阅读说明：本技术 带有基材薄膜的含导电结构体的薄膜的制造方法 (Method for producing conductive structure-containing film with base film ) 是由 矶上宏一郎 保田浩孝 于 2018-07-06 设计创作，主要内容包括：本发明涉及一种带有基材薄膜的含导电结构体的薄膜的制造方法,其包括如下工序：工序(1),在基材薄膜的单面,涂布热塑性树脂组合物(A)而形成树脂层(X),所述热塑性树脂组合物(A)包含选自由聚乙烯醇缩醛树脂、离聚物树脂和乙烯乙酸乙烯酯共聚物树脂组成的组中的至少1种热塑性树脂；和,工序(2),在该树脂层(X)上形成导电结构体。(The present invention relates to a method for producing a conductive structure-containing film with a base film, comprising the steps of: a step (1) of applying a thermoplastic resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin to one surface of a base film to form a resin layer (X); and a step (2) of forming a conductive structure on the resin layer (X).)

1. A method for producing a conductive structure-containing film with a base film, comprising the steps of:

a step (1) of applying a thermoplastic resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin to one surface of a base film to form a resin layer (X); and; and (2) forming a conductive structure on the resin layer (X).

2. A method for producing a conductive structure-containing film with a base film, comprising the steps of:

a step (3) in which a resin layer (X) is formed by applying a thermoplastic resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of polyvinyl acetal resins, ionomer resins, and ethylene vinyl acetate copolymer resins to one surface of a metal foil; a step (4) of laminating a base film on the resin layer (X); and a step (5) of processing the metal foil to form a conductive structure.

3. The method for producing a conductive structure-containing film with a base material film according to claim 1 or 2, wherein in the step (1) or the step (3), the method of applying the thermoplastic resin composition (a) is based on a method of melting and applying the thermoplastic resin composition (a).

4. The method for producing a conductive structure-containing film with a base material film according to claim 1 or 2, wherein in the step (1) or the step (3), the method of applying the thermoplastic resin composition (a) is based on a method of applying a solution or dispersion of the thermoplastic resin composition (a).

5. The method for producing a conductive structure-containing film with a base material film according to any one of claims 1 to 4, wherein the thermoplastic resin composition (A) contains 50% by mass or more of a polyvinyl acetal resin based on the total mass of the thermoplastic resin composition (A).

6. The method for producing a conductive structure-containing film with a substrate film according to claim 5, wherein a toluene/ethanol (mass ratio) 1/1 solution having a concentration of the polyvinyl acetal resin of 10 mass% has a viscosity of more than 200 mPas as measured with a Brookfield type (B type) viscometer at 20 ℃ and 30 rpm.

7. The method for producing a conductive structure-containing film with a base film according to claim 5 or 6, wherein the thermoplastic resin composition (A) contains 0 to 20 mass% of a plasticizer based on the total mass of the thermoplastic resin composition (A).

8. The method for producing a conductive structure-containing film with a base material film according to any one of claims 1 to 7, wherein the thermoplastic resin composition (A) contains a polyvinyl acetal resin in an amount of 80 mass% or more based on the total mass of the thermoplastic resin composition (A).

9. The method for producing a conductive structure-containing film with a substrate film according to any one of claims 1 to 8, wherein the conductive structure has at least 2 bus structures.

10. The method for manufacturing a conductive structure-containing film with a substrate film according to claim 9, wherein the conductive structure has a fine metal wire structure between at least 2 bus bar structures.

11. The method for producing a conductive structure-containing film with a base material film according to any one of claims 1 to 10, wherein in the step (2) or the step (5), the conductive structure is formed by etching a metal foil.

12. A conductive structure-containing film with a base film, which is obtained by the production method according to any one of claims 1 to 11.

13. A method for producing a thin film containing a conductive structure, comprising the following step (6): removing the base film from the conductive structure-containing film with the base film obtained by the production method according to any one of claims 1 to 11.

14. A conductive structure-containing film obtained by the production method according to claim 13.

15. A method for producing a laminated glass, comprising the following step (7): the conductive structure-containing film obtained by the manufacturing method according to claim 13 is sandwiched and laminated between at least 2 sheets of glass.

16. A method for producing a laminated glass, comprising the steps of: a step (8) of laminating a glass on a surface of the conductive structure-containing film with a base film, which is not provided with the base film, obtained by the production method according to any one of claims 1 to 11, to obtain a laminate; and a step (9) of removing the base film from the laminate, and laminating the glass on the surface not having the glass.

17. The method for producing a laminated glass according to claim 15, wherein in the step (7), at least 1 resin layer (Y) is interposed between the conductive structure-containing film and the glass.

18. The method for producing a laminated glass according to claim 16, wherein at least 1 resin layer (Y) is interposed between the glass and the conductive structure-containing film having the base material film in the step (8) and/or between the glass and the laminate from which the base material film has been removed in the step (9).

19. The method for producing a laminated glass according to claim 17 or claim 18, wherein the resin layer (Y) comprises the same thermoplastic resin as that contained in the thermoplastic resin composition (a).

20. A laminated glass obtained by the production method according to any one of claims 15 to 19.

21. A heating member using the conductive structure-containing film according to claim 14.

Technical Field

The present invention relates to a method for producing a conductive structure-containing film with a base film. In addition, the present invention relates to: the conductive structure-containing film with a base film obtained by the above-mentioned production method, the conductive structure-containing film obtained from the film, a production method thereof, a laminated glass and a heating member using the conductive structure-containing film, and a production method of the laminated glass.

Background

There is a need for a method of removing ice and fog from glass on buildings or vehicles, such as windshields for automotive applications. As a solution to this problem, a method of applying hot air to glass is known, but this method has a problem of requiring time to obtain sufficient front visibility. In particular, in an electric vehicle which cannot use the combustion heat of gasoline fuel to remove ice or mist, there are the following problems: the method of electrically heating air and applying hot air to glass is inefficient, directly resulting in a decrease in cruising distance.

Therefore, a method of removing ice and mist by electrifying an electric heating wire provided in glass has been proposed. Patent document 1 describes a method for producing a laminated glass having a conductive structure by bonding 2 transparent plates to at least 1 sheet a and at least 1 sheet B, wherein the sheet a contains polyvinyl acetal PA and a plasticizer WA and has a conductive structure, and the sheet B contains polyvinyl acetal PB and a plasticizer WB. On the other hand, patent document 2 describes a method for producing a laminated glass for shielding electromagnetic waves, which is characterized in that a metal foil is bonded to a carrier resin via an adhesive film, the metal foil is etched to form a metal mesh, a 1 st glass plate is bonded to the metal mesh via the adhesive film, the carrier resin is peeled off, and a 2 nd glass plate is bonded to a peeling surface of the carrier resin via the adhesive film.

Disclosure of Invention

Problems to be solved by the invention

In the method described in patent document 1, it is necessary to minimize the thickness unevenness of the sheet a, and if the surface of the sheet a on which the conductive structure is formed is not finished to be extremely smooth, the conductive structure obtained due to the adhesion unevenness of the metal foil is likely to be broken, and therefore, a highly accurate film forming apparatus is required. Further, if a plurality of sheets a having a conductive structure are stacked or wound in a roll shape, the conductive structure tends to stick to the surface of the sheet a having no conductive structure at the overlapped portion, and it is difficult to transport or store the sheet a at a stage before the laminated glass is manufactured. In the manufacturing method described in patent document 2, since a thin film is used as the adhesive film, when the metal foil is bonded to the carrier resin via the adhesive film, defects such as air bubbles are likely to occur between the metal foil and the adhesive film, and between the adhesive film and the carrier resin. Further, there is a problem that the number of steps increases because the adhesive film is previously formed and then stacked on the metal foil and the carrier resin and heated to be adhered.

The present invention solves the above problems, and an object thereof is to provide: a method for producing a conductive structure-containing film with a base film having less defects such as deformation, breakage, and bubbles of a conductive structure without using a high-precision film-forming apparatus at a high production efficiency and a high production yield. Another object of the present invention is to provide: the conductive structure-containing film with a base film obtained by the above-mentioned production method, the conductive structure-containing film obtained from the film, a production method thereof, a laminated glass and a heating member using the conductive structure-containing film, and a production method of the laminated glass.

Means for solving the problems

The present inventors have made extensive studies to solve the above problems, and have thus completed the present invention. The present invention includes the following suitable embodiments.

[1] A method for producing a conductive structure-containing film with a base film, comprising the steps of:

a step (1) of applying a thermoplastic resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin to one surface of a base film to form a resin layer (X); and; and (2) forming a conductive structure on the resin layer (X).

[2] A method for producing a conductive structure-containing film with a base film, comprising the steps of:

a step (3) in which a resin layer (X) is formed by applying a thermoplastic resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of polyvinyl acetal resins, ionomer resins, and ethylene vinyl acetate copolymer resins to one surface of a metal foil; a step (4) of laminating a base film on the resin layer (X); and a step (5) of processing the metal foil to form a conductive structure.

[3] The method for producing a conductive structure-containing film with a base film according to the above [1] or [2], wherein in the step (1) or the step (3), the method of applying the thermoplastic resin composition (A) is based on a method of melting and applying the thermoplastic resin composition (A).

[4] The method for producing a conductive structure-containing film with a base film according to the above [1] or [2], wherein in the step (1) or the step (3), the method of applying the thermoplastic resin composition (A) is based on a method of applying a solution or dispersion of the thermoplastic resin composition (A).

[5] The method for producing a conductive structure-containing film with a base film according to any one of the above [1] to [4], wherein the thermoplastic resin composition (A) contains a polyvinyl acetal resin in an amount of 50 mass% or more based on the total mass of the thermoplastic resin composition (A).

[6] The method for producing a conductive structure-containing film with a base film according to [5], wherein the polyvinyl acetal resin has a toluene/ethanol (mass ratio) 1/1 solution concentration of 10 mass% and a viscosity of more than 200 mPas measured with a Brookfield (B) viscometer at 20 ℃ and 30 rpm.

[7] The method for producing a conductive structure-containing film with a base film according to the above [5] or [6], wherein the thermoplastic resin composition (A) contains 0 to 20 mass% of a plasticizer based on the total mass of the thermoplastic resin composition (A).

[8] The method for producing a conductive structure-containing film with a base film according to any one of the above [1] to [7], wherein the thermoplastic resin composition (A) contains a polyvinyl acetal resin in an amount of 80 mass% or more based on the total mass of the thermoplastic resin composition (A).

[9] The method for producing a conductive structure-containing film with a substrate film according to any one of the above [1] to [8], wherein the conductive structure has at least 2 bus bar structures.

[10] The method for producing a conductive structure-containing film with a base material film according to the above [9], wherein the conductive structure has a fine metal wire structure between at least 2 bus bar structures.

[11] The method for producing a conductive structure-containing thin film with a base material thin film according to any one of the above [1] to [10], wherein the conductive structure is formed by etching a metal foil in the step (2) or the step (5).

[12] A conductive structure-containing film with a base film, which is obtained by the production method according to any one of the above [1] to [11 ].

[13] A method for producing a thin film containing a conductive structure, comprising the following step (6): removing the base thin film from the conductive structure-containing thin film with the base thin film obtained by the production method according to any one of the above [1] to [11 ].

[14] A conductive structure-containing thin film obtained by the production method according to [13 ].

[15] A method for producing a laminated glass, comprising the following step (7): the conductive structure-containing film obtained by the production method according to the above [13] is sandwiched and laminated between at least 2 sheets of glass.

[16] A method for producing a laminated glass, comprising the steps of: a step (8) of laminating a glass on a surface of the conductive structure-containing film with a base film, which is obtained by the production method according to any one of the above [1] to [11], and which does not have the base film, to obtain a laminate; and a step (9) of removing the base film from the laminate, and laminating the glass on the surface not having the glass.

[17] The method of producing a laminated glass according to the above [15], wherein in the step (7), at least 1 resin layer (Y) is interposed between the conductive structure-containing film and the glass.

[18] The method for producing a laminated glass according to the above [16], wherein at least 1 resin layer (Y) is interposed between the glass and the conductive structure-containing film having the base film in the step (8) and/or between the glass and the laminate from which the base film is removed in the step (9).

[19] The process for producing a laminated glass according to the above [17] or [18], wherein the resin layer (Y) contains the same thermoplastic resin as that contained in the thermoplastic resin composition (A).

[20] A laminated glass obtained by the production method according to any one of the above [15] to [19 ].

[21] A heating member using the conductive structure-containing film according to [14 ].

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a conductive structure-containing film with a base film having less defective points such as deformation, breakage, and bubbles of a conductive structure can be produced with high productivity and high yield without using a highly accurate film forming apparatus. Further, a conductive structure-containing film obtained from the film can be obtained, and a laminated glass and a heating member can be manufactured using the conductive structure-containing film.

Detailed Description

The manufacturing method of the present invention includes the steps of: a step (1) of applying a thermoplastic resin composition (a) (hereinafter, also referred to as "resin composition (a)", in some cases) containing at least 1 thermoplastic resin selected from a polyvinyl acetal resin, an ionomer resin and an ethylene-vinyl acetate copolymer resin, to one surface of a base film to form a resin layer (X); and a step (2) of forming a conductive structure on the resin layer (X). Another aspect of the manufacturing method of the present invention includes the steps of: a step (3) of applying a resin composition (A) containing at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin to one surface of a metal foil to form a resin layer (X); a step (4) of laminating a base film on the resin layer (X); and a step (5) of processing the metal foil to form a conductive structure.

According to these production methods of the present invention, a conductive structure-containing film with a base film having a laminated structure of base film/resin layer (X)/conductive structure can be produced. In the film with a conductive structure attached to a base film, the base film and the resin layer (X) and the conductive structure are bonded or integrated with each other.

< Process (1) and Process (3) >

< resin composition (A) >

The resin composition (a) used in the steps (1) and (3) contains at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene vinyl acetate copolymer resin. Among them, the resin composition (a) preferably contains a polyvinyl acetal resin and/or an ionomer resin, and preferably contains a polyvinyl acetal resin.

< polyvinyl acetal resin >

When the resin composition (a) contains a polyvinyl acetal resin, the content of the polyvinyl acetal resin in the resin composition (a) is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, particularly preferably 85% by mass or more, very preferably 90% by mass or more, most preferably 95% by mass or more, and may be 100% by mass, based on the total mass of the resin composition (a).

The resin composition (a) may contain 1 polyvinyl acetal resin, and may contain 2 or more polyvinyl acetal resins different in any 1 or more of viscosity average polymerization degree, acetalization degree, acetyl group amount, hydroxyl group amount, ethylene content, molecular weight of aldehyde used for acetalization, and chain length.

The polyvinyl acetal resin can be produced by acetalization of a polyvinyl alcohol resin such as polyvinyl alcohol or a vinyl alcohol copolymer. For example, the resin composition can be produced by the following method, but is not limited thereto. First, an aqueous solution of polyvinyl alcohol or an ethylene-vinyl alcohol copolymer having a concentration of 3 to 30 mass% is maintained at a temperature of 80 to 100 ℃ and then slowly cooled for 10 to 60 minutes. After the temperature is lowered to-10 to 30 ℃, aldehyde and an acid catalyst are added, and acetalization is performed for 30 to 300 minutes while keeping the temperature constant. Then, the reaction solution is heated to a temperature of 20 to 80 ℃ for 30 to 200 minutes, and is kept for 30 to 300 minutes. Then, the reaction solution is filtered as necessary, neutralized by adding a neutralizing agent such as an alkali, filtered, washed with water, and dried to produce a polyvinyl acetal resin.

The acid catalyst used in the acetalization reaction is not particularly limited, and an organic acid or an inorganic acid may be used. Examples of the acid catalyst include acetic acid, p-toluenesulfonic acid, nitric acid, sulfuric acid, hydrochloric acid, and the like. Among them, hydrochloric acid, sulfuric acid, and nitric acid are preferable from the viewpoint of the strength of the acid and the ease of removal at the time of washing.

The aldehyde used for producing the polyvinyl acetal resin is preferably a linear, branched or cyclic aldehyde having 2 to 10 carbon atoms, more preferably a linear or branched aldehyde having 2 to 10 carbon atoms, still more preferably a linear aliphatic aldehyde having 2 to 10 carbon atoms, and particularly preferably n-butyl aldehyde. When the above aldehyde is used, a polyvinyl acetal resin having an appropriate breaking energy can be easily obtained. The amount of n-butyraldehyde to be used is preferably 50% by mass or more, more preferably 80% by mass or more, further preferably 95% by mass or more, particularly preferably 99% by mass or more, and may be 100% by mass, based on the total mass of aldehydes used in the acetalization reaction. In addition, a single aldehyde may be used, or a mixture of a plurality of aldehydes may be used.

The viscosity average polymerization degree of the polyvinyl alcohol resin which is a raw material of the polyvinyl acetal resin is preferably 100 or more, more preferably 300 or more, more preferably 400 or more, further preferably 600 or more, particularly preferably 700 or more, and most preferably 750 or more. When the viscosity average polymerization degree of the polyvinyl alcohol resin is not less than the lower limit, deformation and breakage of the conductive structure are easily suppressed in producing a laminated glass, and the glass displacement phenomenon due to heat in the obtained laminated glass is easily prevented. The viscosity average polymerization degree of the polyvinyl alcohol resin is preferably 5000 or less, more preferably 3000 or less, still more preferably 2500 or less, particularly preferably 2300 or less, and most preferably 2000 or less. When the viscosity average polymerization degree of the polyvinyl alcohol resin is not more than the above upper limit, good film forming properties can be easily obtained. The viscosity average polymerization degree of the polyvinyl alcohol resin can be measured, for example, according to JIS K6726 "polyvinyl alcohol test method".

The preferred viscosity average degree of polymerization of the polyvinyl acetal resin is the same as the above viscosity average degree of polymerization of the polyvinyl alcohol resin as a raw material. When the resin composition (a) contains 2 or more different species of polyvinyl acetal resins, it is preferable that the viscosity average degree of polymerization of at least 1 species of polyvinyl acetal resin is not less than the lower limit and not more than the upper limit.

The polyvinyl acetal resin preferably has an acetyl group amount based on an ethylene unit of a polyvinyl acetal main chain, that is, a unit (for example, a vinyl alcohol unit, a vinyl acetate unit, an ethylene unit, or the like) of 2 carbons in the main chain in the polyvinyl alcohol resin as a raw material for producing the polyvinyl acetal resin as one repeating unit, and the content of the vinyl acetate unit based on the one repeating unit is 0.1 to 20 mol%, more preferably 0.5 to 3 mol%, or 5 to 8 mol%. The acetyl group content can be adjusted within the above range by appropriately adjusting the saponification degree of the polyvinyl alcohol resin as a raw material. The amount of acetyl group affects the polarity of the polyvinyl acetal resin, and thus, the plasticizer compatibility and mechanical strength of the resin layer (X) may vary. When the resin composition (a) contains 2 or more different polyvinyl acetal resins, the amount of acetyl groups in at least 1 polyvinyl acetal resin is preferably within the above range.

The acetalization degree of the polyvinyl acetal resin is not particularly limited, but is preferably 40 to 86 mol%, more preferably 45 to 84 mol%, still more preferably 50 to 82 mol%, still more preferably 60 to 82 mol%, and particularly preferably 68 to 82 mol%. In the present invention, the "acetalization degree" refers to the amount of the unit forming acetal, which is based on a unit formed of 2 carbons in the main chain (for example, a vinyl alcohol unit, a vinyl acetate unit, an ethylene unit, etc.) in the polyvinyl alcohol resin which is a raw material for producing the polyvinyl acetal resin, as one repeating unit. The acetalization degree of the polyvinyl acetal resin can be adjusted within the above range by appropriately adjusting the amount of the aldehyde used in acetalizing the polyvinyl acetal resin. When the acetalization degree is within the above range, the compatibility between the polyvinyl acetal resin and the plasticizer is not easily lowered, and the mechanical strength of the conductive structure-containing film with a base film obtained by the production method of the present invention is easily sufficient. When the resin composition (a) contains 2 or more different polyvinyl acetal resins, the acetalization degree of at least 1 polyvinyl acetal resin is preferably within the above range.

The polyvinyl acetal resin preferably contains, as one repeating unit, a unit (for example, a vinyl alcohol unit, a vinyl acetate unit, an ethylene unit, or the like) of 2 carbons in the main chain of the polyvinyl alcohol resin as a raw material for producing the polyvinyl acetal resin, based on the vinyl unit of the polyvinyl acetal main chain, and the content of the vinyl alcohol unit based on the one repeating unit is 6 to 26 mass%, more preferably 12 to 24 mass%, more preferably 15 to 22 mass%, and particularly preferably 18 to 21 mass%, and for the purpose of imparting sound insulation performance, the content is preferably 6 to 20 mass%, more preferably 8 to 18 mass%, more preferably 10 to 15 mass%, and particularly preferably 11 to 13 mass%. The hydroxyl group content can be adjusted to the above range by adjusting the amount of the aldehyde used in acetalizing the polyvinyl alcohol resin. When the resin composition (a) contains 2 or more different polyvinyl acetal resins, the amount of hydroxyl groups in at least 1 polyvinyl acetal resin is preferably within the above range.

The polyvinyl acetal resin is generally composed of an acetal unit, a hydroxyl unit, and an acetyl unit, and the amounts of these units can be measured by, for example, JIS K6728 "polyvinyl butyral test method" or Nuclear Magnetic Resonance (NMR) method.

The viscosity of a 10 mass% toluene/ethanol (mass ratio) 1/1 solution of the polyvinyl acetal resin is preferably 200 mPas or more, more preferably more than 200 mPas, further preferably 240 mPas or more, and particularly preferably 265 mPas or more, as measured with a Brookfield (B) viscometer at 20 ℃ and 30 rpm. The viscosity of the polyvinyl acetal resin can be adjusted to the lower limit or higher by using or using in combination a polyvinyl acetal resin produced using a polyvinyl alcohol resin having a high viscosity average polymerization degree as a raw material or a part of the raw material. When the resin composition (a) is formed of a mixture of a plurality of polyvinyl acetal resins, the viscosity of the mixture is preferably not less than the lower limit value. When the viscosity of the polyvinyl acetal resin is not less than the lower limit, deformation and disconnection of the conductive structure are easily suppressed in producing a laminated glass, and the glass displacement phenomenon due to heat in the obtained laminated glass is easily prevented. From the viewpoint of easily obtaining a good film-forming property, the viscosity is preferably 1000 mPas or less, more preferably 800 mPas or less, further preferably 500 mPas or less, particularly preferably 450 mPas or less, and most preferably 400 mPas or less.

< plasticizer >

The resin composition (A) preferably contains 0 to 20 mass% of a plasticizer based on the total mass of the resin composition (A). The content of the plasticizer in the resin composition (a) is more preferably 0 to 19 mass%, still more preferably 0 to 15 mass%, particularly preferably 0 to 10 mass%, most preferably 0 to 5 mass%. When the content of the plasticizer is within the above range, the conductive structure-containing film obtained by removing the base film from the conductive structure-containing film with a base film according to the present invention tends to be excellent in handling properties, and when a laminated glass is produced using the conductive structure-containing film, deformation and breakage of the conductive structure are easily suppressed, and as a result, good electric conduction properties are easily obtained.

Examples of the plasticizer include the following compounds. The plasticizer may be used alone or in combination of two or more.

Esters of polybasic aliphatic or aromatic acids. Examples thereof include: dialkyl adipates (e.g., dihexyl adipate, di-2-ethylbutyl adipate, dioctyl adipate, di-2-ethylhexyl adipate, hexylcyclohexyl adipate, heptyl adipate, nonyl adipate, diisononyl adipate, heptylnonyl adipate); esters of adipic acid with alcohols or alcohols containing ether compounds (e.g., dibutoxyethyl adipate, dibutoxyethoxyethyl adipate); dialkyl sebacates (e.g., dibutyl sebacate); esters of sebacic acid with alicyclic alcohols or alcohols containing ether compounds; esters of phthalic acids (e.g., butyl benzyl phthalate, bis-2-butoxyethyl phthalate); and esters of alicyclic polycarboxylic acids with aliphatic alcohols (e.g., 1, 2-cyclohexane dicarboxylic acid diisononyl ester).

Esters or ethers of polyhydric aliphatic or aromatic alcohols or oligoether glycols having more than 1 aliphatic or aromatic substituent. Examples thereof include: and esters with linear or branched aliphatic or alicyclic carboxylic acids such as glycerol, diethylene glycol, triethylene glycol and tetraethylene glycol. More specifically, there may be mentioned: diethylene glycol-bis- (2-ethylhexanoate), triethylene glycol-bis- (2-ethylbutyrate), tetraethylene glycol-bis-n-heptanoate, triethylene glycol-bis-n-hexanoate, tetraethylene glycol dimethyl ether, and dipropylene glycol benzoate.

Phosphoric esters of aliphatic or aromatic ester alcohols. Examples thereof include: tris (2-ethylhexyl) phosphate, triethyl phosphate, diphenyl-2-ethylhexyl phosphate, and tricresyl phosphate.

Esters of citric, succinic and/or fumaric acid.

Polyesters or oligoesters formed from polyols and polycarboxylic acids. The terminal may be hydroxyl or carboxyl, or may be esterified or etherified.

Polyesters or oligoesters from lactones or hydroxycarboxylic acids. The terminal may be hydroxyl or carboxyl, or may be esterified or etherified.

< ionomer resin >

When the resin composition (a) contains an ionomer resin, the content of the ionomer resin in the resin composition (a) is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, particularly preferably 85% by mass or more, very preferably 90% by mass or more, most preferably 95% by mass or more, and may be 100% by mass based on the total mass of the resin composition (a) may contain 1 kind of ionomer resin, and may contain 2 or more kinds of ionomer resins that are different from each other in 1 or more of the kind of α -unsaturated carboxylic acid, the content ratio of a structural unit of α -unsaturated carboxylic acid, the kind of metal ion used for neutralization, the kind of α -olefin, the content ratio of a structural unit of α -olefin, the kind of other copolymerizable monomer represented by an ester of α -unsaturated carboxylic acid, and the content ratio thereof, and the like.

The ionomer resin includes, for example, a resin having a structural unit derived from ethylene and a structural unit derived from α -unsaturated carboxylic acid, and β 0, β 1-unsaturated carboxylic acid at least a part of which is neutralized by metal ions, and sodium ions and magnesium ions are examples of metal ions, in the ethylene- α -unsaturated carboxylic acid copolymer which is a base polymer, that is, before neutralization by metal ions, the content ratio of the structural unit of α -unsaturated carboxylic acid is preferably 2% by mass or more, more preferably 5% by mass or more, preferably 30% by mass or less, and more preferably 20% by mass or less, in the case where the resin composition (a) includes different 2 or more ionomer resins, the content ratio of the structural unit of α -unsaturated carboxylic acid is preferably within the range of the lower limit value and the upper limit value for at least 1 ionomer resin, the α -unsaturated carboxylic acid which constitutes the ionomer resin is preferably acrylic acid, methacrylic acid, maleic acid, monomethyl maleate, monoethyl maleate, maleic anhydride, or methacrylic anhydride, and the like are particularly preferably obtained from the ethylene- α -unsaturated carboxylic acid copolymer, and the ethylene-ethylene copolymer or the carboxyl-ethylene copolymer which is particularly preferably obtained from the aspect of the carboxyl group.

< ethylene vinyl acetate copolymer resin >

When the resin composition (a) contains an ethylene-vinyl acetate copolymer resin, the content of the ethylene-vinyl acetate copolymer resin in the resin composition (a) is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, particularly preferably 85% by mass or more, very preferably 90% by mass or more, most preferably 95% by mass or more, and may be 100% by mass based on the total mass of the resin composition (a) may contain 1 type of ethylene-vinyl acetate copolymer resin, and may contain 2 or more types of ethylene-vinyl acetate copolymer resins that are different from each other in the content ratio of the vinyl acetate structural unit, the type of other copolymerizable monomers, for example, vinyl esters other than vinyl acetate, α -olefins having 3 or more carbon atoms, and the content ratio thereof, and the like.

In the ethylene-vinyl acetate copolymer resin, the ratio of the vinyl acetate monomer to the total of the ethylene monomer and the vinyl acetate monomer is preferably less than 50 mol%, more preferably less than 30 mol%, still more preferably less than 20 mol%, and particularly preferably less than 15 mol%. When the ratio of the vinyl acetate monomer to the total of the ethylene monomer and the vinyl acetate monomer is less than the above upper limit value, for example, less than 50 mol%, the mechanical strength and flexibility tend to be exhibited in a well-balanced manner. The ratio of the vinyl acetate monomer to the total of the ethylene monomer and the vinyl acetate monomer may be 1 mol% or more, 3 mol% or more, or 7 mol% or more. When the resin composition (a) contains 2 or more different ethylene-vinyl acetate copolymer resins, the ratio of the vinyl acetate monomer is preferably within the range between the upper limit value and the lower limit value for at least 1 ethylene-vinyl acetate copolymer resin.

< additive >

The resin composition (a) may contain additives other than plasticizers such as water, ultraviolet absorbers, antioxidants, adhesion modifiers, whitening agents or fluorescent brighteners, stabilizers, pigments, processing aids, organic or inorganic nanoparticles, calcined silicic acid, surfactants, and the like. In order to suppress corrosion of the conductive structure formed on the resin layer (X), the resin composition (a) may contain an anticorrosive agent. The content of the anticorrosive in the resin composition (a) is preferably 0.005 to 5% by mass based on the total mass of the resin composition (a). Examples of the anticorrosive agent include benzotriazole compounds and substituted benzotriazole compounds.

< resin layer (X) >

The resin layer (X) is formed by a method of applying the resin composition (a) to one surface of a base film or a metal foil. By adopting the above method, a step of forming the resin composition (a) into a film is not required as compared with a method of laminating a film formed from the resin composition (a) with a base film or a metal foil, and therefore, productivity is high and defects such as air bubbles are less likely to occur between the resin layer (X) and the base film and between the resin layer (X) and the metal foil. The method for applying the resin composition (a) to one surface of the base film or the metal foil is not particularly limited, but a method of melting and applying the resin composition (a) or a method of applying a solution or dispersion of the resin composition (a) is preferable.

As a method of melting and applying the resin composition (a), there can be adopted: a method in which the resin composition (a) is uniformly kneaded to form a melt, and then the melt is extruded onto one surface of a base film or a metal foil, or a method in which the melt is coated with a knife; a method of blowing the resin composition (a) to one surface of a base film or a metal foil and coating the same to melt the same; and the like known methods.

Examples of the method for applying the solution or dispersion of the resin composition (a) include: a known method such as a method of dissolving or uniformly dispersing the resin composition (a) in a solvent, applying or spraying the obtained solution or dispersion to one surface of a base film or a metal foil, and removing the solvent as necessary.

The solvent used for dissolving or dispersing the resin composition (a) is not particularly limited, and examples thereof include alcohols such as methanol, ethanol, propanol, butanol, n-butanol, t-butanol, octanol, and diacetone alcohol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, 1, 4-dioxane, and tetrahydrofuran; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, and isophorone; amides such as N, N-dimethylacetamide, N-dimethylformamide, and N-methyl-2-pyrrolidone; acetates such as methyl acetate, ethyl acetate, isopropyl acetate, and n-butyl acetate; chlorides such as dichloromethane, chlorinated propylene, chlorinated ethylene, and chloroform; dimethyl sulfoxide, acetic acid, terpineol, butyl carbitol and the like. Among them, when the resin composition (a) contains a polyvinyl acetal resin, lower alcohols such as ethanol, propanol, butanol, n-butanol, and tert-butanol are preferable from the viewpoints of ease of solvent removal and solubility of the resin. These 2 or more kinds may be used in combination, and solvents other than the above solvents such as toluene, xylene, cyclohexane and the like may be used in combination within a range not impairing the film-forming property. Further, the plasticizer used in the polyvinyl acetal resin may be contained. On the other hand, when the resin composition (a) contains an ionomer resin or an ethylene-vinyl acetate copolymer resin, toluene, xylene, benzene, trichloroethylene, carbon tetrachloride, mineral essential oils, tetrahydrofuran, and the like are preferable. The concentration of the resin composition (a) in the solution or dispersion is not particularly limited, but is preferably 5 to 30% by mass, more preferably 8 to 20% by mass, based on the total mass of the solution or dispersion.

Among the methods of applying the resin composition (a) to one surface of a base film or a metal foil, a method of applying the molten resin composition (a) using an extruder is particularly suitable. In this case, the temperature of the resin composition (a) during extrusion is not particularly limited as long as the temperature at which the resin composition (a) is melted, and for example, when the resin composition (a) contains a polyvinyl acetal resin, the temperature of the resin composition (a) during extrusion is preferably 150 to 250 ℃, more preferably 170 to 230 ℃. When the resin temperature is excessively high, the polyvinyl acetal resin is decomposed, and the content of volatile substances increases. On the other hand, when the temperature is too low, the content of the volatile substance also increases. In order to effectively remove the volatile substances, it is preferable to remove the volatile substances from the vent of the extruder by reducing the pressure.

< thickness >

The thickness of the resin layer (X) in the step (1) and the step (3) is preferably 1 μm or more, more preferably 5 μm or more, still more preferably 20 μm or more, and particularly preferably 30 μm or more. If the thickness of the resin layer (X) is equal to or greater than the above value, strain or the like of the conductive structure due to shrinkage or deformation of the resin layer (X) is less likely to occur. The thickness of the resin layer (X) is preferably 350 μm or less, more preferably 330 μm or less, still more preferably 270 μm or less, yet more preferably 250 μm or less, particularly preferably 150 μm or less, and most preferably 100 μm or less. When the thickness of the resin layer (X) is equal to or less than the above value, in the case where a resin layer (Y) comprising a polyvinyl acetal resin and a plasticizer, which will be described later, is laminated, the amount of migration of the plasticizer from the resin layer (Y) to the resin layer (X) is reduced, and the reduction in the amount of the plasticizer in the resin layer (Y) is suppressed, so that the head injury index of the laminated glass for vehicles using the film containing a conductive structure is likely to be reduced. The thickness of the resin layer (X) can be measured using a thickness meter, a laser microscope, or the like.

< substrate film >

The resin constituting the base film used in the present invention is not particularly limited, and for example, polyester resins such as polyethylene terephthalate (PET); a polyimide resin; triacetyl chloride (TAC), Polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), and the like. The base film preferably has a suitable adhesiveness to the resin layer (X), and more specifically, is not peeled from the resin layer (X) in the step (2), is removable by means such as peeling from the resin layer (X) when used for producing laminated glass, and is not deformed by shrinkage or the like when heated or when brought into contact with various chemical agents in the step (2). From the above viewpoint, the resin constituting the base film is preferably a polyester resin or a polyimide resin, and particularly preferably PET. The thickness of the base film is preferably 10 to 250. mu.m, more preferably 20 to 150. mu.m, and particularly preferably 30 to 100. mu.m, from the viewpoint of cost and strength.

< Metal foil >

The metal foil used in step (3) is not particularly limited as long as it contains a metal having conductivity, and examples thereof include a copper foil and a silver foil, and among these, a copper foil is preferable.

< Process (4) >

One aspect of the manufacturing method of the present invention is as follows: the method comprises a step (4) of laminating a base film on the resin layer (X) after the step (3) of forming the resin layer (X) on one surface of the metal foil. The method for laminating the substrate film on the resin layer (X) is not particularly limited, and known methods for laminating the resin layer (X) at a temperature not lower than the melting temperature of the resin layer (X) by a pressure-bonding roller, a heating roller, a press, a vacuum laminator, or the like can be mentioned. Among them, a method which can be easily used for a roll-to-roll system pressure bonding roll with high productivity is particularly preferable. In the method using the pressure-bonding roller, the temperature of the resin layer (X) at the time of pressure-bonding is preferably not less than the glass transition temperature (Tg) of the resin composition (a), more preferably not less than Tg +30 ℃, still more preferably not less than Tg +50 ℃, and particularly preferably not less than Tg +70 ℃. The upper limit of the temperature of the resin layer (X) at the time of pressure bonding is not particularly limited. The temperature of the resin layer (X) at the time of pressure bonding is preferably 200 ℃ or lower, more preferably 180 ℃ or lower, and particularly preferably 160 ℃ or lower. When the temperature of the resin layer (X) during pressure bonding is higher than the lower limit, the adhesion between the metal foil and the resin layer (X) and the adhesion between the resin layer (X) and the base film tend to be sufficient, and when the temperature is lower than the upper limit, problems such as thermal decomposition and foaming of the resin layer (X) and reduction in the thickness of the resin layer (X) due to outflow of the resin composition (a) are unlikely to occur. In the method using a heating roller, the lower limit of the surface temperature of the heating roller is preferably higher than the temperature of the thermometer used in the method using a pressure-bonding roller, more preferably higher than the temperature by 10 ℃ or more, and particularly preferably higher than the temperature by 20 ℃ or more.

The preferable embodiment of the base film used in the step (4) is the same as the preferable embodiment of the base film used in the step (1). The presence of the base film used in step (4) makes it possible to suppress the occurrence of wrinkles in step (5) (step of processing a metal foil to form a conductive structure) described later. The base film used in step (4) is present, so that when the base film is formed in a roll form after step (5) described later, the conductive structure can be prevented from coming into contact with the side of the resin layer (X) having no conductive structure.

The step (3) and the step (4) may be performed simultaneously. As a method for simultaneously performing the step (3) and the step (4), a method of inserting a melt, a solution, or a dispersion of the resin composition (a) between the base film and the metal foil may be mentioned.

< Process (5) >

One aspect of the manufacturing method of the present invention is as follows: the method comprises the step (5) of processing the metal foil to form the conductive structure after the step (3) of forming the resin layer (X) on one surface of the metal foil and the step (4) of laminating the base film on the resin layer (X). The method of forming the conductive structure by processing the metal foil is not particularly limited, and examples thereof include a method of forming a conductive structure by etching a metal foil. More specifically, the following methods can be mentioned: after a dry film resist is laminated on the metal foil of the laminated film formed of the metal foil/the resin layer (X)/the base material film obtained in the steps (3) and (4), an etching resist pattern is formed by a photolithography method, and then the laminated film provided with the etching resist pattern is immersed in a copper etching solution to form a conductive structure. The method of forming a conductive structure by etching a metal foil can easily and efficiently form a conductive structure having a desired shape.

< Process (2) >

Another embodiment of the manufacturing method of the present invention is as follows: the method comprises a step (2) of forming a conductive structure on a resin layer (X) after a step (1) of forming the resin layer (X) on one surface of a base film. The method for forming the conductive structure on the resin layer (X) is not particularly limited, and the following methods may be mentioned: a method (i) in which a metal foil is laminated on the resin layer (X), and the metal foil is etched by the above-described method to form a conductive structure; a method (ii) in which a metal layer is formed on the resin layer (X) by vapor deposition or the like, and the metal foil is etched by the above-described method to form a conductive structure; a method (iii) of forming a conductive structure by printing a conductive paste on the resin layer (X); a method (iv) in which a metal line is disposed on the resin layer (X); and the like. Among them, the methods (i) and (ii) are preferable from the viewpoint of producing a conductive structure-containing film with a base film suitable for the production of a laminated glass excellent in front visibility, and the method (i) is more preferable from the viewpoint of production cost. (i) The preferable embodiment of the metal foil used in the method (4) is the same as the preferable embodiment of the metal foil used in the step (3). (i) Of the methods of (1), there is no particular limitation on the method of laminating the metal foil, and: a known method of laminating the resin layer (X) at a temperature not lower than the melting temperature thereof by a pressure-bonding roller, a heating roller, a press, a vacuum laminator, or the like. The preferable temperature of the resin layer (X) at the time of pressure bonding in the method using the pressure bonding roller and the preferable surface temperature of the heating roller in the method using the heating roller are the same as the above-mentioned temperatures as preferable embodiments of the step (4).

< conductive Structure >

The thickness of the conductive structure formed in the step (2) and the step (5) is preferably 1 to 30 μm, more preferably 2 to 20 μm, further preferably 3 to 15 μm, and particularly preferably 3 to 12 μm, from the viewpoint of reducing reflection of light and easily obtaining a desired heat dissipation amount. The thickness of the conductive structure can be measured using a thickness meter, a laser microscope, or the like.

From the viewpoint of ease of etching and availability, the conductive structure is preferably made of copper or silver.

The conductive structure preferably has at least 2 bus bar structures. Examples of a method for forming the bus bar structure include: a method using a bus bar generally used in the art, such as a metal foil tape, a metal foil tape with a conductive adhesive, or a conductive paste; in the case where the conductive structure is formed by etching the metal foil by the above-described method, a bus bar is formed by leaving a part of the metal foil. The power supply lines are connected to at least 2 bus bars, and the power supply lines are connected to a power supply, whereby current can be supplied to the conductive structure.

The conductive structure preferably has a fine metal wire structure between the at least 2 bus bar structures. The metal fine line structure in the present specification means a conductive structure having a line width of 1 to 100 μm. The line width of the fine metal line structure is preferably 1 to 30 μm, more preferably 2 to 15 μm, further preferably 3 to 12 μm, and particularly preferably 3 to 9 μm. When the line width of the conductive structure is within the above range, a sufficient amount of heat radiation can be easily secured, and desired front visibility can be easily obtained.

The conductive structure-containing film with a base film obtained by the production method of the present invention is also one aspect of the present invention.

< step (6) and removal of base film >

A method for producing a conductive structure-containing thin film having no base thin film (hereinafter, simply referred to as "conductive structure-containing thin film") which comprises a step (6) of removing the base thin film from the conductive structure-containing thin film with a base thin film obtained by the above-mentioned production method is also one aspect of the present invention. The conductive structure-containing thin film obtained by the above-described production method is also one aspect of the present invention. The method of removing the base film from the conductive structure-containing film with a base film obtained by the production method of the present invention is not particularly limited, and examples thereof include a method of mechanically peeling off the base film from the interface between the base film and the resin layer (X).

< laminated glass >

A method for producing a laminated glass using the conductive structure-containing film with a base film obtained by the production method of the present invention, and a laminated glass obtained by the production method are also one aspect of the present invention. Examples of the method for producing a laminated glass using a conductive structure-containing film with a base film include the following methods: a manufacturing method (i) including a step (7) of sandwiching and laminating a conductive structure-containing film, in which a base film is removed from a conductive structure-containing film with a base film, between at least 2 sheets of glass; a production method (ii) comprising a step (8) of laminating a glass on a surface of a conductive structure-containing film with a base film, which surface is not provided with the base film, to obtain a laminate, and a step (9) of removing the base film from the laminate, further laminating a glass on the surface which is not provided with the glass, and laminating the glass; a production method (iii) comprising a step of laminating a conductive structure-containing film with a base material film between at least 2 sheets of glass; a method (iv) in which organic glass such as PET is used as a base film, and glass is further placed and laminated on the surface of the conductive structure-containing film with the base film via another layer as necessary; and the like. Among them, the production method of (i) or the production method of (ii) is preferable from the viewpoint of transparency of the obtained laminated glass.

The glass is preferably an inorganic glass from the viewpoint of transparency, weatherability and mechanical strength; organic glass such as a methacrylic resin sheet, a polycarbonate resin sheet, a polystyrene resin sheet, a polyester resin sheet such as polyethylene terephthalate, and a polycycloolefin resin sheet. Among them, inorganic glass, a methacrylic resin sheet, or a polycarbonate resin sheet is preferable, and inorganic glass is particularly preferable. The inorganic glass is not particularly limited, and float glass, tempered glass, semi-tempered glass, chemically tempered glass, green glass, quartz glass, or the like can be given.

In the above method for producing a laminated glass, at least 1 resin layer (Y) may be further sandwiched between at least 2 sheets of glass. Specifically, in the step (7), at least 1 resin layer (Y) may be interposed between the conductive structure-containing film and the glass, or at least 1 resin layer (Y) may be interposed between the conductive structure-containing film with the base film in the step (8) and the glass, and/or between the glass and the laminate from which the base film is removed in the step (9).

The resin layer (Y) preferably contains at least 1 thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ethylene-vinyl acetate copolymer resin, and an ionomer resin, and more preferably contains at least 1 polyvinyl acetal resin. In addition, from the viewpoint of adhesiveness with the resin layer (X), and difficulty in causing reflection, refraction, and the like of light at the adhesion interface with the resin layer (X), it is preferable to contain the same thermoplastic resin as that contained in the resin composition (a).

When the resin layer (Y) contains at least 1 polyvinyl acetal resin, the amount of acetyl groups in the polyvinyl acetal resin based on the vinyl units in the polyvinyl acetal main chain is not particularly limited, but is preferably 0.1 to 20 mol%, more preferably 0.5 to 3 mol%, or 5 to 8 mol%. The acetalization degree of the polyvinyl acetal resin is not particularly limited, but is preferably 40 to 86 mol%, more preferably 45 to 84 mol%, further preferably 50 to 82 mol%, particularly preferably 60 to 82 mol%, and most preferably 68 to 82 mol%. The amount of hydroxyl groups in the polyvinyl acetal resin based on the vinyl units in the polyvinyl acetal main chain is not particularly limited, but is preferably 6 to 26 mass%, more preferably 12 to 24 mass%, more preferably 15 to 22 mass%, and particularly preferably 18 to 21 mass%, and from the viewpoint of obtaining a laminated glass having excellent sound insulation performance, the amount is preferably 6 to 20 mass%, more preferably 8 to 18 mass%, further preferably 10 to 15 mass%, and particularly preferably 11 to 13 mass%. Here, the acetyl group amount, acetalization degree, and hydroxyl group amount have the same meanings as described in the paragraph of < polyvinyl acetal resin >. When the resin layer (Y) contains 2 or more different kinds of polyvinyl acetal resins, the amount of acetyl groups, the acetalization degree, and the amount of hydroxyl groups of at least 1 kind of polyvinyl acetal resin are preferably within the above ranges.

The resin layer (Y) preferably contains a plasticizer. The content of the plasticizer in the resin layer (Y) is preferably 16.0 mass% or more, more preferably 16.1 to 36.0 mass%, further preferably 22.0 to 32.0 mass%, and particularly preferably 26.0 to 30.0 mass% based on the total mass of the resin layer (Y) from the viewpoint of obtaining a laminated glass excellent in impact resistance, and is preferably 30 mass% or more, more preferably 30 to 50 mass%, further preferably 31 to 40 mass%, and particularly preferably 32 to 35 mass% from the viewpoint of obtaining a laminated glass excellent in sound insulation performance. Examples of the plasticizer include the plasticizers described above in the paragraph < plasticizer >.

The method for producing the resin layer (Y) is not particularly limited, and a film produced as follows can be used: the resin composition constituting the resin layer (Y) is uniformly kneaded and then produced by a known film-forming method such as an extrusion method, a rolling method, a pressing method, a casting method, an inflation method, or the like. Further, a commercially available interlayer film for laminated glass can be used.

In the method for producing a laminated glass using the conductive structure-containing film with a base film, the method for laminating is not particularly limited, and a known method can be applied. For example, in the step (7), the conductive structure-containing film obtained by removing the base film from the conductive structure-containing film with the base film and an arbitrary number of resin layers (Y) are stacked on the glass and arranged, and the glass is further stacked thereon, and the conductive structure-containing film and the resin layers (Y) are welded to the glass entirely or partially by raising the temperature as a pre-press bonding step, and then, the glass is treated in an autoclave, whereby lamination can be performed. Further, the conductive structure-containing film and an arbitrary number of resin layers (Y) may be bonded in advance, and then placed between at least 2 sheets of glass and welded to each other at high temperature to perform lamination.

As the pre-pressure bonding step, from the viewpoint of removing excess air or performing light bonding between adjacent layers, there may be mentioned a method of performing deaeration under reduced pressure by a method such as a vacuum bag, a vacuum ring, or a vacuum laminator; a method of degassing with a roll; a method of compression molding at high temperature; etc. of. Examples thereof include: about 2X 10 by vacuum bag method or vacuum ring method described in EP 1235683B1⁴And degassing at the temperature of 130-145 ℃ under Pa. The vacuum laminator is composed of a chamber that can be heated and can be evacuated, and a laminate (laminated glass) is formed in the chamber for about 20 minutes to about 60 minutes. Usually 1Pa to 3X 10⁴The pressure reduction of Pa and the temperature of 100 to 200 ℃ and particularly 130 to 160 ℃ are effective. In the case of using a vacuum laminator, the treatment in the autoclave may not be performed depending on the temperature and pressure. The treatment in an autoclave is, for example, about 1X 10⁶Pa to about 1.5X 10⁶Pa and a temperature of about 100 ℃ to about 145 ℃ for about 20 minutes to about 2 hours.

The upper part of the glass of a windshield of a motor vehicle often has a so-called colored bright-dark area. Thus, the resin layer (X) and/or the resin layer (Y) may be extruded together with the respectively pigmented polymer melt, or at least 1 of the resin layer (X) and the resin layer (Y) may partially have a different coloration.

The resin layer (Y) may have a wedge-shaped thickness profile. Accordingly, the laminate of the present invention may have a tapered thickness profile even when the thickness profile of the resin layer (X) is a parallel plane, and may be used for head-up display (HUD) in a windshield for an automobile.

The laminated glass of the present invention can be used as a laminated glass in a building or a vehicle. For example, the glass can be used for windshields, rear windows, roof windows, side glass, and the like of automobiles, electric trains, automobiles, ships, aircrafts, and the like.

The conductive structure-containing film with a base film obtained by the production method of the present invention can be used for, in addition to laminated glass: heating members for snow fall measures and fog prevention measures such as mirrors, curved mirrors, traffic signals, and traffic signs; heating members for preventing malfunction, such as cameras and sensors, in window glass for automobiles; functional members used in electromagnetic wave transmission/reception, sensors, electromagnetic wave shields, touch panels, anti-theft glasses, displays, and the like; and the like.