阅读说明：本技术 薄切片全自动收集系统 (Full-automatic thin section collecting system ) 是由 骆清铭 袁菁 陈键伟 邓磊 龚辉 于 2019-10-15 设计创作，主要内容包括：本发明公开了一种薄切片全自动收集系统,包括：放卷模块,用于放出胶带；微接触收集模块,包括压杆与活动地绕设于压杆上的胶带,压杆用于对胶带进行支撑的同时将切片粘上；收卷模块,用于回收粘有切片的胶带；纠偏模块,包括位置检测器及位置调整器,位置检测器用于检测胶带是否在胶带的预定运动轨迹上产生偏移,位置调整器用于对产生偏移的胶带进行位置纠正。其目的在于解决现有技术中的自动收集方式无法保证收集到的切片形变满足要求的技术问题。(The invention discloses a full-automatic thin slice collecting system, which comprises: the unwinding module is used for unwinding the adhesive tape; the micro-contact collection module comprises a pressure rod and an adhesive tape movably wound on the pressure rod, and the pressure rod is used for supporting the adhesive tape and adhering the slices; the winding module is used for recovering the adhesive tape adhered with the slices; the deviation rectifying module comprises a position detector and a position adjuster, wherein the position detector is used for detecting whether the adhesive tape deviates on a preset movement track of the adhesive tape, and the position adjuster is used for correcting the position of the adhesive tape which deviates. Its aim at solves the technical problem that the automatic collection mode among the prior art can't guarantee that the section deformation of collecting satisfies the requirement.)

1. A full-automatic thin section collecting system is characterized by comprising:

the unwinding module is used for unwinding the adhesive tape;

the micro-contact collection module comprises a pressure rod and an adhesive tape movably wound on the pressure rod, and the pressure rod is used for supporting the adhesive tape and adhering the slices;

the winding module is used for recovering the adhesive tape adhered with the slices;

the deviation rectifying module comprises a position detector and a position adjuster, wherein the position detector is used for detecting whether the adhesive tape deviates on a preset movement track of the adhesive tape, and the position adjuster is used for correcting the position of the adhesive tape which deviates.

2. The fully automatic thin slice collection system of claim 1 wherein the position detector is an ultrasonic sensor and the position adjuster is a displacement type deviation correction device.

3. The fully automatic collection system for thin slices as claimed in claim 1, further comprising a tension control module located on the movement track of the adhesive tape for detecting the tension of the adhesive tape and adjusting the tension of the adhesive tape according to the tension detection result.

4. The full-automatic collection system for thin slices as claimed in claim 3, wherein the tension control module comprises a tension detector and a tension adjuster, the tension detector is used for detecting the tension of the adhesive tape, and the tension adjuster is used for adjusting the tension of the adhesive tape according to the tension detection result.

5. The fully automatic thin section collection system of claim 4, wherein the tension detector is a tension sensor and the tension adjuster is a magnetic particle brake mounted on the film unwinding module.

6. The system as claimed in claim 4, wherein the deviation rectifying module is located between the unwinding module and the pressing rod, and the tension detector is located between the pressing rod and the winding module.

7. The fully automatic collection system of thin sections as claimed in claim 1, further comprising an angular encoder on the tape movement track for cooperating with a motor in the film collection module to control the tape movement speed.

8. The fully automatic collection system of thin slabs of claim 1, wherein said micro-contact collection module further comprises a deflection adjustment device coupled to said compression bar to adjust the spatial attitude of the compression bar in four degrees of freedom.

9. The full-automatic thin section collecting system according to claim 8, wherein the offset adjusting device comprises a flexible adjusting mechanism and a displacement actuator, the flexible adjusting mechanism comprises a first direction adjusting member and a second direction adjusting member, the displacement actuator comprises a first direction actuator and a second direction actuator, the first direction adjusting member cooperates with the first direction actuator to eliminate the offset of the first direction, and the second direction adjusting member cooperates with the second direction actuator to eliminate the offset of the second direction.

10. The fully automatic thin section collection system of claim 9, wherein the first direction adjustment member is identical in structure and perpendicular to the second direction adjustment member, and the first direction adjustment member comprises four parallel flexible plates nested inside and outside, and the ends of the flexible plates are fixed to the frame such that the flexible plates are displaced in a direction perpendicular to the plates and not displaced in a direction parallel to the plates.

Technical Field

The invention belongs to the field of biomedicine, and particularly relates to a full-automatic thin slice collecting system.

Background

In the biomedical field, biological tissue is thicker, and optical penetrability is relatively poor, can't directly acquire the microscopic data of monoblock tissue, so need to the continuous thin slice cutting imaging of biological tissue, the traditional process mainly is artificial section collection, has labour intensive, and the shortcoming that human error is big, damage and the deformation that cause the sample section can't be estimated.

Some automatic slice collecting devices are developed later, such as semi-automatic or automatic slice collecting modes of a conveyor belt type, an adhesive tape type, a manipulator type and the like, the semi-automatic slice collecting mode cannot completely liberate manpower, cannot completely realize automation, and cannot ensure sample slice collecting precision. The conventional automatic slice collecting mode cannot ensure dislocation and deformation in the slice collecting process.

Disclosure of Invention

Aiming at the defects or the improvement requirements of the prior art, the invention provides a full-automatic thin slice collecting system, which aims to solve the technical problem that the automatic slice collecting mode in the prior art cannot ensure that the collected slices are dislocated and deformed.

In order to achieve the above object, the present invention provides a full-automatic thin slice collecting system, comprising:

the unwinding module is used for unwinding the adhesive tape;

the micro-contact collection module comprises a pressure rod and an adhesive tape movably wound on the pressure rod, and the pressure rod is used for supporting the adhesive tape and adhering the slices;

the winding module is used for recovering the adhesive tape adhered with the slices;

the deviation rectifying module comprises a position detector and a position adjuster, wherein the position detector is used for detecting whether the adhesive tape deviates on a preset movement track of the adhesive tape, and the position adjuster is used for correcting the position of the adhesive tape which deviates.

Preferably, the position detector is an ultrasonic sensor, and the position adjuster is a displacement type deviation correcting device.

Preferably, the tension control module is located on the movement track of the adhesive tape and used for detecting the tension of the adhesive tape and adjusting the tension of the adhesive tape according to the tension detection result.

Preferably, the tension control module comprises a tension detector and a tension adjuster, wherein the tension detector is used for detecting the tension of the adhesive tape, and the tension adjuster is used for adjusting the tension of the adhesive tape according to the tension detection result.

Preferably, the tension detector is a tension sensor, and the tension adjuster is a magnetic powder brake mounted on the film unwinding module.

Preferably, the deviation rectifying module is located between the unwinding module and the pressing rod, and the tension detector is located between the pressing rod and the winding module.

Preferably, the film winding device further comprises an angular speed encoder positioned on the moving track of the adhesive tape, and the angular speed encoder is used for cooperating with a motor in the film winding module to control the moving speed of the adhesive tape.

Preferably, the micro-contact collection module further comprises a deflection adjusting device connected to the pressing rod to adjust the spatial posture of the pressing rod in four degrees of freedom.

Preferably, the offset adjusting device comprises a flexible adjusting mechanism and a displacement actuator, the flexible adjusting mechanism comprises a first direction adjusting piece and a second direction adjusting piece, the displacement actuator comprises a first direction actuator and a second direction actuator, the first direction adjusting piece and the first direction actuator cooperate to eliminate the offset of the first direction, and the second direction adjusting piece and the second direction actuator cooperate to eliminate the offset of the second direction.

Preferably, the first direction adjusting part and the second direction adjusting part are of the same structure and are vertical in direction, the first direction adjusting part comprises four parallel flexible plates nested inside and outside, and the ends of the flexible plates are fixed on the frame so that the flexible plates can be displaced in the direction vertical to the plates and can not be displaced in the direction parallel to the plates.

In general, compared with the prior art, the above technical solution contemplated by the present invention can achieve the following beneficial effects:

(1) the full-automatic slicing system provided by the invention comprises the deviation correcting module, so that the position of the adhesive tape with deviation can be corrected, the adhesive tape is ensured not to have deviation in the moving process, and the slicing dislocation caused by the dislocation of the adhesive tape is further prevented.

(2) The full-automatic slicing system provided by the invention also comprises an adhesive tape tension control module, so that the tension change in the moving process of the adhesive tape can be detected in real time and adjusted in real time, and the slicing deformation caused by the stretching deformation of the adhesive tape is reduced as much as possible.

(3) The full-automatic slicing system provided by the invention also comprises an angular speed encoder which is matched with a motor in the winding module to accurately control the moving speed of the adhesive tape, so that the deformation of the sample slice caused by the mismatching of the moving speed of the adhesive tape is reduced.

(4) The full-automatic slicing system provided by the invention also comprises an offset adjusting device connected with the pressure rod, so that the spatial posture of the pressure rod can be adjusted in four degrees of freedom, namely, the offset of the pressure rod generated in the four degrees of freedom can be eliminated, the four degrees of freedom of the pressure rod can be controlled, the accurate control of the distance between an adhesive tape wound on the pressure rod and a slice can be realized, the adhesive tape is extruded and adhered constantly, and the slice deformation caused in the adhesive tape adhering and extruding process can be reduced as much as possible.

(5) The full-automatic thin section collecting system provided by the invention is suitable for the flat-pushing cutting of all the existing rigid embedded samples, such as resin embedded sections, paraffin embedded sections, frozen sections and the like.

Drawings

FIG. 1 is a schematic structural diagram of a fully automatic collection system for thin slices according to the present invention;

FIG. 2 is a schematic structural diagram of an offset adjustment apparatus according to the present invention;

FIG. 3 is a four degree of freedom schematic view of a compression bar;

fig. 4 is a schematic view of the flexibility adjusting mechanism proposed by the present invention.

The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein:

1-an unwinding module; 2, a winding module; 31-a pressure bar; 32-adhesive tape; 4-a deviation rectifying module; 41-a position detector; 5-a tension detector; 6-angular velocity encoder; 7-an offset adjustment device; 71-a flexible adjustment mechanism; 72-a displacement actuator; 8-slicing; 9-a slicing tool; 10-sample.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

As shown in fig. 1, the present invention provides a fully automatic collection system for thin slices, comprising: the unwinding module 1 is used for unwinding the adhesive tape; the micro-contact collection module comprises a pressure lever 31 and an adhesive tape 32 movably wound on the pressure lever 31, the contact part of the pressure lever 31 and the adhesive tape 32 is arc-shaped so as to ensure that the adhesive tape 32 is smoothly wound on the arc-shaped part, and the pressure lever 31 is used for supporting the adhesive tape 32 and simultaneously the adhesive tape 32 can stick the cut sheet 8; the winding module 2 is used for recovering the adhesive tape adhered with the slices; the deviation rectifying module 4 comprises a position detector 41 and a position adjuster 42, wherein the position detector 41 is an ultrasonic sensor and is used for detecting whether the adhesive tape 32 deviates on a preset movement track of the adhesive tape; the position regulator is a displacement type deviation correcting device and is used for correcting the position of the adhesive tape generating deviation. The deviation rectifying module 4 is located between the unwinding module 1 and the pressing rod 31.

The micro-contact collection module is the basis of a thin slice full-automatic collection system, and the unreeling module 1 and the reeling module 2 are important components of a slice collection system, so that the adhesive tape is ensured to be in a moving state all the time and the slices 8 can be recovered. The full-automatic collecting system can correct the position of the adhesive tape generating the deviation by arranging the deviation correcting module 4 so as to ensure that the adhesive tape does not have the deviation in the moving process, thereby reducing the influence of the deviation of the adhesive tape on the deformation of the sample slice.

The system also comprises a tension control module positioned on the movement track of the adhesive tape and used for detecting the tension of the adhesive tape and adjusting the tension of the adhesive tape according to the tension detection result. The tension control module comprises a tension detector 5 and a tension adjuster, wherein the tension detector 5 is a tension sensor and is used for detecting the tension of the adhesive tape; the tension regulator is a magnetic powder brake arranged on the film placing module 1 and is used for regulating the tension of the adhesive tape according to the tension detection result. The tension detector 5 is located between the pressing rod 31 and the winding module 2. Through the tension control module, the tension change in the moving process of the adhesive tape can be detected in real time, and the tension can be adjusted in real time, so that the deformation of a sample slice caused by the stretching deformation of the adhesive tape is reduced as much as possible.

Wherein, the system also comprises an angular speed encoder 6 positioned on the moving track of the adhesive tape, and the angular speed encoder 6 is used for cooperating with a motor in the film collecting module 2 to control the moving speed of the adhesive tape. Through angle encoder 6 and motor cooperation with accurate control sticky tape translation rate, can reduce the sample section deformation that the sticky tape removal caused.

Wherein, the micro-contact collection module further comprises a deviation adjusting device 7, and the deviation adjusting device 7 is connected with the pressing rod 31 to adjust the spatial posture of the pressing rod 31 in four degrees of freedom, namely, eliminate the deviation of the pressing rod 31 in four degrees of freedom. The offset adjusting device 7 comprises a flexible adjusting mechanism 71 and a displacement actuator 72, wherein the flexible adjusting mechanism 71 comprises a first direction adjusting part and a second direction adjusting part, the displacement actuator 72 comprises a first direction actuator and a second direction actuator, the first direction adjusting part is matched with the first direction actuator to eliminate the offset of the first direction, and the second direction adjusting part is matched with the second direction actuator to eliminate the offset of the second direction. The first direction adjusting piece and the second direction adjusting piece are identical in structure and vertical in direction, the first direction adjusting piece comprises four parallel flexible plates which are nested inside and outside, and the ends of the flexible plates are fixed on the rack so that the flexible plates can displace in the direction vertical to the plates and do not displace in the direction parallel to the plates.

The four degrees of freedom refer to 2 translational degrees of freedom a and b and 2 rotational degrees of freedom m and n shown in fig. 3. Wherein O represents the center of mass of the compression bar 31 (since the two ends of the compression bar are fixed, the compression bar does not move along its axial direction, so the translational degree of freedom refers to the two non-axial displacement directions of the compression bar).

As shown in fig. 2, both ends of the pressing rod 31 are provided with flexible adjusting mechanisms 71. For convenience of description, the displacement actuator parallel to the x-axis in fig. 2 refers to a first direction actuator, and the displacement actuator parallel to the y-axis refers to a second direction actuator. The displacement of the plunger can be converted into the displacement in the directions of the x-axis and the y-axis, so that the offset of the plunger can be adjusted by an actuator parallel to the two directions.

The principle of the flexible adjusting mechanism is explained as follows: FIG. 4a is a cross beam structure diagram, wherein one end of the cross beam is fixed, and the other end of the cross beam generates deformation displacement delta, epsilon and deformation angle theta in the stress direction under the action of an external force F; fig. 4b is a schematic explanatory diagram of the direction adjusting member, which is composed of a primary platform and a secondary platform, wherein the primary platform generates deformation displacement and deformation angle when stressed, but due to the secondary platform, the deformation displacement epsilon of the primary platform in the non-stressed direction in the stressed process can be eliminated, and then the platform deformation displacement is realized to move along the stressed direction. Based on the principle, a flexible adjusting mechanism in the offset adjusting device is designed, and the control of four degrees of freedom of the pressure lever is realized.

The working process is as follows:

in operation, the unwinding module 1 and the winding module 2 are opened to start the tape 32 to move at a speed v, and the movement trace is shown in fig. 1. A fixed slicing tool 9 for moving the specimen 10 at a speed v to slice, wherein the interval between the tape 32 and the slice 8 is controlled by the offset adjusting device 7 during slicing so that the slice 8 can be adhered to the tape 32 with a small pressing force; the moving speed of the adhesive tape 32 is controlled by the angle encoder 9 and the motor, the position of the adhesive tape 32 is adjusted in real time by the deviation rectifying module 4, and the slice deformation of the adhesive tape 32 caused by the deviation of the adhesive tape 32 in the slice collecting process is reduced; and the tension control module detects the tension of the adhesive tape 32 in real time through the tension sensor, and then feeds the tension detection result back to the magnetic powder brake to adjust the output torque of the magnetic powder brake in real time, so that the deformation of the section 8 caused by the tension change of the adhesive tape 32 is reduced. The system can realize the accurate control of the collecting position of the sample thin slice, and the control accuracy reaches within one hundred micrometers.

It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.