阅读说明：本技术 一种异面立体组装键合装置 (Three-dimensional equipment bonding device in antarafacial ) 是由 张乐银 向圆 李彪 于 2019-08-30 设计创作，主要内容包括：本发明提供一种异面立体组装键合装置,它包括底座(1),其特征在于：设置一个旋转块(2),在旋转块(2)两端分别设有与底座(1)对应配合的转轴,在旋转块(2)上设有凹槽(3),在凹槽(3)上设有收缩夹紧装置(4),在旋转块(2)上还设有电加热器(5)。本发明结构简单、使用方便、夹持牢固,适用于多种尺寸的集成电路芯片,在键合时集成电路芯片能做到1°～179°之间任意角度转动等优点。(The invention provides a three-dimensional assembly bonding device with different surfaces, which comprises a base (1) and is characterized in that: the rotary electric heating device is characterized in that a rotary block (2) is arranged, rotating shafts which are matched with the base (1) in a corresponding mode are arranged at two ends of the rotary block (2) respectively, a groove (3) is formed in the rotary block (2), a contraction clamping device (4) is arranged on the groove (3), and an electric heater (5) is further arranged on the rotary block (2). The invention has the advantages of simple structure, convenient use and firm clamping, is suitable for integrated circuit chips with various sizes, and can realize the rotation of the integrated circuit chips at any angle between 1 degree and 179 degrees during bonding.)

1. The utility model provides a three-dimensional equipment bonding device in different planes, it includes base (1), its characterized in that: the rotary electric heating device is characterized in that a rotary block (2) is arranged, rotating shafts which are matched with the base (1) in a corresponding mode are arranged at two ends of the rotary block (2) respectively, a groove (3) is formed in the rotary block (2), a contraction clamping device (4) is arranged on the groove (3), and an electric heater (5) is further arranged on the rotary block (2).

2. The assembly bonding apparatus of claim 1, wherein: one end of one of the rotating shafts is provided with a rotating handle (6).

3. The assembly bonding apparatus of claim 1, wherein: the contraction clamping device (4) comprises a mounting hole (4 a) arranged on the groove wall at one side of the groove (3), a spring (4 d) is arranged in the mounting hole (4 a), a chuck (4 b) is arranged, one end of the clamping head (4 b) is provided with a pressure lever (4 c), one end of the pressure lever (4 c) is inserted into the mounting hole (4 a) to be correspondingly matched with the spring (4 d), a connecting rod (4 f) is arranged on the chuck (4 b) in a penetrating way, two ends of the connecting rod (4 f) are respectively positioned at two sides of the chuck (4 b), the side walls at the two sides of the rotating block (2) are respectively hinged with a swing rod (4), a cross bar (4 h) is inserted at the upper end of the swing rod (4 g), a pull rod (4 j) is hinged between the end part of the connecting rod (4 f) and the swing rod (4 g), a limit column (4 k) which is correspondingly matched with the swing rod (4 g) is also arranged on the groove wall (3) of the groove (3) above the pull rod (4 j).

The technical field is as follows:

the invention relates to the technical field of integrated circuit chip three-dimensional assembly welding, in particular to an out-of-plane three-dimensional assembly bonding device.

Background art:

the wire bonding is a process for connecting a bonding area on a large-scale integrated circuit chip and an inner lead part on a lead frame by using a metal wire in a bonding mode, and the process is simple in process, low in cost and suitable for various electronic packaging forms, and occupies a dominant position in the connection mode.

With the continuous progress of the design and manufacturing process of large-scale integrated circuits, it is increasingly required that wire bonding can be achieved between non-homodromous surfaces of electronic devices, such as bonding between a horizontal surface and an adjacent vertical surface of the electronic device, or bonding between other angles, and three-dimensional assembly can effectively utilize the side surface of an assembly cavity, effectively reduce the assembly area, and particularly for a three-axis accelerometer, three-axial acceleration monitoring can be achieved in a 3D assembly mode.

The invention content is as follows:

the invention provides a three-dimensional assembly bonding device with different surfaces, aiming at overcoming the defects in the prior art.

The application provides the following technical scheme:

the utility model provides a three-dimensional equipment bonding device in antarafacial, it includes the base, its characterized in that: the rotary block is provided with a rotating shaft which is correspondingly matched with the base at two ends, a groove is arranged on the rotating block, a shrinkage clamping device is arranged on the groove, and an electric heater is further arranged on the rotating block.

On the basis of the technical scheme, the following further technical scheme can be provided:

one end of one of the rotating shafts is provided with a rotating handle.

The contraction clamping device comprises a mounting hole formed in the groove wall on one side of the groove, a spring is arranged in the mounting hole, a chuck is arranged, a pressing rod is arranged at one end of the chuck, one end of the pressing rod is inserted into the mounting hole to form corresponding fit with the spring, a connecting rod is arranged on the chuck in a penetrating mode, two ends of the connecting rod are respectively located on two sides of the chuck, swing rods are respectively hinged to the side walls of two sides of the rotating block, a cross rod is inserted into the upper end of each swing rod, a pull rod is hinged between the end portion of each connecting rod and the corresponding swing rod, and limiting columns which are correspondingly matched with the swing rods are further arranged on.

The invention has the advantages that:

the invention has simple structure, convenient use and firm clamping, is suitable for integrated circuit chips with various sizes, can rotate at any angle between 1 and 179 degrees when bonding, and separates a bonding operation surface from a rotating surface, wherein the rotary control handle and the side wall are made of heat insulation materials, thereby avoiding the problem that the rotating bonding surface is easy to scald in the prior art, and has the advantages of good heat conduction effect between the heating device and the bonding surface, energy consumption reduction and the like.

Description of the drawings:

fig. 1 is a perspective view of the present invention.

The specific implementation mode is as follows:

as shown in fig. 1, the three-dimensional assembly bonding device with different surfaces comprises a base 1 with a through groove shape. A rotating block 2 is arranged in a groove body of a base 1, and the rotating block 2 is made of materials with high heat conductivity coefficient, such as stainless steel. The two ends of the rotary block 2 are respectively provided with rotating shafts correspondingly matched with the groove walls at the two sides of the base 1, one of the rotating shafts is longer, the end of the rotating shaft extends to the outer side of the groove wall of the base 1, and the end part of the rotating shaft is connected with a rotating handle 6 through a bolt.

A groove 3 is arranged on the upper surface of the rotating block 2, one side of the groove 3 is a thick groove wall 3a with larger thickness, and the other end is a thin groove wall 3b with thinner thickness. A slot 2a is arranged on the rotating block 2 below the groove 3, an electric heater 5 is inserted in the slot 2a, and the electric heater 5 is electrically connected with a power supply through a cable which is not shown in the figure. Since the electric heater 5 is a device purchased from the prior art, its structure will not be described here. Since the electric heater 5 is provided in the rotary block 2, the heat transfer effect to the entire rotary block 2 is good. And a cable hole 1a correspondingly matched with the cable is reserved at the bottom of the base 1, so that one end of the cable is led out from the cable hole 1a and is connected with a power supply.

The thick groove wall 3a is provided with a contraction clamping device 4, the contraction clamping device 4 comprises a mounting hole 4a which is arranged on the groove wall of the thick groove wall 3a and is opposite to the thin groove wall 3b, the mounting hole 4a is of a blind hole structure, and the axis of the blind hole structure is parallel to and in the same direction as the rotating shaft. A spring 4d is provided in the mounting hole 4 a. A clamping head 4b is arranged in the groove 3, one end of the clamping head 4b is provided with an integrally-made pressure rod 4c, and one end of the pressure rod 4c is inserted into the mounting hole 4a to be correspondingly matched with the spring 4 d.

The end part of one end of the chuck 4b is provided with an inclined chamfered edge 4e, so that the length of the upper surface of the chuck 4b is greater than that of the lower surface. The thickness end face of the chuck 4b in the length direction is provided with a through hole, a connecting rod 4f penetrates through the through hole, and two ends of the connecting rod 4f are respectively positioned at two sides of the chuck 4 b. The clamping head 4b and the pressing rod 4c are made of hard metal materials.

The side walls of the two sides of the rotating block 2 are respectively hinged with a swing rod 4g, and the upper ends of the swing rods 4g of the two sides of the rotating block 2 are inserted with a cross rod 4h stretching over the rotating block 2. A pull rod 4j is hinged between the end part of the connecting rod 4f and the swing rod 4g, and a limit column 4k which is correspondingly matched with the swing rod 4g is also arranged on the thick groove wall 3a above the pull rod 4 j.

Through pulling horizontal pole 4h backward, drive pull rod 4j pulls connecting rod 4f backward to drive chuck 4b and be close to thick cell wall 3a, increase the interval between chuck 4b and the thin cell wall 3b, the circuit chip 7 that the staff will wait to bond of being convenient for is put into recess 3, and the depression bar 4c of chuck 4b one end at this moment increases spring 4 d's pressure, compression spring 4 d. And then the cross rod 4h is slowly released, the pressure of the pressure rod 4c on the spring 4d is reduced, so that the spring 4d rebounds to drive the chuck 4b to move towards the thin slot wall 3b, and the existence of the chamfered edge 4e on the chuck 4b enables the chuck 4b and the thin slot wall 3b to be matched together to clamp circuit chips 7 of various sizes placed in the groove 3. And the limit column 4k limits the swing rod 4g, so that the cross rod 4h is prevented from excessively moving forwards, and meanwhile, the pressure rod 4c is prevented from being ejected out of the mounting hole 4a by the spring 4d, so that the pressure rod 4c can always keep a certain pressure on the spring 4 d. The materials of the swing rod 4g, the connecting rod 4f, the pull rod 4j and the limiting column 4k are the same as those of the rotating block 2.

The base 1, the rotating handle 6 and the cross rod 5b are all made of materials with low heat conductivity coefficient, such as polytetrafluoroethylene. Can effectively avoid scalding during bonding. When the circuit chip 7 is clamped in the groove 3, the circuit chip 7 can be bonded by rotating the handle 6 and rotating the rotating block 2 to rotate the circuit chip 7 to a proper angle.