阅读说明：本技术 波长转换部件及激光光源 (Wavelength conversion member and laser light source ) 是由 张勇 高迪 于 2018-08-15 设计创作，主要内容包括：本发明实施例提供了一种波长转换部件及激光光源,涉及光学设备技术领域,解决波长转换部件的热可靠性及光转换效率低的技术问题；波长转换部件包括基板,所述基板包括透射区和至少一个波长转换区,所述波长转换区固化成型有荧光层；其中,所述透射区用于透射激光,所述荧光层用于受激光激发产生荧光。本发明的波长转换部件,采用荧光层直接固化成型在波长转换区上,从而避免其他连接介质的介入,进而最大限度的保留了荧光层所具有的高耐热性,同时,由于荧光层与基板紧密贴合,使得荧光层与基板之间的热交换效率也得到了极大的保证；从而保证了波长转换部件的热稳定性及光转化效率。(The embodiment of the invention provides a wavelength conversion component and a laser light source, relates to the technical field of optical equipment, and solves the technical problems of low thermal reliability and low light conversion efficiency of the wavelength conversion component; the wavelength conversion component comprises a substrate, wherein the substrate comprises a transmission area and at least one wavelength conversion area, and the wavelength conversion area is cured and molded with a fluorescent layer; the transmission region is used for transmitting laser, and the fluorescent layer is used for being excited by the laser to generate fluorescence. According to the wavelength conversion component, the fluorescent layer is directly solidified and molded on the wavelength conversion region, so that the intervention of other connecting media is avoided, the high heat resistance of the fluorescent layer is retained to the maximum extent, and meanwhile, the heat exchange efficiency between the fluorescent layer and the substrate is greatly ensured due to the close fit of the fluorescent layer and the substrate; thereby ensuring the thermal stability and the light conversion efficiency of the wavelength conversion component.)

1. A wavelength converting member comprising a substrate comprising a transmissive region and at least one wavelength converting region,

the wavelength conversion region is solidified and formed with a fluorescent layer;

the transmission region is used for transmitting laser, and the fluorescent layer is used for being excited by the laser to generate fluorescence.

2. The wavelength converting member according to claim 1, wherein the curing molding comprises:

the fluorescent material is solidified in the wavelength conversion area by adopting any one of a vapor deposition process, a bonding process and a sintering process to form a fluorescent layer.

3. The wavelength conversion member according to claim 1, wherein the substrate is configured as a disk-shaped structure, and the fluorescent layer is located on a first plate surface of the substrate;

the substrate is made of any one of metal, monocrystalline silicon and silicon dioxide.

4. The wavelength conversion member according to claim 3, further comprising a heat conductive plate provided on the second plate surface of the substrate for conducting heat of the substrate;

the second plate surface is a surface deviated from the first plate surface.

5. The wavelength conversion member according to claim 3, wherein the second plate surface of the substrate is coated with a heat conductive film layer for conducting heat of the substrate;

the material of heat conduction rete includes: aluminum nitride, and beryllium oxide.

6. The wavelength conversion member according to claim 3, wherein a laser antireflection film layer is provided on the first plate surface of the transmission region of the substrate or on the second plate surface of the substrate;

the laser antireflection film layer is used for reinforcing light rays with a transmission spectrum range of 420nm-470nm, and the second plate surface is a surface deviating from the first plate surface.

7. The wavelength conversion component of claim 6, wherein the substrate comprises a fluorescent reflective film layer located between the fluorescent layer of the conversion region and the first plate surface of the substrate;

wherein, the fluorescence reflection film layer is used for reflecting light rays with the spectral range of 500nm-670 nm.

8. The wavelength conversion member according to claim 7, wherein the second plate face of the wavelength conversion region of the substrate has a high reflection film layer thereon;

wherein, the high reflection film layer is used for reflecting light rays with the spectral range of 420nm-670 nm.

9. The wavelength conversion member according to claim 6, wherein the substrate has a fluorescent reflection film layer on the second plate surface of the wavelength conversion region;

wherein, the fluorescence reflection film layer is used for reflecting light rays with the spectral range of 500nm-670 nm.

10. A laser light source comprising a laser array, a lens assembly and a wavelength converting component according to any one of claims 1 to 9;

wherein the laser array is used for emitting laser beams;

the lens assembly is used for adjusting laser beams of the laser array and emitting the laser beams to the wavelength conversion component.

Technical Field

The invention relates to the technical field of optical equipment, in particular to a wavelength conversion component and a laser light source.

Background

Laser is widely applied to projection display equipment because of its advantages of high brightness, strong monochromaticity, wide color gamut, etc., and projection display size is getting bigger and bigger nowadays, and the requirement for light source output energy is also getting higher and higher.

Laser light sources are widely used at present to excite fluorescent powder to emit light by high-energy laser; the wavelength conversion component in the prior art is mainly a fluorescent wheel, the fluorescent wheel includes a circular substrate, fluorescent powder is fixed on the substrate through a carrier, a laser beam irradiates on the fluorescent powder to realize light conversion, and the fixing modes between the fluorescent powder and the substrate are generally roughly divided into two types:

(1) using silica gel as a carrier to fix the fluorescent powder on the substrate; mixing fluorescent powder and silica gel, and then bonding the mixture on a substrate; because the thermal conductivity coefficient of the silica gel is low and the maximum bearing temperature of the silica gel is low, the use condition of high-power laser cannot be met; in addition, because the thermal conductivity of silica gel is low, when a high-energy laser beam irradiates on the fluorescent powder, the temperature diffusion is slow, the temperature of the fluorescent powder is also higher, and the light conversion efficiency is reduced.

(2) Fixing the fluorescent powder on the substrate by using glass or ceramic as a carrier; mixing, hot-melting, sintering and curing glass or ceramic and fluorescent powder to form a fluorescent layer, and fixing the fixed and formed fluorescent layer on a substrate by adopting silica gel; however, the optical efficiency of the fluorescent layer is low, and in addition, since the thermal conductivity of the silica gel is low, when a high-energy laser beam is irradiated onto the phosphor, the temperature diffusion is slow, so that the temperature of the phosphor is also higher, thereby reducing the light conversion efficiency.

Therefore, how to improve the thermal reliability and the optical conversion efficiency of the wavelength conversion member is a technical problem to be solved.

Disclosure of Invention

The invention provides a wavelength conversion member and a laser light source which are stable in thermal reliability and high in light conversion efficiency.

A wavelength converting member comprising a substrate comprising a transmissive region and at least one wavelength converting region,

the wavelength conversion region is solidified and formed with a fluorescent layer;

the transmission region is used for transmitting laser, and the fluorescent layer is used for being excited by the laser to generate fluorescence.

As an example, the curing molding includes:

the fluorescent material is solidified in the wavelength conversion area by adopting any one of a vapor deposition process, a bonding process and a sintering process to form a fluorescent layer.

As an example, the substrate is configured as a disc-shaped structure, and the fluorescent layer is located on a first plate surface of the substrate;

the substrate is made of any one of metal, monocrystalline silicon and silicon dioxide.

As an example, the wavelength conversion member further includes a heat conductive plate disposed on the second plate surface of the substrate for conducting heat of the substrate;

the second plate surface is a surface deviated from the first plate surface.

As an example, a heat conducting film layer is plated on the second plate surface of the substrate for conducting heat of the substrate;

the material of heat conduction rete includes: aluminum nitride, and beryllium oxide.

As an example, a laser antireflection film layer is provided on the first plate surface of the transmission region of the substrate or on the second plate surface of the substrate;

the laser antireflection film layer is used for reinforcing light rays with a transmission spectrum range of 420nm-470nm, and the second plate surface is a surface deviating from the first plate surface.

As an example, the substrate includes a fluorescent reflection film layer between the fluorescent layer of the conversion region and the first plate surface of the substrate;

wherein, the fluorescence reflection film layer is used for reflecting light rays with the spectral range of 500nm-670 nm.

As an example, the substrate has a high reflective film layer on the second plate surface of the wavelength conversion region;

wherein, the high reflection film layer is used for reflecting light rays with the spectral range of 420nm-670 nm.

As an example, the second plate surface of the wavelength conversion region of the substrate is provided with a fluorescent reflection film layer;

wherein, the fluorescence reflection film layer is used for reflecting light rays with the spectral range of 500nm-670 nm.

A laser light source comprises a laser array, a lens assembly and any one of the wavelength conversion components;

wherein the laser array is used for emitting laser beams;

the lens assembly is used for adjusting laser beams of the laser array and emitting the laser beams to the wavelength conversion component.

The embodiment of the invention has the beneficial effects that:

according to the wavelength conversion component, the fluorescent layer is directly solidified and molded on the wavelength conversion region, so that the intervention of other connecting media is avoided, the high heat resistance of the fluorescent layer is kept to the maximum extent, and meanwhile, the heat exchange efficiency between the fluorescent layer and the substrate is greatly guaranteed due to the close fit of the fluorescent layer and the substrate; thereby ensuring the thermal stability and the light conversion efficiency of the wavelength conversion component.

Drawings

FIG. 1 is a schematic view of the structure of a substrate of a wavelength conversion member according to the present invention;

fig. 2 is a schematic cross-sectional view of a wavelength conversion member according to a first embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a wavelength conversion member according to a second embodiment of the present invention;

fig. 4 is a schematic structural diagram of a laser light source according to a third embodiment of the present invention;

fig. 5 is a schematic structural diagram of a laser light source according to a fourth embodiment of the present invention.

Reference numerals:

1-a wavelength converting member; 10-a substrate; 101-a wavelength conversion region; 102-a transmissive region; 11-a fluorescent layer; 12-a thermally conductive plate; 13-laser antireflection coating; 14-a fluorescent reflective film layer; 15-high reflective film layer; 2-a drive member; 3a, 3b, 3 c-a lens assembly; 4a, 4 b-dichroic mirrors; 5-a focusing lens; 6-light bar; 7-laser array.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present embodiment provides a wavelength conversion member 1, including a substrate 10, the substrate 10 including a transmissive region 102 and at least one wavelength conversion region 101, the wavelength conversion region 101 being cured and molded with a fluorescent layer 11; the transmissive region 102 is used for transmitting laser light, and the fluorescent layer 11 is used for being excited by the laser light to generate fluorescent light. The wavelength conversion component 1 provided by the embodiment of the invention adopts the fluorescent layer 11 to be directly cured and molded on the wavelength conversion region 101, thereby avoiding the intervention of other connecting media, further keeping the high heat resistance of the fluorescent layer 11 to the maximum extent, and simultaneously, because the fluorescent layer 11 is tightly attached to the substrate 10, the heat exchange efficiency between the fluorescent layer 11 and the substrate 10 is also greatly improved; thereby ensuring thermal stability and light conversion efficiency of the wavelength converting member 1.

Specifically, in the embodiment provided by the present invention, the curing and forming includes: the fluorescent material is cured in the wavelength conversion region 101 by any one of a vapor deposition process, a bonding process, and a sintering process to form the fluorescent layer 11. The thickness of the fluorescent layer 11 is less than 1mm, and specifically, in the embodiment provided by the present invention, the thickness of the fluorescent layer 11 is between 0.1mm and 0.3 mm. In this embodiment, the substrate 10 is made of alumina (commonly referred to as sapphire), and the fluorescent material may be Yttrium Aluminum Garnet (YAG), a derivative fluorescent powder material of YAG, a crystal YAG fluorescent powder crystal, or a mixture of YAG and a high thermal conductivity material; of course, in other embodiments, the material of the substrate 10 may also be a metal material (such as aluminum and copper) or a transparent material such as monocrystalline silicon and glass; when alumina is selected as the material of the substrate 10, the thickness of the substrate 10 may be less than 10mm, and in the embodiment provided by the present invention, the thickness of the substrate 10 is between 0.1 and 0.5 mm. The material and thickness of the substrate 10 and the fluorescent material can be reasonably selected by those skilled in the art according to practical situations.