method for quickly mounting BGA chip
阅读说明：本技术 一种快速贴装bga芯片的方法 (method for quickly mounting BGA chip ) 是由 周思远 尤贵 杨阳 魏露露 金以琴 于 2019-10-25 设计创作，主要内容包括：一种快速贴装BGA芯片的方法。涉及涉及BGA封装芯片焊接及返修技术领域,尤其涉及一种BGA封装芯片焊接及返修时的快速贴装的方法。提供了一种在无贴片机、BGA返修台情况下,使用小型台式回流焊炉或热风焊台,进行BGA芯片工作的快速贴装BGA芯片的方法。所述钢网的对角线设有两个穿孔,所述钢网的中间设有与BGA芯片封装体上的焊盘一一对应的印刷通孔,所述钢网位于框体一的底部,所述定位柱穿过穿孔并将钢网固定在框体一上,印刷时连接定位孔。本发明简化了BGA芯片焊接、返修工序,无需贴片机或专用BGA返修台,而且满足不同BGA芯片对焊接、返修的需求,降低焊接、返修成本,提高生产效率。(The invention relates to a method for quickly mounting BGA chips, relates to the technical field of welding and repairing of BGA packaging chips, and particularly relates to a method for quickly mounting BGA packaging chips during welding and repairing, wherein methods for quickly mounting the BGA chips are provided, wherein a small-sized table type reflow furnace or a hot air welding table is used for carrying out the work of the BGA chips under the condition of no chip mounter or BGA repairing table, the diagonal line of a steel mesh is provided with two through holes, the middle of the steel mesh is provided with a printing through hole corresponding to a welding pad on a BGA chip packaging body, the steel mesh is positioned at the bottom of a frame body , a positioning column penetrates through the through hole and fixes the steel mesh on the frame body , and the positioning hole is connected during printing.)
1, method for quickly mounting BGA chip, which comprises the following steps:
1) two positioning holes are formed in the PCB and positioned on the diagonal line of the BGA chip packaging body;
2) connecting the solder paste printing tool in the two positioning holes, printing solder paste, and taking out the printing tool;
3) connecting the mounting tool in the two positioning holes, mounting the BGA chip in the mounting tool, and pressing down to enable the solder balls of the BGA chip to be in contact with the solder paste;
4) heating the BGA chip by a hot air gun until the solder ball and the solder paste are completely melted, stopping heating, and cooling the BGA chip to the normal temperature;
5) taking out the mounting tool;
6) sliding the height limiting tool over the BGA chip to detect the welding quality of the BGA chip; if the height limiting tool does not move up and down, the product is qualified; if the height limiting tool moves up and down, the product is unqualified;
7) and (4) finishing.
2. The method of kinds of quick mounting BGA chips, as claimed in claim 1, wherein said printing tool comprises a rectangular frame and a steel net, two positioning posts are provided on the diagonal of said frame ,
the diagonal line of the steel mesh is provided with two through holes, the middle of the steel mesh is provided with a printing through hole corresponding to the bonding pad on the BGA chip packaging body,
the steel mesh is located at the bottom of the frame , and the positioning posts pass through the through holes and fix the steel mesh on the frame , and connect with the positioning holes during printing.
3. The method for quickly mounting BGA chips, according to claim 1, wherein the mounting tool includes a second rectangular frame, two second positioning posts are disposed on a diagonal of the second frame, and the second positioning posts are correspondingly disposed in the positioning holes;
the periphery of the inner wall of the second frame body is provided with a guide block, the upper part of the inner side of the guide block is an inclined plane, the lower part of the inner side of the guide block is a vertical plane, and the periphery of the BGA chip is attached to the vertical plane of the guide block;
the lower part of the guide block extends out of the second frame body.
4. The method for quickly mounting the BGA chip, according to claim 1, wherein the height limiting fixture includes a vertical plate, and a rectangular sliding slot is formed in the middle of the bottom of the vertical plate.
5. The method of kinds of quick mounting BGA chips according to claim 1, wherein in step 2), after the printing fixture is taken out, the solder paste in the package is observed for defects, wherein the defects include missing brush or adhesion, and the solder paste is made complete by manual adjustment.
Technical Field
The invention relates to the technical field of BGA package chip welding and repair, in particular to a method for quickly mounting BGA package chips during welding and repair.
Background
With the increasing requirements of people on miniaturization, multiple functions and reliability of electronic products, the chip volume is smaller and smaller, the number of chip pins is increased, and the use of surface mount devices in the form of BGA (ball grid array) is also increased. Because the chip pins are not distributed around the chip but on the bottom surface of the package, the pins led out from the four original surfaces of the substrate of the package shell are actually changed into Pb/Sn convex ball pins in an area array layout, so that more I/O numbers can be accommodated.
Compared with QFP (quad Flat Package) devices with the same leading-out terminals, the BGA device has the advantages that the area occupied by the BGA device is small, the distance between the leading-out terminals is larger, the design and wiring and the mounting and welding are facilitated, the defect rate is obviously reduced, the product quality is improved, and the requirements of consumers are better met.
However, we also note that when a single or specific BGA chip is soldered and repaired, the operation of the chip mounter and the BGA repair table is complex, the time is long, and quick response cannot be achieved.
Disclosure of Invention
The invention provides methods for rapidly mounting BGA chips, which use a small-sized desktop reflow oven or a hot air welding table to work the BGA chips under the condition of no chip mounter or BGA repair table.
The technical scheme of the invention is as follows: the method comprises the following steps:
1) two positioning holes are formed in the PCB and positioned on the diagonal line of the BGA chip packaging body;
2) connecting the solder paste printing tool in the two positioning holes, printing solder paste, and taking out the printing tool;
3) connecting the mounting tool in the two positioning holes, mounting the BGA chip in the mounting tool, and pressing down to enable the solder balls of the BGA chip to be in contact with the solder paste;
4) heating the BGA chip by a hot air gun until the solder ball and the solder paste are completely melted, stopping heating, and cooling the BGA chip to the normal temperature;
5) taking out the mounting tool;
6) sliding the height limiting tool over the BGA chip to detect the welding quality of the BGA chip; if the height limiting tool does not move up and down, the product is qualified; if the height limiting tool moves up and down, the product is unqualified;
7) and (4) finishing.
The printing tool comprises a rectangular frame and a steel net, two positioning posts are arranged on the diagonal line of the frame ,
the diagonal line of the steel mesh is provided with two through holes, the middle of the steel mesh is provided with a printing through hole corresponding to the bonding pad on the BGA chip packaging body,
the steel mesh is located at the bottom of the frame , and the positioning posts pass through the through holes and fix the steel mesh on the frame , and connect with the positioning holes during printing.
The mounting tool comprises a rectangular frame body II, wherein two positioning columns II are arranged on the diagonal line of the frame body II, and the positioning columns II are correspondingly arranged in the positioning holes;
the periphery of the inner wall of the second frame body is provided with a guide block, the upper part of the inner side of the guide block is an inclined plane, the lower part of the inner side of the guide block is a vertical plane, and the periphery of the BGA chip is attached to the vertical plane of the guide block;
the lower part of the guide block extends out of the second frame body.
The height limiting tool comprises a vertical plate, and a rectangular sliding groove is formed in the middle of the bottom of the vertical plate.
In the step 2), after the printing tool is taken out, observing whether the solder paste in the packaging body has defects or not; wherein, the defects comprise missed brushing or adhesion, and the solder paste is complete through manual adjustment.
In the work of the invention, two positioning holes are arranged on the diagonal line of the BGA chip packaging body, the solder paste printing tool can be conveniently fixed by utilizing the two positioning holes to print the solder paste, the BGA chip can be conveniently pasted and placed by the fixed pasting tool, so that the solder balls on the BGA chip and the bonding pads of the packaging body on the PCB board are reliably aligned, the BGA chip is installed by heating and welding the nozzle of the hot air gun, and the welded BGA chip is quickly detected by the height limiting tool, thereby saving the cost and having high production response speed.
The invention simplifies the BGA chip welding and repairing process, does not need a chip mounter or a special BGA repairing table, meets the requirements of different BGA chips on welding and repairing, reduces the welding and repairing cost and improves the production efficiency.
Drawings
Figure 1 is a schematic view of the structure of a PCB board in the present invention,
figure 2 is a schematic diagram of the structure of the printing tool,
figure 3 is a left side view of figure 2,
figure 4 is a schematic perspective view of figure 3,
figure 5 is a schematic view of the structure of the steel net,
figure 6 is a schematic view of the connection structure of the PCB board and the mounting tool,
figure 7 is a top view of figure 6,
figure 8 is a schematic structural view of a mounting tool,
figure 9 is a schematic perspective view of figure 8,
figure 10 is a schematic view of the structure of a BGA chip,
FIG. 11 is a schematic structural view of a height limiting tool;
in the drawings, 1 is a PCB board, 2 is a BGA chip package, 20 is a bonding pad, 3 is a positioning hole,
4 is a printing tool, 41 is a frame , 42 is a steel net, 43 is a positioning post , 44 is a through hole, 45 is a printing through hole,
5 is a mounting tool, 51 is a frame body II, 52 is a positioning column II, 53 is a guide block, 531 is an inclined plane, 532 is a vertical plane, 54 is a gap , 55 is a gap II,
6 is a BGA chip, 60 is a solder ball,
7 is a vertical plate, 70 is a rectangular chute.
Detailed Description
The present invention, as shown in fig. 1-11, comprises the steps of:
1) two positioning holes 3 are formed in a diagonal line of a BGA chip packaging body 2 (namely a packaging area of the BGA chip, a plurality of bonding pads 20 are arranged in the packaging area) on the
2) connecting the solder
3) connecting the
4) heating the BGA chip by using a hot air gun until the solder balls and the solder paste are completely melted, stopping heating after the periphery of the BGA chip is found to be settled, and cooling the BGA chip to the normal temperature;
5) taking out the mounting tool;
6) sliding the height limiting tool over the BGA chip to detect the welding quality of the BGA chip; if the height limiting tool does not move up and down, the product is qualified; if the height limiting tool moves up and down, the product is unqualified;
7) and (4) finishing.
In the work of the invention, two positioning holes are arranged on the diagonal line of the BGA chip packaging body, the solder paste printing tool can be conveniently fixed by utilizing the two positioning holes to print the solder paste, the BGA chip can be conveniently pasted and placed by the fixed pasting tool, so that the solder balls on the BGA chip and the bonding pads of the packaging body on the PCB board are reliably aligned, the BGA chip is installed by heating and welding the nozzle of the hot air gun, and the welded BGA chip is quickly detected by the height limiting tool, thereby saving the cost and having high production response speed.
The invention simplifies the BGA chip welding and repairing process, does not need a chip mounter or a special BGA repairing table, meets the requirements of different BGA chips on welding and repairing, reduces the welding and repairing cost and improves the production efficiency.
The
the diagonal of steel mesh is equipped with two
The steel mesh is located at the bottom of the frame , and the positioning posts pass through the through holes and fix the steel mesh on the frame , and connect with the positioning holes during printing.
The rectangular frame and the steel mesh are arranged, so that the rectangular frame and the steel mesh are conveniently positioned and connected on the PCB, meanwhile, the printing through holes in the steel mesh correspond to the bonding pads on the BGA chip packaging body, the subsequent solder paste printing is convenient, and the operation is convenient.
The
the periphery of the inner wall of the second frame body is provided with a
the lower part of the guide block extends out of the second frame body.
Set up the connection of rectangle framework two on the PCB board, lead BGA chip through the inclined plane of guide block, make its perpendicular landing along the guide block to realize BGA chip's tin ball contact tin cream.
A gap 54 is formed between every two guide blocks on the periphery of the inner wall of the second frame body, and the lower parts of the guide blocks extend out of the second frame body, so that a gap II 55 is formed between the bottom surface of the second frame body and the top surface of the PCB, and the gap is communicated with the gap II;
therefore, when the subsequent hot air gun heats the chip, the whole chip is heated uniformly, the welding time is shortened, and the local temperature of the BGA chip is prevented from being too high.
The height limiting tool comprises a
Move through the riser, pass the BGA chip in the rectangle spout, observe the riser and whether reciprocate to judge the welding quality of BGA chip.
In the step 2), after the printing tool is taken out, observing whether the solder paste in the packaging body has defects or not; wherein, the defects comprise missed brushing or adhesion, and the solder paste is complete through manual adjustment.
Therefore, the reliability of subsequent welding can be ensured, and the product quality is improved.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
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