Lens module
阅读说明:本技术 镜头模组 (Lens module ) 是由 李堃 陈信文 樊珂华 张龙飞 于 2018-06-29 设计创作,主要内容包括:一种镜头模组,包括:一电路板;一感光芯片,固定于所述电路板的其中一表面;一中空的安装支架,固定于所述电路板上并将所述感光芯片收容于其中;一滤光片,固定于所述安装支架且与所述感光芯片相对;以及一镜头单元,通过一中空的胶粘层固定于所述安装支架远离所述电路板的表面,所述安装支架远离所述电路板的表面的角落处设有多个定位柱,所述镜头单元固定于所述安装支架的表面的角落处设有多个定位槽,所述定位柱插入所述定位槽中。(A lens module, comprising: a circuit board; the photosensitive chip is fixed on one surface of the circuit board; the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein; the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; the lens unit is fixed on the surface of the mounting support far away from the circuit board through a hollow adhesive layer, a plurality of positioning columns are arranged at the corners of the surface of the mounting support far away from the circuit board, a plurality of positioning grooves are arranged at the corners of the surface of the lens unit fixed on the mounting support, and the positioning columns are inserted into the positioning grooves.)
1. A lens module, comprising:
a circuit board;
the photosensitive chip is fixed on one surface of the circuit board;
the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein;
the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; and
the lens unit is fixed on the surface of the mounting support far away from the circuit board through a hollow adhesive layer, a plurality of positioning columns are arranged at the corners of the surface of the mounting support far away from the circuit board, a plurality of positioning grooves are arranged at the corners of the surface of the lens unit fixed on the mounting support, and the positioning columns are inserted into the positioning grooves.
2. The lens module as claimed in claim 1, wherein the lens unit includes a lens holder and a lens integrally formed in the lens holder, the lens holder is fixed to a surface of the mounting bracket away from the circuit board, and the lens is opposite to the photo sensor chip.
3. The lens module as recited in claim 2, wherein the lens holder comprises a first lens holder portion having a hollow square shape, the first lens holder portion being fixed to the mounting bracket, the adhesive layer having a hollow square shape and comprising a main body adhesive portion, the main body adhesive portion being formed by four side edges connected end to end in sequence, the side edges being disposed around the positioning posts.
4. The lens module as claimed in claim 3, wherein the adhesive layer further includes an extension portion, and a gap is formed between the top and the sidewall of the positioning groove and the top and the sidewall of the positioning post, and the extension portion extends from the corner of the main body adhesive portion and fills the gap.
5. The lens module as claimed in claim 1, wherein the circuit board is a rigid-flex board including a first hard board portion, a second hard board portion and a soft board portion located between the first hard board portion and the second hard board portion, and the photo sensor chip is fixed to the first hard board portion.
6. The lens module as claimed in claim 5, wherein a plurality of electronic components and gold fingers are mounted on the surface of the first hard board portion to which the photosensitive chip is fixed, the electronic components and the gold fingers are located around the photosensitive chip, a metal wire is disposed on an edge of the surface of the photosensitive chip, the metal wire is electrically connected to the gold fingers, and an electrical connection portion is mounted on one surface of the second hard board portion.
7. The lens module as claimed in claim 1, wherein the mounting bracket has a through-hole, the inner wall of the hole extends toward the central axis of the hole to form a flange, the flange divides the hole into a first space near the circuit board and a second space far from the circuit board, the photo sensor chip is accommodated in the first space, and the filter is fixed to the flange and accommodated in the second space.
8. The lens module as claimed in claim 7, wherein a surface of the filter away from the circuit board is flush with a surface of the mounting bracket away from the circuit board.
9. The lens module as claimed in claim 1, further comprising a protective cover, wherein the protective cover is disposed on the lens unit.
Technical Field
The invention relates to the field of camera shooting, in particular to a lens module.
Background
A conventional lens module generally includes a lens unit, a mounting bracket, a filter, a photo sensor chip and a circuit board. In assembly, the photosensitive chip is usually first attached to the circuit board, the optical filter is attached to the mounting bracket, and then the mounting bracket with the optical filter is attached to the circuit board. Then, glue is applied to the surface of the mounting bracket, and the lens unit is attached to the mounting bracket. However, the mounting bracket has a large surface glue coating amount and a risk of glue overflow, which causes uneven glue coating amount between the lens unit and the mounting bracket, and is difficult to maintain sufficient mounting strength only by gluing fixation, so that there are risks of falling, inclination or dislocation between the mounting bracket and the lens module in the reliability test process.
Disclosure of Invention
Accordingly, there is a need for a lens module that can solve the above problems.
An embodiment of the present invention provides a lens module, including: a circuit board; the photosensitive chip is fixed on one surface of the circuit board; the hollow mounting bracket is fixed on the circuit board and accommodates the photosensitive chip therein; the optical filter is fixed on the mounting bracket and is opposite to the photosensitive chip; the lens unit is fixed on the surface of the mounting support far away from the circuit board through a hollow adhesive layer, a plurality of positioning columns are arranged at the corners of the surface of the mounting support far away from the circuit board, a plurality of positioning grooves are arranged at the corners of the surface of the lens unit fixed on the mounting support, and the positioning columns are inserted into the positioning grooves.
In the lens module of the embodiment of the invention, because the lens unit and the mounting bracket are relatively fixed through the matching of the positioning column and the positioning groove, the lens module is additionally provided with structural limit in the horizontal direction, so that the risk of falling, inclination or dislocation and the like of the lens module under the action of horizontal external force is avoided; furthermore, since the positioning posts are disposed at the corners of the surface of the mounting bracket to which the lens unit is fixed, the width of the positioning posts can be increased appropriately to increase the mounting strength between the lens unit and the mounting bracket.
Drawings
Fig. 1 is a schematic structural diagram of a lens module according to a preferred embodiment of the invention.
Fig. 2 is an exploded view of the lens module shown in fig. 1.
Fig. 3 is a schematic cross-sectional view of the lens module shown in fig. 1 along the direction III-III.
Fig. 4 is a schematic structural diagram of a mounting bracket of the lens module shown in fig. 1.
Fig. 5 is a schematic view of another angle structure of the lens unit of the lens module shown in fig. 1.
Description of the symbols
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 to 3 illustrate a
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It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.