阅读说明：本技术 均热板及具有其的电子设备 (Vapor chamber and electronic equipment with same ) 是由 杨鑫 于 2019-10-12 设计创作，主要内容包括：本申请公开了一种均热板及具有其的电子设备,均热板包括多个拼接的子均热板,相邻两个子均热板相连,每个子均热板包括相连的第一盖板和第二盖板,每个子均热板的第一盖板和第二盖板之间限定出一个密闭腔,每个密闭腔具有抽气口,每个抽气口处设有封堵抽气口的密封头,每个密闭腔内设有工作介质和具有毛细结构的吸液芯,多个子均热板的密闭腔均互不连通。根据本申请实施例的均热板,将均热板设置成包括多个拼接的子均热板,每个子均热板均具有独立的密闭腔和抽气口,可以缩短抽气路径,降低除气不良率,从而降低均热板表面温差ΔT,提高均热板的性能。(The application discloses vapor chamber and have its electronic equipment, the vapor chamber includes the sub vapor chamber of a plurality of concatenations, two adjacent sub vapor chambers link to each other, every sub vapor chamber is including continuous first apron and second apron, inject a sealed chamber between the first apron of every sub vapor chamber and the second apron, every sealed chamber has the extraction opening, every extraction opening department is equipped with the sealed head of shutoff extraction opening, be equipped with working medium and the imbibition core that has capillary structure in every sealed intracavity, the sealed chamber of a plurality of sub vapor chambers all does not communicate each other. According to the soaking plate of this application embodiment, set the soaking plate to the sub-soaking plate including a plurality of concatenations, every sub-soaking plate all has independent airtight chamber and extraction opening, can shorten the route of bleeding, reduces the degasification defective rate to reduce soaking plate surface difference in temperature delta T, improve the performance of soaking plate.)

1. The utility model provides a soaking pit, its characterized in that, the soaking pit includes the sub-soaking pit of a plurality of concatenations, adjacent two sub-soaking pit links to each other, every sub-soaking pit is including continuous first apron and second apron, every sub-soaking pit first apron with inject a sealed chamber between the second apron, every sealed chamber has the extraction opening, every extraction opening department is equipped with the shutoff sealed head of extraction opening, every sealed intracavity is equipped with working medium and the imbibition core that has capillary structure, and is a plurality of sub-soaking pit sealed chamber all not communicates each other.

2. The heat spreader according to claim 1, wherein a plurality of the sub heat spreaders are independently formed.

3. The heat spreader of claim 2, wherein adjacent two of the sub heat spreaders are directly connected.

4. The soaking plate according to claim 3, wherein each of the sub soaking plates comprises a body and a first joining projection formed on side walls of the bodies of the two connected sub soaking plates facing each other and extending toward each other, the first joining projections of the two connected sub soaking plates being superposed and connected in a thickness direction of the soaking plate.

5. The heat spreader according to claim 2, wherein adjacent two of the sub heat spreaders are connected by a connecting member.

6. The soaking plate according to claim 5, wherein the connecting member is a heat-conductive member.

7. The soaking plate according to claim 6, wherein the connecting member is a graphite piece or a graphene piece.

8. The vapor chamber of claim 7, wherein the connecting member is a graphite member formed by stacking a plurality of graphite sheets, and adjacent two graphite sheets are connected to each other by a first adhesive layer.

9. The soaking plate according to claim 7, wherein the connecting member is a graphene piece formed by stacking and pressing a plurality of graphene films.

10. The soaking plate according to claim 7, wherein the outer surface of the connecting member is coated with a protective layer, and the protective layer is a heat conductive layer.

11. The soaking plate according to claim 10, wherein the protective layer is a metal layer.

12. The soaking plate according to claim 5, wherein the connecting piece is connected with the soaking plate through a second adhesive layer.

13. The soaking plate according to claim 12, wherein the second adhesive layer is a thermal conductive adhesive layer.

14. The soaking plate according to claim 5, wherein each of the sub soaking plates comprises a body and a second joining protrusion formed on the side walls of the bodies of the two connected sub soaking plates facing each other, and the connecting member between the adjacent two sub soaking plates is connected to both of the body of each of the sub soaking plates and the second joining protrusion.

15. The vapor chamber of claim 14, wherein the connecting member has a connecting notch, and the second connecting projection is received in the connecting notch and connected to the connecting member.

16. The heat spreader of claim 1, wherein the first cover plates of the plurality of sub heat spreader plates are integrally formed, and the second cover plates of the plurality of sub heat spreader plates are integrally formed.

17. The soaking plate according to any one of claims 1 to 16, wherein the thickness of the soaking plate is not more than 0.4 mm.

18. An electronic device, comprising: vapor chamber according to any one of claims 1 to 17.

19. The electronic device of claim 18, comprising:

a housing;

the heat spreader comprises a main board, wherein the main board is arranged in the shell, a vapor chamber is arranged between the shell and the main board, and the vapor chamber is in contact with the main board.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a vapor chamber and electronic equipment with the same.

Background

With the increasing strength of hardware of electronic equipment, the power consumption and heat are inevitably increased, and a more efficient heat dissipation means is indispensable. At present, the mainstream heat dissipation material of electronic equipment such as mobile phones and tablet computers is a graphite sheet, and heat is also dissipated by using a heat pipe, a vapor chamber and the like. The vapor chamber is a heat conduction component which realizes rapid heat transfer by relying on the phase change of a working medium in the vapor chamber, has larger heat dissipation area relative to a heat pipe, and has higher heat dissipation efficiency than graphite.

The inner space of electronic equipment such as a mobile phone, a tablet personal computer and the like is limited, and the vapor chamber is thinned as much as possible, so that the light and thin of the whole machine are facilitated. However, the vapor chamber is thinner, the medium channel inside the vapor chamber is narrower, and the other part of the vapor chamber is designed into a more complex pattern according to the requirement, so that the medium conduction path is very long, the distance from the air exhaust port of the vapor chamber to the tail end is large, poor degassing is easy to occur, and the surface temperature difference delta T of the vapor chamber (through testing the surface temperature difference delta T of the vapor chamber, the performance of the vapor chamber is evaluated, the smaller the delta T is, the better the poor yield is) is very high.

Disclosure of Invention

The application provides a vapor chamber, and the surface temperature difference delta T of this vapor chamber is less, and the performance of vapor chamber is better.

The application also provides an electronic device with the vapor chamber.

According to the soaking plate of the embodiment of the first aspect of this application, the soaking plate includes the sub-soaking plate of a plurality of concatenations, adjacent two sub-soaking plate links to each other, every sub-soaking plate is including continuous first apron and second apron, every sub-soaking plate first apron with inject a sealed chamber between the second apron, every sealed chamber has the extraction opening, every extraction opening department is equipped with the shutoff sealed head of extraction opening, every be equipped with working medium and the imbibition core that has capillary structure in the sealed chamber, it is a plurality of sub-soaking plate sealed chamber all does not communicate each other.

According to the soaking plate of the embodiment of the application, set the soaking plate to the sub-soaking plate including a plurality of concatenations, every sub-soaking plate all has independent airtight chamber and extraction opening, at the in-process of manufacturing the soaking plate, can bleed respectively to the airtight chamber of every sub-soaking plate, because the airtight chamber of every sub-soaking plate reduces for the volume in the airtight chamber of whole soaking plate, can shorten the route of bleeding, reduce the degasification defective rate, thereby reduce soaking plate surface temperature difference Δ T, improve the performance of soaking plate.

An electronic device according to an embodiment of the second aspect of the present application includes: a vapor chamber according to the embodiment of the first aspect of the present application described above.

According to the electronic equipment provided by the embodiment of the application, the soaking plate is arranged, so that the heat of the easy-to-heat component in the electronic equipment can be dissipated, and the service life, the use stability and the use reliability of the electronic equipment are prolonged.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of a vapor chamber according to some embodiments of the present application;

FIG. 2 is a schematic view of the joining of two adjacent sub-vapor soak plates of a vapor soak plate according to some embodiments of the present application;

fig. 3 is a schematic view of the sub soaking plate in fig. 2;

FIG. 4 is a schematic view of the connector of FIG. 2;

FIG. 5 is a partially schematic illustration of an electronic device according to some embodiments of the present application;

FIG. 6 is a schematic view of an electronic device according to some embodiments of the present application.

Reference numerals:

an electronic device 100;

a housing 1;

a middle frame 2;

a vapor chamber 3; a sub vapor chamber 31; a closed chamber 31 a; a body 310; a first cover 311; a second cover plate 312; a support protrusion 313; the second coupling projection 314; a wick 315; a connecting member 32; the connection notch 321;

a display screen assembly 4.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

The soaking plate 3 according to the embodiment of the present application is described below with reference to fig. 1 to 5.

As shown in fig. 1 and 2, the soaking plate 3 according to the embodiment of the first aspect of the present application, the soaking plate 3 includes a plurality of spliced sub soaking plates 31, and adjacent two sub soaking plates 31 are connected.

In the present application, the term "plurality" means two or more.

Each sub-soaking plate 31 comprises a first cover plate 311 and a second cover plate 312 which are connected, a closed cavity 31a is defined between the first cover plate 311 and the second cover plate 312 of each sub-soaking plate 31, each closed cavity 31a is provided with an air suction port, a sealing head for sealing the air suction port is arranged at each air suction port, a working medium and a liquid suction core 315 with a capillary structure are arranged in each closed cavity 31a, and the closed cavities 31a of the sub-soaking plates 31 are not communicated with each other.

When the vapor chamber 3 is used for the electronic apparatus 100, the vapor chamber 3 can dissipate heat of a heat-liable component such as a circuit board (e.g., a motherboard), a battery, or the like of the electronic apparatus 100. When the electronic device 100 operates, heat generated by components that are easy to heat, such as a circuit board and a battery of the electronic device 100, is absorbed by the working medium in the soaking plate 3, the working medium can change from a liquid state to a gaseous state after absorbing the heat, and the volume of the working medium rapidly expands and rapidly fills the whole sealed cavity 31 a. When the working medium contacts the lower temperature region of the soaking plate 3, condensation occurs, heat accumulated during evaporation is released by the condensation, and the working medium condensed into liquid returns to the original place by the wick 315 having a capillary structure, and the operation is repeated in the closed cavity 31 a. In this case, the heat of the vapor chamber 3 can be transferred to the external environment through the case assembly of the electronic apparatus 100 and the like to be dissipated.

Alternatively, the working medium may be pure water.

Alternatively, the first cover plate 311 and the second cover plate 312 may be heat-conducting members, for example, the first cover plate 311 and the second cover plate 312 may both be metal members, and specifically, both the first cover plate 311 and the second cover plate 312 may be copper members.

Alternatively, the supporting protrusions 313 are formed on the wall surfaces of at least one of the first cover plate 311 and the second cover plate 312 facing each other, whereby the structural strength of the sub heat soak plate 31 can be increased without increasing the thickness of the sub heat soak plate 31.

Alternatively, wick 315 may be a thermally conductive member, e.g., wick 315 may be a metallic member, and in particular, wick 315 may be a copper mesh, a copper foam, or the like.

Since the vapor chamber 3 is provided to include a plurality of spliced sub vapor chambers 31, each sub vapor chamber 31 has the independent airtight chamber 31a and the suction port. In the process of manufacturing the soaking plate 3, the closed cavity 31a of each sub soaking plate 31 can be vacuumized through the extraction opening of each sub soaking plate 31, after the vacuumization of each sub soaking plate 31 is completed, the working medium is injected into the closed cavity 31a of each sub soaking plate 31 through the extraction opening, and then the extraction opening of each sub soaking plate 31 is sealed through the sealing head.

When the plurality of sub vapor soaking plates 31 are formed independently, the first cover plates 311 of the plurality of sub vapor soaking plates 31 may be formed independently, the second cover plates 312 of the plurality of sub vapor soaking plates 31 may be formed independently, and the liquid absorbing cores 315 are disposed between the first cover plates 311 and the second cover plates 312 (for example, the liquid absorbing cores 315 may be fixedly connected to the first cover plates 311, and the liquid absorbing cores 315 may also be fixedly connected to the second cover plates 312) and connect the first cover plates 311 and the second cover plates 312 to form the closed cavities 31 a. After each sub-soaking plate 31 is subjected to air extraction, working medium injection and air extraction port plugging, the plurality of sub-soaking plates 31 are spliced to form the soaking plate 3 with a set shape and structure.

In addition, when the plurality of sub soaking plates 31 are independently formed, the first cover plate 311 and the second cover plate 312 of each sub soaking plate 31 may be coupled by welding. Since the entire soaking plate 3 is decomposed into the plurality of sub soaking plates 31, the welding path of each sub soaking plate 31 is reduced, so that the welding defective rate of each sub soaking plate 31 is reduced, and thus the welding defective rate of the entire soaking plate 3 can be reduced, and the welding defective rate of the soaking plate 3 can be reduced from 40% to 15%.

When the first cover plates 311 of the plurality of sub vapor equal heating plates 31 are integrally formed and the second cover plates 312 of the plurality of sub vapor equal heating plates 31 are integrally formed, the plurality of first cover plates 311 are integrally formed into a first cover plate group, the plurality of second cover plates 312 are integrally formed into a second cover plate group, the plurality of liquid absorbing cores 315 are respectively installed between each first cover plate 311 of the first cover plate group and each second cover plate 312 of the second cover plate group (for example, each liquid absorbing core 315 can be fixedly connected to the corresponding first cover plate 311 or second cover plate 312), and the first cover plate group and the second cover plate group are connected to define a plurality of closed cavities 31a which are not communicated with each other, and each closed cavity 31a is provided with an air suction port, so that the production and manufacturing processes of the vapor equal heating plates 3 can be simplified.

Because the sealed chamber 31a of every sub-soaking board 31 reduces for the sealed chamber 31a of whole soaking board 3's volume, working medium's flow path shortens, when bleeding every sub-soaking board 31, the route of bleeding in the sealed chamber 31a of every sub-soaking board 31 can shorten, thereby can reduce because the bad degasification that the route overlength of bleeding leads to (the bad degasification can remain more air in the sealed chamber 31a, influence soaking board 3's heat conductivity), thereby can reduce the degasification defective rate (for example, in actual production process, the degasification defective rate can be reduced to 15% by original 40%), and then can reduce soaking board 3 surface temperature difference delta T, improve soaking board 3's performance.

When the air extraction path is long, the air extraction pressure is generally increased, and the soaking plate near the air extraction opening tends to collapse to block the air extraction path, thereby causing outgassing failure. And this application decomposes into a plurality of sub soaking boards 31 that have independent airtight chamber 31a and extraction opening with single soaking board 3, can show and shorten the air exhaust route, can avoid or reduce because the emergence sinks to lead to blockking up the risk in air exhaust route.

For example, in the example of fig. 1, the shape of the soaking plate 3 is relatively complex, the soaking plate 3 is divided into three sub soaking plates 31, and each sub soaking plate 31 is rectangular, so that not only the closed cavity 31a and the air extraction path of each sub soaking plate 31 are reduced relative to the whole soaking plate 3, but also the shape of each sub soaking plate 31 is simple and convenient to produce, and the air extraction path can be set relatively simply, so that the air extraction resistance is further reduced, and the air extraction defective rate is further reduced.

It should be noted that the shape of the soaking plate 3 shown in fig. 1 is only one example of the soaking plate 3 of the present application, and the shape of the soaking plate 3 of the present application may be designed in any shape as needed.

Alternatively, the thickness of the soaking plate 3 may be not more than 0.4 mm. Therefore, the thickness of the soaking plate 3 is small, the space occupied by the soaking plate 3 is reduced, the whole machine is light and thin, and the performance of the soaking plate 3 can be guaranteed.

The vapor chamber 3 with different specifications and the thickness of less than 0.4mm is tested, and each test is carried out on the whole vapor chamber (the vapor chamber is only provided with one larger closed cavity and one air suction opening) in the related art and the vapor chamber 3 in the application under the same heat source. And (3) test results: the surface temperature difference delta T of the soaking plate in the related art is more than 12 ℃, and the surface temperature difference delta T of the soaking plate 3 in the application is less than 6 ℃. It follows that the performance of the vapor chamber 3 of the present application is significantly improved compared to the vapor chamber in the related art.

According to the soaking plate 3 of the embodiment of the application, set the soaking plate 3 into the sub-soaking plate 31 including a plurality of concatenations, every sub-soaking plate 31 all has independent airtight chamber 31a and extraction opening, in-process at the soaking plate 3 is made in production, can extract air respectively to the airtight chamber 31a of every sub-soaking plate 31, because the airtight chamber 31a of every sub-soaking plate 31 reduces for the volume of the airtight chamber of whole soaking plate 3, can shorten the route of extracting air, reduce the degasification defective rate, thereby reduce 3 surface temperature difference Δ T of soaking plate, improve the performance of soaking plate 3.

According to some embodiments of the present application, the plurality of sub soaking plates 31 are independently formed, and adjacent two sub soaking plates 31 are directly connected. Therefore, the use of other kinds of materials can be reduced, and the cost is saved.

Alternatively, each of the sub vapor soaking plates 31 includes a body 310 and a first coupling protrusion formed on the sidewalls of the bodies 310 of the two connected sub vapor soaking plates 31 facing each other and extending toward each other, for example, the first coupling protrusion may be formed on the first cover plate 311 of one of the sub vapor soaking plates 31 and the first coupling protrusion may be formed on the second cover plate 312 of the other sub vapor soaking plate 31, and the first coupling protrusions of the two connected sub vapor soaking plates 31 are overlapped and connected in the thickness direction (refer to the d direction in fig. 2) of the vapor soaking plate 3, whereby the coupling area of the two adjacent sub vapor soaking plates 31 may be increased and the stability and reliability of the coupling of the two adjacent sub vapor soaking plates 31 may be improved.

Further, the first coupling protrusion of one of the two adjacent sub soaking plates 31 may also be coupled to the body 310 of the other sub soaking plate 31 at the same time, so that the coupling area may be further increased, and the stability and reliability of the coupling of the two adjacent sub soaking plates 31 may be further improved.

According to some embodiments of the present application, referring to fig. 1 and 2, a plurality of sub heat spreader plates 31 are independently formed, and adjacent two sub heat spreader plates 31 are connected by a connecting member 32. Therefore, the connection of the two sub soaking plates 31 can be more flexible, and meanwhile, a larger connection area can be formed between the two adjacent sub soaking plates 31, so that the stability and the reliability of the connection of the two adjacent sub soaking plates 31 are improved.

Alternatively, the connecting member 32 may be a heat conductive member. Thereby, the thermal conductivity of each portion of the entire soaking plate 3 can be ensured. For example, the connection member 32 may be a graphite member or a graphene member, whereby the connection member 32 can be made to have good thermal conductivity, and thus the soaking plate 3 as a whole can be made to have good thermal conductivity.

For example, when connecting piece 32 is graphite spare, graphite spare can be formed by the superpose of multilayer graphite flake, links to each other through first viscose layer between two adjacent graphite flakes, and first viscose layer can be for heat-conducting glue for graphite spare is whole to have good heat conductivility. Therefore, graphite sheets with different layers can be superposed according to the requirement so as to conveniently form graphite pieces with different thicknesses and meet the connection of the sub soaking plates 31 with different specifications.

For example, when the connection member 32 is a graphene member, the graphene member may be formed by stacking and laminating a plurality of graphene films. Therefore, the graphene part can be conveniently processed and formed, and the graphene part can be guaranteed to have good heat-conducting performance.

In some optional embodiments of the present application, when the connecting member 32 is a graphite member or a graphene member, the outer surface of the connecting member 32 may be coated with a protective layer, the protective layer may prevent surface fragments or powder of the graphite member or the graphene member from dropping, and the protective layer may be a heat conductive layer, thereby ensuring the heat conductivity of the protective layer.

Alternatively, the protective layer may be a metal layer, for example the protective layer may be a copper layer. Therefore, the protective layer has good heat conduction performance.

For example, when the connection member 32 is a graphite member or a graphene member, the protective layer covering the outer surface of the connection member 32 may be formed on the outer surface of the connection member 32 by:

activating the outer surface of the connecting member 32;

sputtering copper on the outer surface of the connecting member 32 by sputtering after the activation treatment is completed to form a sputtered copper layer;

and after the sputtered copper layer meets the set requirement, performing copper electroplating on the sputtered copper layer, thereby forming an electroplated copper layer on the sputtered copper layer, and forming a protective layer comprising the sputtered copper layer and the electroplated copper layer.

In the method for forming the protective layer, the connection strength between the protective layer and the connecting piece 32 can be increased by sputtering the copper layer, so that the protective layer is prevented from falling off; and meanwhile, the subsequent electroplated copper layer is combined, so that the processing cost of the protective layer can be reduced, and the production efficiency can be improved.

In some optional embodiments of the present application, the connecting member 32 is connected to the soaking plate 3 through a second adhesive layer. Thereby, the reliable connection between the joining member 32 and the soaking plate 3 is facilitated. Optionally, the second adhesive layer may be a heat conductive adhesive layer, for example, the heat conductivity of the common adhesive layer is 0.4W/m.k, the heat conductivity of the heat conductive adhesive layer may reach 1W/m.k or more, and the heat conductivity of the heat conductive adhesive layer is 2 times or more of the heat conductivity of the common adhesive layer, so that the heat conductive adhesive layer has good heat conductivity. Therefore, the heat conduction performance of the joint of the connecting piece 32 and the soaking plate 3 can be ensured, and the whole soaking plate 3 is ensured to have good heat conduction performance.

In some alternative embodiments of the present application, referring to fig. 2 to 4, each sub soaking plate 31 includes a body 310 and a second coupling protrusion 314, the second coupling protrusion 314 is formed on the side wall of the body 310 of the connected two sub soaking plates 31 facing each other, for example, the second cover plate 312 of the connected two sub soaking plates 31 may be formed with the second coupling protrusion 314, and the connection member 32 between the adjacent two sub soaking plates 31 is connected to both the body 310 and the second coupling protrusion 314 of each sub soaking plate 31. Accordingly, the connection area of the sub vapor chamber 31 and the connection member 32 can be increased, and the stability and reliability of the connection of the sub vapor chamber 31 and the connection member 32 can be improved, so that the stability and reliability of the connection of the adjacent two sub vapor chambers 31 can be improved.

Further, referring to fig. 2 to 4, the connecting member 32 has a connecting notch 321, and the second coupling projection 314 is received in the connecting notch 321 and coupled to the connecting member 32. Thereby, the connection strength of the sub vapor soaking plates 31 and the connection members 32 can be further improved, and the stability and reliability of the connection of the adjacent two sub vapor soaking plates 31 can be further improved.

Alternatively, the connection notch 321 may penetrate through one end surface of the connection piece 32 in the thickness direction of the sub vapor chamber 31, thereby facilitating the processing of the connection notch 321 and the fitting of the second connection protrusion 314 with the connection notch 321.

Alternatively, the connecting notches 321 of the connecting member 32 may be two at intervals, and the second connecting protrusions 314 of two adjacent sub vapor soaking plates 31 are respectively accommodated in the corresponding connecting notches 321 and connected to the connecting member 32.

Referring to fig. 5 and 6, an electronic device 100 according to an embodiment of the second aspect of the present application includes: the soaking plate 3 according to the above-described first aspect embodiment of the present application.

According to the electronic apparatus 100 of the embodiment of the present application, the heat spreader 3 described above is provided, so that the heat-generating components in the electronic apparatus 100 can be dissipated, and the service life of the electronic apparatus 100 and the stability and reliability of use can be extended.

Referring to fig. 5, an electronic device 100 includes, according to some embodiments of the present application: casing 1 and mainboard, the mainboard is established in casing 1, and vapor chamber 3 is established between casing 1 and mainboard, and vapor chamber 3 and mainboard contact. From this, can dispel the heat to the mainboard through soaking board 3, soaking board 3 can absorb the heat that the mainboard produced and this heat can finally transmit to the outside through casing 1 of electronic equipment 100 etc to the realization is to the heat dissipation of mainboard, improves reliable and stable of electronic equipment 100, prolongs electronic equipment 100's life.

For example, in the examples of fig. 5 and 6, the electronic device 100 includes: the shell assembly, the display screen assembly 4 and the mainboard. The shell assembly comprises a shell 1 and a middle frame 2, the middle frame 2 is located between the display screen assembly 4 and the shell 1, and an installation space is defined between the display screen assembly 4 and the shell 1. The mainboard is established in installation space, and soaking plate 3 is established on center 2 and with the mainboard contact, and display screen subassembly 4 is connected with the mainboard electricity. From this, can dispel the heat to the mainboard through soaking board 3, soaking board 3 can absorb the heat that the mainboard produced and this heat finally can transmit to the outside through center 2, casing 1 etc. of electronic equipment 100 to the realization is to the heat dissipation of mainboard, improves reliable of electronic equipment 100 and stability, prolongs electronic equipment 100's life.

The electronic device 100 of the present application may be, for example, any of various types of computer system devices that are mobile or portable and that perform wireless communications (only one modality shown in fig. 6 by way of example). Specifically, electronic device 100 may be a mobile or smart phone (e.g., an iPhone (TM) based, Android (TM) based phone), a Portable gaming device (e.g., a Nintendo DS (TM), PlayStation Portable (TM), Game Advance (TM), iPhone (TM)), a laptop, a PDA, a Portable Internet device, a music player and data storage device, other handheld devices and head-worn devices such as watches, in-ear headphones, pendant, headphones, etc., electronic device 100 may also be other wearable devices (e.g., a head-worn device (HMD) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic device 100, or smart watches).

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.