阅读说明：本技术 一种环保助焊剂配方及生产工艺 (Formula and production process of environment-friendly soldering flux ) 是由 丁勇 于 2019-10-23 设计创作，主要内容包括：本发明公开了一种环保助焊剂配方及生产工艺,涉及DIP技术领域,有机活化剂1.0-5.0％、活性增强剂0.2-1.0％、标面活性剂0.1-0.6％、保护剂2.0-9.0％、高沸点溶剂1.0-10.0％、成膜剂2.0-8.0％和缓冲剂0.1-0.5％,其余末溶剂为异丙醇或乙醇的一种。本发明中,环保焊剂在生产和使用过程中不产生污染性气体,弥补焊接现场因为通风不良而造成有刺鼻气味呛鼻的缺陷,增加对车间环境的净化和舒适度,且在PCB板焊接过程中起着润湿、清洁工作面、催化焊接功能,以及焊接过后焊点的保护功能,以便解决焊接过程中经常出现的焊盘空洞现象,降低后道修补工序的繁重,增加PCB插件线路板的一次性通过率,减少后道工序的繁重修补减少人工和工时。(The invention discloses an environment-friendly soldering flux formula and a production process, and relates to the technical field of DIP (dual in-line DIP), 1.0-5.0% of an organic activator, 0.2-1.0% of an activity enhancer, 0.1-0.6% of a standard surfactant, 2.0-9.0% of a protective agent, 1.0-10.0% of a high boiling point solvent, 2.0-8.0% of a film forming agent and 0.1-0.5% of a buffer, wherein the rest of the end solvent is one of isopropanol or ethanol. In the invention, the environment-friendly welding flux does not generate polluting gas in the production and use processes, overcomes the defect that a welding field is choked with pungent smell due to poor ventilation, increases the purification and comfort degree of the workshop environment, plays the functions of wetting, cleaning a working surface, catalyzing and welding in the welding process of the PCB and has the protection function of a welding spot after welding, so as to solve the problem of a pad cavity phenomenon which often occurs in the welding process, reduce the heavy work of the subsequent repairing process, increase the one-time pass rate of the PCB plug-in circuit board, reduce the heavy repairing of the subsequent process and reduce the labor and the working hours.)

1. An environment-friendly soldering flux formula is characterized in that: the environment-friendly soldering flux comprises the following raw materials in percentage by mass: 1.0-5.0% of organic activator, 0.2-1.0% of activity enhancer, 0.1-0.6% of standard surfactant, 2.0-9.0% of protective agent, 1.0-10.0% of high boiling point solvent, 2.0-8.0% of film-forming agent and 0.1-0.5% of buffer, and the rest of solvent is one of isopropanol or ethanol.

2. The environment-friendly soldering flux formulation of claim 1, wherein: the organic activator is a mixture of oxalic acid, succinic acid and citric acid.

3. The environment-friendly soldering flux formulation of claim 1, wherein: the activity enhancer is one of succinamide or malonamide.

4. The environment-friendly soldering flux formulation of claim 1, wherein: the standard surfactant is NP-10 nonylphenol polyoxyethylene ether.

5. The environment-friendly soldering flux formulation of claim 1, wherein: the protective agent is polyethylene glycol series compound.

6. The environment-friendly soldering flux formulation of claim 1, wherein: the high boiling point solvent is a mixture of diethylene glycol butyl ether and hexanediol.

7. The environment-friendly soldering flux formulation of claim 1, wherein: the film forming agent is a mixture of hydrogenated rosin or water white rosin and polymerized rosin.

8. The environment-friendly soldering flux formulation of claim 1, wherein: the corrosion inhibitor is benzotriazine

9. A production process of an environment-friendly soldering flux comprises the following steps:

step 1: weighing the raw materials according to the corresponding mass percentage for later use;

step 2: mixing and stirring the organic activator, the activity enhancer and the standard surface activator to prepare a mixture I for later use;

and step 3: mixing and stirring the protective agent, the film-forming agent and the buffering agent to prepare a second mixture for later use;

and 4, step 4: mixing and stirring the high-boiling-point solvent and the rest of the end solvents to prepare a mixture III for later use;

and 5: and mixing and stirring the first mixture, the second mixture and the third mixture, and heating in the process to prepare the environment-friendly soldering flux.

10. The production process of the environment-friendly soldering flux as claimed in claim 9, wherein: the mixing, stirring and heating temperature of the step 4 is 180 ℃.

Technical Field

The invention relates to the technical field of DIP, in particular to an environment-friendly soldering flux formula and a production process.

Background

At present, along with the continuous progress of lead-free in the electronic industry, the use of the environment-friendly soldering flux is more mature and the requirement is higher in the DIP industry. Reliability and environmental requirements for the welding process are also increasing.

However, in the prior art, the one-time welding pass rate of the PCB plug-in circuit board is low, so that the repairing process is heavier, the labor and the working time are greatly increased, a plurality of manufacturers have high requirements on the one-time board passing of the PCB, and meanwhile, the manufacturers pay more and more attention to the working environment of workshop operators. In view of the above, a great deal of time, energy and material resources are required to be invested to develop the environment-friendly flux so as to meet the increasingly demanding electronic DIP industry.

Disclosure of Invention

The invention aims to provide an environment-friendly soldering flux formula and a production process, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme:

the formula of the environment-friendly soldering flux comprises the following raw materials in percentage by mass: 1.0-5.0% of organic activator, 0.2-1.0% of activity enhancer, 0.1-0.6% of standard surfactant, 2.0-9.0% of protective agent, 1.0-10.0% of high boiling point solvent, 2.0-8.0% of film-forming agent and 0.1-0.5% of buffer, and the rest of solvent is one of isopropanol or ethanol.

As a further scheme of the invention: the organic activator is a mixture of oxalic acid, succinic acid and citric acid.

As a still further scheme of the invention: the activity enhancer is one of succinamide or malonamide.

As a still further scheme of the invention: the standard surfactant is NP-10 nonylphenol polyoxyethylene ether.

As a still further scheme of the invention: the protective agent is polyethylene glycol series compound.

As a still further scheme of the invention: the high boiling point solvent is a mixture of diethylene glycol butyl ether and hexanediol.

As a still further scheme of the invention: the film forming agent is a mixture of hydrogenated rosin or water white rosin and polymerized rosin.

As a still further scheme of the invention: the corrosion inhibitor is benzotriazine

A production process of an environment-friendly soldering flux comprises the following steps:

step 1: weighing the raw materials according to the corresponding mass percentage for later use;

step 2: mixing and stirring the organic activator, the activity enhancer and the standard surface activator to prepare a mixture I for later use;

and step 3: mixing and stirring the protective agent, the film-forming agent and the buffering agent to prepare a second mixture for later use;

and 4, step 4: mixing and stirring the high-boiling-point solvent and the rest of the end solvents to prepare a mixture III for later use;

and 5: and mixing and stirring the first mixture, the second mixture and the third mixture, and heating in the process to prepare the environment-friendly soldering flux.

As a still further scheme of the invention: the mixing, stirring and heating temperature of the step 4 is 180 ℃.

Compared with the prior art, the invention has the beneficial effects that: the environment-friendly flux formula is suitable for the electronic DIP industry, pollution gas is not generated in the production and use processes, the defect that a sharp smell is choked in a welding field due to poor ventilation is overcome, the purification and comfort degree of a workshop environment are increased, the functions of wetting, cleaning a working surface and catalyzing welding are realized in the welding process of a PCB, and the protection function of a welding spot after welding is realized, so that the problem of a pad cavity phenomenon frequently occurring in the welding process is solved, the heavy load of the subsequent repairing process is reduced, the one-time pass rate of a PCB plug-in circuit board is increased, the heavy repairing of the subsequent process is reduced, and the labor and the working time are reduced.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.