阅读说明：本技术 一种微带环行器、隔离器及t/r组件 (Microstrip circulator, isolator and T/R assembly ) 是由 谭斯克 吴炎惊 满吉令 张如 梁超 于 2019-11-05 设计创作，主要内容包括：本发明公开了一种微带环行器,可应用于隔离器以及微波通信中,尤其在T/R组件中使用量巨大；该微带环行器通过增加一块基板,该基板的上表面设置有第一接地金属层,其下表面设置有与第一接地金属层呈电性连接且用于表面贴装的焊接区域,且基板上设置有多个避让部；而且,微带环行器的中心导体的多个连接部分别与旋磁层的下表面设置的多个连接端一一对应且呈电性连接；将旋磁层设置在基板之上,第一接地金属层与第二接地金属层呈电性连接,同时,焊接端与避让部一一对应并穿过对应的避让部,作为表面贴装的焊接部分。因此,本发明不仅能够通过基板实现与外部电路的表面贴装,还能通过该基板减小外力对旋磁体的冲击。(The invention discloses a microstrip circulator which can be applied to an isolator and microwave communication, and is particularly large in use amount in a T/R assembly; the micro-strip circulator is characterized in that a substrate is additionally arranged, the upper surface of the substrate is provided with a first grounding metal layer, the lower surface of the substrate is provided with a welding area which is electrically connected with the first grounding metal layer and is used for surface mounting, and the substrate is provided with a plurality of avoiding parts; moreover, a plurality of connecting parts of the central conductor of the microstrip circulator are respectively in one-to-one correspondence with a plurality of connecting ends arranged on the lower surface of the gyromagnetic layer and are electrically connected; the gyromagnetic layer is arranged on the substrate, the first grounding metal layer is electrically connected with the second grounding metal layer, and meanwhile, the welding ends are in one-to-one correspondence with the avoidance parts and penetrate through the corresponding avoidance parts to serve as surface-mounted welding parts. Therefore, the present invention can not only realize surface mounting with an external circuit through the substrate, but also reduce the impact of external force on the gyromagnetic body through the substrate.)

1. The utility model provides a microstrip circulator, includes the gyromagnetic layer, sets up at the gyromagnetic layer upper surface and has the center conductor of a plurality of connecting portions to and set up the permanent magnet above the center conductor, its characterized in that still includes: a substrate;

the upper surface of the substrate is provided with a first grounding metal layer, and the lower surface of the substrate is provided with a welding area which is electrically connected with the first grounding metal layer and is used for surface mounting of the microstrip circulator; a plurality of avoiding parts are arranged on the substrate;

the lower surface of the magnetic rotating layer is provided with a second grounding metal layer and a plurality of welding ends which correspond to the connecting parts one by one; the first grounding metal layer is insulated and isolated from the welding end, and the corresponding connecting part is electrically connected with the welding end;

the magnetic rotating layer is arranged on the substrate, the lower surface of the magnetic rotating layer and the upper surface of the substrate are arranged face to face, the first grounding metal layer is electrically connected with the second grounding metal layer, and the welding ends are in one-to-one correspondence with the avoiding parts and penetrate through the corresponding avoiding parts to serve as the surface-mounted welding part of the microstrip circulator.

2. The microstrip circulator of claim 1 wherein the solder terminal is a metal bump or a metal post.

3. The microstrip circulator of claim 1 wherein the substrate is a metal plate or a PCB plate.

4. The microstrip circulator of claim 1 wherein the gyromagnetic layer is provided with a plurality of metalized vias, the connecting portion being electrically connected to the corresponding bonding end through the metalized via.

5. The microstrip circulator of claim 1 wherein a side of the gyromagnetic layer is provided with a plurality of metalized grooves or metal connecting lines; each connecting part extends to the edge of the upper surface of the gyromagnetic layer and is electrically connected with the corresponding welding end through the metallization groove or the metal connecting line.

6. The microstrip circulator of any one of claims 1 to 5 wherein the evasion portion is an evasion hole formed in the substrate or an evasion groove formed on an edge of the substrate.

7. The microstrip circulator of claim 6 further comprising a dielectric slab and a temperature compensation slab; the medium sheet is arranged between the central conductor and the permanent magnet, and the temperature compensation sheet is arranged between the medium sheet and the permanent magnet.

8. The microstrip circulator of claim 6 wherein a magnetic shield is disposed on the permanent magnet.

9. An isolator comprising a microstrip circulator as claimed in any one of claims 1 to 8 and a load connected to one or more of the bonding terminals of the microstrip circulator.

10. A T/R module, comprising a microstrip circulator as claimed in any one of claims 1 to 8, and a transceiver circuit connected to one or more bonding terminals of the microstrip circulator.

Technical Field

The invention belongs to the technical field of design and manufacture of circulators, and particularly relates to a microstrip circulator, an isolator and a T/R component using the microstrip circulator.

Background

The circulator is a non-reversible device with a plurality of ends, comprises a gyromagnetic body made of gyromagnetic materials, and the gyromagnetic materials generate gyromagnetic characteristics under the combined action of an external microwave magnetic field and a constant direct-current magnetic field, so that electromagnetic waves propagating in the gyromagnetic body are polarized and rotated, and the unidirectional transmission of high-frequency signal energy is realized, and the circulator is widely applied to the field of microwave communication. With the development of communication technology, the requirements for the circulator are higher and higher, for example, the circulator is required to be small in size and simple in process, and meanwhile, the circulator can meet the requirement for high integration.

At present, when the traditional circulator is applied, a manual welding or gold wire bonding mode is usually adopted to electrically connect the pins with the circuit on the PCB, so that the efficiency is low, and the requirement of high integration cannot be met. Although the prior circulator has been designed by Surface Mount Technology (SMT), in practice, when the circulator is subjected to strong external force and strong temperature impact, such as assembly, reflow soldering, and high-frequency energy transmission heating, the gyromagnetic body in the circulator is likely to crack if the gyromagnetic body is stressed unevenly or has a large difference in expansion coefficient from the PCB.

Therefore, there is a need to provide a microstrip circulator with a lower failure rate in a surface mount scenario.

Disclosure of Invention

In view of the above-mentioned deficiencies of the prior art, the present invention aims to: the micro-strip circulator with low failure rate in a surface mounting scene is provided, the impact of external force on a rotary magnet is reduced by improving the structure of the existing surface-mounted circulator, and meanwhile, the assembly and production efficiency of the surface-mounted circulator is improved.

In order to achieve the purpose, the invention provides the following technical scheme:

a microstrip circulator comprises a gyromagnetic layer, a central conductor and a permanent magnet, wherein the central conductor is arranged on the upper surface of the gyromagnetic layer and is provided with a plurality of connecting parts;

the upper surface of the substrate is provided with a first grounding metal layer, and the lower surface of the substrate is provided with a welding area which is electrically connected with the first grounding metal layer and is used for surface mounting of the microstrip circulator; a plurality of avoiding parts are arranged on the substrate;

the lower surface of the magnetic rotating layer is provided with a second grounding metal layer and a plurality of welding ends which correspond to the connecting parts one by one; the first grounding metal layer is insulated and isolated from the welding end, and the corresponding connecting part is electrically connected with the welding end;

the magnetic rotating layer is arranged on the substrate, the lower surface of the magnetic rotating layer and the upper surface of the substrate are arranged face to face, the first grounding metal layer is electrically connected with the second grounding metal layer, and the welding ends are in one-to-one correspondence with the avoiding parts and penetrate through the corresponding avoiding parts to serve as the surface-mounted welding part of the microstrip circulator.

According to a specific embodiment, in the microstrip circulator of the present invention, the bonding end is a metal bump or a metal pillar.

Further objects of the invention are: the probability of gyromagnetic fracture of the circulator under strong temperature impact is reduced.

In the microstrip circulator of the present invention, preferably, the substrate is a metal plate or a PCB plate. Because the thermal expansion coefficient of the base plate material is between the external circuit board and the gyromagnetic material, the internal stress under strong temperature impact can be buffered, and the probability of gyromagnetic body fracture of the circulator is reduced.

According to a specific embodiment, in the microstrip circulator, the gyromagnetic layer is provided with a plurality of metalized through holes, and the connecting portion is electrically connected with the corresponding welding end through the metalized through holes.

According to a specific embodiment, in the microstrip circulator, a plurality of metalized grooves or metal connecting lines are arranged on the side edge of the gyromagnetic layer; each connecting part extends to the edge of the upper surface of the gyromagnetic layer and is electrically connected with the corresponding welding end through the metallization groove or the metal connecting line.

According to a specific embodiment, in the microstrip circulator of the present invention, the avoiding portion is an avoiding hole formed on the substrate or an avoiding groove formed on an edge of the substrate. Because the base plate adopts the metal plate and the avoidance structure is designed on the base plate, the metal plate only needs to be perforated or grooved, other procedures are not needed, and the assembly and production efficiency of the surface-mounted circulator are improved.

According to a specific embodiment, the microstrip circulator of the invention further comprises a dielectric plate and a temperature compensation plate; the medium sheet is arranged between the central conductor and the permanent magnet, and the temperature compensation sheet is arranged between the medium sheet and the permanent magnet. A medium sheet is arranged between the central conductor and the permanent magnet, so that the gap between the central conductor and the permanent magnet can be adjusted, and a magnetic circuit is optimized; and a temperature compensation sheet is arranged between the central conductor and the permanent magnet, so that the temperature characteristic of the circulator is improved.

According to a specific embodiment, in the microstrip circulator of the invention, the permanent magnet is provided with a magnetic shield. The magnetic shielding cover is arranged on the permanent magnet, so that the magnetic circuit of the permanent magnet is denser, and the interference of a leakage magnetic field to surrounding components is reduced.

The invention also provides an isolator which comprises the microstrip circulator and a load connected with one or more welding ends of the microstrip circulator.

The invention also provides a T/R component which comprises the microstrip circulator and a transceiver circuit connected with one or more welding ends of the microstrip circulator.

Compared with the prior art, the invention has the beneficial effects that:

1. the micro-strip circulator is provided with a substrate, wherein the upper surface of the substrate is provided with a first grounding metal layer, the lower surface of the substrate is provided with a welding area which is electrically connected with the first grounding metal layer and is used for surface mounting, and the substrate is provided with a plurality of avoiding parts; moreover, a plurality of connecting parts of the central conductor of the microstrip circulator are respectively in one-to-one correspondence with a plurality of connecting ends arranged on the lower surface of the gyromagnetic layer and are electrically connected; the gyromagnetic layer is arranged on the substrate, the lower surface of the gyromagnetic layer and the upper surface of the substrate are arranged face to face, meanwhile, the first grounding metal layer is electrically connected with the second grounding metal layer, the connecting ends are in one-to-one correspondence with the signal ends and are electrically connected with the signal ends, and meanwhile, the welding ends are in one-to-one correspondence with the avoiding portions and penetrate through the corresponding avoiding portions to serve as surface-mounted welding portions. Therefore, the present invention can not only realize surface mounting with an external circuit through the substrate, but also reduce the impact of external force on the gyromagnetic body through the substrate.

2. In the micro-strip circulator, the thermal expansion coefficient of the substrate material is between the external circuit board and the gyromagnetic material, and if a metal plate or a PCB (printed Circuit Board) is adopted, the internal stress under strong temperature impact can be buffered, so that the probability of gyromagnetic body fracture of the circulator is reduced. Meanwhile, the base plate is a metal plate, so that the magnetic circuit can be optimized without independently adding a uniform magnetic sheet, and the performance of the circulator is improved. Through simulation experiments, the electrical performance index of the insertion loss of the microstrip circulator can be improved.

3. In the microstrip circulator, the substrate adopts the metal plate and the avoidance structure is designed on the substrate, so that the metal plate is only required to be perforated or grooved, other procedures are not required, and the assembly and production efficiency of the surface-mounted circulator are improved.

Drawings

FIG. 1 is an exploded view of a microstrip circulator of the present invention;

FIG. 2 is a schematic view of the structure of the lower surface of the gyromagnetic layer of the microstrip circulator of the present invention;

FIG. 3 is a schematic structural diagram of a dielectric sheet for a microstrip circulator of the present invention;

fig. 4 is a schematic diagram of the microstrip circulator of the present invention with the addition of a magnetic shielding shell.

List of reference numerals

10-substrate, 11 a-first avoidance groove, 11 b-second avoidance groove, 11 c-third avoidance groove, 12-first ground metal layer, 20-gyromagnetic layer, 21 a-first welding end, 21 b-second welding end, 21 c-third welding end, 22-second ground metal layer, 30-central conductor, 30 a-first connecting part, 30 b-second connecting part, 30 c-third connecting part, 40-permanent magnet, 50-dielectric sheet and 60-magnetic shield.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

As shown in fig. 1 and 2, the microstrip circulator of the present invention includes a gyromagnetic layer 20, a central conductor 30 disposed on an upper surface of the gyromagnetic layer 20, and a permanent magnet 40 disposed above the central conductor 30. Meanwhile, a substrate 10 is also included.

The upper surface of the substrate 10 is provided with a first grounding metal layer 12, the lower surface of the substrate 10 is provided with a welding part which is electrically connected with the first grounding metal layer 12 and used for surface mounting, and the side surface of the substrate 10 is provided with a first avoidance groove 11a, a second avoidance groove 11b and a third avoidance groove 11 c.

The central conductor 30 provided on the upper surface of the gyromagnetic layer 20 has a first connection portion 30a, a second connection portion 30b, and a third connection portion 30c, and the lower surface of the gyromagnetic layer 20 is provided with a second ground metal layer 22 and first bonding terminals 21a, second bonding terminals 21b, and third bonding terminals 21c corresponding to the first connection portion 30a, the second connection portion 30b, and the third connection portion 30c one to one. The second ground metal layer 22 is insulated and isolated from the first soldering terminal 21a, the second soldering terminal 21b and the third soldering terminal 21c, the first soldering terminal 21a is electrically connected to the first connecting portion 30a, the second soldering terminal 21b is electrically connected to the second connecting portion 30b, and the third soldering terminal 21c is electrically connected to the third connecting portion 30 c.

The gyromagnetic layer 20 is arranged on the substrate 10, the lower surface of the gyromagnetic layer 20 and the upper surface of the substrate 10 are arranged in a face-to-face manner, the second ground metal layer 22 of the gyromagnetic layer 20 is electrically connected with the first ground metal layer 12 of the substrate 10, the first welding end 21a, the second welding end 21b and the third welding end 21c are respectively aligned with the first avoiding groove 11a, the second avoiding groove 11b and the third avoiding groove 11c one by one, meanwhile, the first welding end 21a penetrates through the first avoiding groove 11a, the second welding end 21b penetrates through the second avoiding groove 11b, and the third welding end 21c penetrates through the third avoiding groove 11c, so that the first welding end 21a, the second welding end 21b and the third welding end 21c are respectively used as surface-mounted welding parts of the microstrip circulator.

Specifically, in the present invention, the electrical connection between the soldering terminal on the lower surface of the gyromagnetic layer 20 and the connecting portion of the central conductor 30 disposed on the upper surface thereof may be: the gyromagnetic layer 20 is provided with a corresponding number of metalized through holes, and the connecting portion is electrically connected with the corresponding welding end on the lower surface of the gyromagnetic layer 20 through the metalized through holes. Or, a plurality of metallized grooves or metal connecting lines are arranged on the side of the gyromagnetic layer 20; moreover, each connection portion extends to the edge of the upper surface of the gyromagnetic layer 20 and is electrically connected with the corresponding welding terminal on the lower surface of the gyromagnetic layer 20 through a metalized groove or a metal connection wire.

Referring to fig. 2 again, in the microstrip circulator of the present invention, the first solder terminal 21a, the second solder terminal 21b, and the third solder terminal 21c are all metal posts, and certainly, metal bumps or protrusions may be adopted as long as the height and shape of the protrusions can pass through the corresponding avoiding portion, which belongs to the content that those skilled in the art can equally replace, and will not be described herein again.

When the micro-strip circulator is manufactured, the grounding metal layer and the port on the gyromagnetic layer are printed with silver paste into corresponding patterns by adopting a printing process, then the silver paste is sintered, and a metal ball, such as a tin ball or a silver ball, is planted at the position where the silver paste sintering of the welding end is required to be finished because the welding end is required to be manufactured into the metal convex point. And then, the gyromagnetic layer and the substrate are combined in a mode that a layer of soldering paste is brushed on the surface of the gyromagnetic layer, then the gyromagnetic layer and the substrate are aligned, the welding end and the avoiding groove are aligned, and then the gyromagnetic layer and the substrate are placed into a high-temperature sintering furnace or a reflow soldering machine for sintering.

Meanwhile, as will be known to those skilled in the art, the number of ports of the circulator depends on the shape design of the central conductor, i.e., the central conductor has a plurality of connecting portions, generally speaking, the number of ports of the circulator is three or more, and the specific number of ports depends on the actual product requirements. Furthermore, the person skilled in the art knows that: except that the side of the substrate is provided with the avoiding groove, the substrate can be provided with corresponding quantity of avoiding holes, and meanwhile, in practical application, the design of the gyromagnetic layer and the combination of the substrate and the gyromagnetic layer can be increased by adopting the mode of avoiding the holes, so that the assembly and production efficiency can be reduced.

In the present invention, the substrate 10 is a PCB, and the first ground metal layer 12 is required to be disposed on the upper surface of the substrate 10, and the soldering area corresponding to the first ground metal layer 12 is required to be disposed on the lower surface, and the first ground metal layer 12 and the soldering area corresponding thereto can be electrically connected through the metalized via hole disposed on the substrate, and can also be electrically connected through the metalized groove or the metal connecting wire disposed on the side of the substrate 10. Although the drawings do not show the connection structures such as the metallized via, the metallized groove and the metal connection line on the substrate 10, the above-mentioned methods are all the well-known PCB layer-to-layer electrical connection methods.

In order to reduce the chance of gyromagnetic cracking of the circulator under strong temperature shock. In practice, a metal plate is used as the substrate 10. Because the thermal expansion coefficient of the base plate material is between the external circuit board and the gyromagnetic material, the internal stress under strong temperature impact can be buffered, and the probability of gyromagnetic body fracture of the circulator is reduced. Meanwhile, the metal plate is adopted, so that the metal plate has conductive property, a second grounding metal layer and a corresponding welding part do not need to be additionally arranged, and the metalized through hole, the metalized groove and the metal connecting wire do not need to be arranged to realize the electrical connection of the metal plate and the second grounding metal layer.

Meanwhile, the base plate is a metal plate, so that the magnetic circuit can be optimized without independently adding a uniform magnetic sheet, and the performance of the circulator is improved. Moreover, as the substrate adopts the metal plate and the avoidance structure is designed on the substrate, the metal plate only needs to be perforated or grooved, other procedures are not needed, and the assembly and production efficiency of the surface-mounted circulator is improved.

The performance of the invention was tested by simulation experiments with frequency range, insertion loss, reverse isolation and voltage standing wave ratio.

	Adding metal plates	Without adding metal plate
			Frequency of	3.3～3.9GHz	3.35～3.7GHz
Insertion loss	0.25dB	0.36dB
			Reverse isolation	25dB	22.5dB
Voltage standing wave ratio	1.14	1.18

As shown in fig. 3, the microstrip circulator of the present invention may further include a dielectric sheet 50 disposed between the central conductor 30 and the permanent magnet 40, so as to adjust the gap between the central conductor and the permanent magnet and optimize the magnetic circuit. Further, the microstrip circulator of the present invention may further include a temperature compensation plate (not shown in fig. 3) disposed between the dielectric plate 50 and the permanent magnet 40, which can improve the temperature characteristic of the circulator. In the invention, the medium sheet and the temperature compensation sheet are fixed in a bonding mode.

In order to further improve the magnetization characteristic of the circulator, a magnetic shield 60 is provided on the permanent magnet 40, as shown in fig. 4. Therefore, the magnetic circuit diffusion of the permanent magnet is avoided, the magnetic circuit of the permanent magnet is more densely concentrated in the circulator, and meanwhile, the interference of a leakage magnetic field to surrounding components is reduced.

In addition, the invention also provides an isolator which comprises the microstrip circulator and a load electrically connected with one or more welding ends of the microstrip circulator. Meanwhile, the invention also provides a T/R component which comprises the microstrip circulator and a transceiver circuit electrically connected with one or more welding ends of the microstrip circulator.

Those skilled in the art can use the microstrip circulator of the present invention in combination with corresponding components and circuit modules to form products for specific applications, such as isolators and T/R assemblies, which are not described herein again.