ranging sensor to obtain corresponding distance data.
And S4, processing the distance data in the step S3, and obtaining the height or the depth of the special-shaped surface microstructure through the fluctuation information generated on the distance data.
The step of calculating the height in step S4 is,
s41, firstly, taking a first point scanned by the one-dimensional optical ranging sensor as a distance reference, recording the first point into software, and setting the distance reference as a zero point;
and S42, forming corresponding coordinates by taking the distance measured subsequently as a zero point and recording the coordinates to obtain the height or the depth of the special-shaped surface microstructure.
The detection equipment for the three-dimensional size of the special-shaped surface microstructure of the part is designed based on the method, and as shown in fig. 2, the detection equipment comprises a rack 1, a
The CCD camera assembly 6 shown in fig. 4 includes a camera mounting bracket 61 provided to the vertical bracket 4 and a CCD camera 62 provided to the camera mounting bracket 61; the CCD camera 62 has the characteristics of ultrahigh pixels and large depth of field, and can measure micron-sized two-dimensional contours; a lamp assembly for illumination is arranged on the camera mounting bracket 61 beside the CCD camera 62, the lamp assembly comprises a lamp bracket 63 and a lamp 64 arranged on the lamp bracket 63, the lamp bracket 63 is annular and is sleeved on the CCD camera 62, and a plurality of lamps 64 are arranged and surround the CCD camera 62; the annular lamp 64 is arranged on the circumferential side of the CCD camera, so that better illumination can be provided, and the shooting precision of the CCD camera 62 is improved.
As shown in fig. 5, the distance measuring assembly 7 includes a distance measuring mounting
The Z-axis moving assembly 5 comprises a
In order to realize the scanning action, the scanning action is realized by an XY horizontal moving platform 3, and as shown in fig. 3, the XY horizontal moving platform 3 comprises an X-axis moving component 31 arranged on the working table 2 and a Y-axis moving component 32 arranged on the X-axis moving component 31; the X-axis moving assembly 31 includes an X-axis fixed table 311 fixed on the table top 2 of the table, X-axis slide rails 312 arranged on the X-axis fixed table 311, an X-axis moving table 313 arranged on the X-axis slide rails 312, and an X-axis linear motor 314 driving the X-axis moving table 313 to move, the X-axis slide rails 312 are arranged in parallel, two sliders are mounted at the bottom of the X-axis moving table 313, the two sliders respectively correspond to the two X-axis slide rails 312 to enable the X-axis moving table 313 to cross over the two X-axis slide rails 312, so as to improve the movement stability of the X-axis moving table 313, and meanwhile, a first stopper 315 for preventing the X-axis moving table 313 from sliding out of the X-axis slide rails 312 is arranged at both ends of the X-axis fixed; the Y-axis moving assembly 32 includes a Y-axis fixed stage 321 fixed on the X-axis moving stage 313, a Y-axis slide rail 322 disposed on the Y-axis fixed stage 321, a Y-axis moving stage 323 disposed on the Y-axis slide rail 322, and a Y-axis linear motor 324 driving the Y-axis moving stage 323 to move, the Y-axis slide rail 322 is provided with two and parallel blocks, two slide blocks are mounted at the bottom of the Y-axis moving stage 323, the two slide blocks respectively correspond to the two Y-axis slide rails 322 to enable the Y-axis moving stage 323 to cross over the two Y-axis slide rails 322, so as to improve the movement stability of the Y-axis moving stage 323, and meanwhile, a second stopper 325 for stopping the Y-axis moving stage 323 from sliding out of the Y-axis slide rails 322 is disposed at both.
The three-dimensional size of the special-shaped surface microstructure of the part can be measured through the equipment.
The medical nail anvil 9 will be described in detail below as an example.
Three-dimensional measurements of the microstructure of the profiled surface of the anvil 9 are required, as shown in fig. 6, including the height of the
Firstly, the nail abutting seat is fixed on the Y-
Secondly, the control system turns on the lighting assembly, adjusts the position of the nail abutting seat 9 by driving the XY horizontal moving
Then, the control system moves the center positions of the
And finally, after the obtained measurement data are transmitted into the control system for processing, the control system can display the measurement data through a display screen, and an early warning can be given out if a certain size has larger deviation.
In summary, the detection method and the detection device are used, the two-dimensional size of the special-shaped surface microstructure is captured by the CCD camera 62, the distance of the special-shaped surface microstructure is captured by the one-dimensional optical ranging
It is to be emphasized that: the above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and all simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.