阅读说明：本技术 具有误差计算的磁场传感器 (Magnetic field sensor with error calculation ) 是由 H·D·罗梅罗 于 2018-04-23 设计创作，主要内容包括：一种磁场感测系统可以包括：第一磁场感测元件；第二磁场感测元件；用于生成具有第一非零频率的第一磁场的装置；用于生成具有第二频率的第二磁场的装置；被定位其响应于第一磁场而生成反射磁场的导电目标；用于在第一交替时间段期间产生表示第一磁场和反射磁场的第一信号的装置；用于在第二交替时间段期间产生表示第二磁场的第二信号的装置；用于根据第一信号和第二信号计算误差值的装置,其中,误差值至少部分地基于在第一时间段期间的第二信号；以及用于将误差值应用于第一交替时间段期间的第一信号的装置。(A magnetic field sensing system may include: a first magnetic field sensing element; a second magnetic field sensing element; means for generating a first magnetic field having a first non-zero frequency; means for generating a second magnetic field having a second frequency; an electrically conductive target positioned to generate a reflected magnetic field in response to the first magnetic field; means for generating a first signal representative of the first magnetic field and the reflected magnetic field during the first alternating time period; means for generating a second signal representative of a second magnetic field during a second alternating time period; means for calculating an error value from the first signal and the second signal, wherein the error value is based at least in part on the second signal during the first time period; and means for applying the error value to the first signal during the first alternating time period.)

1. A system, comprising:

at least one coil configured to:

generating a first magnetic field having a first frequency that induces a first reflected magnetic field in an electrically conductive target during a first time period, wherein the first reflected magnetic field has a first magnetic field strength; and is

Generating a second magnetic field having a second frequency that induces a second reflected magnetic field in the electrically conductive target during a second time period, wherein the second reflected magnetic field has a second magnetic field strength that is different from the first magnetic field strength;

at least one first magnetic field sensing element configured to detect the first magnetic field and the first reflected magnetic field during the first time period and to detect the second magnetic field and the second reflected magnetic field during the second time period;

at least one second magnetic field sensing element configured to detect the first magnetic field and the first reflected magnetic field during the first time period and to detect the second magnetic field and the second reflected magnetic field during the second time period; and

processing circuitry coupled to receive respective output signals from the at least one first magnetic field sensing element and the at least one second magnetic field sensing element and to calculate an error value for the system.

2. The system of claim 1, wherein the second frequency is substantially zero and the second reflected magnetic field strength is substantially zero.

3. The system of claim 1, wherein the first magnetic field comprises a first frequency that induces eddy currents in the conductive target that generate the first reflected magnetic field.

4. The system of claim 1, wherein the error value is based on measurements taken during the first time period, and the processing circuit is configured to apply the error value to measurements taken during the second time period.

5. The system of claim 1, wherein the at least one first magnetic field sensing element is positioned such that its axis of maximum sensitivity is aligned with the first magnetic field.

6. A system, comprising:

at least one coil configured to:

generating a first magnetic field having a first non-zero frequency; and

generating a second magnetic field having a second frequency; a conductive target positioned to generate a reflected magnetic field in response to the first magnetic field; one or more magnetic field sensing elements configured to:

generating a first signal representative of detection of the first magnetic field and the reflected magnetic field; and

generating a second signal indicative of detection of the second magnetic field.

7. The system of claim 6, further comprising a processing circuit to receive the first signal and the second signal and to calculate an error value for the system from the first signal and the second signal.

8. The system of claim 7, wherein the calculated error value is independent of the position of the conductive target.

9. The system of claim 6, wherein the first magnetic field has a frequency high enough to induce eddy currents in the conductive target.

10. The system of claim 9, wherein the reflected magnetic field is generated by the eddy current.

11. The system of claim 6, wherein the second frequency is substantially low such that it does not induce a reflected field from the conductive target.

12. The system of claim 11, wherein the second frequency is substantially zero.

13. The system of claim 6, wherein the first magnetic field is generated during a first time period and the second magnetic field is generated during a second time period.

14. The system of claim 13, further comprising a processing circuit to calculate an error value based on measurements taken during the second time period and apply the error value to measurements taken during the first time period.

15. The system of claim 13, wherein the first and second time periods are non-overlapping time periods.

16. A method, comprising:

generating a first magnetic field having a first non-zero frequency;

generating a second magnetic field having a second frequency;

inducing a reflected magnetic field from a conductive target by the first magnetic field;

generating, by one or more magnetic field sensing elements, a first signal representative of the first magnetic field and the reflected magnetic field; and

generating, by the one or more magnetic field sensing elements, a second signal representative of the second magnetic field.

17. The method of claim 16, further comprising calculating an error value from the first signal and the second signal.

18. The method of claim 17, wherein the calculated error value is independent of the position of the conductive target.

19. The method of claim 16, wherein the first magnetic field has a frequency high enough to induce eddy currents in the conductive target, wherein the reflected magnetic field is generated by the eddy currents.

20. The method of claim 16, wherein the second frequency is substantially low such that the second magnetic field does not induce a reflected magnetic field from the conductive target.

21. The method of claim 20, wherein the second frequency is substantially zero.

22. The method of claim 16, wherein:

generating the first magnetic field comprises generating the first magnetic field during a first time period; and is

Generating the second magnetic field includes generating the second magnetic field during a second time period.

23. The system of claim 22, wherein the first and second time periods are non-overlapping time periods.

24. The method of claim 22, further comprising:

generating the first signal during the first time period;

generating the second signal during the second time period;

calculating an error value based on the first signal measured during the first time period; and

applying the error value to the second signal during the second time period.

25. A system, comprising:

a first magnetic field sensing element;

a second magnetic field sensing element;

means for generating a first magnetic field having a first non-zero frequency;

means for generating a second magnetic field having a second frequency;

a conductive target positioned to generate a reflected magnetic field in response to the first magnetic field;

means for generating a first signal representative of the first magnetic field and the reflected magnetic field during a first alternating time period;

means for generating a second signal representative of the second magnetic field during a second alternating time period;

means for calculating an error value from the first signal and the second signal, wherein the error value is based at least in part on the second signal during the first time period; and

means for applying the error value to the first signal during the first alternating time period.

Technical Field

The present disclosure relates to magnetic field sensors, and more particularly, to magnetic field sensors with error calculation.

Background

Magnetic field sensors are commonly used to detect ferromagnetic targets. They generally act as sensors for detecting the movement or position of an object. Such sensors are ubiquitous in many areas of technology including robotics, automotive, manufacturing, and the like. For example, a magnetic field sensor may be used to detect when a wheel of the vehicle is locked, thereby triggering a control processor of the vehicle to engage an anti-lock braking system. In this example, the magnetic field sensor may detect rotation of the wheel. The magnetic field sensor may also detect the distance of the object. For example, a magnetic field sensor may be used to detect the position of the hydraulic piston.

No magnetic field sensor is completely accurate. Each magnetic field sensor that detects the target location includes at least some error. In some systems, the error may be a non-linear error that is a function of the target position. Compensating for errors as a function of the position of the target may present challenges if the target is used as a reference and/or if the position of the target is not known when attempting to measure and calculate the errors.

Disclosure of Invention

In an embodiment, a system includes at least one coil configured to generate a first magnetic field having a first frequency that induces a first reflected magnetic field in an electrically conductive target during a first time period, wherein the first reflected magnetic field has a first magnetic field strength. The coil may be configured to generate a second magnetic field having a second frequency that induces a second reflected magnetic field in the electrically conductive target during a second time period, wherein the second reflected magnetic field has a second magnetic field strength that is different from the first magnetic field strength.

At least one first magnetic field sensing element may be configured to detect the first magnetic field and the first reflected magnetic field during the first time period and to detect the second magnetic field and the second reflected magnetic field during the second time period.

At least one second magnetic field sensing element may be configured to detect the first magnetic field and the first reflected magnetic field during the first time period and to detect the second magnetic field and the second reflected magnetic field during the second time period.

The processing circuitry may be coupled to receive respective output signals from the at least one first magnetic field sensing element and the at least one second magnetic field sensing element and to calculate an error value for the system.

One or more of the following features may be included.

The second frequency may be substantially zero and the second reflected magnetic field strength may be substantially zero.

The first magnetic field may include a first frequency that induces eddy currents in the conductive target that generate the first reflected magnetic field.

The error value may be based on measurements made during the first time period, and the processing circuit may be configured to apply the error value to measurements made during the second time period.

The at least one first magnetic field sensing element may be positioned such that its axis of maximum sensitivity is aligned with the first magnetic field.

In another embodiment, a system comprises: at least one coil configured to generate a first magnetic field having a first non-zero frequency and to generate a second magnetic field having a second frequency; a conductive target positioned to generate a reflected magnetic field in response to the first magnetic field; one or more magnetic field sensing elements configured to generate a first signal indicative of detecting the first magnetic field and the reflected magnetic field and to generate a second signal indicative of detecting the second magnetic field.

One or more of the following features may be included.

The processing circuit may receive the first signal and the second signal and calculate an error value for the system based on the first signal and the second signal.

The calculated error value may be independent of the position of the conductive target.

The first magnetic field may have a frequency high enough to induce eddy currents in the conductive target.

The reflected magnetic field may be generated by the eddy current.

The second frequency may be substantially low such that it does not induce a reflected field from the conductive target.

The second frequency may be substantially zero.

The first magnetic field may be generated during a first time period and the second magnetic field may be generated during a second time period.

The processing circuit may calculate an error value based on measurements made during the second time period and apply the error value to measurements made during the first time period.

The first and second time periods may be non-overlapping time periods.

In another embodiment, a method comprises: generating a first magnetic field having a first non-zero frequency; generating a second magnetic field having a second frequency; inducing a reflected magnetic field from a conductive target by the first magnetic field; generating, by one or more magnetic field sensing elements, a first signal representative of the first magnetic field and the reflected magnetic field; and generating, by the one or more magnetic field sensing elements, a second signal representative of the second magnetic field.

One or more of the following features may be included.

An error value may be calculated from the first signal and the second signal.

The calculated error value may be independent of the position of the conductive target.

The first magnetic field may have a frequency high enough to induce eddy currents in the conductive target, wherein the reflected magnetic field is generated by the eddy currents.

The second frequency may be substantially low such that the second magnetic field does not induce a reflected magnetic field from the electrically conductive target.

The second frequency may be substantially zero.

Generating the first magnetic field may include generating the first magnetic field during the first time period; and generating the second magnetic field may include generating the second magnetic field during the second time period, wherein the first time period and the second time period do not overlap.

The first and second time periods may be non-overlapping time periods.

The first signal may be generated during the first time period; the second signal may be generated during the second time period; an error value may be calculated based on the first signal measured during the first time period; and applying the error value to the second signal during the second time period.

In another embodiment, a system includes a first magnetic field sensing element; a second magnetic field sensing element; means for generating a first magnetic field having a first non-zero frequency; means for generating a second magnetic field having a second frequency; a conductive target positioned to generate a reflected magnetic field in response to the first magnetic field; means for generating a first signal representative of the first magnetic field and the reflected magnetic field during a first alternating time period; means for generating a second signal representative of the second magnetic field during a second alternating time period; means for calculating an error value from the first signal and the second signal, wherein the error value is based at least in part on the second signal during the first time period; and means for applying the error value to the first signal during the first alternating time period.

Drawings

The foregoing features may be more fully understood in view of the following description of the accompanying drawings. The accompanying drawings are included to provide a further understanding of the disclosed technology. The drawings provided depict one or more exemplary embodiments, since it is often impractical, or impossible, to illustrate and describe every possible embodiment. Accordingly, the drawings are not intended to limit the scope of the present invention. Like reference symbols in the various drawings indicate like elements.

FIG. 1 is a perspective view of a system for sensing a conductive target.

Fig. 2 is a cross-sectional view of the system of fig. 1.

FIG. 3 is a block diagram of a system for sensing a conductive target including a signal processing element.

FIG. 4 is a block diagram of another embodiment of a system for sensing a conductive target including a signal processing element.

Fig. 4A is a schematic diagram of a coil of a magnetic field sensing element.

Fig. 5 is a graph of signals associated with the system of fig. 4.

Fig. 6 is a graph of reflected magnetic field strength versus frequency.

Fig. 7 is a timing diagram of the mode of operation of the system of fig. 4.

Detailed Description

As used herein, the term "magnetic field sensing element" is used to describe various electronic elements that can sense a magnetic field. The magnetic field sensing element may be, but is not limited to, a hall effect element, a magnetoresistive element, or a magnetic transistor. It is well known that there are different types of hall effect elements, for example, planar hall elements, vertical hall elements, and Circular Vertical Hall (CVH) elements. As is well known, there are different types of Magnetoresistive (MR) elements, for example, semiconductor magnetoresistive elements such as indium antimonide (InSb), Giant Magnetoresistive (GMR) elements, anisotropic magnetoresistive elements (AMR), Tunnel Magnetoresistive (TMR) elements, and Magnetic Tunnel Junctions (MTJ). The magnetic field sensing element may be a single element or, alternatively, may comprise two or more magnetic field sensing elements arranged in various configurations, e.g., a half-bridge or a full (wheatstone) bridge. Depending on the device type and other application requirements, the magnetic field sensing element may be a device made of a type IV semiconductor material, such as silicon (Si) or germanium (Ge), or a type III-V semiconductor material, such as gallium arsenide (GaAs), or an indium compound, such as indium antimonide (InSb).

It is well known that some of the above-described magnetic field sensing elements tend to have axes of maximum sensitivity parallel to the substrate supporting the magnetic field sensing elements, while others of the above-described magnetic field sensing elements tend to have axes of maximum sensitivity perpendicular to the substrate supporting the magnetic field sensing elements. In particular, planar hall elements tend to have a sensitivity axis perpendicular to the substrate, while metal-based or metal magnetoresistive elements (e.g., GMR, TMR, AMR) and vertical hall elements tend to have a sensitivity axis parallel to the substrate.

As used herein, the term "magnetic field sensor" is used to describe a circuit that uses a magnetic field sensing element, typically in combination with other circuitry. Magnetic field sensors are used in a variety of applications, including, but not limited to, angle sensors that sense the angle of direction of a magnetic field, current sensors that sense the magnetic field generated by a current carried by a current carrying conductor, magnetic switches that sense the proximity of ferromagnetic objects, rotation detectors that sense ferromagnetic articles passing through (e.g., magnetic domains of a ring magnet or ferromagnetic target (e.g., gear teeth) where the magnetic field sensor is used in conjunction with a reverse-biased magnet or other magnet), and magnetic field sensors that sense the magnetic field density of a magnetic field.

As used herein, the terms "target" and "magnetic target" are used to describe an object to be sensed or detected by a magnetic field sensor or magnetic field sensing element.

Fig. 1 is a perspective view of a system 100 for detecting a conductive target 101. The system 100 may include a substrate 102 that may support a coil 104, a coil 106, and an MR element 108. Although one MR element is shown, MR element 108 may include two or more MR elements, depending on the embodiment of system 100. In other embodiments, coils 104 and 106 may be supported by separate substrates, or may be free standing coils (i.e., coils that are not supported by a substrate or that are supported by a different structure, such as a chip package or frame).

The target 101 may comprise an electrically conductive material, such as a metal, which allows eddy currents to be induced in the target 101 by the magnetic field generated by the coils 104 and 106.

Although not shown, an MR driver circuit may provide current to the MR element 108, and a coil driver circuit 110 may provide current to the coils 104 and 106.

The coils 104 and 106 may be arranged such that current flows through the coils 104 and 106 in opposite directions, as shown by arrows 109 (indicating clockwise current in the coil 104) and 110 (indicating counterclockwise current in the coil 106). As a result, coil 104 may generate a magnetic field having a magnetic moment in the negative Z direction (i.e., downward in FIG. 1), as indicated by arrow 112. Similarly, coil 106 may generate a magnetic field having magnetic moments in the opposite direction (positive Z-direction), as indicated by arrows 114. The concentrated magnetic field 111 produced by the two coils may have a shape similar to that shown by the magnetic field lines 111. It will be appreciated that the coils 104, 106 may be formed from a single coil structure that is wound separately such that current flowing through the coils flows in opposite directions. Alternatively, the coils 104, 106 may be formed from separate coil structures.

In an embodiment, the MR element 108 may be located between the coils 104 and 106. In this arrangement, the net magnetic field at the MR element 108 may be zero without any other magnetic field than the magnetic fields generated by the coils 104 and 106. For example, the negative Z-component of the magnetic field generated by coil 104 may be cancelled by the positive Z-component of the magnetic field generated by coil 106, and the negative X-component of the magnetic field shown above substrate 102 may be cancelled by the positive X-component of the magnetic field shown below substrate 102. In other embodiments, additional coils may be added to the substrate 102 and arranged such that the net magnetic field at the MR element 108 is substantially zero.

To obtain a substantially zero magnetic field at the location of the MR element 108, the coil 104 and the coil 106 may be positioned such that the current through the coils flows in a circular pattern in substantially the same plane. For example, current through coils 104 and 106 flows through the coils in a circular pattern. As shown, these circular patterns are substantially coplanar with each other and with the top surface 116 of the substrate 102.

A coil driver (not shown in fig. 1) coupled to coils 104 and/or 106 may generate the alternating field. In such an arrangement, the magnetic field, shown by magnetic field lines 111, may change direction and magnitude over time. However, during these changes, the magnetic field at the location of the MR element 108 can remain substantially zero.

In operation, as the target 101 moves toward and away from the MR element 108 (i.e., in the positive and negative Z-axis directions), the magnetic field 111 will cause eddy currents to flow within the target 101. These eddy currents will generate their own magnetic field, which will generate a non-zero magnetic field in the plane of the MR element 108, which can be sensed to detect the motion or position of the target 101.

Referring to fig. 2, a cross-sectional view 150 of the system 100 as seen along the Y-direction at line 118 (of fig. 1) illustrates eddy currents within the target 101. The 'x' symbol represents the current flowing into the page, and the '·' symbol represents the current flowing out of the page. As described above, the current through coils 104 and 106 may be an alternating current, which may cause an alternating strength of magnetic field 111. In an embodiment, the phase of the alternating current through coil 104 matches the phase of the alternating current through coil 106 such that magnetic field 111 is an alternating field or a periodic field.

The alternating field 111 may generate eddy currents 140 and 142 within the magnetic target 101. The direction of eddy currents 140 and 142 may be opposite to the current flowing through coils 104 and 106, respectively. As shown, eddy current 148 flows out of the page and eddy current 140 flows into the page, while coil current 151 flows into the page and current 152 flows out of the page. Also, as shown, the direction of eddy current 142 is opposite to the direction of current through coil 106.

Eddy currents 140 and 142 generate a reflected magnetic field 154 having a direction opposite to magnetic field 111. As described above, the MR element 108 detects zero net magnetic field due to the magnetic field 111. However, in the presence of the reflected magnetic field 154, the MR element 108 will detect a non-zero magnetic field. The value of the reflected magnetic field 154 at the MR element 108 is non-zero, as indicated by the magnetic field lines 156.

As the target 101 moves closer to the coils 104 and 106, the magnetic field 111 may generate stronger eddy currents in the target 101. As a result, the strength of the reflected magnetic field 154 may change. The magnetic field 111' (in the right panel of fig. 2) may represent a stronger magnetic field than the magnetic field 111 due to, for example, the closer proximity of the target 101 to the coils 104 and 106. Thus, eddy currents 140' and 142' may be stronger than eddy currents 140 and 142, and magnetic field 154' may be stronger than magnetic field 154. This phenomenon may cause the MR element 108 to detect a stronger magnetic field (i.e., the magnetic field 154') when the target 101 is closer to the coils 104 and 106, and a weaker magnetic field (i.e., the magnetic field 154) when the target 101 is farther from the coils 104 and 106.

In addition, eddy currents 140 'and 142' typically occur on or near the surface of the target 101. The magnetic field strength decreases as a function of radius-i.e., as a function of distance from the magnetic field source. Thus, as the target 101 moves closer to the MR element 108, the MR element 108 may experience a stronger magnetic field from eddy currents because the magnetic field source is closer to the MR element 108.

FIG. 3 is a block diagram of a magnetic field sensor 300 that may include a coil 302, a coil driver 304, an AC driver 310, an MR driver 308, an MR element 306, an amplifier 314, a low pass filter 318, a temperature sensor 320, a material type module 322, an offset module 324, and a piecewise linearization module 326.

Although shown as a single coil, the coil 302 may include one or more coils. In an embodiment, coil 302 may be the same as or similar to coil 104 and/or coil 106 described above. Similarly, the MR element 306 may include one or more MR elements, and may be the same as or similar to the MR element 108 described above.

The coil driver 304 may provide a power signal that drives a current through the coil 302, causing the coil 302 to generate a magnetic field. The MR driver 308 can provide power to the MR elements 306, allowing them to detect magnetic fields.

The MR element 306 may be responsive to a sensing element drive signal (e.g., a signal produced by the MR driver 308) and may be configured to detect the directly coupled magnetic field generated by the coil 302. The MR element 306 may generate a signal 312 representative of the detected magnetic field. The MR element 306 may also be configured to detect a reflected magnetic field generated by eddy currents within a target (such as the target 101).

As shown, AC driver 310 is coupled to coil driver 304. In this embodiment, the coil driver 304 may generate a low frequency signal to drive the coil 302. The frequency may be low enough so that the magnetic field generated by the coil 302 does not cause eddy currents and reflected fields from the target 101. In some embodiments, the frequency is zero (i.e., a "DC" frequency).

The coil 302 may generate a DC (or substantially low frequency AC) magnetic field that may be detected by the MR element 306 but does not generate eddy currents in the target. The signal generated by detecting the DC (or substantially low frequency AC) magnetic field can be used to adjust the sensitivity of the magnetic field sensor.

The coil 302 may also generate an AC magnetic field at higher frequencies that induces eddy currents in the target that generate a reflected magnetic field at higher frequencies that the MR element 306 can detect. The coil 302 may alternate between generating a low frequency magnetic field and generating a high frequency magnetic field.

The MR element 306 may generate a signal 312, which signal 312 may include frequency components of DC or substantially low AC frequencies that are representative of low frequency magnetic fields that do not cause eddy currents in the target (e.g., "directly coupled" signals or signal components), and/or frequency components at higher AC frequencies that are representative of detected reflected fields (e.g., "reflected" signals or signal components). In an embodiment, the directly coupled signal may be used to adjust the sensitivity of the sensor, while the reflected signal may be used to detect the target. The coil driver 304 and/or the MR driver 308 may use the directly coupled signals as sensitivity signals to adjust their respective output drive signals in response to the sensitivity signals.

In an embodiment, the directly coupled signal and the reflected signal may be included as frequency components of the same signal. In this case, the coil 302 may be driven to simultaneously generate two frequency components. In other embodiments, the generation of the directly coupled signal and the reflected signal may be generated at different times, for example, using a time division multiplexing scheme.

Sensor 300 may also include demodulator circuit 350, which demodulator circuit 350 may modulate signal 316 to remove AC components from the signal or to convert AC components within the signal to a different frequency. For example, demodulator circuit 350 may modulate signal 316 at frequency f. As is known in the art, because signal 316 includes a signal component that represents the detected magnetic field at frequency f, modulating signal 316 at frequency f may transform the signal element representing the detected magnetic field to 0Hz or DC. Other frequency components within the signal 316 may be converted to higher frequencies so they may be removed by the low pass filter 318. In an embodiment, the DC or low frequency component of the signal 316, which may represent the sensitivity value, may be fed back to the coil driver 304 to adjust the output of the coil 302 in response to the signal and/or to the MR driver 308 to adjust the drive signal 309 in response to the sensitivity value. The DC output signal 352 may indicate the proximity of a target to the MR element 306.

In other embodiments, a time division multiplexing scheme may be used. For example, the coil driver 304 may drive the coil 302 at a first frequency during a first time period, at a second frequency during a second time period, and so on. In some cases, the first time period and the second (and subsequent) time periods do not overlap. In other cases, the first time period and the second time period may overlap. In these cases, the coil driver 304 may drive the coils 302 at two or more frequencies simultaneously. When the first and second time periods do not overlap, the demodulator 350 may operate at the same frequency as the coil driver 304. When the time periods overlap, multiple modulators may be used, with a first modulator operating at a first frequency and a second modulator operating at a second frequency to separate out the signals at each frequency.

While it may be advantageous to reduce the directly coupled magnetic field detected by MR element 306 to achieve an accurate reading of the reflected field (and thus the detected target), it may also be advantageous to have a certain amount of direct coupling (i.e., to directly detect the magnetic field generated by coil 302) to allow for the calculation of sensitivity values. Simultaneously measuring the field reflected by the target and the field directly generated by the coil allows accurate detection of the distance of the object independently of the sensitivity of the MR element, the coil drive current, and the like. The sensitivity of an MR element may vary with temperature and/or the presence of unwanted DC or AC stray fields in the plane of the MR array. The ratio between the reflected field and the directly coupled field depends only on the geometric design and is therefore a good parameter for accurately determining the distance.

In an embodiment, a frequency hopping scheme may be used. For example, the coil driver 304 may drive the coils 302 at different frequencies (e.g., alternating between frequencies over time, or producing a signal containing multiple frequencies). In such an embodiment, the sensor 300 may include multiple demodulator circuits and/or filters to detect signals at each frequency.

Additional examples of magnetic field SENSORs using COILs and reflected fields may be found in U.S. patent application entitled COIL actuation detection SENSOR WITH REFLECTED MAGNETIC FIELD, which lists mr. latham as the inventor, commonly owned with the present application, filed on even date herewith, with the office docket number ALLEG-590PUS, entitled application number 15/606,358, and incorporated herein by reference in its entirety.

Fig. 4 is a block diagram of a magnetic field sensor 400 for detecting a conductive target. Magnetic field sensor 400 includes a coil 402 for generating a magnetic field, a coil driver 404 for driving a current through coil 402, and magnetic field sensing elements 406 and 408 for detecting the magnetic field. The coil driver 404 may be an adjustable coil driver that may drive currents of different amplitudes and different frequencies through the coil 402. For example, the coil driver 404 may drive an AC current having a first frequency during a first time period and a current having a second frequency during a second time period. In an embodiment, the first frequency may be high enough to generate eddy currents in the conductive target and a reflected magnetic field from the conductive target, and the second frequency may be low enough such that magnetic field sensing elements 406 and 408 are substantially unable to detect any reflected field from the conductive target. In an embodiment, the second frequency may be a zero frequency or a "DC" frequency.

Magnetic field sensing elements 406 and 408 may be MR elements, hall effect elements, or other types of magnetic field sensing elements. In an embodiment, the magnetic field sensing elements 406 and 408 shown in FIG. 4 may represent multiple Hall effect or MR elements. For example, each block 406 and 408 may represent two, four, or more magnetic field sensing elements arranged in a bridge to generate differential output signals 412 and 414, respectively. In other embodiments, magnetic field sensing elements 406 and 408 may generate single-ended output signals.

Magnetic field sensing elements 406 and 408 may detect directly coupled magnetic fields (i.e., they may directly detect the magnetic field generated by coil 402) and may detect reflected fields generated by eddy currents in a conductive target (e.g., target 101 in fig. 1). In an embodiment, magnetic field sensing elements 406 and 408 may be arranged such that their axes of maximum sensitivity are in opposite directions. For example, when a directly coupled field is sensed, the MR element 406 can generate a signal having the same absolute value but opposite sign as the signal generated by the MR element 408. The axis of maximum sensitivity may also be arranged so that the signals produced when the MR elements 406 and 408 detect the reflected magnetic field do not have opposite signs. In an embodiment, this may be achieved by including a counter coil in the coil 402.

Referring to fig. 4A, the coil 448 may be the same as or similar to the coil 402. MR elements 1-4 can include MR element 406 or can be the same as or similar to MR element 406, and MR elements 5-8 can include or can be the same as or similar to MR element 408. For example, MR elements 1-4 can form the same or similar MR bridge as MR element 406 and MR elements 5-8 can form the same or similar MR bridge as MR element 408.

The coil 452 may include traces 454A, 454B, 456A, and 456B, and counter coil portions 454 and 456. The bucking coil portions 454 and 456 may generate a local magnetic field around the MR element that reduces the response of the MR elements 1-8 to the reflected magnetic field and increases the response of the MR element 108 to the direct coupling field. The local magnetic field generated by the counter coil portions 454 and 456 may be in the opposite direction of the magnetic field generated by the traces 454A, 454B, 456A, and 456B.

In fig. 4A, the current through the counter coil portions 454 and 456 is shown traveling in a counter clockwise direction. Although not shown, in other embodiments, the current through the counter coil portions 454 and 456 may travel in a counter-clockwise direction.

The differential output of the bridge including MR elements 1-4 can be defined as the voltage at the series connection node between MR elements 1 and 4 minus the voltage at the series connection node between MR elements 2 and 3, and the differential output of the bridge including MR elements 5-8 can be defined as the voltage at the series connection node between MR elements 5 and 8 minus the voltage at the series connection node between MR elements 6 and 7. The direct coupling field experienced by MR elements 1 and 4 may be the opposite of the direct coupling field experienced by MR elements 2 and 3, taking into account the absence of reflected fields. In other words, the MR elements may be positioned such that as they experience a stronger directly coupled magnetic field, the resistance of MR elements 1 and 3 may increase and the resistance of MR elements 2 and 4 may decrease. Furthermore, the MR elements may be positioned such that as they experience stronger directly coupled magnetic fields, the resistance of MR elements 5 and 7 may increase and the resistance of MR elements 6 and 8 may decrease.

Now consider that in spite of the counter coils 454 and 456, there are also cases where the target and the reflected field are present, and the MR elements 1-8 may experience the reflected field as a uniform field common to both bridges. Thus, the reflected field may cause the differential output of the bridge comprising MR elements 1-4 to be transformed in the same direction as the differential output of the bridge comprising MR elements 5-8. In this way, the reflected field component can be distinguished from the directly coupled field component of the output of the MR bridge by adding or subtracting the differential outputs of the MR bridge.

Referring again to FIG. 4, the magnetic field sensor 400 may also include signal processing elements (such as amplifiers 416 and 418) for amplifying the signals 412 and 414, modulators 420 and 422, and analog-to-digital converters (ADCs) 424 and 426 for processing the signals 412 and 414. The modulators 420 and 422 may multiply the signals from the MR elements by substantially the same frequency as the frequency of the coil driver 404. This may allow frequency conversion to DC for subsequent processing.

In an embodiment, the coil driver 402 may drive the coil 402 at one frequency (F1) during a first time period and at another frequency (F2) during a second time period. Thus, the modulators 420 and 422 may be configured to multiply the signals from the MR elements by the frequency F1 during the first time period and multiply the signals from the MR elements by the frequency F2 during the second time period. The modulators 420 and 422 may convert the signals to DC by multiplying the signals by the same frequency that the drive coil 402 is at.

The magnetic field sensor 400 may also include an MR driver 410, which MR driver 410 may provide power to the magnetic field sensing element. The MR driver may apply power or remove power from the magnetic field sensing elements 406 or 408 during alternating time periods. For example, during a period of time, magnetic field sensing element 406 may be active and magnetic field sensing element 408 may be inactive. During the second time period, magnetic field sensing element 408 may be active and magnetic field sensing element 406 is inactive. Alternatively, the MR driver may provide power to or remove power from both magnetic field sensing elements 406 and 408 simultaneously.

The magnetic field sensor 400 may further comprise processing circuitry for calculating an error value of the magnetic field sensor. The summing circuit 428 may generate the sum of the signal V1 and the signal V2. The subtraction circuit 430 may calculate values V1-V2. The division circuit 432 may divide the signal from the summation circuit 428 by the signal from the subtraction circuit 430 to produce an output signal 434 that may represent the value of (V1+ V2)/(V1-V2). Recall that V1 may be a digital representation of signal 412 generated by magnetic field sensing element 406 and signal V2 may be a digital representation of signal 414 generated by magnetic field sensing element 408.

Sampling circuits 436 and 438 may selectively couple the outputs of summing circuit 428 and subtracting circuit 430, respectively, to the inputs of dividing circuit 432. For example, in an embodiment, the signal (V1+ V2) from the summing circuit 428 may be sampled during a first time period and the signals (V1-V2) from the subtraction circuit 430 may be sampled during a second time period. Accordingly, the division circuit may divide the (V1-V2) factor sampled during the first time period by the (V1+ V2) factor sampled during the second time period to generate the signal 434.

During operation, the magnetic field sensor 400 may change state during a first time period and a second time period. During the first time period, the coil driver 404 may drive the coil 402 with a current having a frequency F1. The magnetic field generated by the coil 402 may induce eddy currents and a reflected magnetic field at a frequency F1. The magnetic field sensing elements 406 and 408 may detect the directly coupled field from the coil 402 and the reflected field from the target during a first time period. As described above, the magnetic field sensing elements may be arranged such that the magnetic field sensing elements 406 and 408 detect directly coupled fields having opposite signs and detect reflected magnetic fields having the same sign.

During the first time period, the sampling circuit 436 may allow the signal (V1+ V2) to pass to the division circuit 434 while the sampling circuit 438 does not pass the signals (V1-V2) to the division circuit 434.

During the second time period, the coil driver 404 may drive the coil 402 with a current having a frequency F2. The magnetic field generated by the coil 402 may induce eddy currents and a reflected magnetic field at a frequency F2. The magnetic field sensing elements 406 and 408 may detect the directly coupled field from the coil 402 and the reflected field from the target during a first time period. In some embodiments, frequency F2 is low enough so that it does not induce significant eddy currents or reflected magnetic fields that may be detected by magnetic field sensing elements 406 and 408. In such embodiments, magnetic field sensing elements 406 and 408 may detect the direct coupling field only during the second time period.

During the second time period, the sampling circuit 438 may allow the signals (V1-V2) to pass to the division circuit 434 while the sampling circuit 436 does not pass the signal (V1+ V2) to the division circuit 434.

After the samples acquired during the first and second time periods are available, the divide circuit 434 may calculate an output signal 434 representing (V1+ V2)/(V1-V2), where (V1+ V2) is sampled during the first time period and (V1-V2) is sampled during the second time period. In embodiments where the frequency F2 does not induce a reflected magnetic field during the second time period, the term (V1+ V2) may represent a direct coupling magnetic field and a reflected magnetic field, while the terms (V1-V2) may represent only a direct coupling magnetic field.

In an embodiment, the signal 434 may be used to determine an error in the magnetic field of the magnetic field sensor 400, for example, a mismatch error between the magnetic field sensing elements. The error may also be based on noise, interference, external magnetic fields, etc. In some cases, for example, when magnetic field sensing elements 406 and 408 are detecting a reflected magnetic field from a target, the error of the magnetic field sensor may be a function of the distance of the target from the location or of magnetic field sensing elements 406 and 408, as well as the frequency and strength of the reflected magnetic field. For example, part of the error due to the reflection field ("reflection field error") may be a non-linear error. By measuring the direct coupling field and the reflected field at two frequencies, as described above, the magnetic field sensor 400 can be used to compensate for errors due to the reflected field.

In the case where the first frequency F1 and the second frequency F2 are non-zero, the magnetic field sensor 400 may compensate for the reflected field error by extrapolating or interpolating the magnetic field error using the two frequency points. This technique may also be used where F1 is non-zero and F2 is zero or low enough that magnetic field sensors 406 and 408 cannot detect the reflected field. In this case, the calculation of the determination error value can be simplified, since at one of the frequency points the reflected field strength is zero. For example, in the above example where F2 is zero, the error value (V1-V2) may not depend on the reflected field, and therefore not on the position of the target, because there is no reflected magnetic field when the error value (V1-V2) is measured.

In a typical system, V1 and V2 can be described by the following formulas:

where I is the current through the coil 402, K₁And K₂Is the coupling factor of the magnetic field sensing elements 406 and 408, respectively, r (x) is the ratio between the reflected field and the directly coupled field, and S is a sensitivity mismatch factor, which represents the sensitivity mismatch between the magnetic field sensing elements 406 and 408. Note that r (x) may be a function of the location of the target. The value q is K₁And K₂Of a ratio of K to K₂＝q*K₁。

In addition, the target P_NCan be described by the following formula:

substitutions V1 and V2, P_NThe formula of (a) may be rearranged as:

equation 4 can be rewritten as:

P_N＝off+G*r(x) (5)

wherein:

if we assume that q is-1 (corresponding to the above-described magnetic field sensing elements 406 and 408 that detect directly coupled magnetic fields with opposite signs), equation 4 can be simplified as:

by way of example, if r (x) is 0.5 and S_M0.01 (representing a 1% mismatch between the magnetic field sensing elements), then equation 8 gives:

this indicates that, in this example, a 1% mismatch between the magnetic field sensing elements correlates to a 0.7% error in position. In addition, the error may be a function of the position of the target, as shown in equation 4 above. However, time multiplexing and changing the frequency of the magnetic field during operation and calibration can reduce position errors.

Referring now to FIG. 5, a graph 500 illustrates the operation of the magnetic field sensor 400 during a calibration ("cal") mode and a normal operating mode. Waveform 502 represents a control signal that switches magnetic field sensor system 400 between a calibration mode and a normal mode. Waveform 504 represents signal V1 and waveform 506 represents signal V2. Signal 508 represents the output of coil driver 404. During the calibration mode, waveform 508 is a DC waveform indicating that the magnetic field generated by coil 402 has a zero frequency. Thus, during the calibration mode, the target may not generate a reflected magnetic field. As shown, waveforms 504 and 506 (corresponding to signals V1 and V2) may also be DC waveforms.

During the calibration mode, error values (V1-V2) may be calculated, as described above. Because (V1-V2) were calculated during the calibration mode, the terms (V1-V2) may not include measurements of the reflected magnetic field, and may not include errors due to the position of the target.

During normal mode, as described above, the term (V1+ V2) may be calculated. Since (V1+ V2) is calculated during the normal mode, the term (V1+ V2) may include the measured value of the reflected magnetic field, and thus may include an error due to the target position.

In an embodiment, the magnetic field sensor 400 may be operated alternately between a calibration mode and a normal mode. In other embodiments, because the measurements made during the calibration mode are not dependent on the reflected field, the magnetic field sensor 400 may be operated less frequently in the calibration mode than in the normal mode. In some embodiments, the calibration mode may be performed only once during startup, and the terms (V1-V2) may be stored and reused during calculation of the system error. In other words:

[V1-V2]_T1＝[V1-V2]_T2(10)

where T1 corresponds to the normal mode and T2 corresponds to the calibration mode. Using equations 5 and 10, we can derive:

the terms off and G' are both independent of r (x), and thus independent of the bit due to the targetThe resulting error is taken into account. Thus, the target position P can be calculated_NWithout including non-linear errors due to the target position.

Referring now to fig. 6, a plot 600 includes a waveform 602 representing the detection of the reflected magnetic field relative to the frequency of the signal drive coil 402. The horizontal axis represents frequency, and the vertical axis represents milligauss of the reflected magnetic field detected by the magnetic field sensing element. The frequency may be chosen to be low enough so that the reflected field detected during the calibration mode is negligible. In the example shown, a frequency of 0.0001MHz or lower may result in a zero reflected magnetic field, as shown by point 606. In an embodiment, if the resulting reflected magnetic field is negligible or within system tolerances, a higher frequency may be used to measure the error of the system.

Referring to fig. 7, a graph 800 shows timing between a calibration mode and a normal mode, where different frequencies are used to drive the coil 402 during the normal mode. If the coil 402 is driven at a single frequency, the magnetic field sensor may radiate emissions at that frequency. In some cases, changing the frequency during the normal mode drives the coil 402 may reduce or change the frequency of the radiation emission of the device.

In fig. 7, waveform 802 indicates a normal mode or a calibration mode, and waveform 804 represents frequency drive coil 402. During the first calibration mode 806, the frequency 804 may be switched between f1, f3, f4, f5, f6, and so on. As described above, during the calibration mode 808, the coil 402 may be driven by a DC signal. When the magnetic field sensor enters the normal operation mode 810 again, the frequency may be switched between f4, f3, f7, f1, etc. In other embodiments, each calibration mode may drive coil 402 at a single frequency, but the frequency may vary with each calibration mode. In addition, fig. 8 shows a specific order of changing the frequency. However, one skilled in the art will recognize that any order or pattern of changing frequencies may be used.

Having described preferred embodiments for illustrating the various concepts, structures and techniques of the subject matter of this patent, it will now become apparent to those of ordinary skill in the art that other embodiments incorporating these concepts, structures and techniques may be used. Accordingly, the scope of patented should not be limited to the described embodiments, but should be defined only by the spirit and scope of the appended claims. All references cited herein are incorporated by reference in their entirety.