阅读说明：本技术 一种电容封装结构 (Capacitor packaging structure ) 是由 姜健偉 于 2021-08-23 设计创作，主要内容包括：本发明公开了一种电容封装结构,所述气密封装结构包括电容单元、金属上盖、与所述金属上盖固定连接的金属基座,以及用于隔绝所述电容单元与所述金属基座的绝缘件；所述金属基座与所述金属上盖形成用于容纳所述电容单元的腔体；所述电容单元包括电容本体,与所述电容本体电性连接的引脚,所述引脚穿设所述金属基座并与其他电子元件连接；所述绝缘件设置于所述金属基座与所述引脚之间。本发明采用金属材质作为封装外壳,现有对金属材质的工艺能够将金属做到非常轻薄,因此,即便电容片的体型较大,整个电容封装结构也能够保持非常小的体积。(The invention discloses a capacitor packaging structure which comprises a capacitor unit, a metal upper cover, a metal base fixedly connected with the metal upper cover and an insulating part for isolating the capacitor unit from the metal base, wherein the metal base is provided with a plurality of grooves; the metal base and the metal upper cover form a cavity for accommodating the capacitor unit; the capacitor unit comprises a capacitor body and pins electrically connected with the capacitor body, and the pins penetrate through the metal base and are connected with other electronic elements; the insulator is arranged between the metal base and the pins. According to the invention, the metal material is adopted as the packaging shell, and the metal can be very light and thin by the existing metal material process, so that the whole capacitor packaging structure can keep very small volume even if the size of the capacitor plate is larger.)

1. A capacitor packaging structure, comprising:

the capacitor comprises a capacitor unit, a metal upper cover, a metal base fixedly connected with the metal upper cover and an insulating part for isolating the capacitor unit from the metal base;

the metal base and the metal upper cover form a cavity for accommodating the capacitor unit;

the capacitor unit comprises a capacitor body and pins electrically connected with the capacitor body, and the pins penetrate through the metal base and are connected with other electronic elements;

the insulator is arranged between the metal base and the pins.

2. The capacitive packaging structure of claim 1, wherein the insulator comprises an insulating sleeve;

the insulating sleeve is sleeved between the pin and the metal base.

3. The capacitor packaging structure of claim 2, wherein the insulating sleeve is made of glass.

4. The capacitor packaging structure according to claim 2, wherein the leads include a support portion connected to the capacitor unit, an intermediate portion sleeved on the insulating sleeve, and an extension portion connected to other electronic components;

the cross section of the supporting part is larger than that of the middle part and smaller than that of the insulating sleeve, the top of the supporting part is electrically connected with the capacitor body, and the bottom of the supporting part is abutted to the insulating sleeve.

5. The capacitive packaging structure of claim 4, wherein the length of the middle portion is greater than the height of the metal base;

the extension part has a gap with the bottom of the metal base.

6. The capacitor packaging structure of claim 1, wherein the insulating member comprises an insulating pad, and the metal base and the extension portion of the pin abut against the insulating pad.

7. The capacitor packaging structure as claimed in claim 6, wherein the bottom of the insulating pad is provided with a polarity mark of the pin.

8. The capacitor packaging structure of claim 1, wherein four corners of the top cover body are rounded.

9. The capacitor packaging structure of claim 6, wherein the insulating spacers wrap around four corners of the metal base.

10. The capacitor packaging structure according to any one of claims 1 to 9, wherein the metal upper cover includes an upper cover body, and an extending cover formed by extending an edge of the upper cover body horizontally outwards;

the metal base is provided with a groove matched with the extension cover.

Technical Field

The present invention relates to electronic devices, and particularly to a capacitor package structure.

Background

The conventional capacitor adopts a winding type capacitor, wherein a positive electrode, a negative electrode and electrolytic paper are wound together to form a cylinder, and then electrolyte and the like are added to form the winding type capacitor. This results in a large limitation in the size of the formed capacitor element, and in industrial production, the existing production process is close to the limit. Therefore, the solid laminated polymer capacitor can be produced.

A solid state laminated polymer capacitor, also called a sheet type conductive polymer capacitor (MLPC), is a widely used capacitive element. A plurality of capacitors deposited with conductive polymers are clicked and welded together, and finally, the capacitors are packaged by resin and carbon paste silver paste to form the solid aluminum capacitor.

The capacitor is required to be packaged after being laminated, at present, the most commonly adopted mode is to laminate a capacitor sheet on a lead frame, wherein an anode part penetrates through aluminum oxide of an anode by laser welding to realize conduction and fixation of the anode, a cathode part realizes conduction and fixation with the lead frame by silver paste, and finally, the whole body is packaged by insulating plastic. The plastic material itself is not water-resistant, and the air tightness and reliability are reduced after oxidation.

Disclosure of Invention

The invention provides a capacitor packaging structure aiming at the defects of the prior art, and aims to solve the technical problem of the prior capacitor packaging structure.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a capacitor packaging structure, comprising:

the capacitor comprises a capacitor unit, a metal upper cover, a metal base fixedly connected with the metal upper cover and an insulating part for isolating the capacitor unit from the metal base;

the metal base and the metal upper cover form a cavity for accommodating the capacitor unit;

the capacitor unit comprises a capacitor body and pins electrically connected with the capacitor body, and the pins penetrate through the metal base and are connected with other electronic elements;

the insulator is arranged between the metal base and the pins.

The capacitor packaging structure, wherein the insulator comprises an insulating sleeve;

the insulating sleeve is sleeved between the pin and the metal base.

The capacitor packaging structure is characterized in that the insulating sleeve is made of glass.

In the capacitor packaging structure, the pins include a supporting portion connected with the capacitor unit, an intermediate portion sleeved on the insulating sleeve, and an extending portion connected with other electronic components;

the cross section of the supporting part is larger than that of the middle part and smaller than that of the insulating sleeve, the top of the supporting part is electrically connected with the capacitor body, and the bottom of the supporting part is abutted to the insulating sleeve.

The capacitor packaging structure, wherein the length of the middle part is greater than the height of the metal base;

the extension part has a gap with the bottom of the metal base.

The capacitor packaging structure, wherein the insulating part comprises an insulating gasket, and the metal base and the extending part of the pin are abutted to the insulating gasket.

In the capacitor packaging structure, the bottom of the insulating gasket is provided with a polarity mark of a pin.

The capacitor packaging structure is characterized in that four corners of the upper cover body are fillets.

The capacitor packaging structure is characterized in that the insulating gasket wraps four corners of the metal base.

The capacitor packaging structure comprises a metal upper cover, a capacitor packaging structure and a capacitor, wherein the metal upper cover comprises an upper cover body and an extension cover, and the edge of the upper cover body extends outwards and horizontally to form the extension cover;

the metal base is provided with a groove matched with the extension cover.

Has the advantages that: compared with the prior art, the capacitor packaging structure provided by the invention adopts the metal material as the packaging shell, and the metal can be very light and thin by the conventional metal material process, so that the whole capacitor packaging structure can keep a very small volume even if the size of the capacitor sheet is large. The metal material has an important defect that the metal material has conductivity, so that an insulating member is arranged between the capacitor unit and the packaging shell to realize insulation between the capacitor unit and the packaging shell.

Drawings

Fig. 1 is an exploded view of a capacitor package structure according to the present invention.

Fig. 2 is a cross-sectional view of a capacitor package structure provided in the present invention.

Fig. 3 is a first perspective view of the capacitor packaging structure provided by the present invention.

Fig. 4 is a second perspective view of the capacitor packaging structure provided by the present invention.

Fig. 5 is a perspective view of the capacitor package structure without the metal top cover according to the present invention.

The meanings marked in the drawings are as follows:

100, packaging the shell; 110, a metal upper cover; 110a, an upper cover body; 110b, an extension cap; 120, a metal base; 200, a capacitor unit; 210, a capacitor body; 211, a release liner; 212, positive side; 213, the negative side; 214, conductive glue; 215, capacitor plates; 220, a pin; 220a, a support portion; 220b, an intermediate portion; 220c, an extension; 221, a first pin; 222, a second pin; 230, a clamping assembly; 230a, a spring plate; 230b, a clamping portion; 231, a first horizontal portion; 232, a folded corner portion; 233, a second horizontal portion; 234, a grasping segment; 235, a through hole; 300, an insulating member; 310, an insulating sleeve; 320, an insulating gasket; 321, polarity flag.

Detailed Description

The present invention provides a capacitor package structure, which is described in further detail below with reference to the accompanying drawings and examples, so as to make the objects, technical solutions and effects of the present invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The invention will be further explained by the description of the embodiments with reference to the drawings.

Although the airtight package can also adopt ceramic to construct the cavity and place the capacitor, the larger the ceramic cavity, the deeper the depth required by the cavity, and the thicker the ceramic thickness, therefore, when the size of the capacitor is larger, the volume of the whole capacitor package structure is very large, which is not beneficial to the size reduction, and meanwhile, the cost is increased.

The existing process for metal materials can make metal very light and thin, so that the whole capacitor packaging structure can keep very small volume even if the size of a capacitor plate is large. The metal material has an important drawback in that the metal material has conductivity, and therefore, in order to realize the capacitor structure using the metal material as the housing, the existing package structure needs to be improved.

This scheme provides a electric capacity packaging structure. The capacitor packaging structure is mainly used for fixing and mounting the MLPC, but can also be applied to other capacitor mounting.

As shown in fig. 1, the capacitor package structure is mainly divided into two parts, one is a package housing 100 and the other is a capacitor unit 200. The capacitor unit 200 mainly includes a capacitor body 210 and a lead 220 led out from the capacitor body 210. In the present embodiment, the capacitor body 210 mainly refers to an MLPC, and the pins 220 penetrate through the metal base 120 and are connected to other electronic components. Since the positive and negative electrodes of the pin 220 are different, the pin 220 is divided into a first pin 221 connected to the positive electrode and a second pin 222 connected to the negative electrode. The number of the first pins 221 and the second pins 222 may be plural, and as shown in fig. 1, the number of the first pins 221 and the second pins 222 is 2.

The package housing 100 has a cavity therein, and the capacitor unit 200 is disposed in the cavity inside the package housing 100.

In order to realize high-air-tightness packaging of the capacitor unit 200, the main material of the housing in this embodiment is a metal material, and includes a metal upper cover 110 and a metal base 120 fixedly connected to the metal upper cover 110. A cavity for accommodating the capacitor unit 200 is formed between the metal upper cover 110 and the metal base 120.

Since the metal has conductivity, an insulator 300 is further provided between the capacitor unit 200 and the package case 100. The metal top cover 110 is not directly connected to the capacitor unit 200, and therefore the insulator 300 is mainly used to isolate the capacitor unit 200 from the metal base 120.

There are three places where the metal base 120 and the capacitor unit 200 may be in direct contact, the first place is the bottom of the capacitor body 210 and the upper surface of the metal base 120, the second place is between the pin 220 and the metal base 120 when the pin 220 penetrates through the metal base 120, the third place is the lower surface of the metal base 120 and the extension c of the pin 220, and the extension c is a portion where the pin 220 extends from the middle portion 220b and is connected with other electronic components.

As shown in fig. 1 and 2, in order to avoid the above mentioned possible direct contact, the insulating member 300 includes an insulating sleeve 310, the insulating sleeve 310 refers to a sleeving structure capable of realizing insulation, and the material of the insulating sleeve 310 may be insulating plastic, such as polyvinyl chloride, polypropylene. In this embodiment, the insulating sleeve 310 is embedded in the package housing 100, so if a problem occurs in the insulating sleeve 310, it is difficult to see the inside and replace the insulating sleeve. Therefore, in this embodiment, the insulating cover 310 is made of insulating glass, so that the insulating glass has high mechanical strength, is not easy to crack, is difficult to age, and has high stability, and therefore, cracks or damages can be found by the appearance inspection due to the transparency of the glass.

To avoid the other two direct contact methods, the pin 220 is divided into a supporting portion 220a directly connected to the capacitor unit 200, a middle portion 220b sleeved on the insulating sleeve 310, and an extending portion c. In the first implementation manner, the insulating sleeve 310 also sleeves the supporting portion 220a and the extending portion c, and supports the capacitor unit 200 together, so as to ensure that the capacitor unit 200 is insulated from the metal base 120. This approach does not facilitate the connection of the pins 220 with the capacitor unit 200 and the extension of the pins 220.

In the second implementation manner, the cross section of the supporting portion 220a is larger than that of the middle portion 220b and smaller than that of the insulating sleeve 310, the supporting portion 220a and the insulating sleeve 310 are abutted to each other, a gap exists between the metal base 120 and the capacitor unit 200 due to the existence of the supporting portion 220a, the two are not in direct contact, and the length of the middle portion 220b is larger than the thickness of the metal base 120, so that the extending portion c is not in direct contact with the bottom of the metal base 120, and the insulation between the metal base 120 and the capacitor unit 200 is realized.

Although the extension c may also be insulated in a similar manner, or the length of the middle portion 220b of the pin 220 is greater than the height of the metal base, so that there is a gap between the extension c and the metal base to achieve insulation therebetween.

However, when the above-mentioned method is applied to the extension portion c and the metal base 120, the lead is weak when the capacitor package structure is mounted on the component carrier. Therefore, in the third implementation manner of the present embodiment, the insulating member 300 includes an insulating pad 320, and the insulating pad 320 is installed between the metal base 120 and the extension portion c of the pin 220. The insulating gasket 320 has elasticity, which can provide more elasticity for the hermetic package of the capacitor after installation, and completely insulate the metal base 120 from the extension c of the lead 220. Since the insulating spacer 320 is disposed between the metal base 120 and the lead 220, it may be easily replaced if there is a breakage.

In order to facilitate identification of the first pin 221 and the second pin 222 in the pin 220, a polarity mark 321 of the pin 220 is further disposed at the bottom of the insulating pad 320, as shown in fig. 3, the polarity mark 321 corresponding to the first pin 221 is "-" to indicate an anode of the electronic component to be connected subsequently, and the polarity mark 321 corresponding to the second pin 222 is "+" to indicate a cathode of the electronic component to be connected subsequently.

The metal upper cover 110 includes an upper cover body 110a and an extension cover 110b formed by horizontally extending an edge of the upper cover body 110a outward. Meanwhile, the metal base 120 is provided with a groove matched with the extension cover 110b, and when the metal upper cover 110 and the upper cover body 110a are closed, the extension cover 110b is matched with the groove of the metal base 120. In order to realize the fixed connection between the metal upper cover 110 and the metal base 120, the extending cover 110b and the groove are connected by welding, dispensing and other methods, so that the air tightness of the whole capacitor packaging structure is improved.

In order to reduce the cost of the metal base 120, in the embodiment, the groove of the metal base 120 is a notch on the edge of the metal base 120. If the metal base 120 is impacted, the metal top cover 110 may be affected, and the areas of the metal base 120 most susceptible to the impact are the four corners of the metal base 120, so in this embodiment, the insulating spacers 320 at least include the four corners of the metal base 120.

Further, as shown in fig. 4, in order to improve the pressure resistance of the upper cover, four corners of the upper cover body 110a are set to be rounded corners, and the rounded corners can disperse pressure through the arc surface of the rounded corners when facing impact.

The number of capacitor plates 215, the size and thickness of the capacitor body 210 formed therewith, will also increase as the required capacitance value increases. The increase in thickness and size also presents challenges to the shock resistance of capacitor-based packaging structures.

In the embodiment of the present disclosure, the capacitor unit 200 is modified, and a clamping assembly 230 for clamping the capacitor body is added on the basis of the original capacitor body 210 and the pins 220, and the pins 220 are not directly connected to the capacitor body 210, but are connected to the clamping assembly 230. The clamping member 230 itself has conductivity, so that the capacitor body 210 can be connected to the pins 220 through the clamping member 230. Meanwhile, the clamping assembly 230 includes a clamping portion 230b for clamping the capacitor body, and further includes a spring piece 230a connected to the pin 220.

The clamping assembly 230 with the elastic sheet 230a can clamp the capacitor body 210 to fix the capacitor body 210, and on one hand, the elastic sheet 230a has elasticity, so that when impact or vibration exists outside, the elasticity of the elastic sheet 230a can play a role in buffering, and the shock resistance is improved.

Further, as shown in fig. 1 and 5, if the capacitor is MLPC, the capacitor body 210 is composed of a plurality of capacitor pieces 215, and the positive electrode of MLPC is aluminum foil and has no conductivity, so the positive electrode of the capacitor piece 215 is punched through by a laser spot to expose aluminum, and then is electrically connected to other capacitor pieces 215 through the conductive adhesive 214. The conductive paste 214 may include gold conductive paste 214, silver conductive paste 214, and the like. The positive electrode side 212 and the negative electrode side 213 are electrically connected to other capacitor plates 215 through conductive paste 214 for balancing the positive electrode and the negative electrode. On the capacitor sheet 215, an insulating paste 211 is also provided between the conductive sheets to separate the positive electrode and the negative electrode.

In addition, the sidewall of the capacitor body 210 is connected to the clamping portion 230b of the clamping assembly 230 by the conductive adhesive 214, which improves the conductivity between the clamping assembly 230 and the capacitor body 210, and improves the stability between the clamping assembly 230 and the capacitor body 210.

The elastic piece 230a includes a first horizontal portion 231, a second horizontal portion 233, and a bent portion 232 connecting the first horizontal portion 231 and the second horizontal portion 233. The bottom of the first horizontal portion 231 is electrically connected to the lead 220, and the second horizontal portion 233 is connected to the holding portion 230 b. Since the clamping element 230 itself is conductive, the clamping portion 230b is electrically connected to the sidewall of the capacitor body 210 and can be transmitted to the leads 220 through the second horizontal portion 233, the bent portion 232 and the first horizontal portion 231.

In order to improve the electrical conductivity, in this embodiment, the upper surface of the second horizontal portion 233 is provided with a conductive member for typically connecting with the bottom of the capacitor body 210, preferably the conductive member is the conductive adhesive 214.

The clamping portion 230b includes a gripping section 234, and the gripping section 234 is a section for gripping. In this embodiment, the through holes 235 are formed in the grasping section 234 to facilitate mounting the capacitor body 210 in the holding assembly 230 during mounting and to facilitate dispensing.

When the capacitor packaging structure is used for packaging the capacitor, the unprocessed capacitor plate 215 is placed on the clamping component 230, and then the spring plate 230a of the clamping component 230 is folded to fasten the capacitor.

Switch on electric capacity piece 215, the process of switching on can be worn the aluminium foil, exposes aluminium, adopts the silver-colored glue to connect electric capacity piece 215's positive pole, adopts the silver-colored glue to carry out the UNICOM to electric capacity piece 215's negative pole simultaneously, forms electric capacity body 210. Then, the capacitor body 210 and the leads 220 are connected, and the leads 220 are inserted through the metal base 120 covered by the insulating cover 310. An insulating spacer 320 is attached to the bottom of the metal base 120 in advance, and the pin 220 passes through the insulating spacer 320 and extends outward to form an extension c. Finally, the metal upper cover 110 and the metal base 120 are covered and fixed by welding or the like, so as to obtain the packaging structure with the capacitor in the embodiment.