阅读说明：本技术 一种替代高压电容的电磁兼容处理方法及pcb敷铜装置 (Electromagnetic compatibility processing method for replacing high-voltage capacitor and PCB copper coating device ) 是由 廖文杰 王嘉 唐浩然 于 2019-11-04 设计创作，主要内容包括：本发明公开了一种替代高压电容的电磁兼容处理方法及PCB敷铜装置,属于PCB设计领域,所述方法包括：在PCB板正面与反面进行敷铜,基于正反两面的铜箔产生分布电容,对高频电磁干扰信号进行泄放；通过本方法制成的产品具有较高的耐压等级,且产品具有较高的可靠性,能够良好的对高频电磁干扰信号进行泄放。(The invention discloses an electromagnetic compatibility processing method for replacing a high-voltage capacitor and a PCB copper coating device, belonging to the field of PCB design, wherein the method comprises the following steps: copper is coated on the front surface and the back surface of the PCB, and distributed capacitance is generated based on the copper foils on the front surface and the back surface to discharge high-frequency electromagnetic interference signals; the product manufactured by the method has higher voltage-resistant grade and higher reliability, and can well discharge high-frequency electromagnetic interference signals.)

1. An electromagnetic compatibility processing method for replacing a high-voltage capacitor, the method comprising: and copper is coated on the front surface and the back surface of the PCB, and distributed capacitance is generated based on the copper foils on the front surface and the back surface to discharge high-frequency electromagnetic interference signals.

2. The method for processing electromagnetic compatibility instead of high-voltage capacitor as claimed in claim 1, wherein the step of applying copper to the front surface and the back surface of the PCB comprises:

step 1: obtaining PCB design information from a production processing system;

step 2: generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information;

and step 3: covering a layer of copper film on the front surface and the back surface of the PCB;

and 4, step 4: attaching an anti-corrosion protective film to the copper film corresponding to the non-corrosion area of the PCB on the PCB obtained in the step (3);

and 5: and (4) corroding the copper film in the PCB corrosion area on the PCB obtained in the step (4) by adopting a corrosion method to obtain the PCB coated with copper after corrosion.

3. The method for processing electromagnetic compatibility instead of high-voltage capacitor as claimed in claim 2, wherein the generating of the PCB non-corrosion area and the PCB corrosion area based on the PCB design information specifically includes:

generating circuit and component distribution position information on the PCB based on PCB design information;

generating position information of a non-corrosion area of the PCB based on the distribution position information of circuits and components on the PCB;

and generating PCB corrosion area position information based on the PCB non-corrosion area position information.

4. The method for processing high-voltage capacitor-alternative electromagnetic compatibility according to claim 3, wherein an anti-corrosion protective film is attached to the copper film corresponding to the non-corrosion area of the PCB, and the method specifically comprises the following steps:

generating the shape of the PCB non-corrosion area and the coordinate position information of the PCB non-corrosion area boundary on the PCB;

cutting an anti-corrosion protective film matched with the shape of the non-corrosion area of the PCB;

moving the boundary of the anti-corrosion protective film to a corresponding coordinate position;

and attaching and fixing the anti-corrosion protective film on the copper film.

5. The method for processing electromagnetic compatibility instead of high voltage capacitor according to claim 1, wherein said method further comprises step 6: and removing the anti-corrosion protective film.

6. The method as claimed in claim 1, wherein the copper film has a plurality of grooves formed therein.

7. The method of claim 1, wherein the copper film is in a mesh shape.

8. A PCB copper-clad device based on the method for replacing the high-voltage capacitor electromagnetic compatibility processing of any one of claims 2-7, characterized in that the device comprises:

the communication module is used for establishing communication connection with the production processing system to obtain PCB design information;

the fixing clamp is used for fixing the PCB;

the scanning camera is used for scanning the PCB to obtain real-time position information of the PCB;

the processor is used for generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information; generating a copper-clad area and a copper-clad path based on the PCB non-corrosion area and the real-time position of the PCB;

the controller is used for controlling the copper plating gun head to carry out copper plating on the front surface and the back surface of the PCB based on the copper plating area and the path;

the cutter is used for cutting the anti-corrosion protective film with the corresponding shape and size;

the laminating machine is used for laminating an anti-corrosion protective film on the copper film corresponding to the non-corrosion area of the PCB;

and 4, corroding the copper film in the PCB corrosion area on the PCB obtained in the step 4 to obtain the PCB coated with copper after corrosion.

9. The PCB copper cladding device of claim 8, wherein the device further comprises a cleaning machine for cleaning the PCB taken out of the corrosion tank.

10. The PCB copper cladding device of claim 9, characterized in that the device further comprises a dryer for drying the cleaned PCB.

Technical Field

The invention relates to the field of PCB design, in particular to an electromagnetic compatibility processing method for replacing a high-voltage capacitor and a PCB copper-clad device.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.

In a switching power supply or a sensor with poor isolation and withstand voltage level, a high-voltage capacitor is often used to bridge between the input and output isolation, so as to discharge electromagnetic interference signals, as shown in fig. 1.

However, the high-voltage capacitor has disadvantages that the isolation voltage-withstanding grade is not high, and the high-voltage capacitor has a discharge risk under the high-voltage condition after being damaged, so that the reliability of the product is affected.

Disclosure of Invention

The invention provides an electromagnetic compatibility processing method for replacing a high-voltage capacitor and a PCB copper-clad device, and aims to solve the technical problems that in the existing method, the isolation and voltage-resistant grade of the high-voltage capacitor is not high, the discharge risk exists, and the reliability of a product is influenced.

In order to achieve the above object, the present invention provides an electromagnetic compatibility processing method for replacing a high-voltage capacitor, the method comprising: and copper is coated on the front surface and the back surface of the PCB, and distributed capacitance is generated based on the copper foils on the front surface and the back surface to discharge high-frequency electromagnetic interference signals.

The method has some innovative measures in the aspect of inhibiting electromagnetic interference, and adopts PCB design to create distributed capacitance and discharge interference signals.

The method adopts the PCB to be coated with copper, and generates distributed capacitance by the copper foils on the front and back surfaces to discharge the high-frequency electromagnetic interference signals. The thickness of the PCB medium between the copper foils on the front side and the back side exceeds 1mm, and theoretically, the PCB medium can bear the isolation and withstand voltage of more than 40 KV.

Preferably, the copper plating is performed on the front surface and the back surface of the PCB, and specifically includes:

step 1: obtaining PCB design information from a production processing system;

step 2: generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information;

and step 3: covering a layer of copper film on the front surface and the back surface of the PCB;

and 4, step 4: attaching an anti-corrosion protective film to the copper film corresponding to the non-corrosion area of the PCB on the PCB obtained in the step (3);

and 5: and (4) corroding the copper film in the PCB corrosion area on the PCB obtained in the step (4) by adopting a corrosion method to obtain the PCB coated with copper after corrosion.

Preferably, the generating the PCB non-corrosion region and the PCB corrosion region based on the PCB design information specifically includes:

generating circuit and component distribution position information on the PCB based on PCB design information;

generating position information of a non-corrosion area of the PCB based on the distribution position information of circuits and components on the PCB;

and generating PCB corrosion area position information based on the PCB non-corrosion area position information.

Preferably, the attaching of the anti-corrosion protective film to the copper film corresponding to the non-corrosion area of the PCB specifically comprises:

generating the shape of the PCB non-corrosion area and the coordinate position information of the PCB non-corrosion area boundary on the PCB;

cutting an anti-corrosion protective film matched with the shape of the non-corrosion area of the PCB;

moving the boundary of the anti-corrosion protective film to a corresponding coordinate position;

and attaching and fixing the anti-corrosion protective film on the copper film.

Preferably, the method further comprises step 6: and removing the anti-corrosion protective film.

Preferably, the copper film is provided with a plurality of grooves.

Preferably, the copper film is in a mesh shape.

The invention also provides a PCB copper-clad device based on the electromagnetic compatibility processing method for replacing the high-voltage capacitor, which comprises the following steps:

the communication module is used for establishing communication connection with the production processing system to obtain PCB design information;

the fixing clamp is used for fixing the PCB;

the scanning camera is used for scanning the PCB to obtain real-time position information of the PCB;

the processor is used for generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information; generating a copper-clad area and a copper-clad path based on the PCB non-corrosion area and the real-time position of the PCB;

the controller is used for controlling the copper plating gun head to carry out copper plating on the front surface and the back surface of the PCB based on the copper plating area and the path;

the cutter is used for cutting the anti-corrosion protective film with the corresponding shape and size;

the laminating machine is used for laminating an anti-corrosion protective film on the copper film corresponding to the non-corrosion area of the PCB;

and 4, corroding the copper film in the PCB corrosion area on the PCB obtained in the step 4 to obtain the PCB coated with copper after corrosion.

The device also comprises a cleaning machine used for cleaning the PCB taken out of the corrosion tank.

The device also comprises a dryer used for drying the cleaned PCB.

One or more technical schemes provided by the invention at least have the following technical effects or advantages:

the product manufactured by the method has higher voltage-resistant grade and higher reliability, and can well discharge high-frequency electromagnetic interference signals.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention;

FIG. 1 is a schematic diagram of a process practiced in the present invention;

FIG. 2 is a schematic diagram of the process of the present invention;

the PCB comprises a PCB 1 and a copper film 2.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflicting with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described and thus the scope of the present invention is not limited by the specific embodiments disclosed below.

Referring to fig. 2, an embodiment of the present invention provides an electromagnetic compatibility processing method for replacing a high-voltage capacitor, where the method includes: and copper is coated on the front surface and the back surface of the PCB, and distributed capacitance is generated based on the copper foils on the front surface and the back surface to discharge high-frequency electromagnetic interference signals.

The method has some innovative measures in the aspect of inhibiting electromagnetic interference, and adopts PCB design to create distributed capacitance and discharge interference signals.

The method adopts the PCB to be coated with copper, and generates distributed capacitance by the copper foils on the front and back surfaces to discharge the high-frequency electromagnetic interference signals. The thickness of the PCB medium between the copper foils on the front side and the back side exceeds 1mm, and theoretically, the PCB medium can bear the isolation and withstand voltage of more than 40 KV.

In the embodiment of the present invention, the copper plating on the front surface and the back surface of the PCB specifically includes:

step 1: obtaining PCB design information from a production processing system;

step 2: generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information;

and step 3: covering a layer of copper film on the front surface and the back surface of the PCB;

and 4, step 4: attaching an anti-corrosion protective film to the copper film corresponding to the non-corrosion area of the PCB on the PCB obtained in the step (3);

and 5: and (4) corroding the copper film in the PCB corrosion area on the PCB obtained in the step (4) by adopting a corrosion method to obtain the PCB coated with copper after corrosion.

Copper plating on the front side and the back side of the PCB can be efficiently and quickly completed through the steps, the copper plating effect is good, and other components cannot be damaged.

In an embodiment of the present invention, the generating a PCB non-corrosion region and a PCB corrosion region based on PCB design information specifically includes:

generating circuit and component distribution position information on the PCB based on PCB design information;

generating position information of a non-corrosion area of the PCB based on the distribution position information of circuits and components on the PCB;

and generating PCB corrosion area position information based on the PCB non-corrosion area position information.

In the embodiment of the present invention, attaching an anti-corrosion protection film to a copper film corresponding to a non-corrosion area of a PCB specifically includes:

generating the shape of the PCB non-corrosion area and the coordinate position information of the PCB non-corrosion area boundary on the PCB;

cutting an anti-corrosion protective film matched with the shape of the non-corrosion area of the PCB;

moving the boundary of the anti-corrosion protective film to a corresponding coordinate position;

and attaching and fixing the anti-corrosion protective film on the copper film.

Wherein, in the embodiment of the present invention, the method further includes step 6: and removing the anti-corrosion protective film.

In the embodiment of the invention, a plurality of grooves are formed on the copper film. The large-area copper coating has double functions of current increasing and shielding, the simple grid copper coating mainly has the shielding function, the current increasing function is reduced, the purpose of grid coating is not necessarily for beauty, and the bubbling of the copper foil caused by gas generated in the process of copper foil adhesive welding can be prevented and relieved. Therefore, the copper foil is coated on a large area, and the grooves are also formed to relieve the blistering of the copper foil.

Preferably, the copper film is in a grid shape, and the grid shape can well dissipate heat and simultaneously relieve the bubbling of the copper foil.

In an embodiment of the present invention, the present invention further provides a PCB copper plating apparatus based on the electromagnetic compatibility processing method for replacing a high-voltage capacitor, the apparatus including:

the communication module is used for establishing communication connection with the production processing system to obtain PCB design information;

the fixing clamp is used for fixing the PCB;

the scanning camera is used for scanning the PCB to obtain real-time position information of the PCB;

the processor is used for generating a PCB non-corrosion area and a PCB corrosion area based on PCB design information; generating a copper-clad area and a copper-clad path based on the PCB non-corrosion area and the real-time position of the PCB;

the controller is used for controlling the copper plating gun head to carry out copper plating on the front surface and the back surface of the PCB based on the copper plating area and the path;

the cutter is used for cutting the anti-corrosion protective film with the corresponding shape and size;

the laminating machine is used for laminating an anti-corrosion protective film on the copper film corresponding to the non-corrosion area of the PCB;

and 4, corroding the copper film in the PCB corrosion area on the PCB obtained in the step 4 to obtain the PCB coated with copper after corrosion.

In the embodiment of the invention, the device further comprises a cleaning machine which is used for cleaning the PCB taken out of the corrosion tank, and the residual liquid can be cleaned by the cleaning machine due to the liquid remained on the PCB taken out of the corrosion tank.

In the embodiment of the invention, the device further comprises a dryer used for drying the cleaned PCB, and the dryer can be used for rapidly drying the PCB, so that the circuit safety of the PCB is guaranteed.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.