Ultrasonic levitation module and object levitation device using ultrasonic waves

文档序号:1570373 发布日期:2020-01-24 浏览:16次 中文

阅读说明:本技术 超声波浮起模块及利用超声波的对象物浮起装置 (Ultrasonic levitation module and object levitation device using ultrasonic waves ) 是由 苏秉禄 李成一 李尚俊 于 2018-06-11 设计创作,主要内容包括:本发明的实施例的超声波浮起模块包括与浮起对象物相对的板、对所述板施加用于浮起所述浮起对象物的振动的振子及结合于通过所述振子形成于所述板的节点线且支撑所述板的支撑部件。(An ultrasonic levitation module according to an embodiment of the present invention includes a plate facing a levitation object, a vibrator that applies vibration for levitating the levitation object to the plate, and a support member that is coupled to a node line formed on the plate by the vibrator and supports the plate.)

1. An ultrasonic levitation module, comprising:

a plate which faces the floating object;

a vibrator that applies vibration for floating the floating object to the plate; and

and a support member that is coupled to a node line formed on the board via the vibrator and supports the board.

2. The ultrasonic levitation module of claim 1,

the support member is in line contact with the plate along the nodal line.

3. The ultrasonic levitation module of claim 1,

the support member is formed in a plate shape, and one of side surfaces constituting a peripheral portion is coupled to the nodal line.

4. The ultrasonic floatation module of claim 1, further comprising:

and a horizontal adjustment part which is arranged between a base supporting the support component and adjusts the height of the plate by adjusting the distance between the support component and the base.

5. The ultrasonic floatation module of claim 4, wherein the level adjustment section comprises:

a first member having an upper surface coupled to the support member and a bottom surface forming an inclined surface; and

and a second member having a bottom surface mounted on the base, an upper surface forming an inclined surface corresponding to the bottom surface of the first member, and moving relative to the first member.

6. The ultrasonic floatation module of claim 4, further comprising:

and a length adjusting part which is provided between the base and the horizontal adjusting part, movably coupled to a rail or a groove formed in the base, and adjusts the length of the supporting member in a length direction of a surface coupled to the plate.

7. The ultrasonic floatation module of claim 4, further comprising:

and a length adjusting part which is provided between the support member and the horizontal adjusting part, is movably coupled to a rail or a groove formed in the horizontal adjusting part, and adjusts the length of the support member in a longitudinal direction of a surface coupled to the plate.

8. The ultrasonic floatation module of claim 4, further comprising:

and an auxiliary plate formed to face the plate, disposed between the horizontal adjustment part and the length adjustment part, and having a rail or a groove formed so that the length adjustment part is movably coupled.

9. The ultrasonic levitation module of claim 1,

the support member has a plurality of node lines coupled to one or more nodes crossing each other.

10. The ultrasonic levitation module of claim 1,

the support member has a through hole formed in a surface thereof for inserting a bolt coupling member to be coupled to the plate by a bolt.

11. The ultrasonic levitation module of claim 1,

the vibrator generates ultrasonic waves.

Technical Field

The present invention relates to an ultrasonic levitation module and an object levitation apparatus using ultrasonic waves, and more particularly, to an ultrasonic levitation module and an object levitation apparatus using ultrasonic waves, which are used to levitate and transfer a thin and wide plate such as a liquid crystal display.

Background

Generally, a Liquid Crystal Display (LCD) is formed in a thin substrate shape and is used as a screen of a TV, a computer, a mobile phone, or the like.

Generally, the lcd substrate is transferred by the plate transfer mechanism, and it is important to safely transfer the lcd substrate during the transfer process to ensure that the lcd substrate is not damaged.

Further, as the screen size of a TV, a computer, or a mobile phone is gradually increased, the size of a liquid crystal display substrate is also increased, and thus, there is a possibility that a large and thin substrate may be transferred without damage.

The prior art (korean patent laid-open No. 10-1434169) discloses a technique for transferring a substrate of a liquid crystal display using air, which can float the substrate to a certain height and transfer the substrate in one direction while minimizing bending deformation of the liquid crystal display using air to reduce damage.

However, in the case of the liquid crystal display substrate, a plurality of processes may be performed during the transfer process more than the simple transfer process, and for example, a process of applying a chemical solution or a process of drying with heat may be performed during the transfer process of the liquid crystal display.

Therefore, when the liquid crystal display substrate is floated by air as in the conventional document, there may occur problems such as thin coating of the liquid medicine on the portion to which air is injected, or uneven drying of the surface of the substrate due to a difference in drying rate between the portion to which air is injected and other portions during the thermal drying process.

Therefore, there is a need for a floating device that can float a liquid crystal display substrate to reduce damage and reduce the influence on a chemical coating or thermal drying process.

(patent document) Korean patent laid-open No. 10-1434169

Disclosure of Invention

Technical problem

The present invention is made to solve the above-described problems, and an object of the present invention is to provide an ultrasonic levitation module capable of levitating a liquid crystal display by ultrasonic waves and an object levitation apparatus using ultrasonic waves.

The object of the present invention is not limited to the above-mentioned object, and other objects not mentioned can be clearly understood by those skilled in the art through the following description.

Technical scheme

According to an aspect of the present invention, there is provided an ultrasonic levitation module including: the vibration-damping device includes a plate facing a floating object, a vibrator applying vibration for floating the floating object to the plate, and a support member coupled to a node line formed on the plate by the vibrator and supporting the plate.

The supporting member included in the ultrasonic levitation module of one aspect of the present invention may be in line contact with the plate along the nodal line.

The support member is formed in a plate shape, and one of side surfaces constituting the peripheral portion is joined to the nodal line.

The plate may further include a horizontal adjustment unit provided between a base supporting the support member and the support member, and configured to adjust a height of the plate by adjusting a distance between the support member and the base.

The horizontal adjustment unit may include a first member having an upper surface coupled to the support member, a bottom surface forming an inclined surface, and a second member having a bottom surface mounted on the base, the upper surface forming an inclined surface corresponding to the bottom surface of the first member, and moving relative to the first member.

Further, the present invention may further include a length adjusting unit which is provided between the base and the horizontal adjusting unit, is movably coupled to a rail or a groove formed in the base, and adjusts a length of the supporting member in a longitudinal direction of a surface coupled to the plate.

The support member may further include a length adjusting portion which is provided between the support member and the horizontal adjusting portion, movably coupled to a rail or a groove formed in the horizontal adjusting portion, and adjusts a length of the support member in a longitudinal direction of a surface coupled to the plate.

Further, the present invention may further include an auxiliary plate which is formed to face the plate, is provided between the horizontal adjustment part and the length adjustment part, and has a rail or a groove formed so that the length adjustment part is coupled to be movable.

The support member may have a plurality of the node lines and may be coupled to one or more node lines crossing each other.

And, a through hole for inserting a bolt coupling member may be formed on a surface of the support member to be coupled to the plate by a bolt.

The transducer may generate ultrasonic waves.

According to another aspect of the present invention, there is provided an object floating apparatus using ultrasonic waves, comprising: a plurality of plates formed to have a width wider than that of the floating object and arranged at intervals along a moving direction of the floating object; and vibrators which are respectively arranged on the plurality of plates and apply vibration for floating the floating object.

The vibrator may further include a support member coupled to a node line formed on the board through the vibrator to support the board.

The plate may further include a horizontal adjustment unit provided between a base supporting the support member and the support member, and configured to adjust a height of the plate by adjusting a distance between the support member and the base.

Technical effects

The ultrasonic levitation module and the object levitation apparatus using ultrasonic waves according to the embodiments of the present invention have the following technical effects.

First, the floating object is floated by ultrasonic waves to reduce damage to the floating object and to reduce the influence on the process of applying the chemical solution, the process of thermal drying, and the like.

Secondly, the linear plate is in line contact with the floating plate to prevent the linear plate from bending and deforming, thereby uniformly applying vibration to the floating object.

Third, line contact to the floating plate is made using a linear plate, thereby enabling easier adjustment of the height of the plate for floating as compared to point contact.

Fourth, the width of the plate for floating is wider than that of the floating object, and a plurality of plates are arranged at intervals along the moving direction of the floating object, so that the surface of the floating object can be prevented from being mottled.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

Drawings

Fig. 1 is a perspective view showing an ultrasonic levitation module and an ultrasonic levitation module according to an embodiment of the present invention, which are provided in an object levitation apparatus;

FIGS. 2 and 3 are side and perspective views showing an ultrasonic levitation module according to an embodiment of the present invention;

fig. 4 and 5 are schematic views for explaining a level adjustment part of an ultrasonic levitation module according to an embodiment of the present invention;

fig. 6 to 8 are schematic views for explaining a length adjustment part of an ultrasonic levitation module according to an embodiment of the present invention;

fig. 9 to 11 are schematic views for explaining an example of a structure in which a support member of an ultrasonic levitation module according to an embodiment of the present invention is coupled to a plate;

fig. 12 is a schematic diagram for explaining a modification of the support member of the ultrasonic levitation module according to the embodiment of the present invention.

Description of the reference numerals

50: floating object 100: board

200: vibrator 300: support member

300 a: hole 320: side surface

350: projection 400: horizontal adjusting part

410: first part 420: second part

500: bolt-connecting member 550: reinforcing member

600: heat source part 650: length adjusting part

650 a: groove 700: auxiliary board

A: a center B: base seat

H1, H2: height L: node line

P: binding sites W1, W2: width of

S: spacer

Detailed Description

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. However, the accompanying drawings are only for illustrative purposes to make the disclosure of the present invention easier, and those skilled in the art to which the present invention pertains will readily appreciate that the scope of the present invention is not limited to the accompanying drawings.

The present invention is an invention for floating and transferring a floating object, for example, a wide and thin plate-shaped object such as a liquid crystal display, and the thin and wide plate-shaped object is not limited to the liquid crystal display, and may be various objects such as a film and a heat insulating plate used for a building. The floating device of one embodiment of the present invention can be used in various fields as described above.

First, an ultrasonic levitation module according to an embodiment of the present invention will be described, and then an object levitation apparatus using ultrasonic waves will be described.

Ultrasonic wave floats module

Referring to fig. 1 to 3, an ultrasonic levitation module according to an embodiment of the present invention includes a plate 100, a vibrator 200, and a support member 300.

The plate 100 may be opposed to the floating object 50. The floating object 50 to be floated by the ultrasonic floating module according to an embodiment of the present invention may be a liquid crystal display, for example, a large-sized liquid crystal display having a length and a width of 3m, respectively.

A plurality of plates 100 may be arranged at intervals along the direction in which the floating object 50 is transferred, and this will be described in detail later with reference to an object floating apparatus using ultrasonic waves according to another embodiment of the present invention.

As described above, each plate 100 is disposed so as to face the floating object 50, and may be disposed along the moving direction of the floating object 50.

The vibrator 200 can apply vibration to the board 100 for floating the floating object 50.

The present invention is an invention for floating the floating object 50 from the plate 100 by vibration, and the vibrator 200 according to the embodiment of the present invention may be an ultrasonic wave generator capable of generating ultrasonic waves.

Therefore, in the present invention, the ultrasonic waves are generated by the vibrator 200, and the floating object 50 is floated by applying the ultrasonic vibration to the floating object 50 through the plate 100.

As described above, when the floating object 50 is floated from the plate 100 by the ultrasonic wave, the floating object 50 can reduce the influence on the step of coating the chemical solution or the step of thermal drying while moving on the plate 100.

Also, the support member 300 is coupled to a node Line (normal Line, L) formed on the board 100 through the vibrator 200, and may support the board 100.

That is, the support member 300 may be located between the board 100 and the base B, and the board 100 may be spaced apart from the base B while supporting the board 100 such that the vibrator 200 is coupled to the bottom surface of the board 100.

The support member 300 may be coupled to a nodal line L of the plate 100, the nodal line L referring to a point where the amplitude of the bending vibration of the support member 300 is 50% or less of the maximum amplitude.

The position of the node line L formed on the board 100 may vary depending on the size of the board 100 and the intensity of vibration applied to the board 100 by the vibrator 200, and a plurality of node lines L may be formed on the board 100 to cross as shown in fig. 4.

Here, the support member 300 may be bonded to the plate 100 by adhesion or locked to the plate 100 by bolting as in fig. 12. The support member 300 is locked to the plate 100 by the bolt connection, which will be described in detail later.

As described above, the support member 300 is coupled to the node line L, so that it is possible to minimize the influence on the intensity of the vibration applied to the floating object 100 by the vibrator 200.

In addition, the support member 300 may be in line contact with the plate 100 along the nodal line L. That is, the support member 300 may be in line contact with the plate 100 along the nodal line L to support the plate 100 to prevent the plate 100 from bending deformation.

And the supporting member 300 can be in line contact with the board 100 as a single member in one embodiment of the present invention, so that it is not necessary to adjust a plurality of variables with respect to adjusting the height or the like with respect to the board 100, and thus process rapidity and convenience can be provided.

For example, in the case of point contact with the node lines L of the plate 100, respectively, it may be necessary to adjust the height of the plate 100 according to the size of the floating object 50, the intensity of vibration applied to the plate 100, and the like. Here, in the case where the supporting member 300 is in line contact with the board 100 as a single member, the variation is reduced compared to point contact, and thus the height of the board 100 can be easily adjusted.

When the plate 100 is prevented from bending deformation by the support member 300, the surface of the plate 100 is uniformly formed in the horizontal direction, and thus the intensity of the vibration transmitted to the floating object 50 can be made uniform. Therefore, the floating object 50 can stably float without bending.

The support member 300 has a plate shape, and any one side surface constituting the peripheral portion may be coupled to the nodal line L.

That is, the support member 300 may be coupled to the nodal line L through one side surface constituting the peripheral portion in order to minimize a coupling area with the plate 100.

Therefore, not only the influence on the strength of the vibration applied to the board 100 can be reduced, but also the heat transfer through the board 100 to the support member 300 can be reduced in the thermal drying process to minimize the deformation of the support member 300.

In addition, the ultrasonic levitation module according to an embodiment of the present invention may further include a level adjustment part 400.

Referring to fig. 4 and 5, the horizontal adjustment unit 400 is provided between the base B supporting the support member 300 and the support member 300, and adjusts the heights H1 and H2 of the plate 100 by adjusting the distance between the support member 300 and the base B.

The plate 100 may have a plurality of horizontal adjustment parts 400, which can adjust the height of each location, respectively. Therefore, the vibration is uniformly applied to the floating object 50 through the plate 100 so that the floating object 50 stably moves in the horizontal direction while keeping a distance from the plate 100.

The horizontal adjustment portion 400 may be formed in various structures, for example, may be formed in a cylinder structure or, as shown in fig. 4 and 5, may be composed of a first member 410 and a second member 420 which are relatively moved.

Here, the upper surface of the first member 410 is coupled to the support member 300, the bottom surface thereof forms an inclined surface, the bottom surface of the second member 420 is mounted on the base B, and the upper surface and the bottom surface of the first member 410 form an inclined surface corresponding thereto, and are relatively movable with respect to the first member 410.

That is, the second member 420 is provided to be movable with respect to the first member 410, and the entire height of the horizontal adjustment portion 400 can be changed according to the position where the second member 420 is coupled to the first member 410.

Referring to fig. 4 and 5, in the case where the second member 420 is located at the rear end of the first member 410, the height of the horizontal adjustment part 400 may be lower than that in the case where it is located at the front end of the first member 410.

That is, when the second member 420 is positioned at the rear end of the first member 410, the board 100 can be positioned at a position higher than H1 from the base B, and when the second member 420 moves toward the front end of the first member 410, the height of the leveling unit 400 rises and can be positioned higher than H2 from the board 100.

As described above, the height of the plate 100 can be adjusted by adjusting the height of the horizontal adjustment portion 400, and the floating object 50 can be stably moved by uniformly adjusting the intensity of the vibration applied to the floating object 50 by the plate 100.

In addition, a thermal drying process may be performed while the floating object 50 is moving, and for example, as shown in fig. 6, a heat source member 600 may be attached to the bottom surface of the plate 100.

Here, the heat source unit 600 may use a Hot Plate (Hot Plate), and when the heat source unit 600 heats the Plate 100, the heat of the Plate 100 is transferred to the floating object 50, so that the floating object 50 can be dried.

However, the heat of the heat source pack 600 may also be directly or indirectly applied to the support pack 300 during the heating of the plate 100 by the heat source pack 600. The bonding site P of the support member 300 to which the board 100 is bonded may be thermally deformed.

The length of the support member 300 may extend in the longitudinal direction with respect to the surface to be bonded to the plate 100, for example, and the other portions of the support member 300 that are not heated may not be thermally deformed on the opposite surface.

As described above, since the support member 300 cannot stably support the plate 100 when it is thermally deformed, it is necessary to extend the length of the other portion of the support member 300 that will not be heated according to the thermal deformation so that the plate 100 can be stably supported even when the support member 300 is thermally deformed.

To this end, a length adjustment part 650 may be further included in an embodiment of the present invention.

The length adjusting part 650 is provided between the base B and the horizontal adjusting part 400, movably coupled to a rail or a groove 650a formed in the base B, and is capable of adjusting the length of the supporting member 300 in the longitudinal direction of the surface coupled to the board 100.

The base B may be formed with a rail or a groove 650a so that the length adjustment part 650 is movably coupled thereto, and hereinafter, for convenience of description, a case where the base B is formed with the groove 650a will be described as an example.

Referring to fig. 7, when the length of the coupling point P coupled to the plate 100 of the support member 300 is increased in the left-right direction by heat, the length adjustment parts 650 coupled to both sides of the support member 300 can be moved outward.

As the length adjustment part 650 moves, the horizontal adjustment part 400 and the support member 300 move in the direction in which the length adjustment part 650 moves, and thus the length can be extended.

Therefore, when the length of the portion elongated by the thermal deformation and the length of the portion elongated by the length adjusting part 650 are adjusted to be the same, the support member 300 can stably support the plate 100.

The length adjustment part 650 may be provided between the support member 300 and the horizontal adjustment part 400, and may be movably coupled to a rail or a groove 650a formed in the horizontal adjustment part 400 to adjust the length of the support member 300 in the longitudinal direction of the surface coupled to the plate 100.

Here, the length-adjusting part 650 may be directly coupled to the horizontal adjusting part 400 or coupled to the horizontal adjusting part 400 through the auxiliary plate 700.

The auxiliary plate 700 is formed to face the plate 100, is provided between the horizontal adjustment part 400 and the length adjustment part 650, and may be formed with a rail or a groove 650a so that the length adjustment part 650 is coupled to be movable.

As described above, in the case where the length of the coupling point P coupled with the board 100 in the support member 300 is lengthened by heat, the length of the other end of the support member 300 opposite to the one end of the lengthened length can be lengthened to both sides by moving the length-adjusting part 650. Therefore, the support member 300 can stably support the board 100.

In addition, the length adjusting part 650 may move in a direction opposite to the aforementioned direction to adjust the length of the other surface of the plate 100 when the length of the plate 100 is shortened.

In addition, as described above, the board 100 may have a plurality of node lines L formed thereon. Thus, referring to fig. 9 to 12, there may be a plurality of support members 300 coupled to one or more nodal lines L crossing each other.

That is, in the case where vibration is applied to the board 100 by the vibrator 200, the plurality of nodal lines L may be formed on the board 100, and the support member 300 may be formed in various shapes coupled to the plurality of nodal lines L.

As described above, the support member 300 having various shapes can be formed in various shapes according to the size of the floating object 50 and the plate 100, the strength of the vibration applied to the floating object 50 by the vibrator 200, and other conditions, and the vibration can be uniformly transmitted to the floating object 50.

As also shown in fig. 6, the surface of the support member 300 may be formed with a through-hole 300a for inserting the bolting member 500 for bolting to the plate 100. Here, it is preferable that the bolt coupling member 500 does not protrude from the plate 100 toward the floating object 50.

Also, the place where the support member 300 is combined with the panel 100 may further have a reinforcing member 550. As described above, one side surface of the support member 300 constituting the peripheral portion may be coupled to the plate 100. Therefore, the support member 300 is supported by the reinforcing member 550 so that the support member 300 supports the board 100 more stably.

Here, the reinforcing member 550 may be coupled to the node line L so as not to affect the floating of the floating object 50.

As described above, the ultrasonic levitation module according to the embodiment of the present invention can not only levitate the levitation object 50 by ultrasonic waves to stably transfer the levitation object without damage, but also minimize an influence on the levitation of the levitation object 50 due to the linear contact of the supporting member 300 with the plate 100, and can effectively prevent the bending deformation of the plate 100 by the supporting plate 100.

Object floating device using ultrasonic wave

An object floating apparatus using ultrasonic waves according to another embodiment of the present invention includes a plate 100 and a vibrator 200, and may further include a support member 300 and a leveling unit 400.

The width of the plate 100 is formed wider than the floating object 50, and a plurality of plates may be arranged at intervals along the moving direction of the floating object 50.

The vibrators 200 are provided on the plurality of plates 100, respectively, and can apply vibration for floating the floating object 50.

That is, as described above with reference to fig. 1, the floating object 50 may be a large-sized liquid crystal display having a length and a width of 3m, and a range in which the vibrator 200 can transmit vibration to the floating object 50 is determined.

Therefore, the size of the plate 100 is formed to correspond to a range in which the vibrator 200 can apply vibration to the floating object 50, and thus the size may be different from the floating object 50.

Therefore, in another embodiment of the present invention, a plurality of plates 100 may be arranged at intervals along the moving direction of the floating object 50.

Further, each plate 100 may be formed to have a width wider than the floating object 50, and if the width of the plate 100 is narrower than the floating object 50 during the passage of the floating object 50 through the plate 100, both side ends of the plate 100 correspond to the surface of the floating object 50 during the movement of the floating object 50, and thus spots may be generated on the surface of the floating object 50.

Therefore, in order to prevent these problems, the plate 100 of the present invention may be formed to have a width W2 wider than the width W1 of the floating object 50.

The support member 300 is coupled to a node line L formed on the board 100 by the vibrator 200, and supports the board 100.

The horizontal adjustment unit 400 is provided between the base B supporting the support member 400 and the support member 300, and can adjust the height of the plate 100 by adjusting the distance between the support member 300 and the base B.

Each of the supporting members 300 included in the object floating apparatus using ultrasonic waves according to another embodiment of the present invention is identical or substantially similar to the leveling unit 400 and the supporting members 300 and the leveling unit 400 included in the ultrasonic vibration module according to one embodiment of the present invention described above with reference to fig. 2 to 12, and thus detailed description thereof is omitted.

As described above, the object floating apparatus using ultrasonic waves according to another embodiment of the present invention includes the plates 100 arranged in series, and thus not only can stably float and transfer the large floating object 50, but also can reduce the influence on the floating object 50 during the process of floating the object 50.

As described above, it will be apparent to those skilled in the art that the present invention can be embodied in another specific form than the embodiments described above without departing from the spirit or scope thereof. It is, therefore, to be understood that the above-described embodiments are not to be taken as limiting, but rather are intended to be illustrative and that the invention is not to be limited by the foregoing description, but may be modified within the scope of the appended claims along with their full scope of equivalents.

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