阅读说明：本技术 压印微纳米网点的压印辊和微纳米网点模具的折弯设备 (Embossing roller for embossing micro-nano dots and bending equipment for micro-nano dot mold ) 是由 冯杰 尤官京 罗世德 曹传春 于 2019-10-28 设计创作，主要内容包括：本发明公开了一种用于压印微纳米网点的压印辊,包括呈圆筒形的加热层,加热层的左端密封连接有左密封件,加热层的右端密封连接有右密封件,左密封件上设有左转轴,右密封件上设有与右转轴,左转轴的旋转轴和右转轴的旋转轴重合,右密封件上设有伸入加热层内的电磁加热棒,加热层的内侧壁、电磁加热棒的外侧壁、左密封件内侧壁、以及右密封件内侧壁之间设有空腔,空腔内填充满导热介质,加热层的表面设有微纳米网点模具,具有温度上升迅速,能节约等待的时间；本发明还公开了一种用于加工微纳米网点模具的折弯设备；能确保微纳米网点模具弯折的质量,避免只经过一次弯折容易出现起拱的现象,而且具有结构简单、制造成本低的优点。(The invention discloses an embossing roller for embossing micro-nano dots, which comprises a cylindrical heating layer, wherein the left end of the heating layer is hermetically connected with a left sealing piece, the right end of the heating layer is hermetically connected with a right sealing piece, a left rotating shaft is arranged on the left sealing piece, a right rotating shaft is arranged on the right sealing piece, a rotating shaft of the left rotating shaft is superposed with a rotating shaft of the right rotating shaft, an electromagnetic heating rod extending into the heating layer is arranged on the right sealing piece, cavities are formed among the inner side wall of the heating layer, the outer side wall of the electromagnetic heating rod, the inner side wall of the left sealing piece and the inner side wall of the right sealing piece, a heat-conducting medium is filled in the cavities, and a micro-nano; the invention also discloses bending equipment for processing the micro-nano mesh point die; the bending quality of the micro-nano mesh point die can be ensured, the phenomenon that the micro-nano mesh point die is easy to arch after being bent once is avoided, and the micro-nano mesh point die has the advantages of simple structure and low manufacturing cost.)

1. The utility model provides a roller platen for impressing micro-nano site, its characterized in that is including zone of heating (11) that is the cylinder, the left end sealing connection of zone of heating (11) has left sealing member (12) that adopts the thermal insulation material to make, the right-hand member sealing connection of zone of heating (11) has right sealing member (13) that adopts the thermal insulation material to make, left sealing member (12) on be equipped with left pivot (121), right sealing member (13) on be equipped with right pivot (131), the rotation axis of left pivot (121) and the rotation axis coincidence of right pivot (131), right sealing member (13) on be equipped with electromagnetic heating rod (14) that stretch into zone of heating (11), be equipped with cavity (101) between inside wall, electromagnetic heating rod (14) the lateral wall, left sealing member (12) inside wall and right sealing member (13) inside wall of zone of heating (11), the cavity (101) is filled with a heat-conducting medium (15), the surface of the heating layer (11) is provided with a micro-nano dot mold (16) for an imprinting process, and the micro-nano dot mold (16) is made of a metal sheet.

2. The embossing roller for embossing micro-nano dots according to claim 1, characterized in that the heat conducting medium (15) is one or more of silica particles, ceramic particles and microcrystalline glass particles.

3. The embossing roller for embossing the micro-nano dots according to claim 1 or 2, characterized in that the heating layer (11) is provided with positioning grooves (111) for positioning the micro-nano dot mold (16), the micro-nano dot mold (16) comprises an embossing part (161) positioned on the outer surface of the heating layer (11) and a bending part (162) embedded in the positioning grooves (111), an included angle between a center line of the positioning grooves (111) and a tangent line of the excircle of the heating layer (11) is α, wherein 44 ° α ° 46 °.

4. The embossing roller for embossing micro-nano dots according to claim 1, characterized in that the right sealing member (13) is sleeved with a heat insulation cover (17).

5. The embossing roller for embossing the micro-nano dots is characterized in that the upper side edge of the embossing part (161) is provided with a circular positioning hole A (21), at least one strip-shaped positioning hole A (22) and a plurality of locking holes A (23) for screws to pass through, the circular positioning hole A (21) is matched with a positioning pin on the heating layer (11), each strip-shaped positioning hole A (22) is matched with a positioning pin on the heating layer (11), and each locking hole A (23) is connected with a screw for connecting the micro-nano dot mold (16) on the heating layer (11).

6. The embossing roller for embossing the micro-nano dots according to claim 1, characterized in that the lower side edge of the embossing part (161) is provided with a circular positioning hole B (31), at least one strip-shaped positioning hole B (32), and a plurality of locking holes B (33) for screws to pass through, the circular positioning hole B (31) is matched with the positioning pins on the heating layer (11), each strip-shaped positioning hole B (32) is matched with the positioning pins on the heating layer (11), and each locking hole B (33) is connected with a screw for connecting the micro-nano dot mold (16) to the heating layer (11).

7. A bending device for processing the micro-nano mesh point mold of claim 3 is characterized by comprising: frame (41), frame (41) on be equipped with horizontal table (42), the one end of horizontal table (42) is equipped with seat (43) of buckling, seat (43) of buckling on be equipped with and accept face (431) and locating surface (432), the upper surface parallel and level of accepting face (431) and horizontal table (42), locating surface (432) accept face (431) slope setting relatively, frame (41) and be located and be equipped with support frame (44) directly over seat (43) of buckling, support frame (44) on be equipped with and be used for positioning mechanism (45) on seat (43) of buckling with micro-nano site mould (16), support frame (44) on be equipped with and be used for driving the first mechanism (46) of buckling that micro-nano site mould (16) of location on seat (43) of buckling buckle downwards, frame (41) on be equipped with and be used for driving micro-nano site mould (16) towards the second mechanism (432) of location face of buckling (432) of buckling (16), (buckle) 47).

8. The bending apparatus of micro-nano mesh point die according to claim 7, wherein an included angle between the positioning surface (432) and the bearing surface (431) is β, wherein the included angle is equal to or larger than 18 degrees and equal to or smaller than β degrees and equal to or smaller than 22 degrees.

9. The bending apparatus of a micro-nano dot mold according to claim 7, wherein the first bending mechanism (46) comprises a first bending block (461) slidably disposed on the support frame (44) along a vertical direction, a first bending inclined plane (4610) interacting with the micro-nano dot mold (16) is disposed on the first bending block (461), and a first driver (462) for driving the first bending block (461) to move along the vertical direction is disposed on the support frame (44); the second bending mechanism (47) comprises a second bending block (471) which is arranged on the rack (41) in a sliding mode along the horizontal direction, a second bending inclined plane (4710) which is parallel to the positioning plane (432) is arranged on the second bending block (471), and a second driver (472) which is used for driving the second bending block (471) to move along the horizontal direction is arranged on the rack (41); the positioning mechanism (45) comprises a pressing block (451) which is arranged on the supporting frame (44) in a sliding mode along the vertical direction, and a third driver (452) which is used for driving the pressing block (451) to move along the vertical direction is arranged on the supporting frame (44).

10. The bending apparatus according to claim 7, wherein the horizontal table (42) is provided with two positioning blocks (421) for positioning the micro-nano dot mold (16).

[ technical field ] A method for producing a semiconductor device

The invention relates to an embossing roller for embossing micro-nano dots.

[ background of the invention ]

The backlight module of the keyboard is characterized in that a light-emitting area is stamped on the light guide film by adopting a micro-nano stamping process, so that the light-emitting area is displayed on the back of the keyboard keys. The micro-nano imprinting process needs to install a micro-nano dot mold on a heating roller, and then transfer the patterns on the micro-nano dot mold to a light guide film material by adopting specific pressure and temperature.

[ summary of the invention ]

In order to solve the technical problem, the embossing roller for embossing the micro-nano dots comprises a cylindrical heating layer, the left end of the heating layer is hermetically connected with a left sealing element made of thermal insulation materials, the right end of the heating layer is hermetically connected with a right sealing element made of thermal insulation materials, the left sealing element is provided with a left rotating shaft, the right sealing element is provided with a right rotating shaft, the rotating shaft of the left rotating shaft is superposed with the rotating shaft of the right rotating shaft, the right sealing element is provided with an electromagnetic heating rod extending into the heating layer, a cavity is arranged among the inner side wall of the heating layer, the outer side wall of the electromagnetic heating rod, the inner side wall of the left sealing element and the inner side wall of the right sealing element, the cavity is filled with heat conducting media, a micro-nano dot mold for an imprinting process is arranged on the surface of the heating layer, and the micro-nano dot mold is made of a metal sheet.

According to the embossing roller for embossing the micro-nano dots, the heat conducting medium is one or more of silicon dioxide particles, ceramic particles and microcrystalline glass particles.

As above a platen roller for impressing micro-nano dot, the zone of heating on be equipped with the constant head tank that is used for fixing a position micro-nano dot mould, micro-nano dot mould contain the kink that is located the impression portion and the embedding constant head tank of zone of heating surface, the contained angle between the central line of constant head tank and the tangent line of zone of heating excircle is α, wherein α is not more than 44 and not more than 46.

According to the embossing roller for embossing the micro-nano dots, the heating layer is made of iron.

According to the embossing roller for embossing the micro-nano dots, the heat insulation cover is sleeved on the right sealing element.

As above, a platen roller for impressing micro-nano dot, the upside edge of impression portion is equipped with a circular locating hole A, at least one bar locating hole A and a plurality of locking hole A that are used for supplying the screw to pass, circular locating hole A cooperate with the locating pin on the zone of heating, each bar locating hole A cooperate with the locating pin on the zone of heating, each locking hole A be connected with and be used for connecting the screw on the zone of heating with micro-nano dot mould.

As above, a platen roller for impressing micro-nano dot, the downside edge of impression portion is equipped with a circular locating hole B, at least one bar locating hole B and a plurality of locking hole B that are used for supplying the screw to pass, circular locating hole B cooperate with the locating pin on the zone of heating, each bar locating hole B cooperate with the locating pin on the zone of heating, each locking hole B be connected with and be used for connecting the screw on the zone of heating with micro-nano dot mould.

The invention also provides bending equipment for processing the micro-nano dot mould, which comprises the following components: the frame, the frame on be equipped with horizontal table, horizontal table's one end is equipped with the seat of buckling, the seat of buckling on be equipped with and accept face and locating surface, the upper surface parallel and level of accepting face and horizontal table, the locating surface accept face slope setting relatively, the frame just be located and be equipped with the support frame directly over the seat of buckling, the support frame on be equipped with and be used for positioning the positioning mechanism of micro-nano site mould on the seat of buckling, the support frame on be equipped with and be used for driving the first bending mechanism that micro-nano site mould of location on the seat of buckling buckled buckles downwards, the frame on be equipped with and be used for driving the second bending mechanism that micro-nano site mould buckled towards the locating surface.

According to the bending equipment of the micro-nano mesh point die, the included angle between the positioning surface and the bearing surface is β, wherein β is more than or equal to 18 degrees and less than or equal to 22 degrees.

According to the bending equipment for the micro-nano dot mould, the first bending mechanism comprises a first bending block which is arranged on the support frame in a sliding mode along the vertical direction, a first bending inclined plane which is used for acting with the micro-nano dot mould is arranged on the first bending block, and a first driver which is used for driving the first bending block to act along the vertical direction is arranged on the support frame.

According to the bending equipment of the micro-nano mesh point die, the included angle between the first bending inclined plane and the vertical plane is gamma, wherein gamma is larger than or equal to 147 degrees and smaller than or equal to 153 degrees.

According to the bending equipment for the micro-nano mesh point die, the second bending mechanism comprises a second bending block which is arranged on the rack in a sliding mode along the horizontal direction, a second bending inclined plane which is parallel to the positioning plane is arranged on the second bending block, and a second driver which is used for driving the second bending block to move along the horizontal direction is arranged on the rack.

According to the bending equipment for the micro-nano mesh point die, the positioning mechanism comprises the pressing block which is arranged on the supporting frame in a sliding mode along the vertical direction, and the supporting frame is provided with the third driver which is used for driving the pressing block to move along the vertical direction.

According to the bending equipment for the micro-nano dot mould, the horizontal workbench is provided with two positioning blocks for positioning the micro-nano dot mould.

Compared with the prior art, the invention has the following advantages:

1. according to the embossing roller for embossing the micro-nano dots, the cylindrical heating layer is adopted, the left sealing piece and the right sealing piece are arranged at the two ends of the heating layer, so that the cavity is formed in the heating layer, the cavity is filled with the heat-conducting medium, and heat generated by the electromagnetic heating rod is uniformly transferred to the embossing roller through the heat-conducting medium so as to heat the micro-nano dot mold, so that the temperature is quickly increased, the waiting time can be saved, and the efficiency is improved; meanwhile, the design can maintain the temperature of the heating layer to be relatively stable, and the imprinting quality is improved.

2. According to the bending equipment, the micro-nano dot mould is positioned on the bending seat through the positioning mechanism, then the bending part is driven to bend downwards through the first bending mechanism, finally the bending part is driven to bend towards the positioning surface through the second bending mechanism, the bending quality of the micro-nano dot mould can be ensured through secondary bending, the phenomenon that arching easily occurs through only one-time bending is avoided, and the micro-nano dot mould has the advantages of simple structure and low manufacturing cost.

[ description of the drawings ]

The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:

FIG. 1 is a schematic view in full section of the embossing roll of the present invention after installation;

FIG. 2 is a schematic structural diagram of the micro-nano dot mold after being unfolded;

FIG. 3 is an enlarged view of portion A labeled in FIG. 2;

FIG. 4 is an enlarged view of portion B labeled in FIG. 3;

FIG. 5 is a schematic view in full section of a heating layer according to the present invention;

FIG. 6 is an enlarged view of portion C labeled in FIG. 5;

fig. 7 is a schematic structural diagram of bending equipment of the micro-nano dot mold in the invention;

fig. 8 is a schematic plan view of a bending device of the micro-nano dot mold in the invention;

FIG. 9 is a schematic view in full section taken along D-D of FIG. 8;

FIG. 10 is an enlarged view of portion E labeled in FIG. 9;

fig. 11 is a schematic three-dimensional cross-sectional view of a bending apparatus of the micro-nano dot mold according to the present invention;

fig. 12 is an enlarged view of a portion F marked in fig. 11.

[ detailed description ] embodiments

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 6, the embossing roller for embossing micro-nano dots of this embodiment includes a cylindrical heating layer 11, the heating layer 11 is made of iron, a left sealing member 12 made of heat insulating material is connected to the left end of the heating layer 11 in a sealing manner, a right sealing member 13 made of heat insulating material is connected to the right end of the heating layer 11 in a sealing manner, a left rotating shaft 121 is arranged on the left sealing member 12, a right rotating shaft 131 is arranged on the right sealing member 13, the rotating shaft of the left rotating shaft 121 coincides with the rotating shaft of the right rotating shaft 131, an electromagnetic heating rod 14 extending into the heating layer 11 is arranged on the right sealing member 13, a cavity 101 is arranged between the inner side wall of the heating layer 11, the outer side wall of the electromagnetic heating rod 14, the inner side wall of the left sealing member 12 and the inner side wall of the right sealing member 13, a heat conducting medium 15 is filled in the cavity 101, a micro-nano dot, the micro-nano dot mould 16 is made of a metal sheet. According to the embossing roller for embossing the micro-nano dots, the cylindrical heating layer is adopted, the left sealing piece and the right sealing piece are arranged at the two ends of the heating layer, so that the cavity is formed in the heating layer, the cavity is filled with the heat-conducting medium, and heat generated by the electromagnetic heating rod is uniformly transferred to the embossing roller through the heat-conducting medium so as to heat the micro-nano dot mold, so that the temperature is quickly increased, the waiting time can be saved, and the efficiency is improved; meanwhile, the design can maintain the temperature of the heating layer to be relatively stable, and the imprinting quality is improved.

In this embodiment, the heat conducting medium 15 is one or more of silica particles, ceramic particles, and glass-ceramic particles.

As shown in fig. 5 and 6, in order to prevent the micro-nano dot mold 16 from being dislocated relative to the heating layer in the imprinting process, a positioning groove 111 for positioning the micro-nano dot mold 16 is arranged on the heating layer 11, the micro-nano dot mold 16 includes an imprinting portion 161 located on the outer surface of the heating layer 11 and a bending portion 162 embedded in the positioning groove 111, an included angle between a center line of the positioning groove 111 and a tangent line of the excircle of the heating layer 11 is α, wherein an included angle is equal to or greater than 44 degrees and equal to α and equal to or.

In order to improve the heat insulation performance, a heat insulation cover 17 is sleeved on the right sealing element 13.

In order to install the micro-nano dot mold on the surface of the heating layer accurately and quickly, a circular positioning hole a21, at least one strip positioning hole a22 and a plurality of locking holes a23 for screws to pass through are arranged on the edge of the upper side of the imprinting part 161, the circular positioning hole a21 is matched with the positioning pins on the heating layer 11, each strip positioning hole a22 is matched with the positioning pins on the heating layer 11, each locking hole a23 is connected with the screws for connecting the micro-nano dot mold 16 to the heating layer 11, a circular positioning hole B31, at least one strip positioning hole B32 and a plurality of locking holes B33 for screws to pass through are arranged on the edge of the lower side of the imprinting part 161, the circular positioning hole B31 is matched with the positioning pins on the heating layer 11, and each strip positioning hole B32 is matched with the positioning pins on the heating layer, each locking hole B33 is connected with a screw for connecting the micro-nano dot mold 16 to the heating layer 11.

The embossing part 161 is provided with an embossing pattern 1612 composed of a plurality of fine and outwardly protruding bumps 1611, and the diameter of the bumps 1611 is 0.04 to 0.05 mm.

When the micro-nano dot mold is installed, a bent part of the micro-nano dot mold is inserted into the positioning groove, then the circular positioning hole A and the circular positioning hole B are aligned with the positioning pin on the heating layer 11, then the strip-shaped positioning hole A and the strip-shaped positioning hole B are aligned with the positioning pin on the heating layer 11, and finally the micro-nano dot mold is locked on the surface of the heating layer by penetrating through the locking hole A and the locking hole B by using screws; by adopting the mode, the micro-nano mesh point die can be positioned quickly and accurately, and can be installed on the heating layer quickly.

Because micro-nano site mould need buckle, this embodiment still provides a bending equipment that is used for buckling micro-nano site mould for this reason.

As shown in fig. 7 to 12, in this embodiment, a bending apparatus for processing the micro-nano dot mold according to claim 4 includes: frame 41, frame 41 on be equipped with horizontal table 42, horizontal table 42's one end is equipped with the seat of buckling 43, the seat of buckling 43 on be equipped with and accept face 431 and locating surface 432, the upper surface parallel and level of accepting face 431 and horizontal table 42, locating surface 432 accept face 431 slope setting relatively, frame 41 and be located and be equipped with support frame 44 directly over the seat of buckling 43, support frame 44 on be equipped with and be used for positioning micro-nano site mould 16 the positioning mechanism 45 on the seat of buckling 43, support frame 44 on be equipped with and be used for driving the first mechanism 46 of buckling that the micro-nano site mould 16 of location on the seat of buckling 43 buckled downwards, frame 41 on be equipped with and be used for driving micro-nano site mould 16 the second mechanism 47 of buckling towards locating surface 432. According to the bending equipment, the micro-nano dot mould is positioned on the bending seat through the positioning mechanism, then the bending part is driven to bend downwards through the first bending mechanism, finally the bending part is driven to bend towards the positioning surface through the second bending mechanism, the bending quality of the micro-nano dot mould can be ensured through secondary bending, the phenomenon that arching easily occurs through only one-time bending is avoided, and the micro-nano dot mould has the advantages of simple structure and low manufacturing cost.

In the embodiment, the included angle between the positioning surface 432 and the bearing surface 431 is β, wherein the included angle is equal to or larger than 18 degrees and equal to or smaller than β degrees and equal to or smaller than 22 degrees.

In this embodiment, the first bending mechanism 46 includes a first bending block 461 disposed on the supporting frame 44 in a sliding manner along the vertical direction, the first bending block 461 is provided with a first bending inclined plane 4610 acting on the micro-nano dot mold 16, the supporting frame 44 is provided with a first driver 462 for driving the first bending block 461 to move along the vertical direction, and the first driver may be an air cylinder. The included angle between the first bending inclined plane 4610 and the vertical plane is gamma, wherein gamma is more than or equal to 147 degrees and less than or equal to 153 degrees.

In this embodiment, the second bending mechanism 47 includes a second bending block 471 slidably disposed on the frame 41 along the horizontal direction, the second bending block 471 is provided with a second bending inclined surface 4710 parallel to the positioning surface 432, the frame 41 is provided with a second driver 472 for driving the second bending block 471 to move along the horizontal direction, and the second driver may be an air cylinder.

In this embodiment, the positioning mechanism 45 includes a pressing block 451 slidably disposed on the supporting frame 44 along the vertical direction, the supporting frame 44 is provided with a third driver 452 for driving the pressing block 451 to move along the vertical direction, and the third driver may be an air cylinder.

In order to position the micro-nano dot mold in the conveying process, two positioning blocks 421 for positioning the micro-nano dot mold 16 are arranged on the horizontal worktable 42.

The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.