阅读说明：本技术 一种晶圆再生处理装置及控制系统 (Wafer regeneration processing device and control system ) 是由 贺贤汉 杉原一男 佐藤泰幸 原英樹 于 2021-07-28 设计创作，主要内容包括：本发明涉及晶圆再生技术领域,公开了一种晶圆再生处理装置,包括底座,底座上设有可水平和竖直方向旋转摆动的夹持臂,夹持臂的内部设有与环形侧壁共轴的转盘,夹持臂的一侧设有用于驱动转盘旋转的电机,转盘的两侧对称设有环形结构的抛光盘,两个抛光盘对应转盘的一侧均设有可拆卸的抛光垫,抛光盘远离转盘的一侧设有直线驱动机构；转盘沿周向设有多个放置晶圆的存放孔,抛光盘远离抛光垫的一侧均设有用于晶圆抛光用的抛光油供油装置和晶圆清洗用的清洗液供液装置,还设有油液回收装置。本发明还提出一种晶圆再生控制系统,本发明可有效提高再生晶圆表面氧化物腐蚀效果的稳定性,提高晶圆再生的处理效率以及晶圆再生的品质。(The invention relates to the technical field of wafer regeneration, and discloses a wafer regeneration treatment device which comprises a base, wherein a clamping arm capable of rotating and swinging in the horizontal and vertical directions is arranged on the base, a turntable coaxial with an annular side wall is arranged in the clamping arm, a motor for driving the turntable to rotate is arranged on one side of the clamping arm, polishing discs in annular structures are symmetrically arranged on two sides of the turntable, detachable polishing pads are arranged on one sides of the two polishing discs corresponding to the turntable, and a linear driving mechanism is arranged on one side of each polishing disc far away from the turntable; the carousel is equipped with a plurality of storage holes of placing the wafer along circumference, and one side that the polishing pad was kept away from to the polishing dish all is equipped with the polishing oil feed oil device that is used for the polishing of wafer usefulness and the washing liquid feed liquid device that the wafer washs the usefulness, still is equipped with fluid recovery unit. The invention also provides a wafer regeneration control system, which can effectively improve the stability of the oxide corrosion effect on the surface of the regenerated wafer, and improve the treatment efficiency and the quality of the regeneration of the wafer.)

1. A wafer regeneration treatment device comprises a base (1), and is characterized in that a clamping arm (2) capable of rotating and swinging in the horizontal and vertical directions is arranged on the base (1), and a rotating cylinder (3) used for swinging the clamping arm (2) is fixedly arranged above the base (1);

two sides of the clamping arm (2) are of annular structures;

a turntable (4) coaxial with the annular side wall is arranged in the clamping arm (2), a motor (6) for driving the turntable (4) to rotate is arranged on one side of the clamping arm (2), and the motor (6) is fixed on the clamping arm (2) through a suspension (7);

polishing disks (8) of an annular structure are symmetrically arranged on two sides of the rotary table (4), a detachable polishing pad (9) is arranged on one side of each of the two polishing disks (8) corresponding to the rotary table (4), and a linear driving mechanism is arranged on one side, away from the rotary table (4), of each polishing disk (8);

the rotary table (4) is provided with a plurality of storage holes (5) for placing wafers along the circumferential direction, and the storage holes (5) correspond to the annular pad width of the polishing pad (9);

one side of the polishing disc (8) far away from the polishing pad (9) is provided with a polishing oil supply device for polishing the wafer;

a cleaning liquid supply device for cleaning the wafer is arranged on one side, away from the polishing pad (9), of the polishing disc (8);

wherein, an oil recovery device is arranged on the polishing disk (8) on one side.

2. A wafer reprocessing apparatus according to claim 1 wherein said turntable (4) is adapted in thickness to the thickness of the wafers to be processed.

3. A wafer reprocessing device according to claim 1 wherein said polishing pad (9) is provided with shallow striations in staggered communication on the pad surface.

4. The wafer recycling device of claim 1, wherein the linear driving mechanism is a plurality of telescopic cylinders (13), the telescopic cylinders (13) are fixedly arranged on the annular arm at the side of the clamping arm (2) in an evenly distributed manner, and the output ends of the telescopic cylinders (13) are fixed on the polishing disk (8).

5. The wafer reprocessing apparatus according to claim 4, wherein a linear guide auxiliary mechanism is further disposed between the polishing disk (8) and the holding arm (2), the linear guide auxiliary mechanism includes an optical shaft rod (11) and a shaft sleeve (12), the shaft sleeve (12) is fixed on a side arm of the holding arm (2) in a penetrating manner and is uniformly distributed between adjacent linear driving mechanisms, the optical shaft rod (11) is movably connected in the shaft sleeve (12), an inner diameter of the shaft sleeve (12) is adapted to the optical shaft rod (11), and one end of the optical shaft rod (11) is fixed on the polishing disk (8).

6. The wafer reprocessing apparatus according to claim 4, wherein said polishing oil supply device comprises an oil supply pump and an oil supply header pipe (14) connected to said common oil pump, said oil supply header pipe (14) is disposed around a disk arm of the polishing disk (8), said oil supply header pipe (14) is provided with a plurality of oil spray pipes (15) uniformly distributed in a circumferential direction of an inner ring of the polishing disk (8), nozzles of said oil spray pipes (15) extend to a side of the polishing pad (9) and have a gap with the polishing pad (9).

7. A wafer regeneration processing device according to claim 4, characterized in that the liquid supply device comprises a liquid supply pump and a liquid supply header pipe (16) connected with the liquid supply pump, the liquid supply header pipe (16) is arranged on one side of the oil supply header pipe (14) in a surrounding manner, a plurality of liquid spray pipes (17) are arranged on the liquid supply header pipe (16) and are uniformly distributed and arranged on the inner circumference of the polishing disk (8), and the nozzles of the liquid spray pipes (17) extend to one side of the polishing pad (9) and are spaced from the polishing pad (9).

8. The wafer reprocessing apparatus according to claim 7, wherein a three-way solenoid valve (20) is connected to a liquid inlet of the liquid supply pump, the three-way solenoid valve (20) comprises two inlets and one outlet, and the two inlets are respectively connected to a chemical reagent tube for wafer surface oxide film etching and a polished cleaning reagent tube.

9. The wafer regeneration treatment device according to claim 4, wherein the oil recovery device comprises a backflow tile (10) with an annular structure, the backflow tile (10) is arranged on the polishing disc (8) on one side, a plurality of brackets (18) for supporting the backflow tile (10) in a suspending manner are arranged on the circumferential direction of the polishing disc (8), the annular cross section of the backflow tile (10) corresponds to the polishing pad (9) on the polishing disc (8), a backflow interface (19) is arranged at the bottom of the backflow tile (10), a four-way solenoid valve (21) is arranged on the backflow interface (19), the four-way solenoid valve (21) comprises an inlet and an outlet, and three outlets are respectively connected with the corrosive liquid recovery device, the polishing oil recovery treatment device and the cleaning liquid recovery treatment device.

10. A wafer recycling control system for use in the wafer recycling apparatus as claimed in any one of claims 1 to 9, comprising a processor, each driving control module electrically connected to the processor;

the driving control module comprises a motor driving control module, a rotary cylinder driving control module, a telescopic cylinder driving control module, an oil supply pump driving control module, a liquid supply pump driving control module and a valve driving control module;

the device also comprises a storage module used for storing the driving programs of the driving control modules.

Technical Field

The invention belongs to the technical field of wafer regeneration, and particularly relates to a wafer regeneration processing device and a control system.

Background

The silicon wafer can be divided into a positive wafer and a control wafer and a separation blade for monitoring and testing according to different application scenes in a wafer factory, wherein the positive wafer is directly used for semiconductor processing, and the control wafer and the separation blade are mainly used for monitoring and testing the silicon wafer.

The baffle is mainly used for maintaining the stability of a machine table, is mainly applied to a scene and is used for a chemical physical reaction stage of a positive wafer, the baffle is used for isolating a place with poor processing conditions and a position vacated when a filling product is insufficient, so that reaction gas is uniformly contacted with a processed silicon wafer, is uniformly heated, and precipitates or grows a uniform high-quality thin film, each processing procedure needs the baffle to pursue the product to be normal, the use amount of the baffle is large, and the demand tends to be expanded along with the progress of the processing procedure.

The separation blade is mainly from a brand new wafer and a regenerated wafer, and the regeneration of the wafer is to recover the used separation blade or control wafer, remove the oxide film, metal particle residue and the like generated on the surfaces of the separation blade and the control wafer due to the test by the treatment methods of chemical soaking, physical grinding and the like, so that the separation blade and the control wafer can have the functions of testing and stabilizing the stability of the machine again.

The existing process for recovering the wafer from the separation blade generally adopts chemical corrosion, mechanical grinding and cleaning, and the existing treatment process has the problems of 1) chemical corrosion, wherein the chemical reagent corrosion is continuously carried out along with the reaction process, the concentration of the solution of the chemical reagent corrosion is continuously changed, so that the difficulty in controlling the concentration of the chemical reagent for corrosion is higher, the corrosion effect of oxide on the surface of the regenerated wafer is unstable, and 2) the chemical corrosion, the mechanical grinding and the cleaning stages are completed step by adopting different equipment, so that the regeneration treatment efficiency of the wafer is low, and the workload is large. Therefore, a device and a method for synchronous double-side continuous regeneration processing of a plurality of wafers are provided.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a wafer regeneration processing device and a control system.

In order to achieve the purpose, the invention adopts the following technical scheme:

designing a wafer regeneration treatment device, which comprises a base, wherein a clamping arm capable of rotating and swinging in the horizontal and vertical directions is arranged on the base, and a rotating cylinder for swinging the clamping arm is fixedly arranged above the base;

two sides of the clamping arm are of annular structures;

a turntable coaxial with the annular side wall is arranged in the clamping arm, a motor for driving the turntable to rotate is arranged on one side of the clamping arm, and the motor is fixed on the clamping arm through a suspension;

polishing disks in an annular structure are symmetrically arranged on two sides of the rotating disk, detachable polishing pads are arranged on one sides of the two polishing disks corresponding to the rotating disk, and a linear driving mechanism is arranged on one side of each polishing disk away from the rotating disk;

the turntable is provided with a plurality of storage holes for placing wafers along the circumferential direction, and the storage holes correspond to the width of the annular pad of the polishing pad;

one side of the polishing disc, which is far away from the polishing pad, is provided with a wafer polishing oil supply device;

a liquid supply device for wafer surface treatment is arranged on one side of the polishing disc, which is far away from the polishing pad;

wherein, an oil recovery device is arranged on the polishing disc on one side.

Compared with the prior art, the wafer regeneration treatment adopting the technical scheme has the following beneficial effects:

firstly, the wafer regeneration treatment device of the invention carries out oxide film corrosion treatment by a rotary spray corrosion mode on the surface of the wafer, can form a layer of flowing corrosive liquid film on the surface of the wafer, can ensure that the concentration of a chemical reagent solution is maintained in the optimum corrosion concentration treatment range during the chemical corrosion of the wafer, and can effectively improve the stability of the oxide corrosion effect on the surface of the regenerated wafer.

The invention adopts a mode of synchronously processing double surfaces of a plurality of wafers to improve the processing capacity of wafer regeneration, and adopts three procedures of chemical corrosion, mechanical grinding and polishing and wafer cleaning to be continuously completed step by step, the procedure transfer is not needed to be carried out on the wafers in the processing process, the efficiency of wafer regeneration processing is further improved, and simultaneously, the labor intensity and the workload are greatly reduced.

Third, the invention can remove the particles after grinding and polishing in time by forming a polishing oil film and a cleaning liquid film flowing on the surface of the wafer, thereby well protecting the regenerated wafer in the grinding, polishing and cleaning stages and improving the quality of the regenerated wafer.

Furthermore, the thickness of the turntable is matched with that of the wafer to be processed, and the turntable can enable the surface of the wafer to be fully contacted with the polishing pad in the high-speed rotating process, so that the polishing pad has the effect of grinding and polishing the oxide on the surface of the wafer.

Furthermore, shallow striations which are communicated in a staggered mode are arranged on the surface of the polishing pad, the shallow striations play two roles, on one hand, oil can smoothly pass through the surface of the polishing pad, on the other hand, the oil can be uniformly distributed on the surface of the polishing pad, and an oil surface or a liquid surface is formed between the surface of the polishing pad and the surface of the wafer.

Further, linear driving mechanism is telescopic cylinder, telescopic cylinder adopts a plurality ofly to fixed the setting on the annular arm of centre gripping arm lateral part of mode of equipartition, telescopic cylinder's output is fixed on the polishing dish, and telescopic cylinder can drive the polishing dish and add the both sides of holding at the carousel.

Further, a linear guide auxiliary mechanism is further arranged between the polishing disc and the clamping arm, the linear guide auxiliary mechanism comprises an optical shaft rod and a shaft sleeve, the shaft sleeve penetrates through and is fixed on a side arm of the clamping arm and is uniformly distributed between adjacent linear driving mechanisms, the optical shaft rod is movably connected in the shaft sleeve, the inner diameter of the shaft sleeve is matched with the optical shaft rod, one end of the optical shaft rod is fixed on the polishing disc, and the linear guide auxiliary mechanism plays a good supporting role in moving the polishing disc and reduces the bearing load of the telescopic cylinder.

Furthermore, the polishing oil supply device comprises an oil supply pump and an oil supply main pipe connected with the common oil pump, the oil supply main pipe is arranged on a disc arm of the polishing disc in a surrounding manner, a plurality of oil spraying pipes are arranged on the oil supply main pipe and are uniformly distributed on the circumference of the inner ring of the polishing disc, nozzles of the oil spraying pipes extend to one side of the polishing pad, a gap is arranged between the nozzles and the polishing pad, when the regenerated wafer is polished, the turntable is in a high-speed rotating state, polishing liquid can be sprayed to a packing of the turntable through the uniformly distributed oil spraying pipes, the polishing liquid sprayed on the turntable penetrates through the turntable along a shallow groove on the polishing pad under the centrifugal action, so that a layer of polishing oil film is formed on the surface of the regenerated wafer, the polishing liquid is continuously sprayed, a flowing polishing oil film is formed on the surface of the regenerated wafer, and the flowing polishing oil film can improve the polishing efficiency of the surface of the regenerated wafer on one hand, on the other hand, the oxide polished from the surface of the regenerated wafer can be discharged along the flowing oil film, so that the damage of the polished oxide to the surface of the regenerated wafer is avoided.

Further, the liquid supply device comprises a liquid supply pump and a liquid supply main pipe connected with the liquid supply pump, the liquid supply main pipe is arranged on one side of the liquid supply main pipe in a surrounding mode, a plurality of liquid spraying pipes are arranged on the liquid supply main pipe, the liquid spraying pipes are evenly distributed on the periphery of the inner ring of the polishing disc, nozzles of the liquid spraying pipes extend to one side of the polishing pad, and a gap is formed between the nozzles and the polishing pad. Like the polishing solution, the sprayed liquid forms a flowing liquid film on the surface of the regenerated wafer.

Furthermore, the liquid inlet end of the liquid supply pump is connected with a three-way electromagnetic valve, the three-way electromagnetic valve comprises two inlets and one outlet, the two inlets are respectively connected with a chemical reagent pipe for etching the oxide film on the surface of the wafer and a polished cleaning reagent pipe, in the stage of etching the oxide film on the surface of the regenerated wafer, a layer of flowing chemical reagent liquid film is formed on the surface of the wafer, the retention time of the flowing chemical reagent liquid film on the surface of the wafer is short, so that a tiny change concentration gradient is formed on the surface of the wafer, the change of the concentration gradient can be ignored, the concentration of the etching reagent with constant concentration can be formed on the surface of the wafer, and the stability of the oxide treatment on the surface of the regenerated wafer is further improved; in the regenerated wafer surface cleaning stage, a layer of flowing cleaning solution can be formed on the surface of the regenerated wafer, so that fine particles obtained by grinding and polishing can be effectively removed, and the cleaning capability of the regenerated wafer is improved.

Further, fluid recovery unit includes the backward flow tile of loop configuration, the backward flow tile sets up on the polishing dish of one side, be equipped with a plurality of supports that are used for the suspension to support backward flow tile in the circumference of polishing dish, the annular cross section of backward flow tile is corresponding with the polishing pad on this polishing dish, the bottom of backward flow tile is equipped with the backward flow interface, be equipped with four-way solenoid valve on the backward flow interface, four-way solenoid valve includes one and advances three, and three outlet is connected corrosive liquid recovery unit, polishing oil recovery processing device and washing liquid recovery processing device respectively, and the backward flow tile is used for retrieving centrifugal discharge's waste liquid, and the waste liquid is including corroding waste liquid, polishing waste oil, washing waste liquid to discharge in the collection device who corresponds the waste liquid through the backward flow interface.

The invention also provides a wafer regeneration control system, which comprises a processor and a plurality of driving control modules, wherein the processor is electrically connected with the driving control modules;

the driving control module comprises a motor driving control module, a rotary cylinder driving control module, a telescopic cylinder driving control module, an oil supply pump driving control module, a liquid supply pump driving control module and a valve driving control module.

The device also comprises a storage module used for storing the driving programs of the driving control modules.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is a schematic view of the present invention with respect to the distribution of the fuel supply main and the liquid supply main;

FIG. 4 is a schematic cross-sectional view of the turntable in the present invention;

FIG. 5 is a schematic diagram illustrating a variation of the apparatus according to an embodiment of the present invention;

labeled as: the polishing device comprises a base 1, a clamping arm 2, a rotary cylinder 3, a rotary disc 4, a storage hole 5, a motor 6, a suspension 7, a polishing disc 8, a polishing pad 9, a backflow tile 10, an optical axis rod 11, a shaft sleeve 12, a telescopic cylinder 13, an oil supply main pipe 14, an oil injection pipe 15, a liquid supply main pipe 16, a liquid spray pipe 17, a support 18, a backflow connector 19 and a four-way electromagnetic valve 20.

Detailed Description

The invention will be further illustrated with reference to the following specific examples. These examples are intended to illustrate the invention and are not intended to limit the scope of the invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided" and "connected" are to be interpreted broadly, e.g. as a fixed connection, a detachable connection or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The structural features of the present invention will now be described in detail with reference to the accompanying drawings.

Referring to fig. 1-2, a wafer regeneration treatment device comprises a base 1, wherein a clamping arm 2 capable of swinging horizontally and vertically is arranged on the base 1, a rotary cylinder 3 used for swinging the clamping arm 2 is fixedly arranged above the base 1, and the rotary cylinder 3 can drive the clamping arm 2 to rotate, so that the clamping arm 2 is in a horizontal state or a vertical state (see fig. 5), is used for feeding regenerated wafers when in the horizontal state, and is used for surface treatment of the regenerated wafers when in the vertical state.

Referring to fig. 1-2, two sides of the clamping arm 2 are in an annular structure, a turntable 4 coaxial with the annular side wall is arranged inside the clamping arm 2, a motor 6 for driving the turntable 4 to rotate is arranged on one side of the clamping arm 2, the motor 6 is fixed on the clamping arm 2 through a suspension 7, the motor 6 is used for driving the turntable 4 to rotate, the rotating speed of the motor is adjustable, and different rotating speeds can be set according to different processing stages.

Referring to fig. 1, the bilateral symmetry of carousel 4 is equipped with polishing dish 8 of loop configuration, and one side that two polishing dishes 8 correspond carousel 4 all is equipped with detachable polishing pad 9, adopts detachable polishing pad 9, the change of the follow-up polishing pad 9 of being convenient for, and the thickness of carousel 4 and pending wafer thickness looks adaptation, carousel 4 are at high-speed rotatory in-process, can make wafer surface and polishing pad 9 fully contact, play the effect of abrasive polishing to wafer surface oxide.

Referring to fig. 1, one side that carousel 4 was kept away from to polishing dish 8 is equipped with linear driving mechanism, and linear driving mechanism is telescopic cylinder 13, and telescopic cylinder 13 adopts a plurality ofly, fixes on the annular arm of 2 lateral parts of centre gripping arms to the mode of equipartition, and telescopic cylinder 13's output is fixed on polishing dish 8, and telescopic cylinder 13 plays the effect of promoting polishing dish 8, can make the mutual centre gripping of polishing dish 8 of carousel 4 both sides. Still be equipped with sharp direction complementary unit between polishing dish 8 and centre gripping arm 2, sharp direction complementary unit includes optical axis pole 11 and axle sleeve 12, axle sleeve 12 runs through and fixes on the side arm of centre gripping arm 2, and the equipartition is between adjacent sharp actuating mechanism, 11 swing joint of optical axis pole is in axle sleeve 12, the internal diameter and the 11 looks adaptations of optical axis pole of axle sleeve 12, the one end of optical axis pole 11 is fixed on polishing dish 8, sharp direction complementary unit plays good supporting role to polishing dish 8's removal, reduce telescopic cylinder 13's load, play the guard action to telescopic cylinder 13.

Referring to fig. 1, a plurality of storage holes 5 for placing wafers are formed in the circumferential direction of a turntable 4, the storage holes 5 correspond to the width of an annular pad of a polishing pad 9, a plurality of storage holes 5 are formed to process a plurality of recycled wafers in a batch, the storage holes 5 are through holes, the recycled wafers in the storage holes 5 can be contacted with the polishing pads 9 on two sides of the recycled wafers, the recycled wafers rotate under the driving of the turntable 4, and the polishing pads 9 are kept static, so that synchronous double-sided processing of the wafers of the recycled wafers is realized, and the processing efficiency of the recycled wafers is improved.

Referring to fig. 1, shallow grooves are formed in the surface of the polishing pad 9 and are connected in a staggered manner, and the shallow grooves serve two functions, so that oil can smoothly pass through the surface of the polishing pad 9, the oil can be uniformly distributed on the surface of the polishing pad 9, and an oil surface or a liquid surface is formed between the polishing pad 9 and the surface of the wafer.

Referring to fig. 1 and 3, a polishing oil supply device for polishing a wafer is disposed on one side of the polishing disk 8 away from the polishing pad 9, the polishing oil supply device includes an oil supply pump and an oil supply header pipe 14 connected to the common oil pump, the oil supply header pipe 14 is disposed on the disk arm of the polishing disk 8 in a surrounding manner, the oil supply header pipe 14 is provided with a plurality of oil spray pipes 15, and the oil spray pipes 15 are disposed in a surrounding manner, nozzles of the oil spray pipes 15 extend to one side of the polishing pad 9, and a gap is disposed between the oil spray pipes 14 and the polishing pad 9, when polishing and polishing a regenerated wafer, the rotating disk 4 is in a high-speed rotation state, polishing liquid can be sprayed to a packing of the rotating disk 4 through the uniformly distributed oil spray pipes 15, the polishing liquid sprayed on the rotating disk 4 passes through the rotating disk 4 along a shallow groove on the polishing pad 9 under the centrifugal action, so as to form a layer of polishing oil film on the surface of the regenerated wafer, and the polishing liquid is continuously sprayed in, a flowing polishing oil film is formed on the surface of the regenerated wafer, the flowing polishing oil film can improve the polishing efficiency of the surface of the regenerated wafer on one hand, and on the other hand, oxides polished from the surface of the regenerated wafer can be discharged along the flowing oil film, so that the damage of the polished oxides to the surface of the regenerated wafer is avoided.

Referring to fig. 1 and 3, a cleaning solution supply device for cleaning a wafer is disposed on a side of a polishing pad 9 away from a polishing pad 8, the supply device includes a solution supply pump and a solution supply header pipe 16 connected to the solution supply pump, the solution supply header pipe 16 is disposed on a side of an oil supply header pipe 14, the solution supply header pipe 16 is provided with a plurality of solution spraying pipes 17 uniformly distributed on a circumference of an inner ring of the polishing pad 8, nozzles of the solution spraying pipes 17 extend to a side of the polishing pad 9, and a gap is disposed between the solution supply pipes and the polishing pad 9, like the above polishing solution, the sprayed solution forms a layer of flowing solution film on a surface of a regenerated wafer, a liquid inlet end of the solution supply pump is connected to a three-way electromagnetic valve 20, the three-way electromagnetic valve 20 includes two inlets and one outlet, the two inlets are respectively connected to a chemical reagent pipe for etching an oxide film on a surface of the wafer and a cleaning reagent pipe after polishing, during an etching stage of the oxide film on the surface of the regenerated wafer, a layer of the chemical reagent film on the wafer forms a layer of flowing solution on the surface of the wafer, the flowing chemical reagent liquid film has short residence time on the surface of the wafer, so that a tiny change concentration gradient is formed on the surface of the wafer, the change of the concentration of the gradient can be ignored, therefore, the concentration of the corrosive reagent with constant concentration can be formed on the surface of the wafer, and the stability of the oxide treatment on the surface of the regenerated wafer is further improved; in the regenerated wafer surface cleaning stage, a layer of flowing cleaning solution can be formed on the surface of the regenerated wafer, so that fine particles obtained by grinding and polishing can be effectively removed, and the cleaning capability of the regenerated wafer is improved.

Referring to fig. 1, 2 and 4, wherein, be equipped with fluid recovery unit on the polishing dish 8 of one side, fluid recovery unit includes the backward flow tile 10 of loop configuration, backward flow tile 10 sets up on the polishing dish 8 of one side, be equipped with a plurality of supports 18 that are used for suspension support backward flow tile 10 on the circumference of polishing dish 8, the annular cross section of backward flow tile 10 is corresponding with polishing pad 9 on this polishing dish 8, the bottom of backward flow tile 10 is equipped with backward flow interface 19, be equipped with four-way solenoid valve 21 on the backward flow interface 19, four-way solenoid valve 21 includes one and advances three, corrosive liquid recovery unit is connected respectively to three ways, polishing oil recovery processing apparatus and washing liquid recovery processing apparatus, the backward flow tile is used for retrieving centrifugal exhaust waste liquid, the waste liquid includes the corruption waste liquid, the polishing waste oil, wash the waste liquid, and discharge in the collection device of corresponding waste liquid through the backward flow interface.

The invention also provides a wafer regeneration control system, which comprises a processor and a plurality of driving control modules, wherein the processor is electrically connected with the driving control modules;

the drive control module comprises a motor drive control module, a rotary cylinder drive control module, a telescopic cylinder drive control module, an oil supply pump drive control module, a liquid supply pump drive control module, a valve drive control module, the motor drive control module is used for controlling starting and stopping and rotating speed of a motor, the rotary cylinder drive control module is used for controlling the rotating angle of the rotary cylinder, the clamping arm is made to be in a horizontal or vertical state, the telescopic cylinder drive control module is used for controlling the telescopic range and the telescopic range of the telescopic cylinder, the oil supply pump drive control module is used for controlling the oil supply of the oil supply pump to start and stop and supply oil quantity, the liquid supply pump drive control module is used for controlling the starting and stopping and supply liquid quantity of the liquid supply pump, the valve drive control module is used for controlling the three-way electromagnetic valve, the four-way electromagnetic valve is opened and is closed. The device also comprises a storage module for storing the driving programs of the driving control modules

The wafer regeneration processing device and the control system of the invention carry out oxidation film corrosion processing by the way of rotating spray corrosion on the surface of the wafer, can form a layer of flowing corrosive liquid film on the surface of the wafer, can ensure that the concentration of a chemical reagent solution is maintained in the processing range of the optimal corrosion concentration when the wafer is chemically corroded, can effectively improve the stability of the oxide corrosion effect on the surface of the regenerated wafer, in addition, adopt the way of synchronously processing the two sides of a plurality of wafers to improve the regeneration processing capability of the wafer, and adopt three procedures of chemical corrosion, mechanical grinding and polishing and wafer cleaning to be continuously completed step by step, the procedure transfer is not needed to be carried out on the wafer in the processing process, further improve the efficiency of the wafer regeneration processing, simultaneously greatly reduce the labor intensity and the workload, and can remove the grains after grinding and polishing in time by forming a flowing polishing oil film and a cleaning liquid film on the surface of the wafer, the method has good protection effect on the recycled wafer in the grinding, polishing and cleaning stages, and improves the quality of the recycled wafer.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.