阅读说明：本技术 电子设备的壳体及电子设备 (Electronic equipment's casing and electronic equipment ) 是由 李奎 于 2019-10-29 设计创作，主要内容包括：本发明公开一种电子设备的壳体,其包括壳本体(100)、密封盖(200)和毛细结构件(300),所述壳本体(100)的内壁开设有凹槽(110),所述密封盖(200)密封设置在所述凹槽(110)的槽口,所述密封盖(200)与所述凹槽(110)形成密封散热内腔(400),所述毛细结构件(300)设置在所述密封散热内腔(400)内,且所述密封散热内腔(400)填充有换热介质。上述方案能解决目前的电子设备的壳体存在强度较差的问题。本发明公开一种电子设备。(The invention discloses a shell of electronic equipment, which comprises a shell body (100), a sealing cover (200) and a capillary structure member (300), wherein a groove (110) is formed in the inner wall of the shell body (100), the sealing cover (200) is arranged at a notch of the groove (110) in a sealing manner, the sealing cover (200) and the groove (110) form a sealed heat dissipation inner cavity (400), the capillary structure member (300) is arranged in the sealed heat dissipation inner cavity (400), and a heat exchange medium is filled in the sealed heat dissipation inner cavity (400). Above-mentioned scheme can solve present electronic equipment's casing and have the relatively poor problem of intensity. The invention discloses an electronic device.)

1. The utility model provides a casing of electronic equipment, its characterized in that includes shell body (100), sealed lid (200) and capillary structure spare (300), recess (110) have been seted up to the inner wall of shell body (100), sealed lid (200) are sealed to be set up the notch of recess (110), sealed lid (200) with recess (110) form sealed heat dissipation inner chamber (400), capillary structure spare (300) set up in sealed heat dissipation inner chamber (400), just sealed heat dissipation inner chamber (400) are filled with heat transfer medium.

2. The housing of claim 1, wherein the electronic device comprises a display module (500), the housing body (100) comprises a middle frame, the display module (500) is disposed on one side of the middle frame, and the groove (110) is opened on the other side of the middle frame away from the display module (500).

3. The housing according to claim 1, wherein a support portion (120) is provided inside the groove (110), one end of the support portion (120) is connected to a bottom wall of the groove (110), and the other end of the support portion (120) is supported by the sealing cover (200).

4. The housing of claim 3, wherein the support portion (120) separates the sealed heat dissipation cavity (400) into a heat dissipation main cavity (410) and a heat dissipation channel (420), the heat dissipation channel (420) being in communication with the heat dissipation main cavity (410), the capillary structure (300) being disposed within the heat dissipation main cavity (410).

5. The housing according to claim 1, wherein the sealing cover (200) is detachably disposed in a notch of the groove (110).

6. The housing according to claim 5, wherein the sealing cover (200) is fixed to the surface of the notch by a screw thread (600), and a sealing ring (700) is provided between the sealing cover (200) and the housing body (100), the sealing ring (700) being provided around the notch.

7. The housing according to claim 1, characterized in that the housing (100) is a metal housing, and the inner wall of the sealed heat dissipation cavity (400) is provided with an anti-oxidation layer.

8. The housing of claim 7, wherein the oxidation resistant layer is an oxygen free copper plating or a silver plating.

9. An electronic device, characterized in that it comprises a circuit board arrangement (800) and a housing according to any one of claims 1-8, the circuit board arrangement (800) comprising a circuit board (810) and heat generating electronics (820) arranged on the circuit board (810), the heat generating electronics (820) being in heat conducting contact with the sealing cover (200).

10. An electronic device according to claim 9, characterized in that a heat conducting layer (900) is arranged between the heat generating electronic device (820) and the sealing cover (200), one side of the heat conducting layer (900) being in heat conducting contact with the heat generating electronic device (820) and the other side of the heat conducting layer (900) being in heat conducting contact with the sealing cover (200).

Technical Field

The present invention relates to the field of communications devices, and in particular, to a housing of an electronic device and an electronic device.

Background

Along with the improvement of user's demand, electronic equipment's function is more and more, and correspondingly, electronic components that integrate in electronic equipment's the casing are more and more. It is known that electronic components generate a large amount of heat during operation, which heat needs to be dissipated in time or otherwise affects the performance of the electronic device.

At present, the through hole is usually arranged on the middle frame of the shell or the shell is hollowed, then the soaking plate is arranged in the through hole, the soaking plate is in heat conduction contact with the electronic component in the shell, under the condition, the heat generated in the working process of the electronic component can be transferred to the middle frame through the soaking plate or the heat pipe, and finally the shell of the electronic equipment is used for realizing the dissipation. In the above structure, the middle frame needs to be punched to form a through hole or a part of the structure of the middle frame needs to be hollowed out to realize installation. Obviously, this can result in a reduction in the strength of the housing, which in turn can affect the overall performance of the housing.

Disclosure of Invention

The invention discloses a shell of electronic equipment and the electronic equipment, which aim to solve the problem that the shell of the conventional electronic equipment has poor strength.

In order to solve the problems, the invention adopts the following technical scheme:

the shell of the electronic equipment comprises a shell body, a sealing cover and a capillary structure, wherein a groove is formed in the inner wall of the shell body, the sealing cover is arranged at a notch of the groove in a sealing mode, a sealing heat dissipation inner cavity is formed by the sealing cover and the groove, the capillary structure is arranged in the sealing heat dissipation inner cavity, and a heat exchange medium is filled in the sealing heat dissipation inner cavity.

An electronic device comprising a circuit board arrangement and a housing as described above, the circuit board arrangement comprising a circuit board and heat generating electronics disposed on the circuit board, the heat generating electronics being in thermally conductive contact with the sealing cover.

The technical scheme adopted by the invention can achieve the following beneficial effects:

in the working process of the electronic equipment, as the heat exchange medium is filled in the sealed heat dissipation inner cavity, the local temperature of the shell body and the sealing cover rises in the working process of the electronic equipment, the heat exchange medium in the sealed heat dissipation inner cavity can change phase, the heat exchange medium is changed into gas from liquid, the gas heat exchange medium can move to a region with lower temperature, then the gas heat exchange medium is liquefied and reduced into the liquid heat exchange medium in the region in a natural cooling mode, the liquid heat exchange medium is conveyed to a high-temperature region of the sealed heat dissipation inner cavity under the adsorption action of the capillary structure part and then enters the next circulation vaporization heat absorption process, and the heat generated by the local high temperature in the working process of the electronic equipment can be transferred to the region with lower temperature of the shell repeatedly and finally better heat dissipation is realized.

Through the process, the shell of the electronic equipment disclosed by the embodiment of the invention forms the sealed heat dissipation inner cavity capable of dissipating heat through the structural improvement, only the groove needs to be formed on the shell, and the middle frame of the shell does not need to be punched or hollowed, so that the strength of the shell is not reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of a partial structure of an electronic device according to an embodiment of the present invention.

Description of reference numerals:

100-shell body, 110-groove, 120-supporting part,

200-sealing cover,

300-capillary structure,

400-sealed heat dissipation inner cavity, 410-heat dissipation main cavity, 420-heat dissipation channel,

500-a display module,

600-threaded connecting piece,

700-sealing ring,

800-circuit board arrangement, 810-circuit board, 820-heating electronic device,

900-heat conducting layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1, an embodiment of the invention discloses a housing of an electronic device, which includes a housing body 100, a sealing cover 200 and a capillary structure 300.

The housing body 100 is a main body of the housing, and the housing body 100 can provide a mounting base for other components of the electronic device. In the embodiment of the present invention, the inner wall of the housing body 100 may be formed with a groove 110, and the sealing cover 200 is sealingly disposed at a notch of the groove 110. The sealing cover 200 and the groove 110 form a sealed heat dissipation inner cavity 400. In a general case, the sealing cover 200 may be disposed at the notch of the groove 110 by a sealing adhesive or a sealing connection member to achieve a sealing connection with the notch of the groove 110.

The capillary structure 300 is disposed in the sealed heat dissipation cavity 400, and the heat exchange medium is filled in the sealed heat dissipation cavity 400.

In the working process of the electronic equipment, the shell of the electronic equipment disclosed by the embodiment of the invention has the advantages that as the heat exchange medium is filled in the sealed heat dissipation inner cavity 400, in the process of generating heat during the operation of the electronic device, the local temperature of the shell body 100 and the sealing cover 200 rises, the heat exchange medium in the sealed heat dissipation cavity 400 changes phase, the heat exchange medium changes from liquid to gas, the gas heat exchange medium can move to a region with lower temperature, then the liquid heat exchange medium is liquefied and reduced into a liquid heat exchange medium in the area by a natural cooling mode, the liquid heat exchange medium is conveyed to the high-temperature area of the sealed heat dissipation inner cavity 400 under the adsorption action of the capillary structure 300, and then the next circulation vaporization heat absorption process is carried out, so that heat generated by local high temperature in the work of the electronic equipment can be transferred to an area with lower shell temperature, and better heat dissipation is finally realized.

Through the above process, the sealed heat dissipation inner cavity 400 capable of dissipating heat is formed by the casing of the electronic device disclosed in the embodiment of the invention through the structural improvement, and only the groove needs to be formed on the casing, so that the middle frame of the casing does not need to be punched or hollowed, and the strength of the casing is not reduced.

In the embodiment of the present invention, the heat exchange medium is a medium that can change phase between gas and liquid, and in a specific embodiment, the heat exchange medium may be water.

The electronic device disclosed by the embodiment of the invention can comprise a display module 500, the shell body 100 comprises a middle frame, the display module 500 is arranged on one side of the middle frame, and the groove 110 is formed in the other side of the middle frame, which is far away from the display module 500. Under this condition, because recess 110 deviates from display module 500 and sets up to can avoid sealed heat dissipation inner chamber 400 to give display module 500 heat transfer, can reduce the harmful effects of heat dissipation to display module 500 at last.

In a more preferable scheme, the inner wall of the groove 110 may be provided with a supporting portion 120, one end of the supporting portion 120 may be connected to the bottom wall of the groove 110, and the other end of the supporting portion 120 is supported by the sealing cover 200, in which case, the supporting portion 120 may support the sealing cover 200, and then the sealing cover 200 may be prevented from collapsing, so as to improve the stability of the structure of the sealing heat dissipation cavity 400. Specifically, the supporting portion 120 may be a supporting column, or may be a supporting member with other structures. In a specific embodiment, the supporting portion 120 may be integrally provided in the groove 110.

In a more preferable aspect, the support portion 120 may divide the sealed heat dissipation cavity 400 into a heat dissipation main cavity 410 and a heat dissipation channel 420, and the capillary structure 300 is disposed in the heat dissipation main cavity 410. The heat dissipation channel 420 is communicated with the heat dissipation main cavity 410, the heat dissipation channel 420 can allow gaseous heat exchange media to pass through, the heat exchange media enters the region with lower shell temperature through the heat dissipation channel 420 and deforms into liquid heat exchange media, and the liquid heat exchange media enters the heat dissipation main cavity 410 again and flows into the region with higher shell temperature through the capillary structure 300, so that the phase change of circulation is carried out.

In the embodiment of the present invention, the sealing cover 200 may be integrally formed with the housing body 100, which is relatively stable. Of course, the sealing cover 200 may be detachably disposed in the notch of the groove 110. Under this kind of structure, sealed lid 200 can be dismantled, and then conveniently overhauls in the sealed heat dissipation inner chamber 400. The sealing cover 200 may be detachably assembled with the housing body 100 in various ways, and specifically, the sealing cover 200 may be fixed on the surface of the notch through the screw thread connector 600, and a sealing ring 700 may be disposed between the sealing cover 200 and the housing body 100, and the sealing ring 700 is disposed around the notch. Specifically, the sealing ring 700 may be a silicone sealing ring.

In order to further improve the heat dissipation performance, in a preferable scheme, the case body 100 may be a metal case, for example, an aluminum alloy structural member. In order to avoid the influence of the heat exchange medium on the inner wall of the groove 110 and the sealing cover 200, in a preferred embodiment, the inner wall of the sealed heat dissipation cavity 400 may be provided with an anti-oxidation layer. Specifically, the oxidation resistant layer may be a copper plated layer, a silver plated layer, or the like. Similarly, in order to improve the heat dissipation performance, in a preferable embodiment, the sealing cover 200 may be a metal cover, such as an aluminum cover, a copper cover, or the like.

In embodiments of the present invention, the capillary structure 300 may be various, for example, the capillary structure may be a metal mesh, or a capillary structure formed by other materials.

Based on the housing of the electronic device disclosed in the embodiment of the present invention, the embodiment of the present invention discloses an electronic device, the disclosed electronic device includes the circuit board apparatus 800 and the housing described above, the circuit board apparatus 800 includes the circuit board 810 and the heat generating electronic device 820 disposed on the circuit board 810, and the heat generating electronic device 820 may be in heat conductive contact with the sealing cover 200. In particular, the heat-generating electronic device 820 may be a central processing chip of an electronic device.

In order to further improve the heat conduction from the heat-generating electronic device 820 to the sealing cover 200, in a preferable scheme, a heat conduction layer 900 may be disposed between the heat-generating electronic device 820 and the sealing cover 200, one side of the heat conduction layer 900 may be in heat conduction contact with the heat-generating electronic device 820, and the other side of the heat conduction layer 900 is in heat conduction contact with the sealing cover 200. The thermally conductive layer 900 is certainly more thermally conductive, thereby enabling the heat generated by the heat-generating electronic device 820 to be more quickly transferred to the sealing cover 200. Specifically, the heat conductive layer 900 may be a heat conductive adhesive layer.

The electronic device disclosed in the embodiment of the present invention may be an electronic device such as a mobile phone, a tablet computer, an electronic book reader, a game machine, a wearable device (e.g., a smart watch), and the specific type of the electronic device is not limited in the embodiment of the present invention.

In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.