阅读说明：本技术 一种交换机光模块散热装置 (Heat dissipation device for optical module of switch ) 是由 张轶杰 于 2019-09-05 设计创作，主要内容包括：本发明公开一种交换机光模块散热装置,包括：光电转换芯片和光纤,还包括基板；所述光电转换芯片设置在基板上,光纤通过板上走线与光电转换芯片电连接。本发明既可有效提高光模块的散热效果,且使高密度部署光口成为可能。(The invention discloses a heat sink for an optical module of a switch, which comprises: the photoelectric conversion chip and the optical fiber also comprise a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate. The invention can effectively improve the heat dissipation effect of the optical module and make high-density arrangement of the optical ports possible.)

1. A switch optical module heat sink comprising: the photoelectric conversion chip and the optical fiber are characterized by also comprising a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate.

2. The switch optical module heat sink of claim 1, wherein a heat sink is further provided on the substrate for dissipating heat from the optoelectronic conversion chip.

3. The switch optical module heat sink of claim 2, wherein the heat sink comprises a heat sink base and a plurality of heat sink sub-boards disposed parallel to each other on the heat sink base.

4. The switch optical module heat sink of claim 3, wherein the optoelectronic conversion chip is disposed on a heat sink base.

5. The switch optical module heat sink according to claim 1 or 2, wherein the optical fiber is electrically connected to the photoelectric conversion chip through a connector.

6. The switch optical module heat sink according to claim 1 or 2, wherein a plurality of photoelectric conversion chips are provided on the substrate.

7. The switch optical module heat sink of claim 1 or 2, wherein the substrate is a PCB board.

Technical Field

The technology relates to the field of heat dissipation devices, in particular to a heat dissipation device of an optical module of a switch.

Background

With the development of communication networks and big data, data centers are also accelerating upgrading, and switches occupy an important part. Switch ports are upgraded from ten million ports a few years ago to the mainstream SFP 25G and QSFP100G interfaces, but at the same time, the heat dissipation problem of network interfaces begins to be highlighted, and at present, the most direct method is to add a small heat sink on an optical cage, which makes the deployment density of the optical ports not too high, and the heat dissipation capability of the small heat sink is very limited. Poor interface heat dissipation can seriously affect the forwarding rate of the optical port chip and thus the signal quality.

Disclosure of Invention

In order to solve the above problems, the present invention provides a heat dissipation device for an optical module of a switch, which can effectively improve the heat dissipation effect.

The technical scheme of the invention comprises the following steps: a switch optical module heat sink comprising: the photoelectric conversion chip and the optical fiber also comprise a substrate; the photoelectric conversion chip is arranged on the substrate, and the optical fiber is electrically connected with the photoelectric conversion chip through the wiring on the substrate.

Further, a heat sink for dissipating heat of the photoelectric conversion chip is provided on the substrate.

Further, the cooling fin comprises a heat dissipation base and a plurality of heat dissipation sub-boards, and the plurality of heat dissipation sub-boards are arranged on the heat dissipation base in parallel.

Further, the photoelectric conversion chip is arranged on the heat dissipation base.

Further, the optical fiber is electrically connected to the photoelectric conversion chip through a connector.

Further, a plurality of photoelectric conversion chips are disposed on the substrate.

Further, the substrate is a PCB.

The heat dissipation device for the optical module of the switch, provided by the invention, has the advantages that the photoelectric conversion chip with large heat productivity is arranged on the substrate, then the optical fiber is connected onto the photoelectric conversion chip by using the on-board wiring method, and the external optical port is only used as the function of butt joint of one optical fiber, so that the heat dissipation space of the photoelectric conversion chip can be enlarged, the heat dissipation area is not limited to the periphery of the optical port, more optical ports can be simultaneously stacked, high-density interface deployment is realized, and the heat dissipation device can be randomly placed according to needs. The invention can effectively improve the heat dissipation effect of the optical module and make high-density arrangement of the optical ports possible.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of the present invention.

In the figure, 1-substrate, 2-photoelectric conversion chip, 3-heat sink, 4-heat sink daughter board, 5-heat sink base, 6-connector, 7-optical fiber.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings by way of specific examples, which are illustrative of the present invention and are not limited to the following embodiments.

As shown in fig. 1, the present embodiment provides a heat dissipation device for an optical module of a switch, including: photoelectric conversion chip 2, optic fibre 7 and base plate 1, photoelectric conversion chip 2 sets up on base plate 1, and optic fibre 7 walks to walk the line and is connected with photoelectric conversion chip 2 electricity on the board. In this embodiment, the photoelectric conversion chip 2 is separated from the optical fiber 7, and the photoelectric conversion chip 2 with a large heat generation amount is separately disposed on the substrate 1, so that the heat dissipation space of the photoelectric conversion chip 2 is effectively enlarged, and the heat dissipation area is not limited to the periphery of the optical port.

In order to further improve the heat dissipation effect, the substrate 1 is further provided with a heat sink 3 for dissipating heat from the photoelectric conversion chip 2. The radiating fin 3 specifically comprises a radiating base and a plurality of radiating daughter boards 4, the radiating daughter boards 4 are arranged on the radiating base in parallel, and the photoelectric conversion chip 2 is arranged on the radiating base. The radiating fin 3 is simple in structure, easy to manufacture and good in radiating effect.

In this embodiment, the substrate 1 may be provided with a plurality of photoelectric conversion chips 2, which may be arbitrarily placed as required to implement the deployment of high-density interfaces. Several photoelectric conversion chips 2 may share one heat sink 3, or one heat sink 3 may be used for each photoelectric conversion chip 2.

In this embodiment, the optical fiber 7 is electrically connected to the photoelectric conversion chip 2 through the connector 6, and the substrate 1 may be a PCB.

The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.