阅读说明：本技术 一种耐高温的石墨烯加热板 (High temperature resistance graphite alkene hot plate ) 是由 王成斌 莫奕田 简炳根 于 2019-11-09 设计创作，主要内容包括：本发明公开了一种耐高温的石墨烯加热板,包括微晶玻璃板、片状石墨烯烧结层和导电部。通过在微晶玻璃板的一侧一体设置有通过片状石墨烯混合物烧结形成的片状石墨烯烧结层,在片状石墨烯烧结层表面设置有两组不相互接触的导电部,由于通过烧结后固定在微晶玻璃板一侧的片状石墨烯烧结层具有稳定的物理结构,结构十分稳定,与微晶玻璃板的结合更为紧密,高温下不易炸裂,而且没有使用胶水进行粘接,在高温下不会出现胶水熔融的问题,经过试验后证实通过本方法生产出的石墨烯加热板发热温度可以高达550度至600度,与现有技术相比,大幅度提高了石墨烯加热板的发热温度。(The invention discloses a high-temperature-resistant graphene heating plate which comprises a microcrystalline glass plate, a flaky graphene sintering layer and a conductive part. Through the integrative flake graphite alkene sintering layer that is provided with through flake graphite alkene mixture sintering formation in one side of microcrystalline glass board, be provided with two sets of not conductive parts of mutual contact on flake graphite alkene sintering layer surface, because the flake graphite alkene sintering layer of fixing in microcrystalline glass board one side has stable physical structure through the sintering after, the structure is very stable, it is inseparable more with the combination of microcrystalline glass board, be difficult for exploding under the high temperature, and use glue to bond, glue melting's problem can not appear under the high temperature, prove through experimental back that the graphite alkene hot plate that produces through this method generates heat the temperature and can reach 550 degrees to 600 degrees, compare with prior art, the temperature that generates heat of graphite alkene hot plate has been increased substantially.)

1. A high temperature resistant graphite alkene hot plate which characterized in that includes:

the graphene composite material comprises a microcrystalline glass plate (10), wherein a flaky graphene sintered layer (20) formed by sintering a flaky graphene mixture is integrally arranged on one side of the microcrystalline glass plate (10);

and the two groups of conductive parts are not in contact with each other and are positioned on the surface of the flake graphene sintering layer (20).

2. The high temperature resistant graphene heating plate of claim 1, comprising:

and a reticular process groove (11) is formed in the surface of one side of the microcrystalline glass plate (10) corresponding to the sheet graphene sintering layer (20).

3. The high temperature resistant graphene heating plate of claim 1, comprising:

the conductive part is conductive silver paste (40), and two groups of conductive silver paste (40) are symmetrically arranged along two sides of the sheet graphene sintering plate.

4. The high temperature resistant graphene heating plate of claim 3, comprising:

the area of the flaky graphene sintering layer (20) is smaller than that of the microcrystalline glass plate (10), the flaky graphene sintering layer (20) is located in the middle of the microcrystalline glass plate (10), and the conductive silver paste (40) covers the edge of the flaky graphene sintering layer (20) and the surface of the microcrystalline glass plate (10) at the same time.

5. The high temperature resistant graphene heating plate of claim 1, comprising:

the flaky graphene mixture comprises, by mass, 30-50% of flaky graphene, 10-40% of carbon crystal powder, 1-5% of an auxiliary agent and 1-5% of a catalyst.

6. The high temperature resistant graphene heating plate of claim 1, comprising:

and a tubular graphene heat conduction layer (30) is arranged on the other side surface of the microcrystalline glass plate (10).

7. The high temperature resistant graphene heating plate of claim 6, comprising:

the side face, corresponding to the tubular graphene heat conduction layer (30), of the microcrystalline glass plate (10) is a frosted surface.

8. The high temperature resistant graphene heating plate of claim 6, comprising:

the tubular graphene heat conduction layer (30) is composed of high-temperature-resistant ink with the mass components of 70-90% and tubular graphene powder with the mass components of 10-30%.

9. The high temperature resistant graphene heating plate of claim 6, comprising:

the thickness of the tubular graphene heat conduction layer (30) is 30-50 microns.

10. The high temperature resistant graphene heating plate of claim 1, comprising:

the sheet graphene sintering layer (20) and the conductive coating are covered with an insulating layer (50) on the outer side.

Technical Field

The invention relates to the field of heating plates, in particular to a high-temperature-resistant graphene heating plate.

Background

The heating plate is a heating mode commonly used for heating articles at present, graphene is a heating carrier emerging at present, and the sheet-shaped graphene plate can generate high temperature by electrifying the sheet-shaped graphene plate, but because the cost of the complete sheet-shaped graphene is high, the existing graphene heating plate is manufactured by mixing sheet-shaped graphene powder with specific glue, then coating the mixture on a microcrystalline glass plate and then hardening the mixture. But the graphite alkene hot plate of this kind of technology production has a serious problem, and graphite alkene hot plate heating temperature can only heat to 230 and give first place to 300 degrees, surpasss this temperature after, the operating condition of graphite alkene hot plate just very unstable, and glue can appear molten state, and graphite alkene hot plate is fried very easily.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a graphene heating plate capable of withstanding higher temperatures.

The technical scheme adopted by the invention for solving the problems is as follows: a high temperature resistant graphene heating plate, comprising:

the graphene composite material comprises a microcrystalline glass plate, wherein a flaky graphene sintering layer formed by sintering a flaky graphene mixture is integrally arranged on one side of the microcrystalline glass plate;

and the two groups of conductive parts are not in contact with each other and are positioned on the surface of the flake graphene sintering layer.

As a further improvement of the above technical solution, a reticular process groove is provided on a surface of one side of the microcrystalline glass plate corresponding to the sheet-like graphene sintered layer.

As a further improvement of the above technical scheme, the conductive portions are conductive silver pastes, and the two groups of conductive silver pastes are symmetrically arranged along two sides of the sheet graphene sintering plate.

As a further improvement of the above technical scheme, the area of the sheet-shaped graphene sintered layer is smaller than that of the glass-ceramic plate, the sheet-shaped graphene sintered layer is located in the middle of the glass-ceramic plate, and the conductive silver paste covers the edge of the sheet-shaped graphene sintered layer and the surface of the glass-ceramic plate simultaneously.

As a further improvement of the technical scheme, the flake graphene mixture comprises 30-50% of flake graphene, 10-40% of carbon crystal powder, 1-5% of an auxiliary agent and 1-5% of a catalyst by mass.

As a further improvement of the above technical solution, a tubular graphene heat conduction layer is disposed on the other side surface of the microcrystalline glass plate.

As a further improvement of the above technical solution, the side of the microcrystalline glass plate corresponding to the tubular graphene heat conduction layer is a frosted surface.

As a further improvement of the technical scheme, the tubular graphene heat conduction layer is composed of high-temperature-resistant ink and tubular graphene powder, wherein the high-temperature-resistant ink comprises 70-90% by mass of the tubular graphene heat conduction layer, and the tubular graphene powder comprises 10-30% by mass of the tubular graphene powder.

As a further improvement of the above technical solution, the thickness of the tubular graphene heat conduction layer is 30-50 micrometers.

As a further improvement of the above technical solution, the sheet graphene sintered layer and the conductive coating are covered with an insulating layer on the outer side.

The invention has the beneficial effects that: through the integrative flake graphite alkene sintering layer that is provided with through flake graphite alkene mixture sintering formation in one side of microcrystalline glass board, be provided with two sets of not conductive parts of mutual contact on flake graphite alkene sintering layer surface, because the flake graphite alkene sintering layer of fixing in microcrystalline glass board one side has stable physical structure through the sintering after, the structure is very stable, it is inseparable more with the combination of microcrystalline glass board, be difficult for exploding under the high temperature, and use glue to bond, glue melting's problem can not appear under the high temperature, prove through experimental back that the graphite alkene hot plate that produces through this method generates heat the temperature and can reach 550 degrees to 600 degrees, compare with prior art, the temperature that generates heat of graphite alkene hot plate has been increased substantially.

Drawings

The invention is further explained below with reference to the drawing description and the detailed description.

FIG. 1 is a schematic front view of a preferred embodiment of the present invention;

FIG. 2 is a schematic view of a sectional view taken along the line A-A in FIG. 1;

FIG. 3 is a schematic view of the backside structure of the preferred embodiment of the present invention;

FIG. 4 is a schematic structural diagram of the preferred embodiment of the present invention after the insulating layer is removed;

fig. 5 is a schematic structural view of a crystallized glass plate according to a preferred embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.