阅读说明：本技术 利用毛细结构与凸点来构成液汽通道的均温板 (Temperature equalizing plate for forming liquid-vapor channel by using capillary structure and salient points ) 是由 曾惓祺 廖文靖 崔明全 于 2018-06-28 设计创作，主要内容包括：本发明公开一种利用毛细结构与凸点来构成液汽通道的均温板,包含有：一第一板,定义一蒸发区、一绝热区以及一冷凝区；一第二板,结合于该第一板而形成一容置空间；一毛细材,位于该容置空间中；以及一作动液。其中,该第一板的板面具有多个第一凸块而位于该容置空间中,该多个凸块分布于该蒸发区、该绝热区以及该冷凝区,并顶抵于该毛细材；该毛细材具有一镂空部位位于该绝热区,借以使部分的多个第一凸块露出；该第二板的板面具有多个第二凸块顶抵于前述露出的多个第一凸块。本发明可对汽态作动液及液态作动液均提供导流的效果。(The invention discloses a temperature equalizing plate for forming liquid-vapor channel by using capillary structure and salient point, comprising: a first plate defining an evaporation zone, an adiabatic zone and a condensation zone; a second plate combined with the first plate to form a containing space; a capillary material in the containing space; and an actuating fluid. The surface of the first plate is provided with a plurality of first bumps which are positioned in the accommodating space, distributed in the evaporation area, the heat insulation area and the condensation area and abutted against the capillary material; the capillary material is provided with a hollow part positioned in the heat insulation area so as to expose part of the plurality of first bumps; the surface of the second plate is provided with a plurality of second convex blocks which are abutted against the exposed first convex blocks. The invention can provide the flow guide effect for both the vapor working fluid and the liquid working fluid.)

1. A vapor chamber using a wick structure and bumps to form a liquid-vapor channel, comprising:

a first plate defining an evaporation zone, an insulating zone and a condensation zone, the insulating zone being adjacent to the evaporation zone and the condensation zone, respectively, and the evaporation zone being not adjacent to the condensation zone;

the second plate is combined with the first plate, and a closed accommodating space is formed between the first plate and the second plate;

a sheet-shaped fine material in the accommodating space; and

an actuating liquid filled into the accommodating space;

the method is characterized in that:

the surface of the first plate is provided with a plurality of first bumps which are positioned in the accommodating space, distributed in the evaporation area, the heat insulation area and the condensation area and propped against the capillary material;

the capillary material is provided with a hollow part, the hollow part is positioned in the heat insulation area, a part of the first bumps are exposed in the hollow part, a gas channel is formed in the hollow part, and at least one liquid channel is formed in the part of the capillary material positioned in the heat insulation area;

the surface of the second plate is provided with a plurality of second convex blocks and is positioned in the accommodating space, and the plurality of second convex blocks are positioned in the hollow parts and are abutted against the exposed plurality of first convex blocks.

2. The vapor chamber using the wick structure and the bump according to claim 1, wherein: the number of the plurality of first bumps positioned in the hollow part in a unit area is less than the number of the plurality of first bumps not positioned in the hollow part in the unit area.

3. The vapor chamber using the wick structure and the bump according to claim 1, wherein: the first bumps in the hollow parts are in strip shape, and two ends of the first bumps face the evaporation area and the condensation area respectively.

4. The vapor chamber plate using the wick structure and the bump to form a liquid-vapor channel according to claim 3, wherein: the first bumps are arranged in a plurality of rows at intervals along the extension direction of the long strip.

5. The vapor chamber plate using the wick structure and the bump to form a liquid-vapor channel according to claim 3, wherein: the second bumps are in a strip shape, and two ends of the second bumps respectively face the evaporation area and the condensation area.

6. The vapor chamber using the wick structure and the bump according to claim 1, wherein: the first plate is provided with at least one blocking member which is positioned in the heat insulation area, the at least one blocking member is abutted against the part of the capillary material positioned in the heat insulation area, and the evaporation area and part of the heat insulation area are spatially blocked, so that the evaporation area and part of the heat insulation area are not communicated with each other spatially.

7. The vapor chamber plate using the wick structure and the bump to form a liquid-vapor channel according to claim 6, wherein: the at least one blocking piece is in a boss shape, and the top surface of the blocking piece is abutted against the part of the capillary material, which is positioned in the heat insulation area, and fills up the space between the part of the capillary material, which is positioned in the heat insulation area, and the first plate.

8. The vapor chamber plate using the wick structure and the bump to form a liquid-vapor channel according to claim 6, wherein: the at least one blocking piece is in a vertical wall shape, and the top edge of the blocking piece is abutted against the part of the capillary material, which is positioned in the heat insulation area.

9. The vapor chamber using the wick structure and the bump according to claim 8, wherein: the at least one barrier spatially isolates the evaporation zone from a space between the first plate and a portion of the capillary material in the insulation zone, and also isolates the vapor channel from a space between the first plate and a portion of the capillary material in the insulation zone.

Technical Field

The invention relates to a Vapor Chamber (Vapor Chamber), in particular to a Vapor Chamber which utilizes a capillary structure and salient points to form liquid-Vapor channels.

Background

The existing temperature equalizing plate is usually formed by overlapping two plate bodies and welding them around to form a closed chamber, and a capillary structure and a working fluid are put into the closed chamber, so that the effect of equalizing temperature and conducting heat is achieved by the conversion of the liquid state and the vapor state of the working fluid.

Taiwan patent No. I476361 discloses a method for forming capillary of uniform temperature plate and a structure thereof, wherein a plurality of supporting protrusions are disposed inside the uniform temperature plate to provide supporting strength and achieve uniform temperature and heat conduction. However, this technique does not have a flow guiding effect for the internal vapor-state working fluid and liquid-state working fluid, but allows them to move freely, and cannot effectively improve the heat conduction and temperature equalization effects.

Taiwan patent No. M532046 discloses a vapor-liquid separation structure of a vapor-liquid thermal equilibrium plate, which mainly provides a flow guiding technique for liquid working fluid and vapor working fluid to increase the thermal conductivity and the vapor-liquid thermal equilibrium effect of the vapor-liquid thermal equilibrium plate. However, the vapor and liquid channels of this technology cannot be applied to the ultra-thin space requirement, and the main reason is that the liquid channel is established by using the fiber bundle, and the evaporation area and the condensation area need to be additionally provided with a layer of capillary material to contact with the fiber bundle.

Disclosure of Invention

The primary objective of the present invention is to provide a vapor chamber plate with a liquid-vapor channel formed by a capillary structure and bumps, which can provide a flow guiding effect for both vapor-state working fluid and liquid-state working fluid, and can be thinned to meet the ultra-thin space requirement.

In order to achieve the above object, the present invention provides a vapor chamber with a wick structure and a bump, comprising: a first plate defining an evaporation zone, an insulating zone and a condensation zone, the insulating zone being adjacent to the evaporation zone and the condensation zone, respectively, and the evaporation zone being not adjacent to the condensation zone; the second plate is combined with the first plate, and a closed accommodating space is formed between the first plate and the second plate; a sheet-shaped fine material in the accommodating space; and an actuating fluid filled into the accommodating space; the surface of the first plate is provided with a plurality of first bumps which are positioned in the accommodating space, distributed in the evaporation area, the heat insulation area and the condensation area and abutted against the capillary material; the capillary material is provided with a hollow part, the hollow part is positioned in the heat insulation area, a part of the first bumps are exposed in the hollow part, a gas channel is formed in the hollow part, and at least one liquid channel is formed in the part of the capillary material positioned in the heat insulation area; the surface of the second plate is provided with a plurality of second convex blocks and is positioned in the accommodating space, and the plurality of second convex blocks are positioned in the hollow parts and are abutted against the exposed plurality of first convex blocks.

Therefore, the invention constructs the gas channel and the liquid channel, can provide the flow guide effect for the gas-state working fluid and the liquid-state working fluid, and can be thinned to meet the ultrathin space requirement.

Preferably, the number of the plurality of first bumps located in the hollow portion in a unit area is less than the number of the plurality of first bumps not located in the hollow portion in a unit area.

Preferably, the first bumps located in the hollow portions are strip-shaped, and two ends of the first bumps face the evaporation area and the condensation area respectively.

Preferably, the plurality of first bumps are arranged in a plurality of rows at intervals along the extending direction of the strip.

Preferably, the second bumps are strip-shaped, and two ends of the second bumps face the evaporation area and the condensation area respectively.

Preferably, the first plate has at least one blocking member located in the heat insulating region, the at least one blocking member abuts against a portion of the capillary material located in the heat insulating region, and the evaporation region is spatially blocked from a portion of the heat insulating region, so that the evaporation region is not spatially communicated with a portion of the heat insulating region.

Preferably, the at least one blocking member is in a boss shape, and the top surface of the blocking member abuts against the part of the capillary material located in the heat insulation area and fills up the space between the part of the capillary material located in the heat insulation area and the first plate.

Preferably, the at least one blocking member is in a shape of a vertical wall, and the top edge of the blocking member abuts against the part of the capillary material located in the heat insulation area.

Preferably, the at least one barrier spatially isolates the evaporation zone from a space between the portion of the capillary material in the adiabatic region and the first plate, and also isolates the vapor channel from a space between the portion of the capillary material in the adiabatic region and the first plate.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1 is an assembled perspective view of the first preferred embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line 2-2 of fig. 1.

Fig. 3 is a partially enlarged view of fig. 2.

Fig. 4 is an exploded view of the first preferred embodiment of the present invention.

Fig. 5 is a top view of the first preferred embodiment of the present invention, showing a state where the second plate is removed.

Fig. 6 is an exploded view of a second preferred embodiment of the present invention.

Fig. 7 is an exploded view of a third preferred embodiment of the present invention.

Fig. 8 is an exploded view of a fourth preferred embodiment of the present invention.

Fig. 9 is an exploded view of a fifth preferred embodiment of the present invention.

Wherein, the reference numbers:

10 vapor chamber with liquid vapor channel formed by capillary structure and salient points

11 first plate 111 first bump 14 second plate

141 second bump 15 receiving space 17 capillary material

171 hollow part

20 vapor-liquid channel temperature equalizing plate formed by capillary structure and salient points

211 first bump 27 capillary material 271 hollow part

30 vapor-liquid channel vapor-vapor homogenizing plate formed by capillary structure and salient points

311 a first bump 341 and a second bump 371 hollow parts

40 vapor-liquid channel vapor-vapor homogenizing plate formed by capillary structure and salient points

41 first plate 412 barrier 47 wicking material

50 vapor-liquid channel temperature equalizing plate formed by capillary structure and salient points

51 first plate 512 barrier 57 wicking material

Adiabatic region A condensation region V evaporation region

GC gas channel LC liquid channel

Detailed Description

To illustrate the technical features of the present invention in detail, the following preferred embodiments are described in conjunction with the drawings, in which:

as shown in fig. 1 to 5, a vapor chamber 10 for forming a liquid-vapor channel by using a capillary structure and bumps according to a first preferred embodiment of the present invention mainly comprises a first plate 11, a second plate 14, a capillary material 17, and an actuating fluid, wherein:

the first plate 11 defines an evaporation zone V, an insulation zone a and a condensation zone C, wherein the insulation zone a is adjacent to the evaporation zone V and the condensation zone C, respectively, and the evaporation zone V is not adjacent to the condensation zone C.

The second plate 14 is combined with the first plate 11, and a closed accommodating space 15 is formed between the first plate 11 and the second plate 14.

The capillary material 17 is in a sheet shape and is located in the accommodating space 15. In practice, the capillary material may be woven copper mesh or sintered copper powder, and may be directly disposed on the second plate 14.

The working fluid is filled in the accommodating space 15. Since the working fluid is adsorbed in the capillary member 17, the drawing is not shown, and the drawing does not show the working fluid because the working fluid has necessary elements that can be understood by a person skilled in the art.

The first plate 11 has a plurality of first protrusions 111 disposed in the accommodating space 15, and the plurality of protrusions are distributed in the evaporation area V, the heat insulation area a, and the condensation area C and abut against the capillary 17.

The capillary material 17 has a hollow portion 171, the hollow portion 171 is located in the thermal insulation region a, a part of the number of the first bumps 111 is exposed in the hollow portion 171, a gas channel GC is formed in the hollow portion 171, and two liquid channels LC are formed in the part of the capillary material 17 located in the thermal insulation region a and located on two sides of the gas channel GC respectively.

The second plate 14 has a plurality of second bumps 141 disposed in the accommodating space 15, and the second bumps 141 are disposed in the hollow portion 171 and abut against the exposed first bumps 111.

The structure of the first embodiment is explained above, and the operation state of the first embodiment is explained next.

Referring to fig. 4 and 5, in use, the vapor chamber 10 of the first embodiment is attached to a heat generating body (not shown), such as a Central Processing Unit (CPU) of a personal computer, and the evaporation region V corresponds to the heat generating body. When the heating element generates heat, the liquid working fluid absorbed by the capillary material 17 in the evaporation zone V is heated and evaporated into vapor working fluid. Since the gas channel GC corresponds to the hollow portion 171 of the capillary material 17, no capillary structure exists, and only the space between the first plate 11 and the second plate 14 and a few first bumps 111 and second bumps 141 are abutted against each other, so that the cross-sectional area of the space is large; since the capillary 17 occupies a part of the cross-sectional area, the cross-sectional area of the space between the capillary 17 and the first plate 11 in the adiabatic region a is smaller than that of the gas channel GC; due to the difference in the cross-sectional areas, the working vapor in the evaporation region V will flow toward the position with larger cross-sectional area due to the pressure difference, and therefore most of the working vapor flows from the vapor channel GC to the condensation region C. When the vapor working fluid enters the space between the capillary 17 and the first plate 11 in the condensation area C, it is condensed into liquid state, and is absorbed by the capillary 17, and rapidly flows back to the evaporation area V through the liquid channel LC by capillary phenomenon. Therefore, the effect of uniform temperature and heat conduction can be achieved through continuous circulation.

In the foregoing operating state, since the vapor channel GC can attract most of the vapor working fluid to flow through, the flow guiding effect on the vapor working fluid can be exerted, so that the vapor working fluid is more easily guided to the vapor channel GC and enters the condensation area C. In addition, since the liquid working fluid flows back from the liquid channel LC to the evaporation area V, the liquid channel LC also exerts a guiding effect on the liquid working fluid, and since the amount of the vapor working fluid between the capillary 17 of the liquid channel LC and the first plate 11 is relatively small, the back flow of the liquid working fluid is not affected. The structure of the first embodiment is suitable for the ultra-thin space requirement because the inside only uses the capillary material 17 and the bump to form the internal structure and space.

Referring to fig. 6, a vapor chamber 20 for forming liquid-vapor channels by using capillary structures and bumps according to a second embodiment of the present invention is substantially the same as the first embodiment, except that:

the capillary material 27 has three hollow portions 271, so that three gas channels GC can be formed, thereby improving the effect of guiding the gas-state working fluid. The capillary 27 has four liquid channels LC and three gas channels GC arranged at intervals.

The number of the first bumps 211 located in the three hollow portions 271 per unit area is less than the number of the first bumps 211 not located in the hollow portions 271 per unit area. Therefore, the volume of the three vapor channels GC occupied by the first bumps 211 can be reduced, so that the three vapor channels GC provide a larger space for guiding the vapor-phase working fluid.

The remaining structure and the effect achieved by the second embodiment are the same as those of the first embodiment, and will not be described again.

Referring to fig. 7, a vapor chamber 30 using a wick structure and bumps to form liquid-vapor channels according to a third embodiment of the present invention is substantially the same as the first embodiment, except that:

the first bumps 311 located in the hollow portion 371 are in a strip shape, and two ends of the first bumps face the evaporation area V and the condensation area C, respectively. In addition, the plurality of first bumps 311 are arranged in a plurality of rows at intervals along the longitudinal extension direction thereof. Furthermore, the second bumps 341 are strip-shaped, and two ends of the second bumps face the evaporation region V and the condensation region C, respectively.

The first bumps 311 and the second bumps 341 are elongated and arranged in multiple rows, and the first bumps 311 and the second bumps 341 are against each other, such a structure can form directional channels between the row-shaped bumps 311,341, and two ends of the channels face the evaporation area V and the condensation area C, thereby generating a better guiding effect for the vapor-state operating liquid.

The remaining structure and the effect achieved by the third embodiment are substantially the same as those of the first embodiment, and will not be described again.

Referring to fig. 8, a vapor chamber 40 using a wick structure and bumps to form a liquid-vapor channel according to a fourth embodiment of the present invention is substantially the same as the first embodiment, except that:

the first plate 41 has two blocking members 412 located in the heat insulating region a, the two blocking members 412 are pressed against the part of the capillary 47 located in the heat insulating region a corresponding to the liquid channel LC, and the evaporation region V and part of the heat insulating region a are spatially blocked, so that the evaporation region V and part of the heat insulating region a are not spatially communicated. In the fourth embodiment, the two blocking members 412 are in the shape of a boss, and the top surface thereof abuts against the part of the capillary material 47 located in the adiabatic region a, and fills the space between the part of the capillary material 47 located in the adiabatic region a and the first plate 41.

With the above structure, the two blocking members 412 fully block the space between the part of the capillary material 47 located in the heat insulation region a and the first plate 41, so as to block the vapor-state working fluid from passing through, and further force the vapor-state working fluid to flow only through the vapor channel GC while moving from the evaporation region V to the heat insulation region a, and the liquid-state working fluid can flow only through the liquid channel LC. Therefore, the fourth embodiment guides the flow of the liquid and vapor working fluids more simply, and still achieves the effects of the first embodiment.

The remaining structure and the effect achieved by the fourth embodiment are substantially the same as those of the first embodiment, and will not be described again.

Referring to fig. 9, a vapor chamber 50 using a wick structure and bumps to form a liquid-vapor channel according to a fifth embodiment of the present invention is substantially the same as the first embodiment, except that:

the two blocking members 512 are in the shape of vertical walls, and the top edges thereof are abutted against the part of the capillary material 57 located in the thermal insulation region a. The two barriers 512 spatially isolate the evaporation region V from the space between the part of the capillary 57 located in the adiabatic region a and the first plate 51, and also isolate the vapor channel GC from the space between the part of the capillary 57 located in the adiabatic region a and the first plate 51. As can be seen from fig. 9, the two barriers 512 do not spatially isolate the evaporation region V from the gas channel GC.

With the above structure, when the working vapor moves from the evaporation region V to the insulation region a, the working vapor can only move to the vapor channel GC due to the two barriers 512, and cannot directly move to the space between the capillary 57 and the first plate 51 in the insulation region a. As for the liquid working fluid, it can still flow back through the two fluid passages LC. It is understood that the structure of the fifth embodiment can exhibit the same effect of guiding the liquid or vapor working fluid.

The remaining structure and the effect achieved by the fifth embodiment are substantially the same as those of the first embodiment disclosed in the foregoing, and will not be described again.

The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.