Three-dimensional integrated filter based on glass through hole
阅读说明：本技术 一种基于玻璃通孔的三维集成滤波器 (Three-dimensional integrated filter based on glass through hole ) 是由 刘阳 刘晓贤 卢启军 尹湘坤 朱樟明 杨银堂 于 2019-08-27 设计创作，主要内容包括：本发明公开了一种基于玻璃通孔的三维集成滤波器,滤波器包括：第一层,包括第一金属板和第一金属线,所述若干第一金属板与所述第一金属线连接；第二层,包括介质基板和第二金属板,介质基板设置于第一金属板和第一金属线上方,第二金属板设置于介质基板内；第三层,包括玻璃基板和玻璃通孔,玻璃基板设置于第二层上方,玻璃通孔均贯穿玻璃基板；第四层,包括第三金属板和第二金属线,第二金属线设置于第三层上方且围成第二区域结构,第三金属板设置于第二区域结构内。本发明基于玻璃通孔构建三维螺旋电感器和平板电容器,通过三维螺旋电感器和平板电容器串并联形成的等效滤波器结构,其结构紧凑、体积小,方便集成,设计灵活。(The invention discloses a three-dimensional integrated filter based on glass through holes, which comprises: the first layer comprises first metal plates and first metal wires, and the first metal plates are connected with the first metal wires; the second layer comprises a dielectric substrate and a second metal plate, the dielectric substrate is arranged above the first metal plate and the first metal wire, and the second metal plate is arranged in the dielectric substrate; the third layer comprises a glass substrate and glass through holes, the glass substrate is arranged above the second layer, and the glass through holes penetrate through the glass substrate; and the fourth layer comprises a third metal plate and a second metal wire, the second metal wire is arranged above the third layer and surrounds a second area structure, and the third metal plate is arranged in the second area structure. The three-dimensional spiral inductor and the plate capacitor are constructed based on the glass through holes, and the equivalent filter structure is formed by connecting the three-dimensional spiral inductor and the plate capacitor in series and parallel, so that the three-dimensional spiral inductor and the plate capacitor are compact in structure, small in size, convenient to integrate and flexible in design.)
1. A three-dimensional integrated filter based on glass vias, the filter comprising:
a first layer (10) comprising a plurality of first metal plates and a plurality of first metal lines, the plurality of first metal plates being connected with the first metal lines;
a second layer (20) disposed above the first layer (10), the second layer comprising a dielectric substrate and a plurality of second metal plates, the dielectric substrate being disposed above the first metal plates and the first metal lines, the second metal plates being disposed within the dielectric substrate;
the third layer (30) is arranged above the second layer (20) and comprises a glass substrate and a plurality of glass through holes, the glass substrate is arranged above the second layer (20), and the glass through holes penetrate through the glass substrate;
and the fourth layer (40) is arranged above the third layer (30) and comprises a plurality of third metal plates and second metal wires, the second metal wires are arranged above the third layer (30) and enclose a second area structure, and the third metal plates are arranged in the second area structure.
2. The filter according to claim 1, wherein the number of first metal plates comprises a first sub-metal plate (101), a second sub-metal plate (102), the number of first metal lines comprises a first sub-metal line (103) and a number of second sub-metal lines (104), wherein,
the first sub-metal lines (103) enclose the first area structure;
the first sub-metal plate (101) and the second sub-metal plate (102) are disposed in the first area structure;
the two ends of the first sub-metal plate (101) and the second sub-metal plate (102) are respectively connected with the first sub-metal wire (103) through the second sub-metal wire (104).
3. The filter according to claim 2, wherein the plurality of second metal plates (202) are sequentially disposed in the dielectric substrate (201) at a first equal interval, and the second metal plates (202) at two outermost sides are disposed directly above the first sub-metal plate (101) and the second sub-metal plate (102), respectively.
4. The filter of claim 3, wherein the number of glass vias comprises a number of first glass vias (302) and a number of second glass vias (303), wherein,
the first glass through holes (302) penetrate through the glass substrate (301), the orthographic projections of the first glass through holes (302) are located on the second metal plate (202), and each first glass through hole (302) is filled with a first metal column;
the plurality of second glass through holes (303) penetrate through the glass substrate (301), orthographic projections of the plurality of second glass through holes (303) are located on the first sub-metal lines (103), and each second glass through hole (303) is filled with a second metal column.
5. The filter according to claim 4, wherein the plurality of first glass through holes (302) are distributed on the glass substrate (301) in a plurality of rows, each row of the first glass through holes (302) is distributed with a second equal interval, the vertical distance between two adjacent first glass through holes (302) in two adjacent rows of the first glass through holes (302) is a third equal interval, and two first glass through holes (302) are distributed at the diagonal vertex of each second metal plate (202);
the second glass through holes (303) are arranged at four vertexes of the glass substrate (301) right above the first sub-metal line (103).
6. A filter according to claim 4, characterised in that the third metal plates (401) are arranged in sequence in the second area structure at the first equidistant spacing.
7. The filter according to claim 6, wherein the third metal plate (401) is connected to the second metal plate (202) by the first metal stud;
the second metal line (402) is connected to the first sub-metal line (103) through the second metal pillar.
8. The filter according to claim 6, wherein the width of each of the first sub-metal line (103) and the second metal line (402) is greater than or equal to the diameter of the second glass via (303).
9. The filter according to claim 6, wherein the first sub-metal plate (101), the second sub-metal plate (102), the second metal plate (202), and the third metal plate (401) are all the same in size and shape, and wherein the first edges of the first sub-metal plate (101), the second sub-metal plate (102), the second metal plate (202), and the third metal plate (401) are all shorter than the second equidistant distance, and wherein the second edges of the first sub-metal plate (101), the second sub-metal plate (102), the second metal plate (202), and the third metal plate (401) are all longer than the third equidistant distance.
10. A filter according to claim 6, characterized in that the first sub-metal plate (101), the second sub-metal plate (102), the second metal plate (202) are all arranged directly below the perpendicular bisector of the adjacent third metal plate (401).
Technical Field
The invention belongs to the technical field of radio frequency/microwave integrated circuits, and particularly relates to a three-dimensional integrated filter based on a glass through hole.
Background
In a radio frequency integrated circuit, a filter plays a very important role as an indispensable frequency selection component in a communication system, and is widely used in various radio frequency integrated circuits.
The filter is very critical to the improvement of the overall operation quality of the communication system. With the increasing demand of people for high-speed wireless mobile communication and high-performance chips, the development of small size and light weight of a filter is urgent. The existing integrated filter mainly comprises a planar capacitor and an inductor which are formed by top-layer metal, can meet broadband performance and channel isolation, but with the rapid development of a three-dimensional manufacturing technology, glass materials can be etched through laser drilling, electrostatic discharge, wet etching and the like, and filling is realized through a silicon-based integrated circuit process, so that a glass adapter plate is formed.
At present, an existing integrated filter mainly comprises a planar capacitor and an inductor which are formed by top-layer metal, the occupied chip area is too large, the size of the filter is too large, and the weight of the system is difficult to reduce.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a three-dimensional integrated filter based on glass vias.
The embodiment of the invention provides a three-dimensional integrated filter based on glass through holes, which comprises:
the first layer comprises a plurality of first metal plates and a plurality of first metal wires, and the first metal plates are connected with the first metal wires;
the second layer is arranged above the first layer and comprises a dielectric substrate and a plurality of second metal plates, the dielectric substrate is arranged above the first metal plates and the first metal wires, and the second metal plates are arranged in the dielectric substrate;
the third layer is arranged above the second layer and comprises a glass substrate and a plurality of glass through holes, the glass substrate is arranged above the second layer, and the glass through holes penetrate through the glass substrate;
and the fourth layer is arranged above the third layer and comprises a plurality of third metal plates and second metal wires, the second metal wires are arranged above the third layer and enclose a second area structure, and the third metal plates are arranged in the second area structure.
In one embodiment of the present invention, the plurality of first metal plates includes a first sub-metal plate, a second sub-metal plate, the plurality of first metal lines includes a first sub-metal line and a plurality of second sub-metal lines, wherein,
the first sub-metal lines enclose the first area structure;
the first sub-metal plate and the second sub-metal plate are disposed in the first area structure;
and the two ends of the first sub-metal plate and the two ends of the second sub-metal plate are respectively connected with the first sub-metal wire through the second sub-metal wire.
In an embodiment of the invention, the plurality of second metal plates are sequentially arranged in the medium substrate at a first equal interval, and the second metal plates on the outermost sides of the two sides are respectively arranged right above the first sub-metal plate and the second sub-metal plate.
In one embodiment of the present invention, the plurality of glass vias includes a plurality of first glass vias and a plurality of second glass vias, wherein,
the plurality of first glass through holes penetrate through the glass substrate, the orthographic projections of the first glass through holes are positioned on the second metal plate, and each first glass through hole is filled with a first metal column;
the plurality of second glass through holes penetrate through the glass substrate, orthographic projections of the plurality of second glass through holes are located on the first sub-metal lines, and each second glass through hole is filled with a second metal column.
In an embodiment of the present invention, the plurality of first glass through holes are distributed in a plurality of rows on the glass substrate, each row of the first glass through holes are distributed at a second equal interval, a vertical distance between two adjacent first glass through holes in two adjacent rows of the first glass through holes is a third equal interval, and two first glass through holes are distributed at a diagonal vertex of each second metal plate;
the plurality of second glass through holes are arranged at four vertexes of the glass substrate right above the first sub-metal wire.
In an embodiment of the invention, the third metal plates are sequentially disposed in the second area structure at the first equal interval.
In one embodiment of the present invention, the third metal plate is connected to the second metal plate through the first metal pillar;
the second metal line is communicated to the first sub-metal line through the second metal pillar.
In one embodiment of the present invention, the widths of the first sub-metal line and the second metal line are both greater than or equal to the diameter of the second glass via.
In an embodiment of the present invention, the first sub metal plate, the second metal plate, and the third metal plate are all the same in size and shape, the lengths of the first edges of the first sub metal plate, the second metal plate, and the third metal plate are all smaller than the second equidistant distance, and the lengths of the second edges of the first sub metal plate, the second metal plate, and the third metal plate are all larger than the third equidistant distance.
In one embodiment of the present invention, the first sub-metal plate, the second sub-metal plate, and the second metal plate are disposed directly below a perpendicular bisector of an adjacent third metal plate.
Compared with the prior art, the invention has the beneficial effects that:
1. the three-dimensional spiral inductor and the plate capacitor are constructed based on the glass through holes, and the equivalent filter structure is formed by connecting the three-dimensional spiral inductor and the plate capacitor in series and parallel, so that the three-dimensional spiral inductor and the plate capacitor are compact in structure, small in size, convenient to integrate and flexible in design.
2. The three-dimensional spiral inductor constructed based on the glass through holes and the plate capacitor are connected in series and parallel to form the L-C-L-C-L equivalent filter structure, so that coupling noise in a circuit is effectively eliminated, the in-band insertion loss can be reduced, and the out-of-band return loss can be increased.
3. The grounding shielding wire is arranged in the bottom layer design, so that electric field lines can be completely collected by the metal wires with the periphery closed, and the energy utilization rate is improved.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of a three-dimensional integrated filter based on a glass via according to an embodiment of the present invention;
fig. 2a to 2d are front views of structures of a first layer, a second layer, a third layer and a fourth layer of a three-dimensional integrated filter based on a glass via according to an embodiment of the present invention;
fig. 3 is a front view of a three-dimensional integrated filter based on glass vias according to an embodiment of the present invention;
fig. 4 is a side view of a three-dimensional integrated filter based on a glass via according to an embodiment of the present invention;
fig. 5 is an equivalent circuit diagram of a three-dimensional integrated filter based on a glass via according to an embodiment of the present invention;
fig. 6 is a schematic diagram of simulation results of a three-dimensional integrated filter based on a glass via according to an embodiment of the present invention.
Description of the reference numerals
A
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
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