阅读说明：本技术 膜片阀、阀部件和用于形成阀部件的方法 (Diaphragm valve, valve part and method for forming valve part ) 是由 J·舒格鲁 于 2019-07-09 设计创作，主要内容包括：公开一种膜片阀。所述膜片阀可以包含阀体,所述阀体包括阀通道,所述阀通道包含入口通道和出口通道。所述膜片阀还可以包含：阀座,其邻近于所述阀通道；及柔性膜片,其包括润湿表面和相对的非润湿表面,所述柔性膜片安置成邻近于所述阀通道。所述膜片阀还可以包含：柔性加热器,其安置在所述柔性膜片的所述非润湿表面上方；及阀致动器,其能够用于将所述柔性膜片的所述润湿表面移动到与所述阀座接触和不与所述阀座接触。还公开了包含柔性加热器的阀部件和用于形成此类阀部件的方法。(A diaphragm valve is disclosed. The diaphragm valve may comprise a valve body including a valve passage comprising an inlet passage and an outlet passage. The diaphragm valve may further comprise: a valve seat adjacent to the valve passage; and a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm disposed adjacent to the valve channel. The diaphragm valve may further comprise: a flexible heater disposed over the non-wetting surface of the flexible membrane; and a valve actuator operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat. Valve components including the flexible heater and methods for forming such valve components are also disclosed.)

1. A diaphragm valve, comprising:

a valve body comprising a valve passage including an inlet passage and an outlet passage;

a valve seat adjacent to the valve passage;

a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm disposed adjacent to the valve channel;

a flexible heater disposed over the non-wetting surface of the flexible membrane; and

a valve actuator operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat.

2. The diaphragm valve of claim 1, further comprising a flexible temperature sensor disposed over the non-wetting surface of the flexible diaphragm.

3. The membrane valve of claim 2, wherein the flexible temperature sensor comprises a flexible printed thermocouple comprising a first printed thermocouple element comprising a first metal-containing ink and a second printed thermocouple element comprising a second metal-containing ink, the first printed thermocouple element in electrical contact with the second printed thermocouple element thereby forming a thermocouple junction.

4. The diaphragm valve of claim 2, wherein the flexible temperature sensor is disposed directly above the non-wetting surface of the flexible diaphragm.

5. The diaphragm valve of claim 2, further comprising a flexible substrate disposed over the flexible temperature sensor.

6. The diaphragm valve of claim 1, wherein the flexible heater is disposed directly on the non-wetting surface of the flexible diaphragm.

7. The membrane valve of claim 1, wherein the flexible heater comprises a flexible printed heater comprising one or more conductive traces comprising conductive ink.

8. The diaphragm valve of claim 1, further comprising a flexible substrate disposed over the flexible heater.

9. The diaphragm valve of claim 1, wherein the flexible heater is disposed over a surface of a flexible intermediate substrate.

10. The diaphragm valve of claim 11, further comprising a bonding interface between a lower surface of the flexible intermediate substrate and the non-wetting surface of the flexible diaphragm.

11. The diaphragm valve of claim 9, further comprising an additional flexible substrate disposed over the flexible intermediate substrate.

12. The diaphragm valve of claim 2, wherein the flexible heater and the flexible temperature sensor are disposed on the same surface.

13. The diaphragm valve of claim 2, wherein the flexible heater and the flexible temperature sensor are disposed on different surfaces.

14. The diaphragm valve of claim 13, wherein the flexible heater is disposed over a surface of a first flexible substrate and the flexible temperature sensor is disposed over a surface of a second flexible substrate.

15. The membrane valve of claim 1, further comprising one or more additional heaters disposed within the valve body, wherein the flexible heater and the one or more additional heaters are configured to maintain a differential temperature of an internal wetted surface of the membrane valve below 1 ℃.

16. A precursor delivery system comprising the membrane valve of claim 1.

17. The precursor delivery system of claim 16, further comprising one or more additional heaters disposed adjacent to the membrane valve and configured to maintain a differential temperature of an interior wetted surface of the membrane valve below 1 ℃.

18. A semiconductor processing apparatus comprising the precursor delivery system of claim 16.

19. A valve component, comprising:

a flexible membrane comprising a wetted surface and an opposing non-wetted surface; and

a flexible heater disposed over the non-wetting surface of the flexible membrane.

20. The valve component of claim 19, wherein the flexible heater comprises a flexible printed heater comprising one or more conductive traces comprising a conductive ink.

21. The valve component of claim 19, further comprising a flexible substrate disposed over the flexible heater.

22. The valve component of claim 19, wherein the flexible heater is disposed over a surface of a flexible intermediate substrate and a bonding interface is disposed between a lower surface of the flexible intermediate substrate and the non-wetting surface of the flexible diaphragm.

23. The valve member of claim 22, further comprising an additional flexible substrate disposed over the flexible intermediate substrate.

24. The valve member of claim 19, further comprising a flexible temperature sensor disposed over the non-wetting surface of the flexible diaphragm.

25. The valve component of claim 24, wherein the flexible temperature sensor comprises a flexible printed thermocouple comprising a first printed thermocouple element comprising a first metal-containing ink and a second printed thermocouple element comprising a second metal-containing ink, the first printed thermocouple element in electrical contact with the second printed thermocouple element, thereby forming a thermocouple junction.

26. The valve member of claim 24, wherein the flexible heater and the flexible temperature sensor are disposed on the same surface.

27. The valve member of claim 24, wherein the flexible heater and the flexible temperature sensor are disposed on different surfaces.

28. A method for forming a valve component, comprising:

providing a flexible membrane comprising a wetted surface and an opposing non-wetted surface; and

forming a flexible heater over the non-wetting surface of the flexible membrane.

29. The method of claim 28, wherein forming the flexible heater further comprises printing the flexible heater over the non-wetting surface of the flexible membrane with one or more conductive inks.

30. The method of claim 29, further comprising printing the flexible heater directly over the non-wetting surface of the flexible membrane.

31. The method of claim 28, further comprising forming a flexible substrate over the flexible heater.

32. The method of claim 29, further comprising printing the flexible heater over a surface of a flexible intermediate substrate and bonding a lower surface of the flexible intermediate substrate with the non-wetting surface of the flexible membrane.

33. The method of claim 32, further comprising forming an additional flexible substrate over the flexible intermediate substrate.

34. The method of claim 28, further comprising forming a flexible temperature sensor over the non-wetting surface of the flexible diaphragm.

35. The method of claim 34, wherein forming the flexible temperature sensor further comprises printing a flexible printed thermocouple comprising a first printed thermocouple element comprising a first metal-containing ink and a second printed thermocouple element comprising a second metal-containing ink, the first printed thermocouple element in electrical contact with the second printed thermocouple element, thereby forming a thermocouple junction.

36. The method of claim 34, wherein the flexible heater and the flexible temperature sensor are printed on the same surface.

37. The method of claim 34, wherein the flexible heater and the flexible temperature sensor are printed on different surfaces.

Technical Field

The present disclosure relates generally to diaphragm valves and, in particular, to diaphragm valves that include a valve component that includes an integrated flexible heater. The present disclosure also generally relates to methods for forming valve components including integrated flexible heaters.

Background

Semiconductor processing equipment typically uses one or more reactants, i.e., precursors, as source chemicals for performing substrate processes, such as deposition, cleaning, and etching processes. Such semiconductor processing equipment typically includes a reaction chamber into which precursors are supplied in order to perform a desired process. The supply of the precursor to the reaction chamber may be performed by a precursor delivery system, and such precursor delivery systems may utilize one or more valves to control the flow of the precursor to the reaction chamber.

The precursor delivery system can utilize one or more membrane valves positioned in a flow path between a source container of the precursor and the reaction chamber to enable flow control of the precursor into the reaction chamber. For example, a precursor in a vapor phase can be pulsed into the reaction chamber by opening and closing appropriate membrane valves in the precursor delivery system. The diaphragm valve may include an actuator configured to open and close the flexible diaphragm relative to the valve seat. When the membrane valve is in the open position, precursor is allowed to pass through the valve channel and into the reaction chamber. When the membrane valve is in the closed position, the membrane blocks the valve passage and prevents precursor from entering the reaction chamber.

An example of a semiconductor processing apparatus that can utilize a precursor delivery system that includes one or more membrane valves is an Atomic Layer Deposition (ALD) apparatus. ALD is a method of depositing thin films on a substrate that involves continuous and alternating self-saturating surface reactions, where one or more vapor phase precursors can be pulsed into the ALD reaction chamber to effect film deposition. ALD processes may require precise temperature control of the precursors, not only in the reaction chamber, but also in the precursor delivery system used to provide the precursors to the reaction chamber. In particular, the precise temperature of the wetted surfaces of the precursor delivery system, i.e., those surfaces in direct contact with the precursor, may be required to achieve optimal film deposition and device lifetime.

The wetted surfaces that make up the precursor delivery system can comprise the internal wetted surfaces of the membrane valve. For example, if the wetted surface of the membrane valve exceeds the operating temperature range of a particular precursor, the precursor can decompose within the membrane valve before entering the reaction chamber. Conversely, if the wetted surface of the membrane valve is below the operating temperature range of a particular precursor, the precursor may condense or even solidify in the valve channel, causing the membrane valve to leak or even block the valve channel. Therefore, there is a strong need for a diaphragm valve incorporating means for precise temperature control of the internal wetted surfaces of the diaphragm valve.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail below in the detailed description of example embodiments of the disclosure. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

In some embodiments of the present disclosure, a diaphragm valve is provided. The diaphragm valve may include: a valve body comprising a valve passage including an inlet passage and an outlet passage; a valve seat adjacent to the valve passage; a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm disposed adjacent to the valve channel; a flexible heater disposed over the non-wetting surface of the flexible membrane; and a valve actuator operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat.

In some embodiments of the present disclosure, a valve member is provided. The valve member may include: a flexible membrane comprising a wetted surface and an opposing non-wetted surface; and a flexible heater disposed over the non-wetting surface of the flexible membrane.

In some embodiments of the present disclosure, methods for forming a valve member may be provided. The method can comprise the following steps: providing a flexible membrane comprising a wetted surface and an opposing non-wetted surface; and forming a flexible heater over the non-wetting surface of the flexible membrane.

For the purpose of summarizing the invention and the advantages achieved over the prior art, certain objects and advantages of the invention have been described herein above. Of course, it is to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention. Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught or suggested herein but that does not necessarily achieve other objects or advantages as may be taught or suggested herein.

All of these embodiments are intended to be within the scope of the invention disclosed herein. These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments having reference to the accompanying drawings, the invention not being limited to any particular embodiment disclosed.

Drawings

While the specification concludes with claims particularly pointing out and distinctly claiming what are regarded as embodiments of the present disclosure, the advantages of embodiments of the disclosure may be more readily ascertained from the description of certain examples of embodiments of the disclosure when read in conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional schematic view of an exemplary diaphragm valve in an open position according to an embodiment of the present invention;

FIG. 2 is a cross-sectional schematic view of an exemplary diaphragm valve in a closed position according to an embodiment of the present invention;

3A, 3B, and 3C illustrate perspective views of a method for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and flexible temperature sensor are disposed directly on the flexible diaphragm;

4A, 4B, and 4C illustrate perspective views of a method for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature sensor are formed on an intermediate flexible substrate and subsequently bonded to the flexible diaphragm;

FIGS. 5A, 5B, and 5C illustrate perspective views of a method for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature sensor are formed on an upper surface of an intermediate flexible substrate and subsequently bonded to the flexible diaphragm;

6A, 6B, and 6C illustrate perspective views of a method for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature are formed on a separate flexible substrate and subsequently bonded to the flexible diaphragm;

7A, 7B, and 7C illustrate another perspective view of a method for forming a valve component comprising a flexible diaphragm, an integrated flexible heater, and an integrated flexible temperature sensor, wherein the flexible heater and the flexible temperature are formed on a separate flexible substrate and subsequently bonded to the flexible diaphragm; and

FIG. 8 illustrates an exemplary semiconductor processing apparatus including a precursor delivery system including one or more membrane valves according to an embodiment of the invention.

Detailed Description

Although certain embodiments and examples are disclosed below, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments and/or uses of the invention and obvious modifications and equivalents thereof. Therefore, it is intended that the scope of the present disclosure should not be limited by the particular disclosed embodiments described below.

The illustrations presented herein are not intended as actual views of any particular material, apparatus, structure, or device, but are merely idealized representations which are employed to describe the embodiments of the present disclosure.

As used herein, the term "substrate" may refer to any underlying material that may be used, or upon which a device, a circuit or a film may be formed.

As used herein, the term "Atomic Layer Deposition (ALD)" may refer to a vapor deposition process in which a deposition cycle, preferably a plurality of consecutive deposition cycles, is performed in a process chamber. Typically, during each cycle, the precursor is chemically adsorbed to a deposition surface (e.g., a substrate surface or a previously deposited underlying surface, such as material from a previous ALD cycle), thereby forming a monolayer or sub-monolayer that is not readily reactive with the additional precursor (i.e., a self-limiting reaction). Thereafter, if necessary, a reactant (e.g., another precursor or a reactive gas) can then be introduced into the process chamber for converting the chemically adsorbed precursor to the desired material on the deposition surface. Typically, this reactant is capable of further reaction with the precursor. Furthermore, during each cycle, a rinse step may also be utilized to remove excess precursor from the process chamber and/or excess reactants and/or reaction byproducts from the process chamber after conversion of the chemically adsorbed precursor. Furthermore, the term "atomic layer deposition" as used herein is also intended to encompass processes specified by related terms such as "chemical vapor atomic layer deposition", "atomic layer epitaxy" (ALE), Molecular Beam Epitaxy (MBE), gas source MBE, or organometallic MBE, and chemical beam epitaxy, when performed using alternating pulses of precursor composition, reactive gas, and purge (e.g., inert carrier) gas.

As used herein, the term "chemical vapor deposition" may refer to any process in which a substrate is exposed to one or more volatile precursors that react and/or decompose on the surface of the substrate to produce a desired deposition.

As used herein, the term "wetted surface" may refer to a surface of a valve that may be in direct contact with a chemical precursor.

As used herein, the term "non-wetting surface" may refer to a surface of a valve that may not be in direct contact with a chemical precursor.

In the specification, it is to be understood that the terms "on … …" or "above … …" may be used to describe the relative positional relationship. Another element or layer may be directly on the mentioned layer, or another layer (intermediate layer) or element may be interposed therebetween, or a layer that does not completely cover the surface of the mentioned layer may be disposed on the mentioned layer. Thus, unless the term "directly" is used alone, the terms "on … …" or "above … …" will be interpreted as relative concepts. Similarly, it should be understood that the terms "under … …," "under … …," or "under … …" will be interpreted as relative concepts.

Embodiments of the present disclosure may include a diaphragm valve, a valve component, and an associated method for forming a valve component. In particular, embodiments of the present disclosure provide a diaphragm valve that incorporates a flexible heater positioned above a non-wetted surface of the diaphragm that allows for precise temperature control of the wetted surface of the diaphragm. For example, the membrane valves of the present disclosure can be used as a component of a precursor delivery system for delivering one or more precursors to a reaction chamber of a deposition apparatus, such as an ALD apparatus, and thus the membrane valves of the present disclosure can provide film deposition with reduced defectivity. In addition, the diaphragm valve of the present disclosure may increase the useful life (i.e., "uptime") of the semiconductor processing equipment, and also reduce the time period between maintenance cycles.

Current techniques for heating a diaphragm valve, and in particular the diaphragm of the diaphragm valve, may include an external heater, such as a block heater disposed proximate to the body of the diaphragm valve. An external heater provides thermal energy to the body of the diaphragm valve, which is conducted through the body of the diaphragm valve to a diaphragm located within the body of the diaphragm valve. However, such indirect external methods for heating the membrane of the membrane valve can result in a wet inner surface of the membrane valve having temperature non-uniformities. For example, an external heater may be used to heat the diaphragm of the diaphragm valve to the operating temperature of the particular precursor; however, due to temperature non-uniformity, other wetted areas of the membrane valve may be outside the operating temperature range of the precursor, causing the precursor to decompose or condense within the membrane valve.

Accordingly, embodiments of the present disclosure provide a diaphragm valve comprising: a valve body comprising a valve passage including an inlet passage and an outlet passage; a valve seat disposed adjacent to the valve channel; a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm disposed adjacent to the valve channel; a flexible heater disposed over the non-wetting surface of the flexible membrane; and a valve actuator operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat.

Fig. 1 and 2 illustrate cross-sectional schematic views of an exemplary diaphragm valve according to embodiments of the present disclosure. It should be noted that the diaphragm valve of fig. 1 and 2 is a non-limiting example configuration of a diaphragm valve incorporating a valve member including a flexible heater, and alternative configurations of diaphragm valves that may incorporate the flexible heater of the present disclosure are contemplated. It should also be noted that fig. 1 and 2 illustrate simplified cross-sectional views of an exemplary diaphragm valve showing key features of the diaphragm valve needed to understand embodiments of the present disclosure.

In more detail, fig. 1 illustrates a cross-sectional illustration of an exemplary membrane valve 100 in an open position, i.e., a valve channel 102 disposed between an inlet channel 104 and an outlet channel 106 is unobstructed by a flexible membrane 108, allowing precursor to flow freely through the membrane valve 100. Fig. 2 illustrates a cross-sectional representation of an exemplary membrane valve 100 in a closed position, i.e., a valve channel 102 disposed between an inlet channel 104 and an outlet channel 106 is blocked by a flexible membrane 108, thereby preventing precursor flow through the membrane valve 100. The example diaphragm valve 100 may include an actuator 110 coupled to a valve body 112 by a ring nut 114.

In more detail, the valve body 112 may include a valve passage 102 including an inlet passage 104 and an outlet passage 106. The inlet channel 104 may be fluidly connected to a source vessel (not illustrated) containing a suitable precursor. For example, the source vessel may contain the precursor in a solid phase, a liquid phase, a gas phase, or a mixture thereof. In embodiments where the precursor is in a solid or liquid phase, the source vessel may also contain means for converting the precursor to a vapor phase precursor, such as one or more heaters. The outlet channel 106 can be fluidly connected to a reaction chamber of a semiconductor processing apparatus. For example, the reaction chamber may be used for one or more deposition processes, etching processes, and/or cleaning processes. In particular embodiments of the present disclosure, the outlet channel 106 may be fluidly connected to a reaction chamber of a semiconductor deposition apparatus, such as an Atomic Layer Deposition (ALD) apparatus or a Chemical Vapor Deposition (CVD) apparatus.

The valve seat 114 may be disposed adjacent to the valve passage 102 and may surround an upper portion of the inlet passage 104. The valve seat 114 includes an upper surface 116 presenting a sealing surface against which a wetting surface 118 of the flexible diaphragm 108 presses to close the valve passageway 102. The upper surface 116 of the valve seat 114 may be polished or otherwise smoothed to reduce contact resistance and to reduce leakage of precursor between the valve seat 114 and the flexible diaphragm 108 when the flexible diaphragm 108 is in the closed position, as illustrated in FIG. 2. Although the upper surface 116 of the valve seat 114 is illustrated in fig. 1 and 2 as a planar surface, alternative sealing surfaces for the upper surface 116 may be utilized. For example, the upper surface 116 of the valve seat 114 may include a seating ridge extending upward from the upper surface 116 toward the flexible diaphragm 108, where the seating ridge may protrude sufficiently and be sized to deform the wetting surface 118 of the flexible diaphragm 108 when the flexible diaphragm 108 is pressed against the valve seat 114.

Disposed within the valve body 112 is a valve member 122, the valve member 122 including a flexible diaphragm 108 and a flexible heater 124. The flexible heater 124 as illustrated in fig. 1 and 2 is shown in simplified block form and is described in more detail below. The flexible membrane 108 can include a wetted surface 118, which is a surface that can be directly contacted by a precursor flowing through the membrane valve 100, and a non-wetted surface 120, which is a surface that cannot be directly contacted by a precursor flowing through the membrane valve 100. The flexible diaphragm 108 may be disposed adjacent to the valve channel 102 and may be secured to the valve body 112 at the edge 126. The valve member 122 additionally includes a flexible heater 124, wherein the flexible heater 124 can be positioned above the non-wetting surface 120 of the flexible membrane 108. Additional details regarding the valve member 122 and methods for forming the valve member are disclosed below.

The diaphragm valve 100 additionally includes an actuator 110 that can be used to move a surface of the flexible diaphragm 108 into and out of contact with the valve seat 114, thereby opening and closing the valve passage 102. In more detail, the actuator 110 may include an actuator stem 128 and, optionally, a contact button 130 that contacts an upper surface of the flexible heater 124 connected to the flexible diaphragm 108. The actuator 110 may include several actuation mechanisms, including but not limited to pneumatic, hydraulic, and piezoelectric mechanisms. In some embodiments, the actuator 110 may include a solenoid (not shown) that may be energized by applying an electrical current to drive the actuator rod 128 to transmit a force to the flexible diaphragm 108 to open and close the valve channel 102 by driving the actuator rod 128 into and out of contact with the flexible heater 124 connected to the flexible diaphragm 108.

The example membrane valve 100 may also include an additional heater 132 that may be positioned outside the valve body and/or within the valve body itself but outside of the wetting flow of the precursor. For example, the one or more heaters 132 may include a resistance heater disposed proximate the valve body 112.

Embodiments of the present disclosure can be used to ensure thermal uniformity of wetted surfaces of the membrane valve 100, where the wetted surfaces can include those internal surfaces of the membrane valve 100 that can be in direct contact with the precursor flowing through the membrane valve, and can include: a wetted surface of the valve passageway 102 (including the inlet passageway 104 and the outlet passageway 106), a wetted surface of the valve seat 114, and a wetted surface 118 of the diaphragm 108. Embodiments of the present disclosure may be used to provide thermal uniformity, i.e., the difference between the maximum and minimum temperatures of the wetted surface of the membrane valve 100 is in a temperature range of substantially less than 1 ℃ or substantially less than 0.5 ℃ or even less than 0.25 ℃. Temperature uniformity of the wetted surface of the membrane valve can be achieved by utilizing one or more external heaters and an internal flexible heater adjacent the membrane of the membrane valve.

Valve member 122 includes at least a flexible diaphragm 108 and a flexible heater 124. Exemplary valve members and methods for forming the same are described in more detail with reference to fig. 3A-3C, 4A-4C, 5A-5C, 6A-6C, and 7A-7C.

An exemplary valve member and method for forming an exemplary valve member are described with reference to fig. 3A-3C, which illustrate perspective views of embodiments in which a flexible heater is disposed directly on a non-wetting surface of a flexible membrane.

In more detail, the valve member may include a flexible diaphragm 308, as illustrated in fig. 3A. The flexible membrane 308 may include a wetted surface 318 and an opposing non-wetted surface 320. The flexible membrane 308 may be formed of a flexible plastic, elastomeric material, metal, or metal alloy. In some embodiments of the present disclosure, the flexible membrane 308 may be formed from a molded thin disc of a plastic material, such as polytetrafluoroethylene ("PTFE") or polyvinylidene fluoride ("PVDF"). In some embodiments, flexible membrane 308 may be formed from an elastomeric material, such as a fluoroelastomer, ethylene propylene diene monomer ("EPDM"), silicone rubber, nitrile rubber, chloroprene rubber (neoprene), natural rubber, or perfluoroelastomer. In some embodiments, the flexible membrane may comprise a metal alloy or a metal alloy laminate, such as Hastelloy alloy.

The flexible heater may be formed over a non-wetting surface of the flexible membrane, as illustrated by flexible heater 324 in fig. 3B. The flexible heater 324 may be positioned directly above the non-wetting surface 320 of the flexible membrane 308. Flexible heater 324 may comprise a flexible printed heater that includes one or more conductive traces. For example, the conductive traces that make up the heating elements of flexible heater 324 may be comprised of conductive ink. The configuration, i.e., layout, of the conductive traces of flexible heater 324 shown in fig. 3B is a possible non-limiting example layout of conductive traces, and alternative configurations may be envisioned depending on the thermal profile required to heat flexible membrane 308. In addition to the conductive traces, two or more contact pads 334 may be formed over the non-wetting surface 320 of the membrane 308, the contact pads 334 being in electrical contact with the conductive traces of the flexible heater 324, thereby allowing electrical connection to the flexible heater 324. As illustrated in fig. 3B, flexible heater 324 includes a single printed heating element, however, it may be desirable to have two or more printed heating elements (with associated contact pads) that may be independently controlled in order to improve thermal control of membrane 308.

The electrical traces for the flexible heater 324 may be formed by a printing process. The flexographic heater may be formed by an additive manufacturing process, which is commonly referred to as three-dimensional (3D) printing. Additive manufacturing techniques or 3D printing techniques typically form physical objects from 3D data by providing, solidifying, or melting material in a layer-by-layer manner. Additive manufacturing techniques include, but are not limited to: extrusion-based 3D printing techniques, stereolithography techniques, Selective Laser Sintering (SLS) techniques, multi-jet modeling techniques, 3D printing techniques that apply binders to powders, layered entity fabrication techniques, and other techniques.

In some embodiments, flexible heater 324 may be formed by a 3D printing process and the conductive traces of the heating element may be built up from one or more conductive inks, such as at least one of aluminum, silver, carbon, nichrome, nickel, chromium, or tungsten. The conductive traces of the flexible heater 324 may be 3D printed to a thickness greater than 0.25 millimeters, or greater than 0.50 millimeters, or even greater than 1 millimeter with a cross-sectional line width of less than 3 millimeters, or less than 2 millimeters, or even less than 1 millimeter. In embodiments where the flexible membrane comprises a metallic material, the insulating dielectric material may be 3D printed before the conductive traces to provide electrical isolation of the conductive traces. For example, an insulating dielectric such as alumina may be 3D printed directly onto the surface of the flexible membrane, and 3D printed conductive traces may be 3D printed directly over the insulating dielectric.

Embodiments of the present disclosure are not limited to 3D printing methods for forming flexible heater 324, and the conductive traces of flexible heater 324 may be formed using alternative printing methods, such as screen printing or inkjet printing. The ability to print the conductive traces of flexible heater 324 enables the formation of flexible heaters with high power densities. For example, the flexible heater 324 may provide a watt density of at least 100 watts per square inch, or at least 200 watts per square inch, or even at least 400 watts per square inch, wherein the watt density of the heater may be limited by the thermal characteristics of the flexible membrane 308, i.e., excessive heating of the flexible membrane may deform the flexible membrane 308 or otherwise adversely affect the integrity of the flexible membrane 308.

To add further functionality to the valve component, and in particular to add further thermal control to the diaphragm, a flexible temperature sensor may also be integrated into the valve component. For example, fig. 3B illustrates a flexible temperature sensor 336 disposed over the non-wetting surface 320 of the flexible membrane 320. In a particular embodiment, the flexible temperature sensor 336 may be disposed directly above the non-wetting surface 320 of the flexible membrane 308.

In some embodiments, flexible temperature sensor 336 may include a flexible printed thermocouple. The flexible printed thermocouple may include a first printed thermocouple element 338 including a first metal-containing ink and a second printed thermocouple element 340 including a second metal-containing ink, the first printed thermocouple element in electrical contact with the second printed thermocouple element to form a thermocouple junction. The first metal-containing ink and the second metal-containing ink may include two different metal species having Seebeck coefficients that are sufficiently different to produce a thermocouple effect, and as a non-limiting example, the two metal-containing ink species may include silver-nickel or tungsten-nickel in order to produce a reproducible temperature signal. In some embodiments, the first printed thermocouple element 338 and the second thermocouple element 340 may be printed by a 3D printing process, a screen printing process, or an inkjet printing process, as previously described herein. Flexible temperature sensor 336 may also include contact pads 342 to enable electrical contact with flexible temperature sensor 336. In embodiments where the flexible diaphragm comprises a metallic material, an insulating dielectric may be printed directly over the non-wetting surface of the flexible diaphragm prior to printing the flexible temperature sensor, enabling the flexible temperature sensor to be electrically isolated from the metallic flexible diaphragm.

The valve component can additionally include a flexible substrate disposed over the flexible heater and over the flexible temperature sensor (if present). In more detail, fig. 3C illustrates a perspective view of an exemplary valve member 322, the exemplary valve member 322 including a flexible membrane 308, a flexible heater 324, and a flexible temperature sensor 336 disposed directly over a non-wetting surface 320 of the flexible membrane 308, and a flexible substrate 344 disposed over the flexible heater 324 and the flexible temperature sensor 336. In a particular embodiment, flexible substrate 344 can be disposed directly over flexible heater 324 and flexible temperature sensor 336. The flexible substrate 344 is illustrated in fig. 3C as a transparent substrate, but in some embodiments the flexible substrate may be opaque, the flexible substrate 344 of this example valve component 322 being shown in transparent form to illustrate the positional relationship between the various elements of the valve component 322.

Flexible substrate 344 may abut non-wetting surface 320 of flexible membrane 308 to form a capping layer over flexible heater 324 and optional flexible temperature sensor 336. For example, when the valve member 322 is driven to the closed position as illustrated in fig. 2, the actuator rod 128 and optionally the contact button 130 may be in direct contact with the upper surface of the flexible heater to deform the flexible diaphragm to close the valve passageway 102. Thus, flexible substrate 344 is disposed over flexible heater 324 and optional flexible temperature sensor 336 to ensure that the actuator stem (or optional contact button) is not in direct contact with the flexible heater, which could cause electrical shorting and wear of the flexible heater by repeatedly contacting the actuator mechanism.

In some embodiments of the present disclosure, the flexible substrate 344 may be formed from a molded thin disc of a plastic material, such as polytetrafluoroethylene ("PTFE") or polyvinylidene fluoride ("PVDF"). In some embodiments, the flexible substrate 344 may be formed from an elastomeric material, such as a fluoroelastomer, ethylene propylene diene monomer ("EPDM"), silicone rubber, nitrile rubber, chloroprene rubber (neoprene), natural rubber, or perfluoroelastomer. In some embodiments of the present disclosure, the flexible substrate 344 may comprise a polyimide substrate.

In some embodiments of the present disclosure, the flexible substrate 344 may comprise a flexible spin-on dielectric material, such as poly (methyl methacrylate) (PMMA). For example, a solution consisting of a solvent containing PMMA polymer can be disposed directly over the non-wetting surface 320 of the flexible membrane 308 that includes the flexible heater 324 and, optionally, the flexible temperature sensor 336. The flexible membrane with PMMA solution thereon is then spun to distribute the PMMA over the entire surface of the non-wetting surface 320 of the flexible membrane 308, thereby simultaneously covering the flexible heater 324 and optional flexible temperature sensor 336. The PMMA may then be post-spin baked to drive off excess solvent to form a flexible substrate 344 that seals the non-wetting surface 320 of the flexible membrane 308 with the flexible heater 324 and the flexible temperature sensor 336 thereon.

In some embodiments of the present disclosure, the flexible substrate 344 may be abutted with the flexible membrane 308 by applying an adhesive between the flexible substrate 344 and the bonding surface of the flexible membrane 308.

In some embodiments of the present disclosure, the flexible substrate 344 may be abutted with the non-wetting surface 320 of the flexible membrane 308 using a bonding process, thereby forming a bonding interface 348 disposed between the lower surface of the flexible substrate 344 and the non-wetting surface 320 of the flexible membrane 308. For example, the bonding process may include contacting the lower surface of the flexible substrate 344 with the non-wetting surface 320 of the flexible membrane 308 and applying pressure between the flexible substrate 344 and the flexible membrane 308 while applying heat to the assembly including the flexible substrate 344 and the flexible membrane 308. In some embodiments, the assembly comprising the flexible substrate 344 and the flexible membrane 308 may be placed into a bonding apparatus, and pressure may be applied while heating the assembly to a temperature substantially less than 250 ℃, thereby bonding the flexible substrate 344 to the flexible membrane 308 and thereby forming a bonding interface 348 disposed between the bottom surface of the flexible substrate 344 and the non-wetting surface 320 of the flexible membrane 308.

It should be noted that two or more electrical connections may be made to flexible heater 324 through connecting electrical leads to bond pad 334 and likewise to flexible temperature sensor 336 through connecting electrical leads to bond pad 342 before the flexible substrate is formed over the flexible membrane and specifically over the flexible heater and optional flexible temperature sensor.

Thus, as illustrated in fig. 3C, the completed valve member 322 includes the flexible membrane 308 with the flexible heater 324 and the flexible temperature sensor 336 disposed directly on the non-wetting surface 320, i.e., both the flexible heater 324 and the flexible temperature sensor 336 are disposed on the same surface. Valve component 322 can additionally include a flexible substrate 344 disposed directly over non-wetting surface 320 of flexible membrane 308, thereby sealing flexible heater 324 and flexible temperature sensor 336. The valve member 322 may be used with the example diaphragm valve 100 of fig. 1 and 2 to provide improved thermal control of the internal wetted surfaces of the diaphragm valve 100.

In an alternative embodiment, the flexible heater and optional flexible temperature sensor may be formed over an intermediate flexible substrate and then abutted with the non-wetting surface of the flexible membrane. In more detail, fig. 4A illustrates a flexible intermediate substrate 446 including a flexible heater 424 and an optional flexible temperature sensor 436 formed over an upper surface of the flexible intermediate substrate 446. The flexible intermediate substrate 446 may comprise a flexible plastic or elastomeric material, as previously described herein. In some embodiments, the flexible intermediate substrate 446 may comprise a polyimide material. The flexible heater 424 and the optional flexible temperature sensor 436 may both be formed on the upper surface of the flexible intermediate substrate 446 by one or more printing processes, as previously described herein. In embodiments where the flexible diaphragm comprises a metallic material, an insulating dielectric layer may be printed over the upper surfaces of both the flexible heater 424 and the flexible temperature sensor to later provide electrical isolation from the metallic diaphragm.

Next, the flexible intermediate substrate 446 having the flexible heater 424 and optional flexible temperature sensor 436 disposed thereon is inverted, as shown in FIG. 4B, and brought into abutment with the non-wetting surface 420 of the flexible membrane 408. For example, the inverted flexible intermediate substrate 446 having the flexible heater 424 and optional flexible temperature sensor 436 disposed thereon may be brought into abutment with the non-wetting surface 420 of the flexible membrane 408 by applying an adhesive to one or more of the non-wetting surface 420 of the flexible membrane 408 and/or the surface of the flexible intermediate substrate 446 containing the flexible heater 424 and optional flexible temperature sensor 436. The assembly comprising the flexible membrane 408 and the flexible intermediate substrate 446 may then be subjected to pressure to initiate bonding between the flexible membrane 408 and the flexible intermediate substrate 446.

In an alternative embodiment of the present disclosure, the flexible intermediate substrate 446 may abut the non-wetting surface 420 of the flexible membrane 408 through a bonding process. For example, the surface of the flexible intermediate substrate 446 containing the flexible heater 424 and optional flexible temperature sensor 436 may be placed in direct contact with the non-wetting surface 420 of the flexible membrane 408, and a bonding interface 448 may be formed between the bottom surface of the flexible intermediate substrate 446 and the non-wetting surface 420 of the flexible membrane 408 by the application of pressure and heat as previously described herein, resulting in the valve component 422 of fig. 4C.

As illustrated in fig. 4C, the completed valve component 422 includes: the flexible membrane 408, the flexible heater 424, and optionally the flexible temperature sensor 436 disposed over the non-wetting surface 420 of the flexible membrane 408, are bonded directly to the flexible intermediate substrate 446 by a bonding interface 448. In this exemplary embodiment, the flexible intermediate substrate 446 includes a cap layer over the flexible heater 424 and the optional flexible temperature sensor 436, thereby protecting the flexible heater 424 and the flexible temperature sensor 436 from direct contact with the actuation mechanism of the diaphragm valve 100 of fig. 1 and 2.

In additional embodiments of the present disclosure, a flexible heater and an optional flexible temperature sensor may be formed over the upper surface of the flexible intermediate substrate and then abutted with the non-wetting surface of the flexible membrane. In more detail, fig. 5A illustrates a flexible intermediate substrate 546 including a flexible heater 524 and an optional flexible temperature sensor 536 formed over an upper surface of the flexible intermediate substrate 546. The flexible intermediate substrate 546 may comprise a flexible plastic or elastomeric material, as previously described herein. In some embodiments, flexible intermediate substrate 546 may comprise a polyimide material. The flexible heater 524 and optional flexible temperature sensor 536 can each be formed on the upper surface of the flexible intermediate substrate 546 by one or more printing processes, as previously described herein.

In contrast to the previous embodiment (as illustrated in fig. 4A-4C), in this particular embodiment, flexible intermediate substrate 546 is not inverted, but rather the lower surface of flexible intermediate substrate 546, i.e., the surface of flexible intermediate substrate 546 that does not include flexible heater 524 and optional flexible temperature sensor therein, is abutted to non-wetting surface 520 of flexible membrane 508. For example, the flexible intermediate substrate 546 may be abutted with the non-wetting surface 520 of the flexible membrane 508 using a gluing process or a bonding process, as previously described herein.

Upon abutting the non-wetting surface 520 of the flexible intermediate substrate 546 and the flexible membrane 508, a transition structure 560 (fig. 5B) is formed that includes the flexible membrane 508 having the flexible intermediate substrate 546 disposed thereon, wherein a bonding interface 548 is disposed between the non-wetting surface 520 of the flexible membrane 508 and the lower surface of the flexible intermediate substrate 546. The upper surface of the transition structure 560 includes a flexible heater 524 and an optional flexible temperature sensor 536.

To complete the exemplary valve components, an additional flexible substrate may be formed over the upper surface of the transition structure 560, forming a protective cover layer over the flexible heater and optional flexible temperature sensor. In more detail, fig. 5C illustrates a perspective view of an exemplary valve component 522 that includes a flexible diaphragm 508 having a flexible intermediate substrate 546 disposed thereon. The first bonding interface 548 may be disposed between the lower surface of the flexible intermediate substrate 546 and the non-wetting surface 520 of the flexible membrane 508. Disposed above the flexible intermediate substrate 546 is an additional flexible substrate 550. The additional flexible substrate 550 may be adjoined to the flexible intermediate substrate 546 by a gluing process or a bonding process, as previously described herein. In some embodiments, the additional flexible substrate 550 may comprise a flexible spin-on dielectric, as previously described herein. A second bonding interface 552 may be disposed between the lower surface of the additional flexible substrate 550 and the flexible intermediate substrate 546. The additional flexible substrate 550 may thus form a capping layer over the flexible heater 524 and optional flexible temperature sensor 536, thereby protecting the flexible heater 524 and optional flexible temperature sensor 536 from direct interaction with the actuation mechanism of the diaphragm valve 100 of fig. 1 and 2.

In further embodiments of the present disclosure, the flexible heater and the flexible temperature sensor may be formed over different substrates, allowing more flexibility in the design layout of the flexible heater and the flexible temperature sensor. Thus, in some embodiments of the present disclosure, the flexible heater and the flexible temperature sensor may be disposed on different surfaces.

In more detail, fig. 6A illustrates a flexible intermediate substrate 646 upon which a flexible temperature sensor 636 is disposed. As with the previous embodiments, the flexible intermediate substrate 646 may be formed from a flexible plastic or elastomeric material (e.g., a polyimide material), and the flexible temperature sensor 636 may be formed over an upper surface of the flexible intermediate substrate 646 using one or more printing processes. The flexible intermediate substrate 646 may then be inverted and adjoined with the transition structure 660, as illustrated in fig. 6B. The transition structure 660 may include a flexible membrane 608, a flexible substrate 644 disposed over a non-wetting surface of the membrane 608, and a flexible heater 624 disposed over an upper surface of the flexible substrate 644. Finally, the transition structure 660 can include an additional flexible substrate 650 disposed over the flexible heater 624. A flexible intermediate substrate 646 including a flexible temperature sensor 646 disposed on a lower surface (once inverted) may be adjoined to the transition structure 660 by a gluing process or a bonding process, as previously described herein.

Fig. 6C illustrates the exemplary valve member 622 after bonding the flexible intermediate substrate 646 with the transition structure 660. The example valve component 622 includes a flexible heater 624 and a flexible temperature sensor 636 disposed on different substrates of the example valve component 622. For example, the example valve component 622 includes a flexible diaphragm 608 in which a flexible substrate 644 is disposed over a non-wetting surface of the flexible diaphragm 608. The flexible substrate 644 includes a flexible heater 624 disposed over the upper surface. Disposed over the flexible substrate 644 is an additional flexible substrate 650 that covers and protects the flexible heater 624, and disposed over the flexible substrate 650 is a flexible intermediate substrate 646 that includes a flexible temperature sensor 636 disposed on a lower surface of the flexible intermediate substrate 646. The inverted flexible intermediate substrate 646 provides a cover protective layer for the flexible temperature sensor 636 so that the flexible temperature sensor 636 is not in direct contact with the actuation mechanism of the exemplary diaphragm valve of fig. 1 and 2.

In further embodiments of the present disclosure, the flexible heater and the flexible temperature sensor may be disposed over different substrates such that the design layout of the flexible heater and the flexible temperature sensor has more degrees of freedom. In more detail, FIG. 7A illustrates a flexible intermediate substrate 746 upon which a flexible temperature sensor 736 is disposed. As with the previous embodiments, the flexible intermediate substrate 746 may be formed of a flexible plastic or elastomeric material, and the flexible temperature sensor 736 may be formed over a surface of the flexible intermediate substrate 746 using one or more printing processes. In this exemplary embodiment, the flexible intermediate substrate 746 is not inverted, but rather the lower surface of the flexible intermediate substrate 746, i.e., the surface on which no flexible temperature sensor is disposed, is adjoined by the transition structure 760, as illustrated in FIG. 7A. In this exemplary process, transition structure 760 includes flexible membrane 708 with flexible substrate 744 disposed over a non-wetting surface of flexible membrane 708, where flexible substrate 744 includes flexible heater 724 disposed over an upper surface. The lower surface of the flexible interposer 746 may be abutted with the upper surface of the transition structure 760 by a gluing process or a bonding process, as previously described herein, forming a bonding interface 748 disposed between the lower surface of the flexible interposer 746 and the upper surface of the transition structure 760, as illustrated in fig. 7B.

To complete the valve components, an additional flexible substrate 750 may be disposed over the flexible temperature sensor 736, as illustrated in fig. 7C, thereby protecting the flexible temperature sensor 736 and ensuring that the flexible temperature sensor is not in direct contact with the actuation mechanism of the example diaphragm valve 100 of fig. 1 and 2.

The completed valve member 722 of fig. 7C thus includes the diaphragm 708 with a flexible substrate 744 disposed over the non-wetting surface of the diaphragm 708, the flexible substrate 744 including a flexible heater 724 disposed over the upper surface. Disposed over the flexible heater 724 is a flexible intermediate substrate 746 including a flexible temperature sensor 736 disposed over the upper surface and finally an additional flexible substrate 750 disposed over the flexible temperature sensor 736 and protecting the flexible temperature sensor 736.

The example valve components and methods for forming the valve components described herein are non-limiting, and it is contemplated that the forming methods and valve component elements, such as flexible diaphragms, flexible substrates, flexible heaters, and flexible temperature sensors, may be combined in alternative arrangements.

The diaphragm valve of the present disclosure may be used in several applications. As a non-limiting example, the exemplary membrane valves of the present disclosure may be used as a component of a precursor delivery system configured to supply one or more precursors to a reaction chamber of a semiconductor processing apparatus.

In more detail, fig. 8 illustrates an exemplary semiconductor processing apparatus 800 comprising a reaction chamber 802 and a precursor delivery system 812. The precursor delivery system 812 can be configured to employ the membrane valve of the present disclosure to enable flow control of the precursor to supply the precursor to the reaction chamber 802. It should be noted that the semiconductor processing apparatus 800 is a simplified schematic version of an exemplary semiconductor processing apparatus and does not contain every element, i.e., for example, every valve, gas line, heating element, reactor component, and the like. The semiconductor processing apparatus 800 of fig. 8 provides key features of the apparatus to provide sufficient disclosure to one of ordinary skill in the art.

The exemplary semiconductor processing apparatus 800 may include a reaction chamber 802 constructed and arranged to hold at least one substrate 804. In some embodiments, the reaction chamber 802 may be configured for one or more of a deposition process, an etch process, or a cleaning process. For example, the reaction chamber 802 may be configured for an Atomic Layer Deposition (ALD) process or a Chemical Vapor Deposition (CVD) process. The substrate 804 may be disposed in the reaction chamber 802 and held in place by a pedestal 808 configured to hold at least one substrate thereon. The susceptor may include a heater 810 configured to heat the substrate to a suitable processing temperature.

The precursor delivery system 812 may include one or more precursor sources 814A and 814B constructed and arranged to provide vapor phase precursors to the reaction chamber 802. For example, precursor sources 814A and 814B may include solid precursors, liquid precursors, gaseous precursors, or mixtures thereof. The precursor delivery system 812 can also include a source vessel 814C configured to store a purge gas and dispense the purge gas to the reaction chamber 802.

Precursor delivery system 812 can include several membrane valves, such as membrane valves 822A, 822B, and 822C, configured to enable control of the flow of precursor and purge gases to reaction chamber 802. The membrane valves 822A, 822B, and 822C can comprise membrane valves of the present disclosure, and can therefore comprise integrated flexible heaters, and optionally flexible temperature sensors. In addition, membrane valves 822A, 822B, and 822C may additionally include one or more external heaters (shown as heaters 132 in fig. 1 and 2) disposed within or proximate to the valve body. The combination of an internal flexible heater and an external heater can allow precise temperature control of the wetted surface of the membrane valve, thereby preventing decomposition or condensation of the precursor flowing through the membrane valve. For example, the difference between the maximum and minimum temperatures of the wetted surfaces of the membrane valves 822A, 822B, and 822C can span a temperature range of substantially less than 1 ℃, or substantially less than 0.5 ℃, or even less than 0.25 ℃.

In addition to the membrane valves, the precursor delivery system 812 can additionally include flow controllers 820A, 820B, and 820C configured to monitor and regulate the mass flow of precursor and purge gases into the reaction chamber 802. For example, flow controllers 820A, 820B, and 820C may comprise Mass Flow Controllers (MFCs).

One or more gas lines, such as gas lines 824, 826, and 828, can be in fluid communication with both the precursor/rinse source and the reaction chamber 802 to enable the supply of vapor to the reaction chamber 802. In a particular embodiment, the precursor delivery system 812 can be in fluid communication with a gas distributor 832, the gas distributor 832 configured to distribute the precursor vapor and the purge gas into the reaction chamber 802 and across the substrate 804. By way of non-limiting example, the gas distributor 832 may comprise a showerhead, as illustrated in block form in FIG. 8. It should be noted that although shown in block form, the showerhead may be a relatively complex structure and may be configured to mix vapors from multiple sources or maintain separation between multiple vapors introduced into the showerhead.

The exemplary semiconductor processing apparatus 800 may also include a gas removal system constructed and arranged to remove gas from the reaction chamber 802. For example, the removal system may include: an exhaust port 834 disposed within a wall of the reaction chamber 802, an exhaust line 836 in fluid communication with the exhaust port 834, and a vacuum pump in fluid communication with the exhaust line 836 and configured to evacuate gas from within the reaction chamber 802. Once the gases are exhausted from the reaction chamber 802 using the vacuum pump 838, the gases may be delivered along an additional exhaust line 840 and exit the apparatus 100 for use in other abatement processes.

Exemplary semiconductor processing apparatus 800 may additionally include a sequence controller 842, which sequence controller 842 is operably connected to precursor delivery system 812, reaction chamber 802, and removal system by way of exemplary control lines 844A, 844B, and 844C. The sequence controller 842 may include electronic circuitry that selectively operates valves, heaters, flow controllers, manifolds, pumps, and other equipment associated with the semiconductor processing apparatus 800. Such circuitry and components are used to introduce precursor gases and purge gases from sources 814A, 814B, and 814C. The sequence controller 842 may also control the timing of the precursor pulse sequence, the temperature of the substrate and the reaction chamber, and the pressure of the reaction chamber and various other operations required to provide proper operation of the semiconductor processing apparatus 800. The sequence controller 842 may also include a memory 844 having a program that executes a semiconductor process when run on the sequence controller 842. For example, the sequence controller 842 may include a module (e.g., an FPGA or an ASIC), such as a software or hardware component, that performs a particular semiconductor process, such as an etch process, a cleaning process, and/or a deposition process. The modules may be configured to reside on addressable storage media of the sequence controller 842 and may be configured to perform one or more semiconductor processes.

In certain embodiments, the sequence controller 842 can be connected (electrically and/or optically) to the membrane valves 822A, 822B, and 822C to enable thermal control and thermal monitoring of the membrane valves. For example, the sequence controller may be connected to both the internal flexible heater and the external heater associated with each membrane valve, thereby enabling independent temperature control of the internal flexible heater and the external heater. In addition, a flexible temperature sensor that may be associated with each membrane valve may provide a temperature feedback signal to the sequence controller 842 such that a set point temperature and a minimum differential temperature may be maintained by the interior wetted surfaces of the membrane valves 822A, 822B, and 822C.

The above-described example embodiments of the present disclosure do not limit the scope of the invention, as these embodiments are merely examples of embodiments of the present invention, which is defined by the appended claims and their legal equivalents. Any equivalent embodiments are intended to be within the scope of the present invention. Indeed, various modifications of the disclosure, e.g., alternative useful combinations of the elements described, in addition to those shown and described herein will become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to be within the scope of the appended claims.