Semiconductor wafer flattening equipment
阅读说明：本技术 一种半导体晶圆平坦化设备 (Semiconductor wafer flattening equipment ) 是由 邓筑蓉 于 2019-10-31 设计创作，主要内容包括：本发明公开了一种半导体晶圆平坦化设备,其结构包括控制板、装置壳体、信号灯、工作舱、平坦研磨装置,其特征在于：平坦研磨装置位于工作舱设有信号灯的一侧的下端并且嵌入工作舱内部两者采用机械焊接的方式固定连接,信号灯垂直于工作舱上端表面并且与工作舱活动连接,装置壳体与工作舱为左右相衔接的一体化结构,本发明的有益效果：通过清扫器与限位器的配合,以弧形柱缔造流水的运动趋势,配合头尾相连的螺旋板体的轮盘提供的止流作用,来集合废料,同时使用上形状可变得软垫块受压形变和横向排列的绒毛层结构来勾牵剩余废料,进入进料架内部,循环往复,达到不在待磨表面余留飞出的废料,极大程度来保证晶圆的平坦度控制。(The invention discloses semiconductor wafer flattening equipment, which structurally comprises a control panel, a device shell, a signal lamp, a working cabin and a flat grinding device, and is characterized in that: the flat grinding device is positioned at the lower end of one side of the working cabin, which is provided with the signal lamp, and is embedded into the working cabin, the flat grinding device and the working cabin are fixedly connected in a mechanical welding mode, the signal lamp is vertical to the surface of the upper end of the working cabin and is movably connected with the working cabin, and the device shell and the working cabin are of an integrated structure which is connected left and right, so that the flat grinding device has the beneficial effects that: through the cooperation of sweeper and stopper to the motion trend of flowing water is set up to the arc post, cooperates the stagnant flow effect that the rim plate of the spiral plate body of end to end provided, comes the set waste material, uses simultaneously that the shape can become soft cushion compression deformation and transversely arranged's tapetum structure to collude and lead surplus waste material, gets into inside the feed frame, and the circulation is reciprocal, reaches not waiting to grind the remaining waste material that flies out of surface, and the flatness control of wafer is guaranteed to very big degree.)
1. The utility model provides a semiconductor wafer flattening equipment, its structure includes control panel (1), device casing (2), signal lamp (3), work cabin (4), flat grinder (5), its characterized in that:
the flat grinding device (5) is positioned at the lower end of one side of the working cabin (4) provided with the signal lamp (3) and is embedded into the working cabin (4), the flat grinding device and the working cabin are fixedly connected in a mechanical welding mode, the signal lamp (3) is perpendicular to the upper end surface of the working cabin (4) and is movably connected with the working cabin (4), the device shell (2) and the working cabin (4) are of an integrated structure which is connected in a left-right mode, and the device shell (2) is of a rectangular block structure, and an embedded control panel (1) is arranged on the front end face of the device shell (2);
the flat grinding device (5) is provided with a grinding wheel device (51), an assembling plate (52), a sliding chute (53), an oil hydraulic cylinder (54) and a fixing frame (55), the grinding wheel device (51) is vertically arranged at one end of the upper end surface of the assembly plate (52) provided with a fixing frame (55), the sliding grooves (53) and the grinding wheel device (51) are arranged on the left side and the right side of the end surface of the assembly plate (52) in a relative position relationship and are integrated with the assembly plate (52), the oil hydraulic cylinder (54) and the sliding chute (53) are mutually vertical and are connected with the sliding chute (53) in a clearance fit way through a sliding block below the shell of the oil hydraulic cylinder (54), the fixing frame (55) is located between the grinding wheel device (51) and the oil hydraulic cylinder (54) and is fixedly connected with the oil hydraulic cylinder (54) in a mechanical welding mode, and a foldable pipeline structure is arranged on the fixing frame (55).
2. The semiconductor wafer planarization apparatus of claim 1, wherein: grinding wheel device (51) is equipped with support (a), grinds panel (b), flange (c), sweeper (d), stopper (e), support (a) lie in the outside arc surface of flange (c) and constitute integrated structure through mechanical welding's mode with flange (c), grind panel (b) and support (a) fixed connection, stopper (e) alternate and install the clearance between grinding panel (b) and grinding panel (b), sweeper (d) depend on and install at stopper (e) medial surface, grinding panel (b) is equipped with coarse protruding structure for the surface of circular arc rectangle block.
3. The semiconductor wafer planarization apparatus of claim 2, wherein: the sweeper (d) is provided with a movable device (d1), a spring wheel (d2), a limiting block (d3) and a supporting block (d4), the supporting block (d4) is fixedly connected with the limiting block (d3), the spring wheel (d2) is located between the limiting block (d3) and the supporting block (d4) and fixedly connected with the limiting block (d3) in a plate body welding mode, the movable device (d1) wraps the outer side end face of the spring wheel (d2) and is connected with the spring wheel (d2) in a surface-face contact clearance fit mode, and the supporting block (d4) is of a rectangular block structure and an inclined triangular structure combined special-shaped structure.
4. The semiconductor wafer planarization apparatus of claim 3, wherein: the movable device (d1) is provided with a through hole column (d11), a wedge-shaped block (d12), a plush layer (d13) and a cushion block (d14), the wedge-shaped block (d12) is positioned on the upper side end face of the through hole column (d11), the wedge-shaped block and the through hole column (d11) are perpendicular to each other and are mechanically welded to form an integrated structure, the soft cushion block (d14) is mechanically connected with the wedge-shaped block (d12), the plush layer (d13) is flatly laid and mounted on the upper side surface of the soft cushion block (d14) in a mechanical welding mode to form the integrated structure, the plush layer (d13) is in a rectangular transverse row and is provided with a rough plush special-shaped structure at one end, and the soft cushion block (d14) is in a 7-shaped folded plate structure and is provided with a round spherical cushion structure.
5. The semiconductor wafer planarization apparatus of claim 2, wherein: stopper (e) are equipped with rim plate (e1), arc post (e2), feeding frame (e3), baffle (e4), cylinder (e5), arc post (e2) encircle to laminate in feeding frame (e3) terminal surface and keep away from one side of cylinder (e5), the inside of cylinder (e5) perpendicular embedding feeding frame (e3) is simultaneously with feeding frame (e3) welding constitution integrated structure, rim plate (e1) winding is pasted and is tightly adopted mechanical welding's mode fixed connection in the circular arc terminal surface of cylinder (e5) simultaneously with cylinder (e5), baffle (e4) and rim plate (e1) fixed connection, arc post (e2) has the rectangular block structure on circular arc inclined plane for one side.
6. The semiconductor wafer planarization apparatus of claim 1, wherein: the wheel disc (e1) is of an oval head-to-tail single-face thin plate structure.
Technical Field
The invention relates to the field of semiconductors, in particular to semiconductor wafer planarization equipment.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and in the processing process, the purpose of use needs to be achieved through various processing technologies, wherein the flatness control of the wafer is to process the wafer through a mechanochemical grinding mode, and the flatness is crucial to the use of a finished product, when the current semiconductor wafer flattening equipment is used for flattening process, the polishing operation is usually carried out by matching a grinding cutter which is flattened vertically downwards with pressure, and rotating as power through the cooling of grinding fluid, but the wafer has the following defects:
carry out the back of face through grinding cutter and carrier, the cutter is through the easy collapse of wafer carrier surface atress behind, cause the back of having fritter or likepowder granule departure, at present wash and grind the work simultaneously with the lapping liquid again, but have certain rotatory traction force easily to be drawn into the waste material at the rotatory in-process of cutter, because the waste material is mostly the polyhedron, scrape the surface of flower wafer carrier easily in following the rotation of cutter, thereby influence the surface flatness of wafer carrier, reduce the rate of utilization of wafer.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: the utility model provides a semiconductor wafer flattening equipment, its structure includes control panel, device casing, signal lamp, work cabin, flat grinder, its characterized in that: the flat grinding device is located at the lower end of one side, provided with the signal lamp, of the working cabin and is embedded into the working cabin, the flat grinding device and the working cabin are fixedly connected in a mechanical welding mode, the signal lamp is perpendicular to the upper end surface of the working cabin and is movably connected with the working cabin, the device shell and the working cabin are of an integrated structure which is connected in a left-right mode, and the device shell is of a rectangular block structure and is provided with an embedded control panel on the front end face of the device shell.
The flat grinding device is further optimized to be provided with a grinding wheel device, an assembly plate, a sliding groove, an oil hydraulic cylinder and a fixing frame, wherein the grinding wheel device is vertically installed at one end, provided with the fixing frame, of the upper end face of the assembly plate, the sliding groove and the grinding wheel device are installed on the left side and the right side of the end face of the assembly plate in a relative position relation and are in an integrated structure with the assembly plate, the oil hydraulic cylinder and the sliding groove are perpendicular to each other and are in clearance fit connection with the sliding groove through a sliding block below a shell of the oil hydraulic cylinder, the fixing frame is located between the grinding wheel device and the oil hydraulic cylinder and is fixedly connected with the oil hydraulic cylinder in a mechanical welding mode, a foldable pipeline structure is arranged on the fixing frame, and grinding fluid can be.
As a further optimization of the invention, the grinding wheel device is provided with a support, a grinding panel, a flange, a sweeper and a limiter, wherein the support is positioned on an outer arc surface of the flange and forms an integrated structure with the flange in a mechanical welding mode and is fixedly connected with the support, the limiter is inserted into a gap between the grinding panel and the grinding panel, the sweeper is attached to the inner end surface of the limiter, the surface of the grinding panel which is an arc rectangular block body is provided with a rough convex structure, and the grinding panel is positioned at one end of the support, which is far away from the flange.
As a further optimization of the sweeper, the sweeper is provided with a movable device, a spring wheel, a limiting block and a supporting block, the supporting block is fixedly connected with the limiting block, the spring wheel is positioned between the limiting block and the supporting block and is fixedly connected with the limiting block through a plate body in a welding mode, the movable device wraps the outer end face of the spring wheel and is in clearance fit connection with the spring wheel in a surface-to-surface contact mode, the supporting block is a special-shaped structure formed by combining a rectangular block structure and an oblique triangular structure, and the supporting block is positioned on the right side of the limiting block and is parallel to the limiting block in the left-right direction.
As a further optimization of the invention, the movable device is provided with a through hole column, a wedge block, a plush layer and a cushion block, wherein the wedge block is positioned on the upper end face of the through hole column, the wedge block and the wedge block are mutually vertical and are mechanically welded with the through hole column to form an integrated structure, the soft cushion block is mechanically connected with the wedge block, the plush layer is flatly laid on the upper surface of the soft cushion block, the wedge block and the soft cushion block are mechanically welded to form an integrated structure, the plush layer is in a rectangular transverse row and is provided with a rough plush special-shaped structure at one end, the soft cushion block is in a 7-shaped folded plate structure and is provided with a round ball cushion structure at one end, and the soft cushion block is positioned on one side, far away.
As a further optimization of the invention, the limiter is provided with a wheel disc, an arc-shaped column, a feeding frame, a baffle plate and a column body, wherein the arc-shaped column surrounds and is attached to one side, far away from the column body, of the end surface of the feeding frame, the column body is vertically embedded into the feeding frame and is welded with the feeding frame to form an integrated structure, the wheel disc is wound and attached to the arc-shaped end surface of the column body and is fixedly connected with the column body in a mechanical welding mode, the baffle plate is fixedly connected with the wheel disc, the arc-shaped column is of a rectangular block structure with an arc inclined surface on one side, and the arc-shaped column and the feeding frame form the integrated.
As a further optimization of the invention, the wheel disc is of an elliptical head-tail connected single-face thin plate structure, and is arranged in the center of the through hole of the feeding frame.
Advantageous effects
The invention relates to a semiconductor wafer flattening device, which is characterized in that when the flattening device works, raw materials are fixedly arranged on a fixed frame in advance, high-pressure oil bodies are pressed into an oil pressure cylinder for fastening, the raw materials arranged above the fixed frame can be well matched with the raw materials to be ground for transverse displacement through the transverse movability of a sliding chute, after the flattening device is assembled, a motor is started, a grinding wheel device starts to work after the raw materials are fixed through a flange and inherits the power transmitted by the motor, an arc grinding panel is used for contacting the grinding surface of the raw materials to be ground, a pipeline on the fixed frame is adjusted to a proper angle, grinding fluid is output, then the waste materials ground and flying out through the grinding panel in point contact have a certain flowing trend through the flowability of the grinding fluid by matching with an arc surface on an arc column, so that the grinding fluid mixed with the waste materials flows into a feeding frame, and the rim plate of spiral winding on the cylinder is certain tiltability for the inward has, rivers get into the back along the rim plate, because the rim plate head and the tail link to each other, and rotatory centrifugal force that brings only can say that the waste material is thrown away and hugs closely on the plate face of rim plate, thereby prevent the backward flow outflow of waste material, simultaneously grind the panel past back, what the trail comes is the soft cushion on the activity ware, receiving horizontal extrusion force, the spring wheel pulls back the wedge with the tensile force of spring, and the soft cushion of top also can receive the block of pressure formation face bodily form, sweep remaining waste material inside the feeding frame, the fine hair on the fine hair layer of the same year rear side, can clip the waste material, and because softer texture, can not exert pressure, the injury of waste material to waiting to grind the surface has been avoided, the flatness of improvement wafer of very big limit.
Compared with the prior art, the invention has the following advantages:
through the cooperation of sweeper and stopper to the motion trend of flowing water is set up to the arc post, cooperates the stagnant flow effect that the rim plate of the spiral plate body of end to end provided, comes the set waste material, uses simultaneously that the shape can become soft cushion compression deformation and transversely arranged's tapetum structure to collude and lead surplus waste material, gets into inside the feed frame, and the circulation is reciprocal, reaches not waiting to grind the remaining waste material that flies out of surface, and the flatness control of wafer is guaranteed to very big degree.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a semiconductor wafer planarization apparatus according to the present invention.
FIG. 2 is a schematic structural diagram of a flat polishing apparatus of a semiconductor wafer planarization apparatus according to the present invention.
FIG. 3 is a schematic structural diagram of a grinding wheel device of a semiconductor wafer planarization apparatus according to the present invention.
Fig. 4 is an enlarged structural view of a grinding wheel device a of a semiconductor wafer planarization apparatus according to the present invention.
FIG. 5 is a schematic diagram of an operation swing displacement structure of a sweeper of the semiconductor wafer planarization apparatus according to the present invention.
FIG. 6 is a schematic view of a semiconductor wafer planarization apparatus with a movable device according to the present invention.
FIG. 7 is a schematic view of a stopper of a semiconductor wafer planarization apparatus according to the present invention.
In the drawing, a control panel-1, a device shell-2, a signal lamp-3, a working cabin-4, a flat grinding device-5, a grinding wheel device-51, an assembly plate-52, a chute-53, an oil hydraulic cylinder-54, a fixed frame-55, a bracket-a, a grinding panel-b, a flange-c, a sweeper-d, a stopper-e, a movable device-
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
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