Polishing pad and polishing apparatus
阅读说明：本技术 研磨垫及研磨装置 (Polishing pad and polishing apparatus ) 是由 杨一凡 于 2019-10-29 设计创作，主要内容包括：本发明提供了一种研磨垫及研磨装置,包括：一面为研磨面、另一面为支持面的板状的垫主体；以及多个开孔,每个所述开孔从所述研磨面朝向所述支持面凹陷,且每个所述开孔从靠近所述垫主体的中心区域延伸至靠近所述垫主体的周边区域。所述研磨垫上分布多个开孔,减少了被研磨的晶圆中心跟所述研磨垫开孔的区域的接触时间,从而减少了晶圆中心的研磨量,使晶圆中心和晶圆周圈的研磨量趋于一致,提高被研磨晶圆的平整度。(The invention provides a polishing pad and a polishing device, comprising: a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and a plurality of apertures, each of the apertures being recessed from the abrasive surface toward the seating surface, and each of the apertures extending from a central region proximate the pad body to a peripheral region proximate the pad body. The grinding pad is provided with a plurality of openings, so that the contact time between the center of a ground wafer and the area of the openings of the grinding pad is reduced, the grinding amount of the center of the wafer is reduced, the grinding amounts of the center of the wafer and the periphery of the wafer tend to be consistent, and the flatness of the ground wafer is improved.)
1. A polishing pad, comprising:
a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and
a plurality of openings, each of the openings being recessed from the abrasive surface toward the seating surface, and each of the openings extending from a central region proximate the pad body to a peripheral region proximate the pad body.
2. The polishing pad of claim 1, wherein the pad body is disk-shaped, each of the openings extends from a center of the pad body to a circumference of the pad body, and the plurality of openings are arranged in a windmill about the center of the pad body.
3. The polishing pad of claim 2, wherein the number of the openings is 3 to 10, and each of the openings is recessed from the polishing surface and penetrates through the supporting surface.
4. The polishing pad of claim 2, wherein the cross-sectional shape of the opening, in a cross-section parallel to the polishing surface, comprises: any one or a combination of two or more of an arc shape, a bar shape and an oval shape.
5. The polishing pad according to claim 2, wherein the diameter of the pad body is 60 to 900mm, and the thickness of the pad body is 1.3 to 5.0 mm.
6. The polishing pad of claim 2, wherein a plurality of grooves extending from the polishing surface to the support surface are distributed on the pad body between adjacent openings.
7. The polishing pad of claim 6, wherein the grooves are circular blind holes.
8. The polishing pad of claim 6, wherein the groove is an annular groove.
9. The polishing pad of claim 1, wherein the material of the pad body comprises: a foamed polyurethane resin or a non-foamed polyurethane resin.
10. A grinding apparatus, comprising:
the polishing pad of any one of claims 1 to 9;
a holding member arranged to face the polishing pad and holding an object to be polished; and
and a drive mechanism for polishing the surface of the object to be polished by causing the polishing pad and the object to be polished held by the holding member to perform relative frictional motion.
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a grinding pad and a grinding device.
Background
In wafer manufacturing, with the upgrading of process technology and the shrinking of critical dimension, the requirement for the flatness of the wafer surface is higher and higher, and the chemical mechanical polishing process is widely applied. A polishing surface of a polishing pad used for chemical mechanical polishing is planar, and a surface to be polished of a wafer and a polishing surface of the polishing pad are arranged parallel to each other and polished by rotating and contacting each other. The thin film on the surface of the wafer is removed through a series of complicated mechanical and chemical actions, so that the aim of flattening the wafer is fulfilled.
In the actual chemical mechanical polishing process, the polished wafer has poor flatness due to the inconsistent polishing amount on the polished surface of the wafer, as shown in fig. 1, the polished amount at the center of the polished wafer is large, the polishing amount at the periphery of the wafer is small, and the poor flatness of the wafer affects the consistency and performance of a plurality of chips manufactured on the wafer.
Disclosure of Invention
The invention aims to provide a polishing pad and a polishing device, which can improve the polishing flatness of a polished wafer.
The invention provides a polishing pad, comprising:
a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and
a plurality of openings, each of the openings being recessed from the abrasive surface toward the seating surface, and each of the openings extending from a central region proximate the pad body to a peripheral region proximate the pad body.
Further, the pad main body has a disk shape, each of the openings extends from a center of the pad main body to a circumference of the pad main body, and the plurality of openings are arranged in a windmill shape around the center of the pad main body.
Furthermore, the number of the openings is 3-10, and each opening is recessed from the grinding surface and penetrates through the supporting surface.
Further, in a cross section parallel to the abrasive surface, the cross-sectional shape of the opening includes: any one or a combination of two or more of an arc shape, a bar shape and an oval shape.
Further, the diameter of the pad main body is 60-900 mm, and the thickness of the pad main body is 1.3-5.0 mm.
Further, a plurality of grooves extending from the grinding surface to the support surface are distributed on the pad body between the adjacent openings.
Further, the groove is a round blind hole.
Further, the groove is an annular groove.
Further, the material of the pad main body includes: a foamed polyurethane resin or a non-foamed polyurethane resin.
The present invention also provides a grinding apparatus comprising:
the above-mentioned polishing pad;
a holding member arranged to face the polishing pad and holding an object to be polished; and
a drive mechanism for driving the polishing pad and the object to be polished held by the holding member
The object to be ground makes relative friction movement to grind the surface to be ground of the object to be ground.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a polishing pad and a polishing apparatus, comprising: a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and each opening is sunken from the grinding surface to the supporting surface, a plurality of openings are distributed on the grinding pad, and each opening extends from a central area close to the pad body to a peripheral area close to the pad body, so that the contact time between the center of a ground wafer and the opening area of the grinding pad is reduced, the grinding amount of the center of the wafer is reduced, the grinding amounts of the center and the periphery of the wafer tend to be consistent, and the flatness of the ground wafer is improved.
Drawings
FIG. 1 is a schematic diagram illustrating the amount of polishing of a wafer by a polishing pad of the prior art;
FIG. 2 is a schematic top view of a polishing pad according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a polishing pad according to another embodiment of the present invention;
FIG. 4 is a schematic top view of a polishing pad according to another embodiment of the present invention;
FIG. 5 is a schematic view of the polishing amount of a wafer polished by the polishing pad according to the embodiment of the present invention.
Wherein the reference numbers are as follows:
10-a pad body; 20-opening pores; 31-a groove; 32-grooves.
Detailed Description
Based on the above research, the embodiments of the present invention provide a polishing pad and a polishing apparatus. The invention is described in further detail below with reference to the figures and specific examples. The advantages and features of the present invention will become more apparent from the following description. It is to be noted, however, that the drawings are designed in a simplified form and are not to scale, but rather are to be construed in an illustrative and descriptive sense only and not for purposes of limitation.
An embodiment of the present invention provides a polishing pad, including:
a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and a plurality of openings, each of the openings being recessed from the abrasive surface toward the seating surface, the openings being blind or through in a thickness direction of the pad body, and each of the openings extending from a central region near the pad body to a peripheral region near the pad body.
The grinding pad is provided with a plurality of openings, each opening extends from a central area close to the pad main body to a peripheral area close to the pad main body, so that the contact time between the center of a ground wafer and the opening area of the grinding pad is reduced, the grinding amount of the center of the wafer and the grinding amount of the periphery of the wafer tend to be consistent, and the flatness of the ground wafer is improved.
In the present embodiment, the wafer is, for example, a semiconductor device wafer, but may be various wafers such as a semiconductor substrate, an inorganic material substrate, and a package substrate. As the semiconductor substrate, various substrates such as silicon, gallium arsenide, gallium nitride, and silicon carbide can be used. As the inorganic material substrate, various substrates such as sapphire, ceramic, and glass can be used. The semiconductor substrate and the inorganic material substrate may or may not form a device. As the Package substrate, a CSP (Chip Size Package) or a WLCSP (Wafer Level Chip Size Package) can be used.
The polishing pad of the present invention is described in detail with reference to fig. 2 to 5.
As shown in fig. 2, the
The
Preferably, a plurality of grooves extending from the grinding surface to the support surface are distributed on the pad body between the adjacent openings. The grooves are used for storing grinding fluid, and the grinding fluid in the grooves participates in grinding along with the progress of a grinding process, so that the contact area occupation ratio of the grinding fluid and a wafer is increased, and the grinding speed and efficiency of a chemical mechanical grinding (CMP) process are stabilized. Specifically, as shown in fig. 3, the
The chemical mechanical polishing process uses a polishing slurry with polishing particles and chemical additives. The polishing slurry is transferred to the surface of the polishing pad, and the polished surface of the wafer is brought into contact with the polishing pad and polished while rotating. The thin film on the surface of the wafer is removed through a series of complicated mechanical and chemical actions, so that the aim of flattening the wafer is fulfilled.
By adopting the polishing pad provided by the embodiment of the invention, the plurality of openings are distributed on the polishing pad, and each opening extends from the central area close to the pad main body to the peripheral area close to the pad main body, so that the contact time between the center of a polished wafer and the opening area of the polishing pad is reduced, and the polishing amount of the center of the wafer is reduced.
An embodiment of the present invention further provides a polishing apparatus, including:
a polishing pad;
a holding member arranged to face the polishing pad and holding an object to be polished; and
a drive mechanism for polishing the surface to be polished of the object to be polished by causing the polishing pad and the object to be polished held by the holding member to perform relative frictional motion;
the polishing pad includes:
a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and
a plurality of openings, each of the openings being recessed from the abrasive surface toward the seating surface, and each of the openings extending from a central region proximate the pad body to a peripheral region proximate the pad body.
Specifically, the object to be polished is a disk-shaped substrate (wafer) made of a material such as silicon, SiC (silicon carbide), or other semiconductors, or a material such as sapphire, glass, or quartz. The front surface of the object to be polished is divided into a plurality of regions by a plurality of lines to divide (streets) arranged in a grid pattern, and devices such as ICs are formed in each of the plurality of regions. Finally, the object to be ground is divided along the dividing lines, thereby forming the respective device chips.
Specifically, the grinding device further comprises a grinding disc and a conveying pipeline for distributing grinding liquid, and the grinding pad is attached to the grinding disc. The working process is as follows: a polishing liquid based on water and containing polishing particles and chemical additives is delivered to the surface of a polishing pad by a nozzle of a delivery pipeline, the polishing liquid soaks the surface of the polishing pad, the polished surface of a wafer is pressed and contacted with the polishing pad, a polishing disc attached with the polishing pad and a holding member bearing the wafer rotate in the same direction, and the polishing is carried out by utilizing the relative mechanical friction between the polishing agent and the polished surface. The number of revolutions of the grinding disk is, for example: 80-100 rpm, the pressure of the wafer with the polished surface pressing on the polishing pad is, for example: 10 to 100kPa, preferably 5 to 50kPa in order to satisfy the requirements for uniformity of the surface to be polished and flatness of the pattern. During the polishing period, the polishing liquid is continuously supplied to the polishing pad through the transfer line by a pump or the like. The supply amount is not limited, and it is preferable that the surface of the polishing pad is always covered with the polishing liquid. After polishing, the wafer is preferably thoroughly washed in running water and then dried by shaking off water droplets adhering to the surface by a spin drying method or the like.
In order to perform chemical mechanical polishing so that the surface state of the polishing pad is always kept uniform, it is preferable to add a polishing pad dressing step before polishing. For example, the polishing pad is dressed by ejecting a liquid containing at least water onto the polishing pad.
The grinding device of the embodiment of the invention can prolong the service life of the grinding pad, improve the flatness of the ground wafer and prevent the wafer from being attached to the grinding pad.
In summary, the polishing pad and the polishing apparatus provided by the present invention include: a plate-like pad body having a polishing surface on one side and a supporting surface on the other side; and each opening is sunken from the grinding surface to the supporting surface, a plurality of openings are distributed on the grinding pad, and each opening extends from a central area close to the pad body to a peripheral area close to the pad body, so that the contact time between the center of a ground wafer and the opening area of the grinding pad is reduced, the grinding amount of the center of the wafer is reduced, the grinding amounts of the center and the periphery of the wafer tend to be consistent, and the flatness of the ground wafer is improved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the method disclosed by the embodiment, the description is relatively simple because the method corresponds to the device disclosed by the embodiment, and the relevant points can be referred to the description of the method part.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
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