阅读说明：本技术 感应装置及其制备方法、机器人 (Induction device, preparation method thereof and robot ) 是由 郭师峰 黄林冰 冯伟 吴新宇 张艳辉 陈丹 李叶海 张树潇 于 2019-10-25 设计创作，主要内容包括：本发明涉及传感器技术领域,公开了一种感应装置及其制备方法、机器人。该感应装置包括：基底、感应层以及弹性层。感应层设于基底上,感应层包括若干感应元件组,各感应元件组分别包括对称设置的两个感应元件；弹性层设于感应元件组的两个感应元件上,以在弹性层接受剪切力作用或是接受不平整表面的抵压时,弹性层对应两个感应元件的部分发生不同的形变,使得感应元件组中的两个感应元件发生不同的形变,进而产生不同的电信号。通过上述方式,本发明能够丰富感应装置的功能。(The invention relates to the technical field of sensors, and discloses an induction device, a preparation method of the induction device and a robot. The sensing device includes: the sensor comprises a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate and comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged; the elastic layer is arranged on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or is pressed by the uneven surface, the parts of the elastic layer corresponding to the two sensing elements are deformed differently, so that the two sensing elements in the sensing element group are deformed differently, and further different electric signals are generated. Through the mode, the induction device can enrich the functions of the induction device.)

1. An induction device, characterized in that the induction device comprises:

a substrate;

the induction layer is arranged on the substrate and comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged;

the elastic layer is arranged on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or is pressed by an uneven surface, parts of the elastic layer corresponding to the two sensing elements are deformed differently, and the two sensing elements in the sensing element group are deformed differently to generate different electric signals.

2. The sensing device as claimed in claim 1, wherein the elastic layer includes an elastic block, the two sensing elements of the sensing element set are respectively provided with different elastic blocks, and the elastic blocks of the two sensing elements of the sensing element set are symmetrically arranged, so that when the elastic blocks of the two sensing elements of the sensing element set are pressed by an uneven surface, the elastic blocks of the two sensing elements of the sensing element set are deformed differently, so that the two sensing elements of the sensing element set are deformed differently, and thus different electrical signals are generated.

3. The sensing device as claimed in claim 1, wherein the elastic layer includes an elastic block, and the elastic block is correspondingly disposed on the two sensing elements of the sensing element set, so that when the elastic block on the two sensing elements of the sensing element set is subjected to a shearing force or pressed by an uneven surface, portions of the elastic block on the two sensing elements of the sensing element set corresponding to the two sensing elements are deformed differently, so that the two sensing elements of the sensing element set are deformed differently, and thus different electrical signals are generated.

4. A sensing device according to claim 2 or 3, wherein an orthographic projection of the surface of the resilient block facing the sensing element on the substrate covers the orthographic projection of the sensing element on the substrate.

5. An inductive device according to claim 2 or 3, characterized in that the inductive element comprises one-dimensional material layers and two-dimensional material layers arranged alternately one above the other.

6. The inductive device of claim 2 or 3, further comprising a plurality of electrodes and a plurality of electrode leads extending from the substrate, wherein the plurality of electrodes are disposed on the periphery of the inductive layer, one of the electrodes is connected to one of the electrode leads, and each two of the electrode leads are respectively connected to one of the inductive elements.

7. The sensing device as claimed in claim 6, wherein the sensing device comprises a plurality of sensing element sets, the sensing element sets are sequentially arranged on the substrate along a circumferential direction, and the two sensing elements in each sensing element set are symmetrically arranged around a circle center corresponding to the circumferential direction.

8. The inductive device of claim 7, wherein the inductive element is disposed along the surface of the substrate in a serpentine shape extending from a first end to a second end, the first end and the second end are connected to one of the electrode leads, respectively, and a width of an arc of an end of the inductive element away from the center of the circle is greater than a width of an arc of an end of the inductive element close to the center of the circle, forming a fan-shaped structure.

9. The inductive device of claim 7, wherein the inductive element covers a portion of the two electrode leads to which it is correspondingly connected, the portion of the two electrode leads covered by the inductive element constituting an interdigitated electrode structure.

10. The inductive device of claim 6, further comprising an encapsulation layer covering the inductive element and at least a portion of the electrode leads to which the inductive element is connected that is proximate to the inductive element, and wherein the resilient layer is disposed on a side of the encapsulation layer that faces away from the inductive layer.

11. The inductive device of claim 1, wherein the substrate is a flexible body.

12. A robot, characterized in that it comprises a sensing device according to any of claims 1-11.

13. A method of making an inductive device, the method comprising:

providing a substrate;

forming an induction layer on the substrate, wherein the induction layer comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged;

and forming an elastic layer on the sensing layer, wherein the elastic layer is formed on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or pressed by an uneven surface, parts of the elastic layer corresponding to the two sensing elements are deformed differently, and the two sensing elements in the sensing element group are deformed differently to generate different electric signals.

Technical Field

The invention relates to the technical field of sensors, in particular to an induction device, a preparation method of the induction device and a robot.

Background

At present, a sensor for detecting pressure has a single function, and does not have a function of detecting other acting force, such as shearing force.

Disclosure of Invention

In view of this, the present invention provides an induction device, a method for manufacturing the same, and a robot, which can enrich the functions of the induction device.

In order to solve the technical problems, the invention adopts a technical scheme that: an induction device is provided. The sensing device includes: the sensor comprises a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate and comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged; the elastic layer is arranged on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or is pressed by the uneven surface, the parts of the elastic layer corresponding to the two sensing elements are deformed differently, so that the two sensing elements in the sensing element group are deformed differently, and further different electric signals are generated.

In an embodiment of the invention, the elastic layer includes an elastic block, different elastic blocks are respectively disposed on two sensing elements of the sensing element group, and the elastic blocks on the two sensing elements of the sensing element group are symmetrically disposed, so that when the elastic blocks on the two sensing elements of the sensing element group are pressed by the uneven surface, the elastic blocks on the two sensing elements of the sensing element group are deformed differently, so that the two sensing elements of the sensing element group are deformed differently, and further different electrical signals are generated.

In an embodiment of the invention, the elastic layer includes an elastic block, and the elastic block is correspondingly disposed on two sensing elements of a sensing element group, so that when the elastic blocks on the two sensing elements of the sensing element group are subjected to a shearing force or pressed by an uneven surface, portions of the elastic blocks on the two sensing elements of the sensing element group corresponding to the two sensing elements are deformed differently, so that the two sensing elements of the sensing element group are deformed differently, and further different electrical signals are generated.

In an embodiment of the present invention, an orthographic projection of the surface of the elastic block facing the sensing element on the substrate covers the orthographic projection of the sensing element on the substrate.

In one embodiment of the present invention, the sensing element includes one-dimensional material layers and two-dimensional material layers alternately stacked.

In an embodiment of the invention, the sensing device further includes a plurality of electrodes and a plurality of electrode leads extending on the substrate, the plurality of electrodes are disposed on the periphery of the sensing layer, one electrode is connected to one electrode lead, and each two electrode leads are respectively connected to one sensing element.

In an embodiment of the present invention, the sensing device includes a plurality of sensing element groups, the plurality of sensing element groups are sequentially arranged on the substrate along a circumferential direction, and two sensing elements in each sensing element group are symmetrically arranged with a circle center corresponding to the circumferential direction as a center.

In an embodiment of the invention, the sensing element is disposed along the substrate surface in a serpentine shape extending from a first end to a second end, the first end and the second end are respectively connected to an electrode lead, wherein a width of a circular arc of an end portion of the sensing element away from a center of the circle is greater than a width of a circular arc of an end portion close to the center of the circle, so as to form a fan-shaped structure.

In an embodiment of the present invention, the sensing element covers a portion of the two electrode leads correspondingly connected thereto, and the portion of the two electrode leads covered by the sensing element constitutes an interdigital electrode structure.

In an embodiment of the invention, the sensing device further includes an encapsulation layer, the encapsulation layer covers the sensing element and at least a portion of the electrode lead connected to the sensing element, the portion being close to the sensing element, and the elastic layer is disposed on a side of the encapsulation layer away from the sensing layer.

In one embodiment of the present invention, the substrate is a flexible body.

In order to solve the technical problem, the invention adopts another technical scheme that: a robot is provided. The robot comprises a sensing device as explained in the above embodiments.

In order to solve the technical problem, the invention adopts another technical scheme that: a method for manufacturing an inductive device is provided. The preparation method comprises the following steps: providing a substrate; forming a sensing layer on a substrate, wherein the sensing layer comprises a plurality of sensing element groups, and each sensing element group comprises two sensing elements which are symmetrically arranged; form the elastic layer on the response layer, wherein the elastic layer is formed on two response components of response component group to when the elastic layer received the shearing force effect or received the support of unevenness surface, the deformation that the elastic layer corresponds two response component's part takes place the difference for two response component in the response component group take place different deformations, and then produce different signals.

The invention has the beneficial effects that: different from the prior art, the invention provides an induction device, a preparation method thereof and a robot. The induction device is arranged on the elastic layers of the two induction elements of the induction element group, and when the induction device receives shearing force or receives the pressing of an uneven surface, the parts of the elastic layers corresponding to the two induction elements are deformed differently, so that the two induction elements in the induction element group are deformed differently, and different electric signals are generated, namely the induction device can be used for detecting the shearing force and the flatness of the surface of an object. Moreover, the elastic layer and the sensing element can be pressed to deform so as to detect pressure. That is, the sensing device provided by the invention not only has the function of detecting pressure, but also has the function of detecting shearing force and object surface flatness, so that the function of the sensing device can be enriched.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. Moreover, the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate it by those skilled in the art with reference to specific embodiments.

FIG. 1 is a schematic structural diagram of an embodiment of an induction device according to the present invention;

FIG. 2 is a schematic top view of the sensing device shown in FIG. 1;

FIG. 3 is a schematic cross-sectional view of the sensing device of FIG. 1;

FIG. 4 is a schematic cross-sectional view of the sensing device of FIG. 1 in a pressure sensing state;

FIG. 5 is a schematic cross-sectional view of the sensing device of FIG. 1 in a state of detecting shear force;

FIG. 6 is a schematic cross-sectional view of the sensing device of FIG. 1 in a state of detecting flatness of the surface of an object;

FIG. 7 is a schematic structural diagram of another embodiment of an induction device according to the present invention;

FIG. 8 is a schematic cross-sectional view of the sensing device of FIG. 7;

FIG. 9 is a schematic cross-sectional view of the sensing device of FIG. 7 in a pressure sensing state;

FIG. 10 is a schematic cross-sectional view of the sensing device of FIG. 7 in a state of detecting flatness of the surface of an object;

FIG. 11 is a schematic structural diagram of an embodiment of an inductive element of the present invention;

FIG. 12 is a schematic flow chart illustrating a method for manufacturing an inductive device according to an embodiment of the present invention;

FIG. 13 is a schematic diagram showing steps in a method of manufacturing the inductive device of FIG. 12;

fig. 14 is a schematic structural diagram of an embodiment of the robot of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

In order to solve the technical problem of single function of the sensor in the prior art, an embodiment of the present invention provides an inductive device. The sensing device includes: the sensor comprises a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate and comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged; the elastic layer is arranged on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or is pressed by the uneven surface, the parts of the elastic layer corresponding to the two sensing elements are deformed differently, so that the two sensing elements in the sensing element group are deformed differently, and further different electric signals are generated. As described in detail below.

Referring to fig. 1-2, fig. 1 is a schematic structural diagram of an embodiment of an induction device of the present invention, and fig. 2 is a schematic top structural diagram of the induction device shown in fig. 1. Wherein the encapsulation layer 5 and the elastic layer 3 are omitted in fig. 2.

In one embodiment, the sensing device includes a substrate 1, a sensing layer 2, and an elastic layer 3. The induction layer 2 is arranged on the substrate 1, the induction layer 2 comprises a plurality of induction element groups 21, and each induction element group 21 comprises two induction elements 211 which are symmetrically arranged. The elastic layer 3 is provided on the two sensing elements 211 of the sensing element group 21.

Optionally, the substrate 1 may be a flexible body, and may be a thin film made of a flexible material, so that the substrate 1 has a better mechanical strength and is allowed to bend, and the substrate 1 can be matched with the surface topography of the installation position of the sensing device to be conveniently attached to the installation position of the sensing device, thereby facilitating the installation of the sensing device. Of course, the sensing device is preferably mounted to a flat surface to ensure detection accuracy. Preferably, the flexible material used for the substrate 1 may be PI (polyimide) or the like, and the thickness thereof is preferably less than 100 μm.

The sensing element 211 may be a piezoresistive element, etc., and the deformation of the sensing element 211 may cause the resistance value of the deformation of the sensing element 211 to change, and the change amount of the resistance value of the deformation of the sensing element 211 is related to the deformation degree of the deformation of the sensing element 211, which can reflect the pressure applied to the sensing element 211.

Different types and forms of forces can be detected using the piezoresistive principle of the sensor element 211 described above. Wherein the surfaces of the respective inductive elements 211 are usually designed to be flush with each other, and the entire inductive layer 2 is a force-bearing surface. The method comprises the following specific steps:

when induction system was used for measuring pressure, elastic layer 3 accepted the pressure effect, and elastic layer 3 takes place deformation for two response component 211 of the response component group 21 that elastic layer 3 corresponds take place equivalent deformation, and then detect out the size of the pressure that receives.

When the sensing device is used for detecting the shearing force, the elastic layer 3 receives the action of the shearing force, and the parts of the elastic layer 3 corresponding to the two sensing elements 211 of the sensing element group 21 are deformed differently, so that the two sensing elements 211 in the sensing element group 21 are deformed differently to generate different electrical signals, that is, the two sensing elements 211 of the sensing element group 21 generate different electrical signals respectively, and the shearing force is detected.

When induction system is used for detecting object surface roughness, elastic layer 3 accepts the pressure of waiting to detect object surface, wherein when accepting the pressure on uneven surface, the deformation that the part of elastic layer 3 corresponding two response component 211 of response component group 21 takes place differently, make two response component 211 in the response component group 21 take place different deformations, and then produce different signals of telecommunication, two response component 211 of response component group 21 produce different signals of telecommunication respectively promptly, and then detect out the condition of waiting to detect object surface roughness, can reflect the degree of waiting to detect object surface roughness simultaneously.

As can be seen from the above, the sensing device provided by the invention not only has the function of detecting pressure, but also has the function of detecting shearing force and flatness of the surface of an object, so that the function of the sensing device can be enriched. The induction device provided by the invention can be applied to a touch system of a robot, and provides force feedback for a robot arm to accurately grasp an object; it can also be applied to human epidermis to monitor the activity of joints and muscles.

Referring to fig. 1 and 3, fig. 3 is a schematic cross-sectional structure diagram of the sensing device shown in fig. 1.

In an embodiment, the elastic layer 3 comprises elastic blocks 31. One elastic block 31 is correspondingly disposed on the two sensing elements 211 of one sensing element group 21, so that when the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 are subjected to a shearing force or pressed by an uneven surface, the portions of the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 corresponding to the two sensing elements 211 are deformed differently, so that the two sensing elements 211 of the sensing element group 21 are deformed differently, and further different electrical signals are generated.

Fig. 1 and 3 illustrate a situation where one elastic block 31 is correspondingly disposed on two sensing elements 211 of one sensing element group 21, and the elastic blocks 31 corresponding to different sensing element groups 21 are connected at a junction. It should be noted that, the embodiment of the present invention is described by taking a case that one elastic block 31 is correspondingly disposed on two sensing elements 211 of one sensing element group 21 as an example, which is only necessary for discussion and is not limited thereby.

Specifically, when the sensing device is used to detect pressure, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 receive pressure, and the whole elastic block 31 is pressed to collapse, so that the two sensing elements 211 of the sensing element group 21 corresponding to the elastic block 31 are compressed equally, and the magnitude of the pressure received is detected, as shown in fig. 4.

When the sensing device is used for detecting a shearing force, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 receive the action of the shearing force, and the parts of the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are deformed differently, so that the two sensing elements 211 in the sensing element group 21 are deformed differently, and further different electrical signals are generated, that is, the two sensing elements 211 of the sensing element group 21 generate different electrical signals, respectively, and then the magnitude of the shearing force is detected, as shown in fig. 5.

When the sensing device is used for detecting the surface flatness of an object, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 receive the pressing of the surface of the object to be detected, wherein when receiving the pressing of the uneven surface, the parts of the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are deformed differently, so that the two sensing elements 211 in the sensing element group 21 are deformed differently, and further different electrical signals are generated, that is, the two sensing elements 211 of the sensing element group 21 generate different electrical signals respectively, and further the surface flatness of the object to be detected is detected, and meanwhile, the degree of the surface flatness of the object to be detected can be reflected, as shown in fig. 6.

Referring to fig. 7-8, fig. 7 is a schematic structural diagram of another embodiment of the sensing device of the present invention, and fig. 8 is a schematic cross-sectional structural diagram of the sensing device shown in fig. 7.

In an alternative embodiment, the elastic layer 3 comprises elastic blocks 31. Different elastic blocks 31 are respectively arranged on the two sensing elements 211 of the sensing element group 21, and the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 are symmetrically arranged, so that when the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 are pressed by uneven surfaces, the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 are deformed differently, so that the two sensing elements 211 of the sensing element group 21 are deformed differently, and further different electric signals are generated.

Specifically, when the sensing device is used to detect pressure, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 receive pressure, and each elastic block 31 is pressed and depressed, so that the two sensing elements 211 of the sensing element group 21 are compressed equally, and the magnitude of the pressure is detected, as shown in fig. 9.

When the sensing device is used for detecting the surface flatness of an object, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 receive the pressing of the surface of the object to be detected, wherein when receiving the pressing of the uneven surface, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 respectively generate different deformations, so that the two sensing elements 211 in the sensing element group 21 generate different deformations, and further generate different electrical signals, that is, the two sensing elements 211 of the sensing element group 21 respectively generate different electrical signals, thereby detecting the surface unevenness of the object to be detected, and reflecting the surface unevenness degree of the object to be detected, as shown in fig. 10.

Further, the orthographic projection of the surface of the elastic block 31 facing the sensing element 211 on the substrate 1 covers the orthographic projection of the sensing element 211 on the substrate 1, as shown in fig. 3 and 8. In this way, the acting force received by the elastic block 31 can be better transmitted to the sensing element 211, so that the change of the resistance value reflected by the deformation of the sensing element 211 can more accurately describe the acting force received by the elastic block 31.

Please refer to fig. 3 and 8. In one embodiment, the inductive element 211 includes one-dimensional material layers 2111 and two-dimensional material layers 2112 alternately stacked. Specifically, the sensing element 211 is formed by alternately stacking one-dimensional material layers 2111 and two-dimensional material layers 2112 one by one, and the resistance of the sensing element 211 can be changed when the sensing element 211 receives different acting forces by using the quantum tunneling effect. Moreover, the sensing element 211 of the present embodiment has a stable structure, a low elastic modulus, and is beneficial to micro-scale movement and ion penetration and escape. In addition, the sensor element 211 of the present embodiment is not easily bundled, has a high specific surface area, good adhesion, and a large contact area, and thus the sensor element 211 of the present embodiment has high detection sensitivity.

Alternatively, the material used for the one-dimensional material layer 2111 may be nano-carbon black, single-walled or multi-walled carbon nanotubes, or the like, preferably carbon nanotubes. The material used for the two-dimensional material layer 2112 may be metal carbonitride, graphene, or the like, and specifically may be Nb₂C、V₂C、(Ti_0.5Nb_0.5)₂C、Ti₃C₂、Ti₃CN、(V_0.5Cr_0.5)₃C₂、Ta₄C₃、Ti₂C, etc., wherein Ti is preferred₃C₂。

Please continue with fig. 2. Further, the sensing device includes a plurality of sets of sensing elements 21. The multiple groups of sensing element groups 21 are sequentially arranged along a circumferential direction on the substrate 1, and two sensing elements 211 in each sensing element group 21 are symmetrically arranged around a circle center (a circle center O shown in fig. 2, the same below) corresponding to the circumferential direction. In this way, when the sensing device is applied to detecting the shearing force, the sensing device can detect the direction of the shearing force. Specifically, when the sensing devices receive the shearing forces in different directions, the corresponding sensing element groups 21 correspond to the shearing forces, so as to detect the magnitude of the shearing force, and the direction of the shearing force can be determined according to the spacing direction of the two sensing elements 211 of the sensing element group 21 corresponding to the shearing force.

It is understood that the more the number of the sensing element groups 21 is, the higher the accuracy of the judgment of the shear force direction is. Fig. 2 shows a case where the number of groups of the sensing element groups 21 is 8, and the 8 sensing element groups 21 constitute a complete circle.

Please continue with fig. 2. In an embodiment, the sensing device further comprises a number of electrodes 41 and a number of electrode leads 42 extending over the substrate 1. A plurality of electrodes 41 are disposed on the periphery of the sensing layer 2, wherein one electrode 41 is connected to one electrode lead 42, and each two electrode leads 42 are connected to one sensing element 211. The two electrode leads 42 connected to the sensing element 211 are used to connect the sensing element 211 to two electrodes 41, wherein one electrode 41 is used to input an electrical signal to the sensing element 211, and the other electrode 41 is used to extract the electrical signal, so as to form a current path. And the resistance value of the sensing element 211 changes, which affects the electrical signal led out from the sensing element 211, and the change of the resistance value of the sensing element 211 is calculated according to the change of the electrical signal led out from the sensing element 211, so as to be used for detecting the acting force received by the sensing device, including detecting the pressure, the shearing force, the surface flatness of the object, and the like.

Further, the sensing element 211 is disposed along the surface of the substrate 1 and extends from the first end 2113 to the second end 2114 in a serpentine shape, the first end 2113 and the second end 2114 are respectively connected to an electrode lead 42, and specifically, the sensing element 211 covers the electrode lead 42 to be connected to the electrode lead 42. The width of the arc of the end of the sensing element 211 far from the center of the circle is larger than the width of the arc of the end close to the center of the circle, so as to form a fan-shaped structure, so that the sensing element groups 21 of each sensing element group 21 form the complete circumference. Of course, in other embodiments of the present invention, the sensing element 211 may also have a rectangular structure, and the like, which is not limited herein.

It should be noted that the first end 2113 and the second end 2114 may be sequentially disposed along a direction away from the center of circle, specifically, the first end 2113 is close to the center of circle relative to the second end 2114, as shown in fig. 2; or the first end 2113 and the second end 2114 are arranged in this order in the circumferential direction, which is not limited herein. The first end 2113 and the second end 2114 are preferably the beginning and the end of the sensing element 211 extending in a serpentine shape, so that the whole sensing element 211 can be applied with force and can be used for detecting the applied force. Moreover, the piezoresistive change of the sensing element 211 which is arranged in a serpentine extending manner is obvious when the sensing element 211 is pressed, which is beneficial to improving the stress sensitivity of the sensing element 211.

Please refer to fig. 11. In an alternative embodiment, the sensing element 211 is not arranged in a serpentine shape as in the above-mentioned embodiment, but the sensing element 211 is a complete block structure. In order to ensure that the sensing element 211 has sufficient force sensitivity, the sensing element 211 covers a portion of the two electrode leads 42 correspondingly connected thereto, and the portion of the two electrode leads 42 covered by the sensing element 211 constitutes an interdigital electrode structure. The electrode lead 42 in the form of an interdigital electrode enables changes in resistance caused by the fact that any position on the sensing element 211 is pressed to be fed back to the two electrode leads 42 connected with the sensing element 211, and further causes changes in electrical signals led out from the sensing element 211 to be applied to detection of acting force.

Please continue to refer to fig. 1-3. In an embodiment, the sensing device further includes an encapsulation layer 5, the encapsulation layer 5 covers the sensing element 211, and at least a portion of the electrode lead 42 connected to the sensing element 211, which is close to the sensing element 211, is also encapsulated by the encapsulation layer 5, so as to protect the sensing element 211 and the electrode lead 42 from encapsulation. Wherein, the elastic layer 3 is arranged on one side of the packaging layer 5 departing from the induction layer 2. And, the encapsulation layer 5 is also an elastomer to ensure that the force applied to the elastic layer 3 can be transmitted to the sensing element 211.

Alternatively, the elastic layer 3 and the encapsulation layer 5 may be made of PDMS, silicon rubber, or other materials with the same properties, so that the elastic layer 3 and the encapsulation layer 5 have good elasticity and insulation performance. Of course, the materials of the elastic layer 3 and the encapsulation layer 5 may be the same or different, and are not limited herein.

Referring to fig. 12 to 13, fig. 12 is a schematic flow chart of an embodiment of a manufacturing method of an inductive device according to the present invention, and fig. 13 is a schematic structural diagram of steps in the manufacturing method of the inductive device shown in fig. 12. It should be noted that the manufacturing method of the sensing device described in this embodiment is based on the sensing device described in the above embodiment. In addition, the method for manufacturing the sensing device described in this embodiment is not limited to the following steps.

S101: coating a first photoresist layer 62 with uniform thickness on a hard base 61;

in the present embodiment, the hard base 61 has stable chemical properties, and the surface coated with the first photoresist layer 62 is flat and clean, so as to ensure stable performance of the subsequent processes.

S102: attaching and forming a substrate 1 on the first photoresist layer 62;

in this embodiment, a film for forming the substrate 1, such as the PI film described in the above embodiments, is attached on the first photoresist layer 62, so as to form the substrate 1. The first photoresist layer 62 can make the substrate 1 and the hard base 61 more closely fit, so as to keep the surface of the substrate 1 flat.

S103: a second photoresist layer 63 is coated on the substrate 1 in a uniform layer thickness.

S104: patterning the second photoresist layer 63, and separating the substrate 1 and the hard base 61 by removing the first photoresist layer 62;

in the present embodiment, the second photoresist layer 63 is patterned to form a groove 631, and further the sensing layer 2 is formed. Specifically, a corresponding mask may be used in combination, and a photolithography process is performed to remove a portion of the second photoresist layer 63 using a remover, so that the groove 631 is formed at the position of the removed second photoresist layer 63. Further, in the present embodiment, the first photoresist layer 62 may be removed by a remover, so that the substrate 1 and the hard base 61 are separated. Wherein the remover may be acetone, alcohol, etc., depending on the specific composition of the first and second photoresist layers 62 and 63.

S105: forming an electrode 41 and an electrode lead 42 on a substrate 1;

in the present embodiment, the electrode 41 and the electrode lead 42 are formed on the substrate 1 by sputtering through a magnetron sputtering process in combination with a mask plate having a desired specific mask pattern. Specifically, the area of the mask used in the magnetron sputtering process corresponding to the groove 631 on the second photoresist layer 63 is hollowed out to allow the metal beam to pass through and reach the second photoresist layer 63, and other areas are shielded to block the metal beam, so that the electrode 41 and the electrode lead 42 are formed in the groove 631 on the second photoresist layer 63. Since the thickness of the electrode 41 and the electrode lead 42 is small, and is usually only several hundred nanometers, the electrode 41 and the electrode lead 42 are not shown in the schematic diagram of the subsequent steps.

S106: alternately depositing one-dimensional material layers 2111 and two-dimensional material layers 2112 on the substrate 1;

in the present embodiment, the one-dimensional material layers 2111 and the two-dimensional material layers 2112 are alternately deposited on the substrate 1 by a vacuum filtration technique.

S107: removing the second photoresist layer 63 remaining after the patterning process and the one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63, thereby forming the sensing layer 2;

in the present embodiment, the second photoresist layer 63 remaining after the patterning process is removed, so that the one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63 lack bottom support, resulting in that the one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63 are also easily removed, and then the sensing layer 2 is formed. Wherein the second photoresist layer 63 can also be removed by a remover.

It should be noted that the sensing layer 2 includes a plurality of sensing element groups 21, and each sensing element group 21 includes two sensing elements 211 symmetrically disposed, which is as described in the above embodiments and will not be described herein again.

S108: forming an encapsulation layer 5 on the induction layer 2;

in this embodiment, an encapsulation layer 5 is formed on the inductive layer 2. Specifically, the sensing layer 2 may be encapsulated using a PDMS solution, and then cured to form the encapsulation layer 5.

S109: forming an elastic layer 3 on the encapsulation layer 5;

in the present embodiment, the elastic layer 3 is formed on the encapsulating layer 5 by mold casting. The elastic layer 3 is formed on the two sensing elements 211 of the sensing element set 21, so that when the elastic layer 3 is subjected to a shearing force or pressed by an uneven surface, the portions of the elastic layer 3 corresponding to the two sensing elements 211 are deformed differently, so that the two sensing elements 211 in the sensing element set 21 are deformed differently, and further different electrical signals are generated. The specific detection principle has been described in detail in the above embodiments, and will not be described herein again.

Referring to fig. 14, fig. 14 is a schematic structural diagram of a robot according to an embodiment of the present invention.

In an embodiment, the robot 7 comprises a sensing device 71. The robot 7 may be a robot arm or the like, and the sensing device 71 provides force feedback for the robot arm to accurately grasp an object. The sensing device 71 is the sensing device described in the above embodiments, and will not be described herein.

In addition, in the present invention, unless otherwise expressly specified or limited, the terms "connected," "stacked," and the like are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.