Method for measuring coating thickness in coating process and coating equipment
阅读说明:本技术 在镀层过程中测量镀层厚度的方法及镀层设备 (Method for measuring coating thickness in coating process and coating equipment ) 是由 谷新 王亮 于 2018-07-06 设计创作,主要内容包括:本申请公开了一种在镀层过程中测量镀层厚度的方法及镀层设备,该镀层设备包括:第一称重装置,用于测量待作业的产品的重量;镀层装置,用于加工待作业的产品,以在待作业的产品上形成镀层;第二称重装置,用于测量作业后的产品的重量;数据处理装置,与第一称重装置、第二称重装置连接,用于通过待作业的产品的重量、作业后的产品的重量、镀层的总覆盖面积,计算出镀层的厚度,通过该镀层设备,能够在镀层过程中自动地监控镀层的厚度。(The application discloses a method for measuring the thickness of a coating in the coating process and coating equipment, wherein the coating equipment comprises the following components: the first weighing device is used for measuring the weight of a product to be operated; the coating device is used for processing the product to be operated so as to form a coating on the product to be operated; the second weighing device is used for measuring the weight of the operated product; and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating, and the thickness of the coating can be automatically monitored in the coating process through the coating equipment.)
1. A coating apparatus, characterized in that the coating apparatus comprises:
the first weighing device is used for measuring the weight of a product to be operated;
the coating device is used for processing the product to be operated so as to form a coating on the product to be operated;
the second weighing device is used for measuring the weight of the operated product;
and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
2. The coating apparatus according to claim 1,
the data processing device calculates the thickness of the coating by using the following formula:
wherein H is the thickness of the plating layer, M2Is the weight of the product after the operation, M1And p is the weight of the product to be operated, the density of the coating material is rho, and S is the total coverage area of the coating.
3. The coating apparatus according to claim 1,
the plating device is an electroplating device.
4. The plating apparatus as recited in claim 3,
the plating apparatus includes: a feeding part, a processing part and a discharging part;
the feeding part feeds the product to be operated into the processing part for processing, so that a coating is formed on the product to be operated, and then the operated product is fed into the discharging part from the processing part.
5. The coating apparatus according to claim 4,
the electroplating device is a vertical line electroplating device;
the weighing devices all include: the clamp type electronic balance of the first weighing device is positioned between the feeding part and the processing part, and the clamp type electronic balance of the second weighing device is positioned between the processing part and the discharging part;
when the product to be operated is transmitted from the feeding part to the processing part, the clamp type electronic balance of the first weighing device clamps one end of the product to be operated so as to measure the weight of the product to be operated, and when the product after operation is transmitted from the processing part to the discharging part, the clamp type electronic balance of the second weighing device clamps one end of the product after operation so as to measure the weight of the product after operation.
6. The coating apparatus according to claim 4,
the electroplating device is a horizontal line electroplating device;
the material loading portion the unloading portion all includes: sensor and transmission gyro wheel, first weighing device is located the below of the transmission gyro wheel of material loading portion, second weighing device is located the below of the transmission gyro wheel of unloading portion, weighing device all includes: the electronic balance comprises a platform type electronic balance and a lifting connecting rod arranged on the platform type electronic balance;
when the sensors in the feeding part/the discharging part detect the product, the lifting connecting rod in the first weighing device/the second weighing device rises and penetrates through the transmission roller to support the product, then the platform type electronic balance in the first weighing device/the second weighing device measures the weight of the product, and after the measurement is finished, the lifting connecting rod in the first weighing device/the second weighing device contracts back to the lower part of the transmission roller, and then the transmission roller transmits the product.
7. The plating apparatus as recited in claim 3,
the product is a printed circuit board, and the material of the plating layer is copper.
8. The plating apparatus as recited in claim 1, further comprising:
and the alarm reminding device is connected with the data processing device and used for sending an alarm to remind when the thickness of the coating does not meet the preset requirement.
9. A method of measuring the thickness of a coating during the coating process, the method comprising:
measuring the weight of a product to be worked;
processing the product to be operated to form a coating on the product to be operated;
measuring the weight of the product after operation;
and calculating the thickness of the plating layer according to the weight of the product to be operated, the weight of the operated product and the total coverage area of the plating layer.
10. The method of claim 9, wherein said calculating the thickness of said coating comprises:
calculating the thickness of the coating by using the following formula:
wherein H is the thickness of the plating layer, M2Is the weight of the product after the operation, M1And p is the weight of the product to be operated, the density of the coating material is rho, and S is the total coverage area of the coating.
Technical Field
The application relates to the technical field of plating, in particular to a method for measuring the thickness of a plating layer in a plating process and plating equipment.
Background
The electroplating process is an electrochemical reaction, which takes the plated body metal as a cathode in a salt solution containing the preplating metal to deposit the cations of the preplating metal in the plating solution on the surface of a substrate. The packaging substrate is a printed circuit board which is mainly made of organic materials and applied to electronic packaging, and the current methods for measuring the coating on the surface of the packaging substrate mainly comprise two methods: the first is to measure the slice after the plating is completed, and the second is to use a contact copper thickness measuring device.
The inventor of the present application found in long-term research that both of the above-mentioned two measurement methods have certain defects, the first method has low efficiency and needs to destroy the package substrate, resulting in waste, and therefore each package substrate cannot be monitored, and the second method needs to perform manual measurement after the completion of electroplating, wherein, the sampling measurement cannot monitor each package substrate by one hundred percent, the full measurement wastes time and labor, has low efficiency, and cannot monitor the copper thickness in real time during the processing of the package substrate, resulting in a large amount of scrap.
Disclosure of Invention
In view of the above, the present application provides a method and a plating apparatus for measuring the thickness of a plated layer during a plating process, which can automatically monitor the thickness of the plated layer during the plating process.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided a plating apparatus comprising:
the first weighing device is used for measuring the weight of a product to be operated;
the coating device is used for processing the product to be operated so as to form a coating on the product to be operated;
the second weighing device is used for measuring the weight of the operated product;
and the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a method of measuring the thickness of a coating during the coating process, the method comprising:
measuring the weight of a product to be worked;
processing the product to be operated to form a coating on the product to be operated;
measuring the weight of the product after operation;
and calculating the thickness of the plating layer according to the weight of the product to be operated, the weight of the operated product and the total coverage area of the plating layer.
Has the advantages that: in contrast to the state of the art, the coating installation in the present application comprises: the first weighing device is used for measuring the weight of a product to be operated; the coating device is used for processing the product to be operated so as to form a coating on the product to be operated; the second weighing device is used for measuring the weight of the operated product; the data processing device is connected with the first weighing device and the second weighing device and used for calculating the thickness of the coating through the weight of a product to be operated, the weight of the operated product and the total coverage area of the coating.
Drawings
FIG. 1 is a schematic structural view of an embodiment of the coating apparatus of the present application;
FIG. 2 is a schematic structural view of another embodiment of the coating apparatus of the present application;
FIG. 3 is a schematic view of the structure of the
FIG. 4 is a schematic view of the coating apparatus of FIG. 2 in an application setting;
FIG. 5 is a schematic illustration of the coating installation shown in FIG. 2 in another application scenario;
FIG. 6 is a schematic flow chart of one embodiment of a method for measuring the thickness of a coating during the coating process of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a plating apparatus of the present application, the plating apparatus including: a
The
Specifically, the
For the same batch of products, which have the same coating, the total coverage area of the coating is constant, so that the total coverage areas of the coatings of different batches of products can be stored in the
From the above, the thickness of cladding material can be measured at the cladding material in-process automatically to this application, and can monitor the thickness of cladding material on every product to one hundred percent, need not to invest in a large amount of manpowers, reduce cost.
Specifically, in the present embodiment, the
wherein H is the thickness of the plating layer, M2For the weight of the worked product, M1Rho is the density of the coating material and S is the total coverage area of the coating, which is the weight of the product to be worked.
In a certain application scene, when the product is a printed circuit board and the material of a plating layer is copper, the rho is 8.9g/cm3When the total coverage area of the plating layer is obtained, M is measured by the
FIG. 2 is a schematic structural view of another embodiment of the coating apparatus of the present application. Referring to fig. 2, unlike the above embodiment, the plating apparatus of the present embodiment further includes: and an
The
Wherein, the
Alternatively, the
Fig. 3 is a schematic structural diagram of the
Fig. 4 is a schematic diagram of the coating installation shown in fig. 2 in an application scenario in which the
In this application scenario, the weighing devices each include a clamp-type electronic balance, specifically, the
Specifically, the first clamp electronic balance 11 includes a
When the
When the worked
Fig. 5 is a schematic structural diagram of the coating apparatus shown in fig. 2 in another application scenario, in which the
In this application scenario, the
The
Simultaneously, the weighing device all includes: platform formula electronic balance and the lifting link who sets up on platform formula electronic balance, specifically,
Specifically, when the
When the
Referring to fig. 6, fig. 6 is a schematic flow chart of an embodiment of a method for measuring a thickness of a plated layer in a plating process according to the present application, the method in the present application may adopt a plating apparatus in any one of the above embodiments, and detailed plating apparatuses may refer to the above embodiments, which are not described herein again, and the method in the present application is described in detail below with reference to fig. 1, and includes:
s101: the weight of the product to be worked is measured.
The
S102: and processing the product to be worked to form a coating on the product to be worked.
The
S103: the weight of the product after the operation was measured.
The
S104: and calculating the thickness of the coating through the weight of the product to be operated, the weight of the operated product and the total coverage area of the coating.
The
Specifically, step S104 specifically includes:
the thickness of the coating is calculated by the following formula:
wherein H is the thickness of the plating layer, M2For the weight of the worked product, M1Rho is the density of the coating material and S is the total coverage area of the coating, which is the weight of the product to be worked.
In a certain application scene, when the product is a printed circuit board and the material of a plating layer is copper, the rho is 8.9g/cm3。
In summary, different from the prior art, the coating apparatus in the present application measures the weight of the product to be processed by the first weighing device, measures the weight of the product after processing by the second weighing device, and calculates the thickness of the coating by the data processing device according to the weight of the product to be processed, the weight of the product after processing, and the total coverage area of the coating, so that the thickness of the coating can be automatically measured in the coating process, and the thickness of the coating on each product can be monitored without a large amount of manpower input, thereby reducing the cost.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.