阅读说明：本技术 一种射频功率放大器 (Radio frequency power amplifier ) 是由 徐长久 张永胜 于 2018-07-27 设计创作，主要内容包括：本发明提供了一种射频功率放大器,涉及通信技术领域,该射频功率放大器包括双路封装功放管、输入匹配电路、输入偏置电路、输出匹配电路以及输出偏置电路,输入匹配电路与双路封装功放管的输入端连接,输出匹配电路与双路封装功放管的输出端连接,输入偏置电路与输入匹配电路连接。输出偏置电路包括第一输出偏置电路和第二输出偏置电路,第一输出偏置电路和第二输出偏置电路均与输出匹配电路连接,且第一输出偏置电路为双偏置电路,第二输出偏置电路为单偏置电路。相较于现有技术,本发明提供的一种射频功率放大器,其既能拓宽功率放大器的视频带宽,又能满足双路封装功放管的结构尺寸,减小电路板上的占用面积。(The invention provides a radio frequency power amplifier, which relates to the technical field of communication and comprises a double-path packaging power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit and an output bias circuit, wherein the input matching circuit is connected with the input end of the double-path packaging power amplifier tube, the output matching circuit is connected with the output end of the double-path packaging power amplifier tube, and the input bias circuit is connected with the input matching circuit. The output bias circuit comprises a first output bias circuit and a second output bias circuit, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit. Compared with the prior art, the radio frequency power amplifier provided by the invention can not only broaden the video bandwidth of the power amplifier, but also meet the structural size of a double-path packaging power amplifier tube and reduce the occupied area on a circuit board.)

1. A radio frequency power amplifier is characterized by comprising a double-path packaged power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit and an output bias circuit, wherein the input matching circuit is connected with the input end of the double-path packaged power amplifier tube, the output matching circuit is connected with the output end of the double-path packaged power amplifier tube, and the input bias circuit is connected with the input matching circuit;

the output bias circuit comprises a first output bias circuit and a second output bias circuit, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit.

2. The rf power amplifier of claim 1, wherein the output matching circuit comprises a first output matching circuit and a second output matching circuit, the first output matching circuit and the second output matching circuit are both connected to an output terminal of the dual-packaged power amplifier, the first output bias circuit is connected to the first output matching circuit, and the second output bias circuit is connected to the second output matching circuit.

3. The rf power amplifier of claim 2, wherein the first output bias circuit comprises two first output bias lines and two first capacitors, one end of each of the two first output bias lines is connected to the first output matching circuit, and the other end of each of the two first output bias lines is grounded through one of the first capacitors.

4. The radio frequency power amplifier according to claim 2 or 3, wherein the second output bias circuit includes a second output bias line and a second capacitor, one end of the second output bias line is connected to the second output matching circuit, and the other end of the second output bias line is grounded through the second capacitor.

5. The RF power amplifier of claim 1, wherein one of the outputs of the single bias circuit and the double bias circuit is respectively located at two sides of the pin of the dual-path packaged power amplifier tube, and the other output of the double bias circuit is located between the two outputs.

6. The rf power amplifier of claim 1, wherein the input matching circuit comprises a first input matching circuit and a second input matching circuit, the first input matching circuit and the second input matching circuit are both connected to the input end of the dual-packaged power amplifier tube, and the input bias circuit is respectively connected to the first input matching circuit and the second input matching circuit.

7. The RF power amplifier of claim 6, wherein the input bias circuit comprises a first input bias circuit and a second input bias circuit, the first input bias circuit is connected to the first input matching circuit, the second input bias circuit is connected to the second input matching circuit, and the first input bias circuit is a dual bias circuit and the second input bias circuit is a single bias circuit.

8. The radio frequency power amplifier of claim 6, wherein the second input bias circuit comprises a second input bias line, a second resistor, and a fourth capacitor, wherein one end of the second input bias line is connected to the second input matching circuit through the second resistor, and the other end of the second input bias line is grounded through the fourth capacitor.

9. The rf power amplifier of claim 1, wherein the dual-encapsulated power amplifier tube comprises two amplification channels, and one side of a tube shell of the dual-encapsulated power amplifier tube is provided with two input pins, the two input pins are connected to the input matching circuit, and the other side of the tube shell is provided with two output pins, the two output pins are connected to the output matching circuit.

10. A radio frequency power amplifier is characterized by comprising a power dividing module, a two-way packaged power amplifier tube, a circuit board, an input matching circuit, an input bias circuit, an output matching circuit and an output bias circuit, wherein the two-way packaged power amplifier tube, the input matching circuit, the input bias circuit, the output matching circuit and the output bias circuit are all arranged on the circuit board, the input matching circuit is connected with the input end of the two-way packaged power amplifier tube, the power dividing module is connected with the input matching circuit, the output matching circuit is connected with the output end of the two-way packaged power amplifier tube, and the input bias circuit is connected with the input matching circuit;

the output bias circuit comprises a first output bias circuit and a second output bias circuit, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit.

Technical Field

The invention relates to the technical field of communication, in particular to a radio frequency power amplifier.

Background

With the development of communication technology, communication systems gradually develop towards high efficiency, miniaturization and the like, the modulation mode of the communication systems is more and more complex, and the bandwidth of processed signals is more and more wide.

A power amplifier module in a communication system is usually a Doherty architecture and cooperates with a digital predistortion algorithm, and in order to reduce the board layout area of the Doherty power amplifier circuit on a circuit board, a two-way packaging type power amplifier tube is usually adopted. At present, the signal bandwidth processed by a digital predistortion system is wider and wider, and a Doherty power amplifier is required by a broadband digital predistortion system to have a sufficiently wide video bandwidth, which is usually more than 3 times of the bandwidth of a digital predistortion signal. In the prior art, in the design of a circuit board diagram of a Doherty power amplifier circuit PCB, when a two-way packaged power amplifier tube is used for board-level power amplifier design, a single-bias power supply mode is generally adopted, so that the video bandwidth of the Doherty power amplifier circuit is greatly limited, and the Doherty power amplifier circuit PCB is not friendly to the broadband correction force of digital predistortion.

Therefore, how to furthest widen the video bandwidth of the power amplifier tube of the double-path packaging type in the circuit design is a problem to be solved at present.

Disclosure of Invention

The invention aims to provide a radio frequency power amplifier, which not only can widen the video bandwidth of the power amplifier, but also can meet the structural size of a double-path packaging power amplifier tube and reduce the occupied area on a circuit board.

The invention is realized by adopting the following technical scheme.

A radio frequency power amplifier comprises a double-path packaged power amplifier tube, an input matching circuit, an input bias circuit, an output matching circuit and an output bias circuit, wherein the input matching circuit is connected with the input end of the double-path packaged power amplifier tube, the output matching circuit is connected with the output end of the double-path packaged power amplifier tube, and the input bias circuit is connected with the input matching circuit. The output bias circuit comprises a first output bias circuit and a second output bias circuit, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit.

Furthermore, the output matching circuit comprises a first output matching circuit and a second output matching circuit, the first output matching circuit and the second output matching circuit are both connected with the output end of the double-path packaging power amplification tube, the first output bias circuit is connected with the first output matching circuit, and the second output bias circuit is connected with the second output matching circuit.

Furthermore, the first output bias circuit comprises two first output bias lines and two first capacitors, one end of each of the two first output bias lines is connected with the first output matching circuit, and the other end of each of the two first output bias lines is grounded through one first capacitor.

Furthermore, the second output bias circuit comprises a second output bias line and a second capacitor, one end of the second output bias line is connected with the second output matching circuit, and the other end of the second output bias line is grounded through the second capacitor.

Furthermore, the output end of the single bias circuit and one of the output ends of the double bias circuit are respectively located at two sides of the pin of the double-path packaging power amplifier tube, and the other output end of the double bias circuit is located between the two output ends.

Furthermore, the input matching circuit comprises a first input matching circuit and a second input matching circuit, the first input matching circuit and the second input matching circuit are both connected with the input end of the double-path packaging power amplification tube, and the input bias circuit is respectively connected with the first input matching circuit and the second input matching circuit.

Furthermore, the input bias circuit comprises a first input bias circuit and a second input bias circuit, the first input bias circuit is connected with the first input matching circuit, the second input bias circuit is connected with the second input matching circuit, the first input bias circuit is a double bias circuit, and the second input bias circuit is a single bias circuit.

Furthermore, the first input bias circuit comprises two first input bias lines, two first resistors and two third capacitors, one end of each of the two first input bias lines is connected with the first input matching circuit through one first resistor, and the other end of each of the two first input bias lines is grounded through one third capacitor.

Furthermore, the second input bias circuit comprises a second input bias line, a second resistor and a fourth capacitor, one end of the second input bias line is connected with the second input matching circuit through the second resistor, and the other end of the second input bias line is grounded through the fourth capacitor.

Furthermore, the double-path encapsulation power amplifier tube comprises two amplification channels and a tube shell, wherein two input pins are arranged on one side of the tube shell and connected with an input matching circuit, two output pins are arranged on the other side of the tube shell and connected with an output matching circuit.

A radio frequency power amplifier comprises a power distribution module, a double-path packaging power amplifier tube, a circuit board, an input matching circuit, an input bias circuit, an output matching circuit and an output bias circuit, wherein the double-path packaging power amplifier tube, the input matching circuit, the input bias circuit, the output matching circuit and the output bias circuit are all arranged on the circuit board, the input matching circuit is connected with the input end of the double-path packaging power amplifier tube, the power distribution module is connected with the input matching circuit, the output matching circuit is connected with the output end of the double-path packaging power amplifier tube, and the input bias circuit is connected with the input matching circuit. The output bias circuit comprises a first output bias circuit and a second output bias circuit, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit.

The invention has the following beneficial effects:

the invention provides a radio frequency power amplifier, wherein an input matching circuit is connected with the input end of a double-path packaging power amplifier tube, an output matching circuit is connected with the output end of the double-path packaging power amplifier tube, and an input bias circuit is connected with the input matching circuit. Meanwhile, the first output bias circuit and the second output bias circuit are both connected with the output matching circuit, the first output bias circuit is a double bias circuit, and the second output bias circuit is a single bias circuit. The first output bias circuit and the second output bias circuit are respectively arranged on an upper circuit and a lower circuit of the double-circuit packaging power amplifier tube, generally, the first output bias circuit is arranged on the circuit with larger influence on linearity of the double-circuit packaging power amplifier tube, due to the adoption of double bias, the equivalent inductance of a bias network of the first output bias circuit is reduced by half, the video bandwidth of the double-circuit packaging power amplifier tube is increased by 1.414 times, due to the limited size of the double-circuit packaging power amplifier tube, the other output bias circuit cannot adopt the double bias circuit at the same time, and meanwhile, in order to reduce the occupied area of the bias circuit on a circuit board, the second output bias circuit adopts the single bias circuit. Compared with the prior art, the radio frequency power amplifier provided by the invention can not only broaden the video bandwidth of the power amplifier, but also meet the structural size of a double-path packaging power amplifier tube and reduce the occupied area on a circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a block diagram of a circuit structure of a radio frequency power amplifier according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a radio frequency power amplifier according to a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of the two-way packaged power amplifier tube in fig. 2;

fig. 4 is a schematic structural diagram of a radio frequency power amplifier according to a second embodiment of the present invention.

Icon: 100-a radio frequency power amplifier; 110-double-path packaging power amplifier tubes; 111-input pin; 113-an output pin; 130-a circuit board; 150-input matching circuit; 151-first input matching circuit; 153-second input matching circuit; 170-input bias circuit; 171-a first input bias circuit; 173-second input bias circuit; 180-output matching circuit; 181-first output matching circuit; 183-second output matching circuit; 190-an output bias circuit; 191-a first output bias circuit; 193-second output bias circuit.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships conventionally put on the products of the present invention when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.

First embodiment

Referring to fig. 1 to fig. 3 in combination, the present embodiment provides an rf power amplifier 100, which not only can broaden the video bandwidth of the power amplifier, but also can satisfy the structural size of the dual-channel packaged power amplifier tube 110, and reduce the occupied area on the circuit board 130.

The video power amplifier comprises a two-way packaging power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180 and an output bias circuit 190, wherein the two-way packaging power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180 and the output bias circuit 190 are all arranged on the circuit board 130, the input matching circuit 150 is connected with the input end of the two-way packaging power amplifier tube 110, the output matching circuit 180 is connected with the output end of the two-way packaging power amplifier tube 110, and the input bias circuit 170 is connected with the input matching circuit 150.

In this embodiment, the two-way packaged power amplifier tube 110 includes a die and a case, the die is packaged in the case, and two amplification channels are provided in one two-way packaged power amplifier tube 110. And one side of the tube shell is provided with two input pins 111 and the other side of the tube shell is provided with two output pins 113. The distance between the two input pins 111 and the distance between the two output pins 113 are relatively small and fixed, and are usually less than 6mm, but of course, all the two-way packaged power amplifier tubes 110 are not at this distance, and only the size is described here, so that there is a certain limitation effect on the configuration of the bias network.

In this embodiment, the input matching circuit 150 and the output matching circuit 180 are respectively disposed on two sides of the dual-channel packaged power amplifier tube 110, and are both implemented on the circuit board 130 and matched by a pure microstrip, where, of course, the input matching circuit 150 and the output matching circuit 180 may also have microstrip plus capacitor or microstrip plus inductor matching, and are not limited herein.

The input matching circuit 150 includes a first input matching circuit 151 and a second input matching circuit 153, and the first input matching circuit 151 and the second input matching circuit 153 are both connected to the input end of the two-way packaged power amplifier tube 110. The first input matching circuit 151 forms a first input matching section on the circuit board 130, the second input matching circuit 153 forms a second input matching section on the circuit board 130, and the first input matching section and the second input matching section are connected to the input end of the two-way packaged power amplifier tube 110.

Specifically, the first input matching circuit 151 and the second input matching circuit 153 are respectively connected to the two input pins 111, that is, the first input matching circuit 151 and the second input matching circuit 153 are respectively connected to the input terminals of the two amplification channels.

The output matching circuit 180 includes a first output matching circuit 181 and a second output matching circuit 183, and both the first output matching circuit 181 and the second output matching circuit 183 are connected to the output end of the two-way packaged power amplifier tube 110. And the first output matching circuit 181 forms a first output matching section on the circuit board 130, the second output matching circuit 183 forms a second output matching section on the circuit board 130, and the first output matching section and the second output matching section are connected to the output end of the two-way packaged power amplifier tube 110.

Specifically, the first output matching circuit 181 and the second output matching circuit 183 are respectively connected to the two output pins 113, that is, the first output matching circuit 181 and the second output matching circuit 183 are respectively connected to the output ends of the two amplification channels.

The output bias circuit 190 includes a first output bias circuit 191 and a second output bias circuit 193 which are separately arranged up and down, the first output bias circuit 191 and the second output bias circuit 193 are both connected with the output matching circuit 180, specifically, the first output bias circuit 191 is connected with the first output matching circuit 181, and the second output bias circuit 193 is connected with the second output matching circuit 183. The first output bias circuit 191 is a dual bias circuit, and the second output bias circuit 193 is a single bias circuit, so that the video bandwidth of the rf power amplifier 100 can be effectively increased without increasing the size of the dual-channel packaged power amplifier tube 110 and the occupied area on the circuit board 130. Specifically, on the circuit board 130, an output terminal of the single bias circuit and one output terminal of the double bias circuit are respectively located at the upper and lower sides of the pin of the dual-path packaged power amplifier tube 110, and the other output terminal of the double bias circuit is located between the two output terminals, preferably, within the tube body of the dual-path packaged power amplifier tube 110.

The video bandwidth of the power amplifier can directly reflect the capability of the power amplifier to process broadband signals, and is usually determined by the parallel resonance frequency fr of the output capacitor of the power amplifier and the equivalent inductance of the bias line, and the higher the resonance frequency is, the wider the video bandwidth is. The correlation formula is as follows:

it can be seen that, with such double bias, the equivalent inductance of the single bias is reduced by half, and the resonant frequency is increased by 1.414 times.

The first output bias circuit 191 includes two first output bias lines and two first capacitors, one end of each of the two first output bias lines is connected to the output matching circuit 180, one end of each of the two first output bias lines is connected to the first output matching circuit 181, and the other end of each of the two first output bias lines is grounded through the two first capacitors.

In this embodiment, the first capacitor is formed by connecting two sub-capacitors in parallel to satisfy the filtering function of the radio frequency and the power supply, and the capacitance magnitude thereof needs to be determined according to a specific frequency band.

The second output bias circuit 193 includes a second output bias line and a second capacitor, one end of the second output bias line is connected to the output matching circuit 180, specifically, one end of the second output bias line is connected to the first output matching circuit 181, and the other end of the second output bias line is grounded through the second capacitor. The second capacitor is also formed by connecting two sub-capacitors in parallel, which is not described herein.

In this embodiment, on the circuit board 130, one of the first output bias lines and the second output bias line are respectively located at the upper side and the lower side of the output pin of the dual-channel packaged power amplifier tube 110 and are respectively connected to the two output pins 113, the other first output bias line is disposed at the right side of the pin of the dual-channel packaged power amplifier tube 110 and is located between the first output bias line and the second output bias line disposed at the upper side, preferably, the first output bias line disposed at the right side is located within the tube body range of the dual-channel packaged power amplifier tube 110, and both the two first output bias lines are connected to the same output pin 113.

The input bias circuit 170 includes a first input bias circuit 171 and a second input bias circuit 171 which are separated up and down, and both the first input bias circuit 171 and the second input bias circuit 171 are connected to the input matching circuit 150. Specifically, the first input bias circuit 171 is connected to the first input matching circuit 151, and the second input bias circuit 171 is connected to the second input matching circuit 153. The influence of the input terminal on the dual-path packaged power amplifier tube 110 is smaller than that of the output terminal, in this embodiment, the first input bias circuit 171 is a dual bias circuit, and the second input bias circuit 171 is a single bias circuit.

The first input bias circuit 171 includes two first input bias lines, two first resistors, and two third capacitors, one end of each of the two first input bias lines is connected to the input matching circuit 150 through the two first resistors, specifically, one end of each of the two first input bias lines is connected to the first input matching circuit 151, and the other end of each of the two first input bias lines is grounded through the two third capacitors. The third capacitor is also formed by connecting two sub-capacitors in parallel, which is not described herein.

The second input bias circuit 171 includes a second input bias line, a second resistor, and a fourth capacitor, one end of the second input bias line is connected to the input matching circuit 150 through the second resistor, specifically, one end of the second input bias line is connected to the second input matching circuit 153, and the other end of the second input bias line is grounded through the fourth capacitor. The fourth capacitor is also formed by connecting two sub-capacitors in parallel, which is not described herein.

In this embodiment, on the circuit board 130, one of the first input bias lines and the second input bias line are respectively located at the upper side and the lower side of the input pin of the dual-channel packaged power amplifier tube 110 and are respectively connected to the two input pins 111, and the other first input bias line is located at the left side of the input pin of the dual-channel packaged power amplifier tube 110 and is located between the first input bias line and the second input bias line that are located at the upper side, preferably, the first input bias line that is located at the left side is located within the tube body range of the dual-channel packaged power amplifier tube 110, and both the two first input bias lines are connected to the same input pin 111.

In the present embodiment, the line widths of the first output bias circuit 191 and the second output bias circuit 193 are larger than the line widths of the first input bias circuit 171 and the second input bias circuit 171 because the first output bias circuit 191 and the second output bias circuit 193 have a larger influence on the line shape of the radio frequency power amplifier 100 and need to withstand a relatively large current with respect to the first input bias circuit 171 and the second input bias circuit 171.

In summary, in the radio frequency power amplifier 100 provided by the present invention, the video bandwidth performance of the radio frequency power amplifier 100 is mainly determined by the output network, so that the first output bias circuit 191 adopts a dual bias circuit, the second output bias circuit 193 adopts a single bias circuit, usually the first output bias circuit 191 is connected to the path of the dual-path packaged power amplifier tube 110 that has a large influence on the linearity, and since the dual bias circuit is adopted, the equivalent inductance of the bias network thereof is reduced by half, the video bandwidth of the dual-path packaged power amplifier tube 110 is increased by 1.414 times, and the second output bias circuit 193 adopts the single bias circuit, which can satisfy the size limitation between the two output pins 113 of the dual-path packaged power amplifier tube 110, and simultaneously avoid enlarging the occupied area thereof. The first input bias circuit 171 is a double-bias circuit, generally, the first input bias circuit 171 is connected to one of the two-way packaged power amplifier tube 110, which has a large linear influence, so that the video bandwidth of the two-way packaged power amplifier tube is further improved, and the second input bias circuit 171 is a single-bias circuit, so that the size limitation between the two input pins 111 of the two-way packaged power amplifier tube 110 can be met, and meanwhile, the occupied area is prevented from being enlarged. Compared with the prior art, the radio frequency power amplifier 100 provided by the invention can improve the video bandwidth, meet the size requirement of a double-path packaged power tube, and reduce the occupied area on the circuit board 130.

Second embodiment

The basic structure and principle of the rf power amplifier 100 and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment for the sake of brevity.

Referring to fig. 4, the radio frequency power amplifier 100 provided in this embodiment includes a two-way packaged power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180, and an output bias circuit 190, where the two-way packaged power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180, and the output bias circuit 190 are all disposed on the circuit board 130, the input matching circuit 150 is connected to an input end of the two-way packaged power amplifier tube 110, the output matching circuit 180 is connected to an output end of the two-way packaged power amplifier tube 110, and the input bias circuit 170 is connected to the input matching circuit 150.

The input bias circuit 170 includes a first input bias circuit 171 and a second input bias circuit 171 which are separated up and down, and both the first input bias circuit 171 and the second input bias circuit 171 are connected to the input matching circuit 150. The influence of the input terminal on the dual-channel packaged power amplifier tube 110 is smaller than that of the output terminal, and in this embodiment, the first input bias circuit 171 and the second input bias circuit 171 are both single bias circuits.

Each of the first input bias circuit 171 and the second input bias circuit 171 has only one bias line, and one end of the bias line is connected to the input matching circuit 150 through a resistor, and the other end is grounded through a capacitor.

Third embodiment

The basic structure and principle of the rf power amplifier 100 and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment for the sake of brevity.

The rf power provided by this embodiment includes a power dividing module, a two-way packaged power amplifier tube 110, a circuit board 130, an input matching circuit 150, an input bias circuit 170, an output matching circuit 180, and an output bias circuit 190, where the two-way packaged power amplifier tube 110, the input matching circuit 150, the input bias circuit 170, the output matching circuit 180, and the output bias circuit 190 are all disposed on the circuit board 130, the input matching circuit 150 is connected to an input end of the two-way packaged power amplifier tube 110, the power dividing module is connected to the input matching circuit 150, the output matching circuit 180 is connected to an output end of the two-way packaged power amplifier tube 110, and the input bias circuit 170 is connected to the input matching circuit 150. The output bias circuit 190 includes a first output bias circuit 191 and a second output bias circuit 193, the first output bias circuit 191 and the second output bias circuit 193 are both connected to the output matching circuit 180, and the first output bias circuit 191 is a double bias circuit and the second output bias circuit 193 is a single bias circuit.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.