阅读说明：本技术 一种高导热金属基双面铜基覆铜板 (High-thermal-conductivity metal-based double-sided copper-based copper-clad plate ) 是由 周文英 程展 李长岭 张剑 丁金龙 施华 吴伟 夏海燕 别红玲 于 2019-10-31 设计创作，主要内容包括：本发明涉及电路板技术领域,且公开了一种高导热金属基双面铜基覆铜板,包括覆铜板,所述覆铜板的上下两侧均固定连接有铜基板,上下两侧所述铜基板相背一侧的侧壁上均固定连接有绝缘板。该高导热金属基双面铜基覆铜板,通过副散热孔能够起到基础的散热效果,且在使用该高导热金属基双面铜基覆铜板产生热量时通过散热套筒内部的空气被加热后流速加快,此时热空气推动散热杆使得散热杆在连接弹簧和旋转孔的共同作用下做旋转上下往复运动,从而使得散热效果更加的同时使得散热套筒不会因为灰尘堵塞,且通过覆铜板、铜基板、绝缘板和硅胶导热板使得该装置导热效果更加好,相对于传统的装置而言导热和散热效果更加的优良。(The invention relates to the technical field of circuit boards and discloses a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate which comprises a copper-clad plate, wherein copper substrates are fixedly connected to the upper side and the lower side of the copper-clad plate, and insulating plates are fixedly connected to the side walls of the upper side and the lower side, opposite to each other, of the copper substrates. This high heat conduction metal-based double-sided copper base copper-clad plate, can play basic radiating effect through vice louvre, and the air through heat dissipation sleeve inside when using this high heat conduction metal-based double-sided copper base copper-clad plate to produce heat is heated the back velocity of flow and is accelerated, hot-air promotes the radiating rod this moment and makes the radiating rod do rotatory up and down reciprocating motion under the combined action of coupling spring and rotation hole, thereby make the radiating sleeve can not block up because of the dust when the radiating effect is more, and through the copper-clad plate, the copper substrate, insulation board and silica gel heat-conducting plate make the device heat conduction effect better, heat conduction and radiating effect are better for traditional device.)

1. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate comprises a copper-clad plate (1) and is characterized in that: copper base plates (2) are fixedly connected to the upper side and the lower side of the copper-clad plate (1), insulating plates (3) are fixedly connected to the side wall of one side of the copper base plate (2) opposite to the back, silica gel heat-conducting plates (4) are fixedly connected to the side wall of one side of the insulating plates (3) opposite to the back, auxiliary heat dissipation holes (5) are formed in the tops of the silica gel heat-conducting plates (4), hollow cavities (7) are formed in the copper-clad plate (1), heat dissipation sleeves (6) penetrating through the upper side and the lower side of the silica gel heat-conducting plates (4) and penetrating through the hollow cavities (7) are inserted into the tops of the silica gel heat-conducting plates (4), connecting springs (9) are fixedly connected to the upper side wall and the lower side of the cavity (7), rotating plates (11) are fixedly connected to the side wall of one side of the connecting springs (9) opposite to the upper side and the lower, the inner wall of the heat dissipation sleeve (6) is provided with a rotating hole (8), and the left side wall and the right side wall inside the rotating plate (10) are fixedly connected with a heat dissipation rod (12) which penetrates through the rotating hole (8) and extends to the inside of the heat dissipation sleeve (6).

2. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the number of the auxiliary heat dissipation holes (5) is two, and the two auxiliary heat dissipation holes (5) are symmetrically distributed.

3. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the heat dissipation sleeve (6) is an insulating sleeve, the insulating sleeve (6) is located between the two auxiliary heat dissipation holes (5), and the diameter of the heat dissipation sleeve (6) is larger than that of the auxiliary heat dissipation holes (5).

4. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the connecting springs (9) are insulating springs, the number of the connecting springs (9) is two, and the two connecting springs (9) are symmetrically distributed.

5. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the rotating hole (8) is a spiral hole, and the width of the spiral hole (8) is equal to the height of the heat dissipation rod (12).

6. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the rotating plate (11) and the rotating plate (10) are both annular plates, and the diameters of the rotating plate (11) and the rotating plate (10) are equal.

Technical Field

The invention relates to the technical field of circuit boards, in particular to a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate.

Background

Copper Clad Laminate (CCL) is a board-shaped material formed by soaking a reinforcing material in resin, coating Copper foil on one or two surfaces of the reinforcing material and performing hot pressing, is called a Copper Clad Laminate, is used as a basic material of a PCB (printed circuit board), is often called a base material, is called a CORE board (CORE) when being used for producing a multilayer board, is a product formed by soaking wood pulp paper or glass fiber cloth and the like in the reinforcing material, coating the Copper foil on one or two surfaces of the reinforcing material and performing hot pressing, is shown in figure 1, is a basic material of the electronic industry, is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), and is widely used for electronic products such as televisions, radios, computers, mobile communication and the like.

The copper-clad plates on the market are various in types, but the heat dissipation effect of the copper-clad plates on the market is not good, and although the heat dissipation holes are formed, the heat dissipation holes are easy to block, so that the heat dissipation effect is not good, and therefore the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is provided to solve the problems.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides the high-thermal-conductivity metal-based double-sided copper-based copper-clad plate which has the advantages of good heat dissipation effect and the like and solves the problem of good heat dissipation effect.

In order to achieve the purpose of good heat dissipation effect, the invention provides the following technical scheme: a high-heat-conductivity metal-based double-sided copper-based copper-clad plate comprises a copper-clad plate, wherein copper base plates are fixedly connected to the upper side and the lower side of the copper-clad plate, insulating plates are fixedly connected to the side walls of the back sides of the copper base plates, silica gel heat-conducting plates are fixedly connected to the side walls of the back sides of the insulating plates, auxiliary heat dissipation holes are formed in the tops of the silica gel heat-conducting plates, hollow cavities are formed in the copper-clad plate, heat dissipation sleeves penetrating through the upper side and the lower side of the silica gel heat-conducting plates and penetrating through the hollow cavities are inserted into the tops of the silica gel heat-conducting plates, connecting springs are fixedly connected to the upper side wall and the lower side wall in each hollow cavity, rotating plates are fixedly connected to the side walls of the opposite sides of the connecting springs on the, and the left side wall and the right side wall in the rotating plate are fixedly connected with heat dissipation rods which penetrate through the rotating holes and extend to the inside of the heat dissipation sleeve.

Preferably, the number of the auxiliary heat dissipation holes is two, and the two auxiliary heat dissipation holes are symmetrically distributed.

Preferably, the heat dissipation sleeve is an insulating sleeve, the insulating sleeve is located between the two auxiliary heat dissipation holes, and the diameter of the heat dissipation sleeve is larger than that of the auxiliary heat dissipation holes.

Preferably, the connecting springs are two insulating springs, and the two connecting springs are symmetrically distributed.

Preferably, the rotating hole is a spiral hole, and the width of the spiral hole is equal to the height of the heat dissipation rod.

Preferably, the rotating plate and the rotating plate are both annular plates, and the diameters of the rotating plate and the rotating plate are equal.

Compared with the prior art, the invention provides a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate, which has the following beneficial effects:

this high heat conduction metal-based double-sided copper base copper-clad plate, can play basic radiating effect through vice louvre, and the air through heat dissipation sleeve inside when using this high heat conduction metal-based double-sided copper base copper-clad plate to produce heat is heated the back velocity of flow and is accelerated, hot-air promotes the radiating rod this moment and makes the radiating rod do rotatory up and down reciprocating motion under the combined action of coupling spring and rotation hole, thereby make the radiating sleeve can not block up because of the dust when the radiating effect is more, and through the copper-clad plate, the copper substrate, insulation board and silica gel heat-conducting plate make the device heat conduction effect better, heat conduction and radiating effect are better for traditional device.

Drawings

FIG. 1 is a schematic view of the structure of the present invention.

In the figure: the heat dissipation device comprises a copper-clad plate 1, a copper substrate 2, an insulating plate 3, a silica gel heat conducting plate 4, 5 pairs of heat dissipation holes, a heat dissipation sleeve 6, a hollow cavity 7, a rotary hole 8, a connecting spring 9, a rotating plate 10, a rotating plate 11 and a heat dissipation rod 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a high thermal conductivity metal-based double-sided copper-based copper-clad plate comprises a copper-clad plate 1, copper base plates 2 are fixedly connected to the upper and lower sides of the copper-clad plate 1, insulating plates 3 are fixedly connected to the side walls of the opposite sides of the copper base plates 2, silica gel heat-conducting plates 4 are fixedly connected to the side walls of the opposite sides of the insulating plates 3, auxiliary heat-dissipating holes 5 are formed in the top of the silica gel heat-conducting plate 4, two auxiliary heat-dissipating holes 5 are symmetrically distributed, a hollow cavity 7 is formed in the copper-clad plate 1, a heat-dissipating sleeve 6 penetrating through the upper and lower silica gel heat-conducting plates 4 and the hollow cavity 7 is inserted into the top of the upper silica gel heat-conducting plate 4, the heat-dissipating sleeve 6 is an insulating sleeve, the insulating sleeve 6 is located between the two auxiliary heat-dissipating holes 5, the diameter of the heat-, the connecting springs 9 are insulating springs, the number of the connecting springs 9 is two, the two connecting springs 9 are symmetrically distributed, the side walls of the opposite sides of the upper and lower connecting springs 9 are fixedly connected with rotating plates 11, the rotating plates 11 and the rotating plates 10 are both annular plates, the diameters of the rotating plates 11 are equal to that of the rotating plates 10, the side walls of the opposite sides of the upper and lower rotating plates 11 are movably connected with the rotating plates 10, the inner wall of the heat dissipation sleeve 6 is provided with a rotating hole 8, the rotating hole 8 is a spiral hole, the width of the spiral hole 8 is equal to the height of a heat dissipation rod 12, the left and right side walls inside the rotating plates 10 are fixedly connected with heat dissipation rods 12 which penetrate through the rotating hole 8 and extend to the inside of the heat dissipation sleeve 6, the heat dissipation effect of the foundation can be achieved through the auxiliary heat dissipation holes 5, and the flow speed is accelerated after air inside the heat dissipation sleeve 6 is heated when, at this moment, the hot air pushes the heat dissipation rod 12 to enable the heat dissipation rod 12 to do rotary up-and-down reciprocating motion under the combined action of the connecting spring 9 and the rotary hole 8, so that the heat dissipation effect is better, the heat dissipation sleeve 6 cannot be blocked by dust, the heat conduction effect of the device is better through the copper-clad plate 1, the copper substrate 2, the insulation plate 3 and the silica gel heat conduction plate 4, and the heat conduction and the heat dissipation effect are better compared with the traditional device.

To sum up, this high heat conduction metal-based double-sided copper-based copper-clad plate, can play basic radiating effect through vice louvre 5, and the air through the inside of heat dissipation sleeve 6 is heated the back velocity of flow and is accelerated when using this high heat conduction metal-based double-sided copper-based copper-clad plate to produce heat, hot-air promotion radiating rod 12 makes radiating rod 12 do rotatory reciprocating motion from top to bottom under the combined action of coupling spring 9 and rotatory hole 8 this moment, thereby make heat dissipation sleeve 6 can not block up because of the dust when making the radiating effect better, and through copper-clad plate 1, copper base plate 2, insulation board 3 and silica gel heat-conducting plate 4 make the device heat conduction effect better, heat conduction and radiating effect are better for traditional device, the good problem that the radiating effect is good has been solved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.