阅读说明：本技术 高集成智能功率模块及空调器 (High-integration intelligent power module and air conditioner ) 是由 毕晓猛 苏宇泉 黄浩 冯宇翔 于 2018-07-24 设计创作，主要内容包括：本发明公开一种高集成智能功率模块及空调器,该高集成智能功率模块包括：第一安装基板及第二安装基板,第一安装基板和第二安装基板一侧表面设置有多个安装位；控制模块,对应安装于第一安装基板的安装位上；功率模块,对应安装于第二安装基板的安装位上；其中,控制模块与功率模块通过金属绑线电气连接；第一安装基板叠设于第二安装基板上。本发明解决了电控板采用多个分立的元器件实现时器件较多,导致空调器装配复杂,以及自身的功耗较大,发热等也较严重,导致空调的热效率,不利于空调器实现节能减排的问题。(The invention discloses a high-integration intelligent power module and an air conditioner, wherein the high-integration intelligent power module comprises: the mounting structure comprises a first mounting substrate and a second mounting substrate, wherein a plurality of mounting positions are arranged on one side surfaces of the first mounting substrate and the second mounting substrate; the control module is correspondingly arranged on the mounting position of the first mounting substrate; the power module is correspondingly arranged on the mounting position of the second mounting substrate; the control module is electrically connected with the power module through a metal binding wire; the first mounting substrate is stacked on the second mounting substrate. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the components are more, so that the air conditioner is complex to assemble, the power consumption of the air conditioner is higher, the heating is serious, the heat efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.)

1. A highly integrated smart power module, comprising:

the mounting structure comprises a first mounting substrate and a second mounting substrate, wherein a plurality of mounting positions are arranged on one side surfaces of the first mounting substrate and the second mounting substrate;

the control module is correspondingly arranged on the mounting position of the first mounting substrate;

the power module is correspondingly arranged on the mounting position of the second mounting substrate;

the control module is electrically connected with the power module through a metal binding wire;

the first mounting substrate is stacked on the second mounting substrate.

2. The highly integrated smart power module of claim 1 further comprising a circuit wiring layer disposed on one side surface of the second mounting substrate, the circuit wiring layer forming the corresponding mounting sites on the second mounting substrate;

or the circuit wiring layer is embedded in the second mounting substrate and is electrically connected with the mounting position on the second mounting substrate.

3. The highly integrated smart power module of claim 1, wherein the first mounting substrate and the second mounting substrate are fixedly connected by an adhesive material.

4. The high-integration smart power module of claim 1, further comprising an insulating layer disposed between the first mounting substrate and the second mounting substrate.

5. The highly integrated smart power module according to claim 1, wherein the power module is a fan drive power module and/or a compressor drive power module.

6. The high integrated smart power module of claim 5 wherein said control module comprises an MCU; and the number of the first and second groups,

when the power module is a fan driving power module, the control module further comprises a fan power driving chip;

when the power module is a compressor driving module, the control module further comprises a compressor power driving chip;

the MCU has a plurality of first control terminals and a plurality of second control terminals,

the plurality of first control ends of the MCU are correspondingly connected with the plurality of signal input ends of the fan power driving chip one by one; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the compressor power driving chip one by one;

a plurality of output ends of the fan power driving chip are correspondingly connected with a plurality of controlled ends of the fan driving power module one by one;

and a plurality of output ends of the compressor power driving chip are connected with a plurality of controlled ends of the compressor driving power module in a one-to-one correspondence manner.

7. The high integrated smart power module of claim 6 wherein the power module further comprises a PFC power switch module.

8. The highly integrated smart power module of claim 7, wherein the control module further comprises a PFC power driver chip, the third control terminal of the MCU being connected to the signal input terminal of the PFC power driver chip; and the signal output end of the PFC power driving chip is connected with the controlled end of the power switch module.

9. The highly integrated smart power module of any of claims 1 to 8, further comprising a rectifier bridge disposed on the second mounting substrate.

10. An air conditioner characterized by comprising the highly integrated smart power module as recited in any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a high-integration intelligent power module and an air conditioner.

Background

With the development of scientific and technological progress and social productivity, the problems of resource excessive consumption, environmental pollution, ecological destruction, climate warming and the like are increasingly prominent, and the green development, energy conservation and emission reduction become the transformation development direction of various enterprises and industrial fields. Therefore, how to reduce energy consumption of refrigeration equipment with large energy consumption, such as air conditioners, refrigerators and the like, and energy conservation becomes an effort direction of researchers.

Disclosure of Invention

The invention mainly aims to provide a high-integration intelligent power module and an air conditioner, and aims to solve the problems that when an electric control board is realized by adopting a plurality of discrete components, the number of components is large, the assembly of the air conditioner is complex, the power consumption of the air conditioner is large, the heating is serious, the thermal efficiency of the air conditioner is caused, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.

To achieve the above object, the present invention provides a highly integrated smart power module, which includes:

the mounting structure comprises a first mounting substrate and a second mounting substrate, wherein a plurality of mounting positions are arranged on one side surfaces of the first mounting substrate and the second mounting substrate;

the control module is correspondingly arranged on the mounting position of the first mounting substrate;

the power module is correspondingly arranged on the mounting position of the second mounting substrate;

the control module is electrically connected with the power module through a metal binding wire;

the first mounting substrate is stacked on the second mounting substrate.

Optionally, the highly integrated smart power module further includes a circuit wiring layer disposed on a side surface of the second mounting substrate, the circuit wiring layer forming the corresponding mounting locations on the second mounting substrate;

or the circuit wiring layer is embedded in the second mounting substrate and is electrically connected with the mounting position on the second mounting substrate.

Optionally, the first mounting substrate and the second mounting substrate are fixedly connected by an adhesive material.

Optionally, the highly integrated smart power module further includes an insulating layer disposed between the first mounting substrate and the second mounting substrate.

Optionally, the power module is a fan driving power module and/or a compressor driving power module.

Optionally, the control module comprises an MCU; and the number of the first and second groups,

when the power module is a fan driving power module, the control module further comprises a fan power driving chip;

when the power module is a compressor driving module, the control module further comprises a compressor power driving chip;

the MCU has a plurality of first control terminals and a plurality of second control terminals,

the plurality of first control ends of the MCU are correspondingly connected with the plurality of signal input ends of the fan power driving chip one by one; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the compressor power driving chip one by one;

a plurality of output ends of the fan power driving chip are correspondingly connected with a plurality of controlled ends of the fan driving power module one by one;

and a plurality of output ends of the compressor power driving chip are connected with a plurality of controlled ends of the compressor driving power module in a one-to-one correspondence manner.

Optionally, the power module further comprises a PFC power switch module.

Optionally, the control module further includes a PFC power driver chip, and the third control terminal of the MCU is connected to the signal input terminal of the PFC power driver chip; and the signal output end of the PFC power driving chip is connected with the controlled end of the power switch module.

Optionally, the highly integrated smart power module further includes a rectifier bridge disposed on the second mounting substrate.

The invention also provides an air conditioner, which comprises the high-integration intelligent power module; the highly integrated smart power module includes: the mounting structure comprises a first mounting substrate and a second mounting substrate, wherein a plurality of mounting positions are arranged on one side surfaces of the first mounting substrate and the second mounting substrate; the control module is correspondingly arranged on the mounting position of the first mounting substrate; the power module is correspondingly arranged on the mounting position of the second mounting substrate; the control module is electrically connected with the power module through a metal binding wire; the first mounting substrate is stacked on the second mounting substrate.

According to the invention, the control module is arranged on the corresponding mounting position on the first mounting substrate, the power modules are integrally arranged on the corresponding mounting position on the second mounting substrate, the power modules of the control module are electrically connected through the metal binding wires, so that the heat dissipation of the power modules to the control module can be avoided, the normal work of the control module is influenced, the first mounting substrate is overlapped on the second mounting substrate, the size of the substrate can be reduced, and the whole size of the high-integration intelligent power module is reduced. The invention integrates the functional modules into a packaging body, can shorten the distance between the control module and the power module, improves the integration level of the integrated intelligent power module, realizes the integrated drive control of a plurality of loads, such as a fan and a compressor, reduces the volume of an electric control board, is convenient to install, and reduces the electromagnetic interference caused by overlong jumper wires and excessive jumper wires. The invention can also reduce the components of the electric control board, simplify the PCB layout of the electric control board and effectively reduce the production cost of the air conditioner. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a highly integrated smart power module according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of a highly integrated smart power module according to the present invention;

FIG. 3 is a schematic diagram of a circuit wiring layer on a first mounting substrate according to an embodiment of the present invention;

FIG. 4 is a schematic view of another embodiment of a circuit wiring layer on a first mounting substrate according to the present invention;

fig. 5 is a schematic circuit diagram of a highly integrated smart power module according to an embodiment of the invention.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a high-integration intelligent power module.

In many electrical appliances such as air conditioners, washing machines, refrigerators, and the like, motors are provided to drive other loads to operate. For example, a conventional air conditioner generally includes an indoor unit and an outdoor unit, wherein the outdoor unit and the indoor unit are both provided with a motor and an electric control board for driving the motor to operate. Regarding the electric control board of the outdoor unit, the electric control board of the outdoor unit is mostly provided with an intelligent power module for driving the compressor, an intelligent power module for driving the fan, a main control module, a power module and other functional modules. These functional modules adopt the circuit module of discrete or partial integration to realize mostly, and the scattered each part of arranging at automatically controlled PCB board, but because automatically controlled board self structure, strong and weak electric isolation, prevent signal interference, heat dissipation etc. requirement, require the interval between each functional module to guarantee in safe distance for the automatically controlled board of off-premises station's volume is great, is unfavorable for the installation. Or disperse these on polylith circuit board, adopt the mode of wire jumper again to realize between main control module and other functional modules to and mutual electrical connection between each functional module, but the dispersion sets up each functional module and can lead to the wire jumper more and long, leads to electrical apparatus EMC performance to descend. And the electric control board of these two kinds of structures all can appear the device of electric control board more, lead to the assembly of off-premises station complicated, still can increase the manufacturing cost of air conditioner simultaneously, and the maintenance rate also can increase, is unfavorable for the stable use of air conditioner. More importantly, when the electric control board is realized by adopting a plurality of components, the energy consumption of the components is large, the heating is serious, the heat efficiency of the air conditioner is low, and the realization of energy conservation and emission reduction of the air conditioner is not facilitated.

In order to solve the above problem, referring to fig. 1 to 5, in an embodiment of the present invention, the highly integrated smart power module includes:

a first mounting substrate 100 and a second mounting substrate 200, wherein a plurality of mounting positions are arranged on one side surface of the first mounting substrate 100 and the second mounting substrate 200;

a control module 10 correspondingly mounted on the mounting position of the first mounting substrate 100;

a power module 20 mounted on the mounting position of the second mounting substrate 200; wherein the content of the first and second substances,

the control module 10 and the power module 20 are electrically connected through a metal binding wire 400;

the first mounting substrate 100 is stacked on the second mounting substrate 200.

In this embodiment, the first mounting substrate 100 and the second mounting substrate 200 may be implemented by circuit substrates made of materials such as PCB, lead frame, cardboard, half-glass fiber board, and the second mounting substrate 200 may also be a substrate made of materials with high heat conduction and heat dissipation properties such as aluminum and aluminum alloy, copper and copper alloy, aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic, or a substrate made of a mixture of the above materials. In this embodiment, the first mounting substrate 100 and the second mounting substrate 200 may be implemented by using ceramic substrates. Among the first mounting substrate 100 and the second mounting substrate 200, the first mounting substrate 100 is used for mounting the control module 10 and dissipating heat from electronic components in the control module 10. The second mounting substrate 200 may be used to mount the power module 20 and dissipate heat generated by each power switch in the power module 20, so as to improve the heat dissipation rate of the highly integrated smart power module. The shapes of the first mounting substrate 100 and the second mounting substrate 200 may be determined according to the specific positions and sizes of the electronic components mounted on the mounting positions thereof, and may be square, but not limited to square, and may be packaged into a whole by a packaging material after being respectively disposed on the two heat dissipation substrates of the first mounting substrate 100 and the second mounting substrate 200.

In this embodiment, the control module 10 may have a driving circuit unit and a control circuit unit, and the driving circuit unit further integrates a real-time detection circuit capable of continuously detecting parameters such as current, temperature, and voltage of each element in the power module 20, and when a fault such as a severe overload, a direct short circuit, or an overheat temperature, and an overvoltage driving voltage occurs, the driving circuit unit can control the power device in the power module 20 to be turned off, and simultaneously send a fault signal to the control circuit unit, so that the control circuit unit controls other circuit modules to operate, thereby avoiding damage to other circuit modules due to the fault. In addition, a bridge arm pair tube interlocking circuit and a driving power supply under-voltage protection circuit can be further integrated in the control module 10, so that the power module 20 can be ensured to operate safely and stably.

In this embodiment, each power module 20 is integrated with a plurality of power switching tubes, and the plurality of power switching tubes form a driving inverter circuit, for example, six power switching tubes form a three-phase inverter bridge circuit, or four power switching tubes form a two-phase inverter bridge circuit. Each power switch tube can be realized by adopting an MOS tube or an IGBT.

It should be noted that the control module 10 generally includes a control chip, such as an MCU, an operating voltage of the MCU is generally 3.3V or 5V, that is, the operating voltage of the MCU is weak current, so that the MCU generates less heat during operation, and an ideal operating temperature of the control chip is generally lower than 85 ℃. The power module 20 generally includes power elements, such as IGBTs, the driving voltage of the power elements is generally above 12V, so that the heat generation of the power elements is generally serious when the power module works, the working temperature of the power elements such as the IGBTs can reach above 100 ℃, and the heat generated by the power elements can be conducted to the control module 10(MCU) through the substrate, so that the temperature of the power elements and the temperature of the MCU can be almost the same. And thus, the operating temperature of the control chip in the control module 10 is too high and a fault occurs, so that the MCU is prone to output an erroneous control signal, for example, the upper and lower arms of the power module 20 are controlled to be simultaneously turned on to cause a short circuit, thereby burning the highly integrated intelligent PFC power switch module 23.

It should be noted that, since the MCU is susceptible to interference from electronic components in the high-voltage part due to weak control signals received or outputted by the MCU, when the high-voltage and low-voltage components are mounted on a single mounting board, the circuit wiring of the components in the high-voltage part and the circuit wiring of the weak-voltage part need to be kept at a certain safety distance to meet the safety requirements. When two kinds of circuit wiring are wired on the same mounting substrate, the wiring of the circuit wiring is thin, and the size of the mounting substrate is generally required to be set to be larger so as to realize strong and weak electric isolation.

In order to avoid the above problem, the present embodiment arranges the control module 10, i.e., the non-heat source period, on the first circuit substrate, and arranges the power module 20, i.e., the heat source device, on the second circuit substrate, the first mounting substrate 100 is preferably implemented by a high thermal conductive heat dissipation substrate, the second mounting substrate 200 may be implemented by a high thermal resistance mounting substrate, and the control module 10 and the plurality of power modules 20 may be electrically connected by the metal binding wire 400. By the arrangement, the problem that the heat source device radiates heat to the non-heat source device to influence the work of the non-heat source device can be avoided. And the working temperature of the control chip is lower, which is beneficial to shortening the drive control delay of the control module 10 to the power module 20, thereby improving the switching speed of each power switching tube. Because the strong and weak electric elements are respectively arranged on the second mounting substrate 200 and the first mounting substrate 100, the work influence of electromagnetic interference generated by a power switch tube on the control module 10 can be reduced, the long-term reliable operation of each circuit module in the high-integration intelligent power module can be ensured, meanwhile, the line width and the area of circuit wiring can be increased, the board distribution difficulty of each mounting substrate is reduced, the heat dissipation area of each element can be increased due to the increase of the circuit wiring area, the junction temperature of a power device is reduced, and further, the heat dissipation rate of the control module 10 and the heat dissipation rate of the power module 20 are increased.

According to the invention, the control module 10 is arranged on the corresponding mounting position on the first mounting substrate 100, the power module 20 is integrally arranged on the corresponding mounting position on the second mounting substrate 200, the control module 10 and the power module 20 are electrically connected through the metal binding wire 400, so that the heat dissipation of the power module 20 to the control module 10 can be avoided, the normal work of the control module 10 is influenced, the first mounting substrate 100 is overlapped on the second mounting substrate 200, the size of the substrate can be reduced, and the whole size of the high-integration intelligent power module is reduced. The invention integrates the above functional modules into a packaging body, can shorten the distance between the control module 10 and the power module 20, so as to improve the integration level of the integrated intelligent power module, realize the integrated drive control of a plurality of loads, such as a fan and a compressor, reduce the volume of an electric control board, facilitate the installation and reduce the electromagnetic interference caused by overlong jumpers and excessive jumpers. The components of the electric control board can be reduced, the PCB layout of the electric control board is simplified, and the production cost of the air conditioner is effectively reduced. The invention solves the problems that when the electric control board is realized by adopting a plurality of discrete components, the number of components is large, so that the electric control board is difficult to assemble when being assembled to electric equipment, and the heat efficiency of the air conditioner is low, and the air conditioner is not beneficial to realizing energy conservation and emission reduction due to large power consumption, serious heating and the like of the air conditioner.

Referring to fig. 1 to 5, in an alternative embodiment, the highly integrated smart power module further includes a circuit wiring layer 300, the circuit wiring layer 300 is disposed on one side surface of the second mounting substrate 200, and the circuit wiring layer 300 forms the corresponding mounting position on the first mounting substrate 100;

alternatively, the circuit wiring layer 300 is embedded in the second mounting substrate 200 and electrically connected to the mounting sites on the second mounting substrate 200.

In this embodiment, as shown in fig. 3, the circuit wiring layer 300 may be disposed on a side surface of the second mounting substrate 200 according to a material of the circuit wiring substrate, or as shown in fig. 4, the circuit wiring layer 300 may also be embedded in the second mounting substrate 200, for example, when the second mounting substrate 200 is implemented by using a ceramic substrate, according to a circuit design of the power module 20, after etching a corresponding circuit channel on a side surface of the ceramic substrate, copper paste or silver paste is poured into the circuit for communication, and the circuit wiring layer 300 and the second mounting substrate 200 are integrally formed by using a sintering process.

When the circuit wiring layer 300 is disposed on the surface of one side of the second mounting substrate 200, the circuit wiring layer 300 forms corresponding lines and mounting positions, i.e., pads, on the surface of one side of the second mounting substrate 200, where electronic components of the power module 20 are mounted, according to the circuit design of the power module 20.

Further, in the above embodiment, when the circuit wiring layer 300 is disposed on the surface of the second mounting substrate 200, the power module 20 may further include an insulating layer disposed on the second mounting substrate 200 according to a material of the second mounting substrate 200, for example, when the second mounting substrate 200 is made of a material having a conductive property, such as an aluminum material or a copper material, the insulating layer may be made of a material, such as a thermoplastic adhesive or a thermosetting adhesive, so as to achieve a fixed connection and insulation between the heat dissipation substrate and the circuit wiring layer 300. The insulating layer can be realized by adopting one or more materials of epoxy resin, alumina and the like. The insulating layer is used to realize electrical isolation and electromagnetic shielding between the circuit wiring layer 300 and the second mounting substrate 200, and to reflect external electromagnetic interference, thereby preventing external electromagnetic radiation from interfering with normal operation of the power module 20, and reducing interference influence of electromagnetic radiation in the surrounding environment on electronic components in the power module 20. The insulating layer can also be made of an insulating material with high thermal resistance, so that a heat insulation effect is realized, and heat of the second mounting substrate 200 is further prevented from being conducted to the first mounting substrate 100. Specifically, after an insulating layer is provided on the second mounting substrate 200, a copper foil is laid on the insulating layer 120 and etched in accordance with a preset circuit design, thereby forming a circuit wiring layer 300. After the electronic components of the circuit modules such as the PFC power switch module 23, the compressor IPM module 20, and the fan IPM module 30 are integrated in the circuit wiring layer 300 on the heat dissipation substrate, the electrical connection between the circuit modules may be realized by the metal binding wire 400.

Referring to fig. 1 to 5, in an alternative embodiment, the first mounting substrate 100 and the second mounting substrate 200 are fixedly connected by an adhesive material 500.

In this embodiment, the first mounting substrate 100 and the second mounting substrate 200 may be fixedly connected by screws, snaps, or the like, or fixedly connected by the adhesive material 500. For example, when the circuit wiring layer 300 is disposed on one surface of the second mounting substrate 200, the circuit wiring layer 300 may form a protrusion on the second mounting substrate 200, and the first mounting substrate 100 and the second mounting substrate 200 may be fixedly connected by using a liquid adhesive in order to prevent the circuit protrusion on the circuit unwanted layer from forming an adhesive void on the second mounting substrate 200.

When the circuit wiring layer 300 is embedded in the second mounting substrate 200, an adhesive film adhesive, such as a double-sided adhesive tape, may be optionally used between the first mounting substrate 100 and the second mounting substrate 200 to achieve a fixed connection.

It is understood that, in the above embodiment, the adhesive material 500 may be implemented by using an adhesive material with a low expansion coefficient, so as to prevent the adhesive material 500 from expanding due to the heat generated by the second mounting substrate 200, and the first mounting substrate 100 is separated from the second mounting substrate 200, which causes the relative movement between the first mounting substrate 100 and the second mounting substrate 200.

Referring to fig. 1 to 5, in an alternative embodiment, the highly integrated smart power module further includes an insulating layer (not shown) disposed between the first mounting substrate 100 and the second mounting substrate 200.

In this embodiment, the insulating layer may be made of insulating materials such as insulating paste, silicon nitride, and organic insulating film, for example, when the insulating paste is used for implementation, electrical isolation and electromagnetic shielding between the first mounting substrate 100 and the second mounting substrate 200 may be implemented to reflect external electromagnetic interference, so as to prevent the electromagnetic radiation interference control module 10 generated by the power module 20 from working normally, and reduce the interference influence of electromagnetic radiation in the surrounding environment on electronic components in the highly integrated intelligent power module. The insulating layer may also serve as an adhesive material 500 to achieve a fixed connection between the first mounting substrate 100 and the second mounting substrate 200.

Referring to fig. 1-5, in an alternative embodiment, the power module 20 is a compressor drive power module 21 and/or a fan drive power module 22.

In this embodiment, the fan driving power module 22 is used for driving the wind wheel motor, and the compressor driving power module 21 is used for driving the compressor motor, but in other embodiments, the power module 20 may also be used for driving frequency converters and various inverter power supplies of other motors, and is applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo driving, and variable frequency household appliances such as air conditioners. The fan driving power module 22 and the compressor driving power module 21 are respectively integrated with a plurality of power switching tubes such as IGBTs and MOS tubes, the number of the plurality of power switching tubes may be four or six, the specific number may be set according to the type of the motor, the driving power, and the like, and the present disclosure is not limited thereto.

It is understood that, in the above embodiments, the compressor driving power module 21 for driving the compressor motor, the fan driving power module 22 for driving the fan motor, or both the compressor driving power module 21 and the fan driving power module 22 may be integrated on the second mounting substrate 200 according to the requirements of the customers and the size of the mounting substrate, and the like, which is not limited herein.

Referring to fig. 1 to 5, in an alternative embodiment, the control module 10 includes an MCU; and the number of the first and second groups,

when the power module 20 is a fan driving power module 22, the control module 10 further includes a fan power driving chip 12;

when the power module 20 is a compressor driving module, the control module 10 further includes a compressor power driving chip 11;

the MCU has a plurality of first control terminals and a plurality of second control terminals,

a plurality of first control ends of the MCU are connected with a plurality of signal input ends of the fan power driving chip 12 in a one-to-one correspondence manner; a plurality of second control ends of the MCU are correspondingly connected with a plurality of signal input ends of the compressor power driving chip 11 one by one;

a plurality of output ends of the fan power driving chip 12 are connected with a plurality of controlled ends of the fan driving power module 22 in a one-to-one correspondence manner;

a plurality of output terminals of the compressor power driving chip 11 are connected to a plurality of controlled terminals of the compressor driving power module 21 in a one-to-one correspondence.

In this embodiment, the MCU is integrated with a timing controller, a memory, a data processor, and a software program and/or module stored in the memory and operable on the data processor, and outputs a corresponding timing control signal to the fan power driving chip 12 and the compressor power driving chip 11 by operating or executing the software program and/or module stored in the memory and calling the data stored in the memory, so that the fan power driving chip 12 converts the received timing control signal into a corresponding driving signal to drive a corresponding power switch in the fan power driving chip 12 to turn on/off, thereby driving the fan to operate. And the compressor power driving chip 11 converts the received timing control signal into a corresponding driving signal to drive the corresponding power switch tube in each power module 20 to turn on/off, so as to drive the compressor to work.

Referring to fig. 1 to 5, in an alternative embodiment, the power module 20 further includes a PFC power switch module 23, and an output terminal of the PFC power switch module 23 is connected to an output terminal of the compressor driving power module 21 and/or an output terminal of the fan driving power module 22, respectively.

In this embodiment, the PFC power switch module 23 may be implemented by only a PFC switch, or may further form a PFC circuit with other components such as a diode and an inductor to implement power factor correction on the dc power supply. The PFC circuit may be implemented by a passive PFC circuit to form a boost PFC circuit, a buck PFC circuit, or a boost PFC circuit. It can be understood that, in practical applications, the positions and the connection relationship between the PFC power switch module 23 and the rectifier bridge 30 may be adaptively adjusted according to the setting type of the PFC circuit, and are not limited herein. The PFC power switch module 23 adjusts the power factor of the direct current input by the rectifier bridge 30 based on the control of the control module 10, and the adjusted direct current can be output to the compressor power component and the fan power component, so that the compressor power component drives the compressor to work and the fan power component drives the fan. The dc power adjusted by the PFC power switch module 23 may be used to generate driving voltages of various values, such as 5V and 15V, through an external switching power circuit, and be respectively used for supplying power to the MCU and each IPM driver IC.

Referring to fig. 1 to 5, based on the above embodiment, the control module 10 further includes a PFC power driver chip 13, and a third control terminal of the MCU is connected to a signal input terminal of the PFC power driver chip 13; and the signal output end of the PFC power driving chip 13 is connected with the controlled end of the power switch module.

In this embodiment, the PFC driving chip 11 converts the received timing control signal output by the MCU into a corresponding driving signal to drive the power switch in the PFC power switch module 23 to operate.

Referring to fig. 1 to 5, in an alternative embodiment, the highly integrated smart power module further includes a rectifier bridge 30, and the rectifier bridge 30 is disposed on the second mounting substrate 200.

In this embodiment, the rectifier bridge 30 converts the input ac power into dc power and outputs the dc power to the PFC circuit, so as to adjust the power factor of the input dc power. It is understood that the rectifier bridge 30 may be implemented by combining four chip diodes, and in some embodiments, the electronic components of the rectifier bridge 30, the MCU in the control module 10, the compressor power driving chip 11, the PFC power driving chip 13, and the fan power driving chip 12, and the PFC power switch module 23 in the power module 20, the compressor driving power module 21, and the fan driving power module 22 may be implemented by using chip components having a package housing, and the chip components may be soldered on a mounting substrate by using a conductive material such as solder. Alternatively, the electronic components may be implemented by using bare wafers, each bare wafer may be mounted on the mounting substrate by a flip-chip process, and the electronic components in the control modules 10 and the electronic components in the power modules 20 may be electrically connected by the respective circuit wiring layers 300 to form a current loop. The electronic components in the control module 10 are electrically connected to the electronic components in the power module 20 by the metallic binding wire 400.

Referring to fig. 1 to 5, it can be understood that, in the highly integrated smart power module, the control module 10 disposed on the first mounting substrate 100 may be integrated with the MCU, the compressor power driving chip 11, the PFC power driving chip 13, and the fan power driving chip 12, and the power module 20 disposed on the second mounting substrate 200 may be integrated with the compressor driving power module 21, the fan driving power module 22, the PFC power switching module 23, and the rectifier bridge 30. The functional modules in the control module 10 and the power module 20 may be combined according to different loads to be driven, or the size of the high-integrated intelligent power module, so as to form different advanced intelligent power modules 20.

Referring to fig. 5, fig. 5 is a schematic circuit diagram of an embodiment of a highly integrated smart power module; in an embodiment, the highly integrated smart power module integrates the combination of the power module 20 and the control module 10, wherein an input end of the rectifier bridge 30 is used for accessing an alternating current power supply, and an output end of the rectifier bridge 30 is connected with an input end of the PFC power switch module 23; the output end of the PFC power switch module 23 is connected to the power input ends of the plurality of power modules 20; the control terminals of the control module 10 are connected to the controlled terminal of the PFC power switch module 23 and the controlled terminals of the power modules 20 in a one-to-one correspondence manner. The PFC driving chip 13 drives the PFC power switch module 23 to correct the dc voltage output by the rectifier bridge 30 and output the corrected dc voltage to the control module 10, so as to provide a stable working voltage for the control module 10, and simultaneously output the dc power supply with the power factor corrected to the compressor driving power module 21 and the fan driving power module 22, respectively, the compressor power driving chip 11 outputs a corresponding control signal to control the compressor driving power modules 21 to drive the compressor motors to work, and the fan power driving chip 12 outputs a corresponding control signal to control the compressor driving power modules 22 to drive the fan motors to work.

The invention also provides an air conditioner which comprises the high-integration intelligent power module. The detailed structure of the highly integrated intelligent power module can refer to the above embodiments, and is not described herein again; it can be understood that, because the air conditioner of the present invention uses the above-mentioned high-integration intelligent power module, the embodiments of the air conditioner of the present invention include all technical solutions of all embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are also completely the same, and are not described herein again.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.