High-thermal-conductivity coating and preparation method thereof

文档序号:1499856 发布日期:2020-02-07 浏览:8次 中文

阅读说明:本技术 一种高导热涂料及其制备方法 (High-thermal-conductivity coating and preparation method thereof ) 是由 刘佰臣 于 2019-10-16 设计创作,主要内容包括:本发明公开了一种高导热涂料,所述的涂料按重量百分比计,包括以下组分:有机载体18-50%、纳米导电炭黑15-20%、石墨粉8-15%、助剂5-15%、溶剂a 15-30%;其中以有机载体为100%计,包括以下重量百分比成分:溶剂b 35-40%、环氧改性有机硅树脂20-30%、双酚A型环氧树脂20-30%、异氰酸酯树脂类固化剂10-20%、取代脲固化促进剂2-8%。本发明采用上述配方,得到亮黑色流动性浆料即高导热涂料。该高导热涂料的使用温度可长期位于100-800℃,而且其发热温度均匀,长期使用不会发生功率衰退。(The invention discloses a high-thermal-conductivity coating, which comprises the following components in percentage by weight: 18-50% of organic carrier, 15-20% of nano conductive carbon black, 8-15% of graphite powder, 5-15% of auxiliary agent and 15-30% of solvent a; wherein the organic carrier is 100 percent, and comprises the following components in percentage by weight: 35-40% of solvent b, 20-30% of epoxy modified organic silicon resin, 20-30% of bisphenol A epoxy resin, 10-20% of isocyanate resin curing agent and 2-8% of substituted urea curing accelerator. By adopting the formula, the invention obtains bright black flowable slurry, namely the high-thermal-conductivity coating. The high-thermal-conductivity coating can be used at the temperature of 100 ℃ and 800 ℃ for a long time, and has uniform heating temperature, so that power recession cannot occur after long-term use.)

1. The high-thermal-conductivity coating is characterized in that: the coating comprises the following components in percentage by weight:

Figure FDA0002235320070000011

wherein the organic carrier is 100 percent, and comprises the following components in percentage by weight:

Figure FDA0002235320070000012

2. the high thermal conductivity coating according to claim 1, wherein: the coating comprises the following components in percentage by weight:

Figure FDA0002235320070000013

wherein the organic carrier is 100 percent, and comprises the following components in percentage by weight:

Figure FDA0002235320070000014

Figure FDA0002235320070000021

3. the high thermal conductivity coating according to claim, wherein: the solvent a is a high-boiling point solvent and comprises one or more of cyclohexanone, dimethylformamide and N-methylpyrrolidone.

4. The high thermal conductivity coating according to claim, wherein: the solvent b at least comprises one of dimethylformamide and N-methylpyrrolidone.

5. The high thermal conductivity coating according to claim, wherein: the auxiliary agent is selected from one or more of a defoaming agent, a dispersing agent, a rheological agent and a drier.

6. A preparation method of a high-thermal-conductivity coating is characterized by comprising the following steps: the specific method comprises the following steps: step A, according to the proportion, taking a solvent b in a container, placing the solvent b in a water bath at 90 ℃ for heating, and adding 10-20% of isocyanate resin curing agent; 2-8% of substituted urea curing accelerator is dispersed by a dispersion machine at the same time;

step B, after the curing agent solid is dissolved, adding 20-30% of epoxy modified organic silicon resin; 20-30% of bisphenol A epoxy resin, and uniformly dispersing by a dispersion machine to obtain an organic carrier;

step C, putting the prepared organic carrier into another container, adding an auxiliary agent and a solvent a, and uniformly dispersing by using a dispersion machine;

and D, after uniform dispersion, adding the nano conductive carbon black and the graphite powder while slowly dispersing, after pre-dispersing for 15-30min, transferring the formed slurry to a three-roller machine for grinding and dispersing until the fineness of the slurry is less than 10 mu m, and obtaining bright black flowable slurry, namely the high-temperature electric heating coating.

Technical Field

The invention relates to the field of electrothermal coatings, in particular to a high-thermal-conductivity coating and a preparation method thereof.

Background

The electrothermal paint widely used in the market at present is a functional paint which takes carbon materials such as carbon black, graphite and the like as conductive agents, is uniformly dispersed in an organic carrier, is simultaneously coated on insulating base materials such as PET, epoxy glass fiber boards, ceramic panels and the like in a coating, silk-screen printing, gravure and other modes, takes a conductive copper strip as two-end electrodes, and applies voltage to two ends of the electrodes so as to stably generate heat. The electrothermal conversion efficiency of the heating coating adopting the carbon-series conductive agent can reach more than 90 percent, and far infrared light with the wavelength of 8-13um can be radiated, so the electrothermal coating is widely applied to the fields of floor heating, seed heating plates, pet heat-insulating pads, heating carpets and the like. However, the common heating carbon-based slurry in the market has the defects of insufficient heating temperature, nonuniform heating, long service time, easy power decline and the like when the heating carbon-based slurry is heated at the working temperature of 40-60 ℃.

Accordingly, the prior art is yet to be improved and developed.

Disclosure of Invention

The invention aims to provide a high-thermal-conductivity coating and a preparation method thereof, and aims to solve the problems of insufficient heating temperature and nonuniform heating of the conventional electric heating coating.

In order to achieve the purpose, the invention provides the following technical scheme: the high-thermal-conductivity coating comprises the following components in percentage by weight:

Figure BDA0002235320080000011

Figure BDA0002235320080000021

wherein the organic carrier is 100 percent, and comprises the following components in percentage by weight:

Figure BDA0002235320080000022

preferably, the high thermal conductive coating comprises the following components in percentage by weight:

Figure BDA0002235320080000023

wherein the organic carrier is 100 percent, and comprises the following components in percentage by weight:

Figure BDA0002235320080000024

wherein the solvent a is a high boiling point solvent and comprises one or more of cyclohexanone, dimethylformamide and N-methylpyrrolidone.

Wherein the solvent b at least comprises one of dimethylformamide and N-methylpyrrolidone.

Wherein the auxiliary agent is selected from one or more of a defoaming agent, a dispersing agent, a rheological agent and a drier;

a preparation method of a high-thermal-conductivity coating comprises the following steps:

step A, according to the proportion, taking a solvent b in a container, placing the solvent b in a water bath at 90 ℃ for heating, and adding 10-20% of isocyanate resin curing agent; 2-8% of substituted urea curing accelerator is dispersed by a dispersion machine at the same time;

step B, after the curing agent solid is dissolved, adding 20-30% of epoxy modified organic silicon resin; 20-30% of bisphenol A epoxy resin, and uniformly dispersing by a dispersion machine to obtain an organic carrier;

step C, putting the prepared organic carrier into another container, adding an auxiliary agent and a solvent a, and uniformly dispersing by using a dispersion machine;

and D, after uniform dispersion, adding the nano conductive carbon black and the graphite powder while slowly dispersing, after pre-dispersing for 15-30min, transferring the formed slurry to a three-roller machine for grinding and dispersing until the fineness of the slurry is less than 10 mu m, and obtaining bright black flowable slurry, namely the high-temperature electric heating coating.

Compared with the prior art, the invention has the following beneficial effects: by adopting the formula, the invention obtains bright black flowable slurry, namely the high-thermal-conductivity coating. The high-thermal-conductivity coating can be used at the temperature of 100 ℃ and 800 ℃ for a long time, and has uniform heating temperature, so that power recession cannot occur after long-term use.

Detailed Description

The technical solutions of the present invention will be described clearly and completely in the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

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