阅读说明：本技术 双面研磨装置和方法 (Double-side grinding device and method ) 是由 赵晟佑 于 2019-10-29 设计创作，主要内容包括：本发明公开了一种双面研磨装置和方法,所述装置所述双面研磨装置包括上定盘、下定盘、承载盘和驱动机构,其中,所述上定盘与所述下定盘相对设置,所述承载盘设置在所述上定盘与所述下定盘之间且包括多个工件承载盘孔；所述驱动机构能够驱动所述承载盘相对于所述上定盘和所述下定盘转动；所述下定盘的上表面开设有延伸至边缘的多个导液槽；并且所述双面研磨装置还包括网状结构,所述网状结构以可拆卸地方式设置所述导液槽中。该双面研磨装置通过在导液槽的底部设置网状结构,可以防止研磨废液聚集在所述导液槽的底部而难以清洗,从而防止双面研磨过程中晶圆表面的损伤。(The invention discloses a double-sided grinding device and a method, the double-sided grinding device comprises an upper fixed disc, a lower fixed disc, a bearing disc and a driving mechanism, wherein the upper fixed disc and the lower fixed disc are oppositely arranged, the bearing disc is arranged between the upper fixed disc and the lower fixed disc and comprises a plurality of workpiece bearing disc holes; the driving mechanism can drive the bearing disc to rotate relative to the upper fixed disc and the lower fixed disc; the upper surface of the lower fixed plate is provided with a plurality of liquid guide grooves extending to the edge; and the double-sided grinding device also comprises a net-shaped structure which is detachably arranged in the liquid guide groove. According to the double-side grinding device, the reticular structure is arranged at the bottom of the liquid guide groove, so that grinding waste liquid can be prevented from being gathered at the bottom of the liquid guide groove and being difficult to clean, and the damage to the surface of a wafer in the double-side grinding process can be prevented.)

1. A double-sided grinding device is characterized by comprising an upper fixed disc (1), a lower fixed disc (2), a bearing disc (3) and a driving mechanism, wherein,

the upper fixed disc (1) and the lower fixed disc (2) are arranged oppositely, and the bearing disc (3) is arranged between the upper fixed disc (1) and the lower fixed disc (2) and comprises a plurality of workpiece bearing disc holes (5); the driving mechanism can drive the bearing disc (3) to rotate relative to the upper fixed disc (1) and the lower fixed disc (2); the upper surface of the lower fixed plate (2) is provided with a plurality of liquid guide grooves (6) extending to the edge; and is

The double-sided grinding device also comprises a net-shaped structure (4), and the net-shaped structure (4) is detachably arranged in the liquid guide groove (6).

2. A double-sided grinding apparatus according to claim 1, characterized in that the net structure (4) comprises a fixed ring (41) and a net (42) disposed inside the fixed ring (41).

3. A double-sided lapping apparatus as claimed in claim 2, wherein the position of said fixing ring (41) and said lower surface plate (2) is fixed relatively when in a mounted state, and the wires of said net (42) are respectively accommodated in the corresponding liquid guide grooves (6).

4. A double-sided grinding apparatus according to claim 3, wherein the plurality of fluid channels (6) are distributed in a mesh structure on the lower surface plate (2), the mesh wires being distributed in a corresponding mesh structure inside the fixed ring (41).

5. A double-sided lapping apparatus as claimed in claim 3, wherein the cross-sectional width dimension of said mesh wire is slightly smaller than the width of said fluid-guiding groove (6).

6. A double-sided grinding apparatus according to claim 5, wherein the net (2) fills the bottom of the liquid guide groove (6) when in the mounted state to prevent grinding waste from accumulating at the bottom of the liquid guide groove (6).

7. A double-sided grinding apparatus according to claim 2, wherein the fixing ring (41) and the net (42) are both made of stainless steel material.

8. A double-sided grinding apparatus according to claim 1, wherein the lower fixed plate (2) is provided with a sun gear (7) at the center, the lower fixed plate (2) is provided with an annular inner gear (8) at the circumferential edge, and the carrier plate (3) is engaged between the sun gear (7) and the annular inner gear (8); the driving mechanism drives the lower fixed plate (2), the sun gear (7) and the annular internal gear (8) to rotate so as to drive the bearing plate (3) to rotate around the axis of the bearing plate and revolve around the center of the lower fixed plate (2).

9. A double-side polishing method for polishing a workpiece to be polished by using the double-side polishing apparatus according to any one of claims 1 to 8, the method comprising:

loading the workpiece to be ground into the bearing disc hole;

adjusting the relative positions of the upper fixed plate and the lower fixed plate to enable the upper surface and the lower surface of the workpiece to be ground to be in contact with the upper fixed plate and the lower fixed plate respectively;

the bearing disc is driven by the driving mechanism to rotate around the axis of the bearing disc and revolve around the center of the lower fixed disc, and the workpiece to be ground is ground under the action of grinding slurry.

10. The double-sided polishing method according to claim 9, further comprising, after polishing the workpiece to be polished by the polishing slurry: and taking the reticular structure from the lower fixed disc, and respectively cleaning the lower fixed disc and the reticular structure.

Technical Field

The invention relates to the technical field of wafer manufacturing and processing, in particular to a double-side grinding device and a double-side grinding method.

Background

The wafer double-side grinding process is used for removing wafer surface damage generated during wire cutting in the forming process so as to improve the surface roughness of the wafer. In the double-side polishing process, a wafer is brought into contact with the surface of an upper/lower fixed plate, undergoes a cycloid motion by the rotation of an internal gear (sun gear) and an external gear (ring gear), and undergoes a mechanical reaction and a chemical reaction on a polishing surface and a physical reaction accompanying the rotation and pressurization by supplying polishing slurry, thereby achieving the purpose of polishing the surface of the wafer.

In the double-side grinding process of the wafer, a plurality of criss-cross grooves are usually formed in the grinding fixed disc, and the grooves are communicated to form a channel for throwing waste liquid generated in the grinding process out of the edge of the fixed disc. However, by-products such as polishing residues, wafer residues, and slurry particles are generated during polishing due to mechanical reaction between the wafer and the slurry and friction between the surface plate and the wafer, and it is difficult to directly discharge the by-products from the edge of the surface plate. As the slurry is recirculated, these byproducts continue to circulate or accumulate in the grooves of the platen. The byproducts accumulated in the grooves of the fixed disc are difficult to clean, and are fixed like hard concrete, so that the surface of the wafer is seriously scratched, the defect rate of the wafer is increased, and the product quality is influenced.

Disclosure of Invention

In order to solve the above problems in the prior art, the present invention provides a double-side polishing apparatus and a double-side polishing method. The technical problem to be solved by the invention is realized by the following technical scheme:

one aspect of the present invention provides a double-side grinding apparatus comprising an upper surface plate, a lower surface plate, a carrier plate, and a driving mechanism, wherein,

the upper fixed disc and the lower fixed disc are oppositely arranged, and the bearing disc is arranged between the upper fixed disc and the lower fixed disc and comprises a plurality of workpiece bearing disc holes; the driving mechanism can drive the bearing disc to rotate relative to the upper fixed disc and the lower fixed disc; the upper surface of the lower fixed plate is provided with a plurality of liquid guide grooves extending to the edge; and is

The double-sided grinding device also comprises a net-shaped structure, and the net-shaped structure is detachably arranged in the liquid guide groove.

In one embodiment of the invention, the mesh structure comprises a fixed ring and a mesh disposed inside the fixed ring.

In one embodiment of the invention, when in the installation state, the fixing rings and the lower fixed plate are fixed in position relatively, and the net wires of the net are respectively accommodated in the corresponding liquid guide grooves.

In one embodiment of the present invention, the plurality of liquid guiding grooves are distributed on the lower fixed plate in a net structure, and the net wires are distributed inside the fixed ring in a corresponding net structure.

In one embodiment of the invention, the cross-sectional width dimension of the mesh wire is slightly smaller than the width of the liquid guide groove.

In one embodiment of the invention, the mesh fills the bottom of the fluid guide channel when in the installed state to prevent abrasive waste from accumulating at the bottom of the fluid guide channel.

In one embodiment of the invention, the retaining ring and the net are both made of stainless steel material.

In one embodiment of the invention, a sun gear is arranged at the center of the lower fixed disc, an annular internal gear is arranged at the circumferential edge of the lower fixed disc, and the bearing disc is meshed between the sun gear and the annular internal gear; the driving mechanism drives the lower fixed plate, the sun gear and the annular internal gear to rotate so as to drive the bearing disc to rotate around the axis of the bearing disc and revolve around the center of the lower fixed plate.

Another aspect of the present invention provides a double-side polishing method for polishing a workpiece to be polished by the double-side polishing apparatus according to any one of the above embodiments, the method comprising:

loading the workpiece to be ground into the bearing disc hole;

adjusting the relative positions of the upper fixed plate and the lower fixed plate to enable the upper surface and the lower surface of the workpiece to be ground to be in contact with the upper fixed plate and the lower fixed plate respectively;

the bearing disc is driven by the driving mechanism to rotate around the axis of the bearing disc and revolve around the center of the lower fixed disc, and the workpiece to be ground is ground under the action of grinding slurry.

In one embodiment of the present invention, after the workpiece to be ground is ground by the grinding slurry, the method further includes: and taking the reticular structure from the lower fixed disc, and respectively cleaning the lower fixed disc and the reticular structure.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the double-side grinding device, the reticular structure is arranged at the bottom of the liquid guide groove, so that grinding waste liquid can be prevented from being gathered at the bottom of the liquid guide groove and being difficult to clean, and the damage to the surface of a wafer in the double-side grinding process can be prevented.

2. The double-sided grinding device can prevent the pollution slurry and large particle size accumulated when the slurry drops to the lower fixed plate by arranging the net-shaped structure at the bottom of the liquid guide groove, so that the cleaning efficiency of the upper/lower fixed plates is the same, the service life of the grinding fixed plate can be maximized, the grinding rate of the upper/lower fixed plates can be maintained to be the same while the service life of the fixed plate is prolonged, and the defects of wafers can be improved.

The present invention will be described in further detail with reference to the accompanying drawings and examples.

Drawings

FIG. 1 is a schematic cross-sectional view of a double-side polishing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic top view of a double-side polishing apparatus provided in accordance with an embodiment of the present invention, with an upper surface plate removed;

FIG. 3 is a schematic structural diagram of a lower fixed plate according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a mesh structure provided by an embodiment of the present invention;

fig. 5 is a flowchart of a double-side polishing method according to an embodiment of the present invention.

Description of reference numerals:

1-fixing the disc; 2-lower fixed plate; 3-carrying tray; 4-a network structure; 41-a fixed ring; 42-a net; 5-workpiece bearing disc holes; 6-liquid guide groove; 7-a sun gear; 8-ring gear; 9-workpiece to be ground.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.