阅读说明：本技术 一种隔热效果好顶棚用的pc板 (PC board with good heat insulation effect for ceiling ) 是由 黄志力 黄江华 于 2019-10-23 设计创作，主要内容包括：本发明公开了一种隔热效果好顶棚用的PC板,包括第一PC基板层、第二PC基板层、遮光层、隔热结构,所述的第一PC基板层设于最上端,所述的第一PC基板层下端设有遮光层,所述的遮光层下端设有第二PC基板层,所述的第二PC基板层内设有隔热结构,本发明通过设置遮光层,遮光层的热反射铝箔条可以反射掉一部分的阳光和热量,热反射铝箔条下端的导光板和光扩散板可以使透过热反射铝箔条间隙的光线分散,使光线更均匀,降低热反射铝箔条对光线的影响,通过在第二PC基板层内设置隔热气凝胶,可以提高板材的隔热性能,提高使用舒适性。(The invention discloses a PC board with good heat insulation effect for a ceiling, which comprises a PC substrate layer, a second PC substrate layer, a light shielding layer and a heat insulation structure, wherein the PC substrate layer is arranged at the uppermost end, the lower end of the PC substrate layer is provided with the light shielding layer, the lower end of the light shielding layer is provided with the second PC substrate layer, and the heat insulation structure is arranged in the second PC substrate layer.)

The utility model provides a PC board that kinds of thermal-insulated effectual ceiling was used, its characterized in that includes PC base plate layer (1), second PC base plate layer (2), light-shield layer (3), thermal-insulated structure (4), PC base plate layer (1) locate the top, PC base plate layer (1) lower extreme be equipped with light-shield layer (3), light-shield layer (3) lower extreme be equipped with second PC base plate layer (2), second PC base plate layer (2) in be equipped with thermal-insulated structure (4).

2. The PC board with good heat insulation effect for ceiling according to claim 1, wherein the light shielding layer (3) comprises a light guide plate (31) and a light diffusion plate (32), the light guide plate (31) is arranged at the lower end of the PC substrate layer (1), and the light diffusion plate (32) is arranged at the lower end of the light guide plate (31).

3. The PC boards with good heat insulation effect for ceiling as claimed in claim 2, wherein several heat reflection aluminum foil strips (33) are provided between the light guide plate (31) and the PC substrate layer (1), the heat reflection aluminum foil strips (33) are uniformly spaced at the upper end of the light guide plate (31), and constant gaps are provided between the adjacent heat reflection aluminum foil strips (33).

4. The PC board for ceiling having good heat insulation effect as set forth in claim 2, wherein the light guide plate (31) and the light diffusion plate (32) are formed into a body by a two-layer co-extrusion process.

5. The PC board with good heat insulation effect for ceilings as claimed in claim 1, wherein the heat insulation structure (4) comprises a plurality of heat insulation cavities (41) and a plurality of heat insulation aerogels (42), the second PC substrate layer (2) is internally provided with a plurality of heat insulation cavities (41), the heat insulation cavities (41) are all independent sealed cavities, and the heat insulation cavities (41) are all filled with the heat insulation aerogels (42).

6. The kind of PC boards used for ceilings with good heat insulation effect as claimed in claim 5, wherein the vertical section of the heat insulation cavity (41) is triangle, the heat insulation cavity (41) and the heat insulation cavity (41) are arranged with up and down crossing and interval.

7. The PC boards with good heat insulation effect as claimed in claim 1, wherein the PC board layer (1) is uniformly provided with a plurality of flow guide protruding strips (11) on the upper end surface.

8. The PC boards with good heat insulation effect as claimed in claim 1, wherein an antistatic film (5) is provided on the top end face of the PC substrate layer (1).

9. The PC board with good heat insulation effect for ceiling as claimed in claim 1, wherein the lower end face of the second PC substrate layer (2) is provided with an ultraviolet-proof film (6).

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of plates, in particular to the technical field of a PC plate for a ceiling.

[ background of the invention ]

The plate is materials commonly used in the fields of modern buildings, interior decoration and the like, the PC plates are of the plates, the PC plates are called polycarbonate plates and kaplan plates, weak acid resistance is realized, polycarbonate is used as a main component, the PC plate is formed by adopting a CO-EXTRUSION technology CO-EXTRUSION, neutral oil resistance, strong acid resistance, durability and alkali resistance are shown, a coating UV is required, but the PC sunlight plate with good high temperature resistance and lighting effect is processed by high-performance engineering plastics, namely polycarbonate PC resin, has the characteristics of high transparency, light weight, impact resistance, sound insulation, heat insulation, flame retardancy, ageing resistance and the like, is high-tech, energy-saving and environment-friendly plastic plates with extremely excellent comprehensive performance, is a plastic building material commonly used internationally at present, has incomparable advantages of other building decoration materials such as glass, organic glass and the like, has heat insulation performance similar to that the PC plates in the residential fields such as and sunlight sheds, and the like, and has strict requirements on light rays, larger temperature requirements on the existing PC plates cannot be met.

[ summary of the invention ]

The invention aims to solve the problems in the prior art, and provides PC boards with good heat insulation effect for ceilings, which can improve the heat insulation performance of the boards, filter part of sunlight from the boards, reduce the indoor temperature and improve the use comfort.

In order to achieve the purpose, the invention provides PC boards with good heat insulation effect for a ceiling, which comprise a PC board layer, a second PC board layer, a shading layer and a heat insulation structure, wherein the PC board layer is arranged at the uppermost end, the shading layer is arranged at the lower end of the PC board layer, the second PC board layer is arranged at the lower end of the shading layer, and the heat insulation structure is arranged in the second PC board layer.

Preferably, the light shielding layer includes a light guide plate provided at a lower end of the PC substrate layer, and a light diffusion plate provided at a lower end of the light guide plate.

Preferably, a plurality of heat reflection aluminum foil strips are arranged between the light guide plate and the th PC substrate layer, the heat reflection aluminum foil strips are uniformly arranged at the upper end of the light guide plate at intervals, and fixed gaps are formed between the adjacent heat reflection aluminum foil strips.

Preferably, the light guide plate and the light diffusion plate are integrally formed through a double-layer co-extrusion process .

Preferably, the heat insulation structure comprises a plurality of heat insulation cavities and a plurality of heat insulation aerogels, a plurality of heat insulation cavities are arranged in the second PC substrate layer, the heat insulation cavities are independently sealed cavities, and the heat insulation cavities are filled with the heat insulation aerogels.

Preferably, the longitudinal section of the heat insulation cavity is triangular, and the heat insulation cavity are arranged in a vertically crossed and spaced mode.

Preferably, a plurality of flow guide protruding strips are uniformly arranged on the upper end surface of the PC substrate layer.

Preferably, an antistatic film is provided on the upper end surface of the PC substrate layer.

Preferably, the lower end face of the second PC substrate layer is provided with an ultraviolet-proof film.

The PC boards with good heat insulation effect for the ceiling have the advantages that the light shielding layer is arranged, the heat reflection aluminum foil strips of the light shielding layer can reflect parts of sunlight and heat, the light guide plate and the light diffusion plate at the lower ends of the heat reflection aluminum foil strips can disperse light penetrating through gaps of the heat reflection aluminum foil strips, the light is more uniform, the influence of the heat reflection aluminum foil strips on the light is reduced, the heat insulation performance of the boards can be improved, and the use comfort is improved by arranging the heat insulation aerogel in the second PC substrate layer.

The features and advantages of the present invention will be described in detail by embodiments in conjunction with the accompanying drawings.

[ description of the drawings ]

FIG. 1 is a schematic diagram of a PC board structure for ceilings with good heat insulation effect.

In the figure, 1- th PC substrate layer, 2-second PC substrate layer, 3-shading layer, 4-heat insulation structure, 5-antistatic film, 6-ultraviolet-proof film, 11-flow guide protruding strip, 31-light guide plate, 32-light diffusion plate, 33-heat reflection aluminum foil strip, 41-heat insulation cavity and 42-heat insulation aerogel.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and examples, but it should be understood that the specific examples described herein are only for the purpose of explaining the present invention and do not limit the scope of the present invention.

Referring to fig. 1, PC boards for a ceiling with a good heat insulation effect according to the present invention include a PC substrate layer 1, a second PC substrate layer 2, a light shielding layer 3, and a heat insulation structure 4, where the PC substrate layer 1 is disposed at the uppermost end, the light shielding layer 3 is disposed at the lower end of the PC substrate layer 1, the second PC substrate layer 2 is disposed at the lower end of the light shielding layer 3, the heat insulation structure 4 is disposed in the second PC substrate layer 2, the light shielding layer 3 includes a light guide plate 31 and a light diffusion plate 32, the light guide plate 31 is disposed at the lower end of the PC substrate layer 1, the light diffusion plate 32 is disposed at the lower end of the light guide plate 31, a plurality of heat reflective aluminum foil strips 33 are disposed between the light guide plate 31 and the PC substrate layer 1, the heat reflective aluminum foil strips 33 are uniformly spaced at the upper end of the light guide plate 31, a gap is defined between adjacent heat reflective aluminum foil strips 33, the light guide plate 31 and the light diffusion plate 32 are formed by a double-layer process , the heat insulation structure 4 includes a plurality of heat insulation cavities 41 and a plurality of heat insulation cavities 3541 and a plurality of heat insulation films 3541, a plurality of heat insulation films are disposed on the heat insulation films formed by co-extrusion, the heat insulation films formed by the heat insulation films, the heat insulation films 41, the heat insulation films are disposed at the heat insulation films.

The working process of the invention is as follows:

in the working process of the PC boards with good heat insulation effect for the ceiling, sunlight and heat are injected through the PC board layer 1, parts of the sunlight and heat are blocked and reflected by the heat reflection aluminum foil strips 33, the light guide plate 31 and the light diffusion plate 32 at the lower ends of the heat reflection aluminum foil strips 33 can disperse light penetrating through gaps of the heat reflection aluminum foil strips 33, so that the light is more uniform, the influence of the heat reflection aluminum foil strips 33 on the light is reduced, and the heat insulation performance of the boards can be improved by arranging the heat insulation aerogel 42 in the second PC board layer 2.

The above embodiments are illustrative of the present invention, and are not intended to limit the present invention, and any simple modifications of the present invention are within the scope of the present invention.