阅读说明：本技术 一种有源频率选择表面结构 (Active frequency selective surface structure ) 是由 张岭 陈志勇 于 2019-10-22 设计创作，主要内容包括：本发明提供了一种有源频率选择表面结构,通过将一个可重构有源共振带通结构和一个非共振带通结构的组合实现了在PIN管通电时某一透波频段透波和PIN管断电时全频屏蔽两种状态间的有源可控。此时在透波状态下,该复合结构等效为两个带通滤波器的叠加,从而实现通带内透波；而在屏蔽状态下,该复合结构等效为一个带通滤波器和一个带阻滤波器的叠加,从而实现全频带内的屏蔽性能。(The invention provides an active frequency selection surface structure, which realizes active controllability between two states of wave transmission in a certain wave transmission frequency band when a PIN (personal identification number) tube is electrified and full frequency shielding when the PIN tube is powered off by combining a reconfigurable active resonance band-pass structure and a non-resonance band-pass structure. At the moment, in a wave-transparent state, the composite structure is equivalent to the superposition of two band-pass filters, so that wave-transparent in a pass band is realized; and under the shielding state, the composite structure is equivalent to the superposition of a band-pass filter and a band-stop filter, thereby realizing the shielding performance in the full frequency band.)

1. An active frequency selective surface structure, comprising:

the passive resonance band-pass structure is formed by compounding and overlapping a plurality of passive resonance band-pass structures and at least one reconfigurable active resonance band-pass structure;

the reconfigurable active resonance band-pass structure is positioned among the plurality of passive resonance band-pass structures, and one end of the non-resonance band-pass structure is compositely overlapped with one of the plurality of passive resonance band-pass structures; gaps are formed between the reconfigurable active resonance band-pass structure and the plurality of passive resonance band-pass structures, and no gap is formed between the non-resonance band-pass structure and the passive resonance band-pass structures.

2. The active frequency selective surface structure of claim 1, wherein the non-resonant bandpass structure comprises: the plurality of first equivalent capacitor layers, the plurality of second equivalent capacitor layers and the plurality of equivalent inductor layers are compounded and overlapped, and gaps are formed between every two adjacent layers; the plurality of first equivalent capacitor layers are distributed at two ends of the non-resonance band-pass structure, the plurality of second equivalent capacitor layers and the plurality of equivalent inductance layers are distributed in a staggered mode, and the first equivalent capacitor layers are adjacent to the equivalent inductance layers.

3. The active frequency selective surface structure of claim 2, wherein the first equivalent capacitive layer at one end of the non-resonant bandpass structure is free of voids with a passive resonant bandpass structure compositely overlapped therewith.

4. The active frequency selective surface structure of claim 2, wherein the first equivalent capacitance layer of a single layer comprises a dielectric substrate and metamaterial microstructures attached to the dielectric substrate.

5. The active frequency selective surface structure of claim 4, wherein the second equivalent capacitance layer of a single layer comprises a dielectric substrate and metamaterial microstructures attached to the dielectric substrate.

6. The active frequency selective surface structure of claim 5, wherein the first equivalent capacitance layer of a single layer comprises a dielectric substrate and metamaterial microstructures attached to the dielectric substrate.

7. The active frequency selective surface structure of claim 6, wherein the gap between the single layer dielectric substrates is between 1 mm and 2 mm.

Technical Field

The invention belongs to the field of microwave metamaterials, and relates to an active frequency selective surface structure.

Background

Gigahertz bands (GHz) are widely used in the radar field. Airborne or missile-borne radars are usually in an inoperative state during a relatively long flat flight time, and the radar is started only when the target is approached, while the aircraft is most easily intercepted and tracked by enemy radars during the flat flight time. By utilizing the characteristic, the electrically-controllable stealth active intelligent antenna housing is adopted, so that the radar can be ensured to be in a stealth state in a level flight stage and be in a wave-transmitting state in a tail system stage. Therefore, the active controllable mechanism of the electrically controllable cloaking active intelligent antenna housing is very important.

Generally, there are two types of active frequency selective surfaces available: the band-pass band-stop switching type active frequency selection surface can only meet the switching between a wave-transparent state and a shielding state in a certain specific frequency band, cannot realize the shielding of a full frequency band, and has certain limitation on the stealth performance; the active adjustable frequency selective surface and the wave-transparent window can realize dynamic adjustment in a certain frequency range, and can not realize shielding of full frequency bands.

In the existing active band-pass band-stop switching type frequency selection surface, the band stop can be realized only when the PIN tube is powered on, and the working state of wave transmission is realized when the PIN tube is powered off, and the working state is contradictory to the working mode of an actual radar.

In view of the above, there is a need for an active frequency selective surface structure to solve the above problems.

Disclosure of Invention

The invention aims to provide an active frequency selection surface structure to solve the problem that the working state of a PIN tube in the prior art is inconsistent with the working mode of an actual radar.

The invention provides an active frequency selective surface structure, comprising:

the passive resonance band-pass structure is formed by compounding and overlapping a plurality of passive resonance band-pass structures and at least one reconfigurable active resonance band-pass structure;

the reconfigurable active resonance band-pass structure is positioned among the plurality of passive resonance band-pass structures, and one end of the non-resonance band-pass structure is compositely overlapped with one of the plurality of passive resonance band-pass structures; gaps are formed between the reconfigurable active resonance band-pass structure and the plurality of passive resonance band-pass structures, and no gap is formed between the non-resonance band-pass structure and the passive resonance band-pass structures.

Preferably, in the above active frequency selective surface structure, the non-resonant bandpass structure includes: the plurality of first equivalent capacitor layers, the plurality of second equivalent capacitor layers and the plurality of equivalent inductor layers are compounded and overlapped, and gaps are formed between every two adjacent layers; the plurality of first equivalent capacitor layers are distributed at two ends of the non-resonance band-pass structure, the plurality of second equivalent capacitor layers and the plurality of equivalent inductance layers are distributed in a staggered mode, and the first equivalent capacitor layers are adjacent to the equivalent inductance layers.

Preferably, in the above active frequency selective surface structure, there is no gap between the first equivalent capacitance layer at one end of the non-resonant bandpass structure and the passive resonant bandpass structure compositely overlapped therewith.

Preferably, in the active frequency selective surface structure, the first equivalent capacitance layer of a single layer includes a dielectric substrate and metamaterial microstructures attached to the dielectric substrate.

Preferably, in the active frequency selective surface structure, the second equivalent capacitor layer of a single layer includes a dielectric substrate and a metamaterial microstructure attached to the dielectric substrate.

Preferably, in the active frequency selective surface structure, the first equivalent capacitance layer of a single layer includes a dielectric substrate and metamaterial microstructures attached to the dielectric substrate.

Preferably, in the active frequency selective surface structure, the gap between the single-layer dielectric substrates is 1 mm to 2 mm.

According to the active frequency selection surface structure, the reconfigurable active resonance band-pass structure and the non-resonance band-pass structure are combined, so that active controllability between two states of wave transmission in a certain wave transmission frequency band when the PIN tube is electrified and full frequency shielding in the power failure of the PIN tube is realized. At the moment, in a wave-transparent state, the composite structure is equivalent to the superposition of two band-pass filters, so that wave-transparent in a pass band is realized; and under the shielding state, the composite structure is equivalent to the superposition of a band-pass filter and a band-stop filter, thereby realizing the shielding performance in the full frequency band.

And an active device is used for reconstructing a band-pass structure, so that the structure is actively adjustable between the band-pass structure and the broadband band-pass structure, and the band-pass structure is compounded. The active adjustability of full frequency shielding when realizing that broadband band-pass and PIN pipe outage when circular telegram of PIN pipe is adjustable.

Drawings

FIG. 1 is a schematic side view of an active frequency selective surface structure according to one embodiment of the present disclosure;

FIG. 2 is a front view of a reconfigurable active resonant bandpass structure in one embodiment of the present disclosure;

FIG. 3 is a front view of a passive resonant bandpass structure in one embodiment of the present description;

FIG. 4 is a front view of a first equivalent capacitance layer according to an embodiment of the present disclosure;

FIG. 5 is a front view of a second equivalent capacitance layer in one embodiment of the present disclosure;

FIG. 6 is a front view of an equivalent inductor layer in an embodiment of the present disclosure;

fig. 7 is a transmission curve of the reconfigurable active resonance band-pass structure when the PIN tube is powered on in one embodiment of the present disclosure;

fig. 8 is a simulation diagram of transmission curves of the reconfigurable active resonance band-pass structure at different incidence angles when the PIN tube is conducted in the above embodiment;

fig. 9 is a transmission curve of the reconfigurable active resonance band-pass structure when the PIN is powered off in one embodiment of the present disclosure;

fig. 10 is a simulation diagram of transmission curves of the reconfigurable active resonance band-pass structure at different incidence angles when the PIN tube is disconnected in the above embodiment;

FIG. 11 is a schematic diagram of the operation of a non-resonant bandpass structure in one embodiment of the present disclosure;

FIG. 12 is a simulation diagram of transmission curves of the non-resonant bandpass structure according to different incident angles of electromagnetic waves in the above embodiment;

fig. 13 is a schematic view of the working principle of the active frequency selective surface structure in the above embodiment in a wave-transparent state;

fig. 14 is a simulation diagram of the wave-transmitting performance of the active frequency selective surface structure in fig. 13 in the power-on state at different incident angles of electromagnetic waves;

fig. 15 is a schematic diagram illustrating the working principle of the active frequency selective surface structure in the shielding state in the above embodiment;

FIG. 16 is a simulation graph of the shielding performance of the active frequency selective surface structure of FIG. 15 under different electromagnetic wave incident angles in the power-off state;

fig. 17 is a schematic structural diagram of an arrangement of reconfigurable active resonance bandpass structures in a 3 x 3 array and a loading manner of PIN tubes in an embodiment of the present disclosure;

FIG. 18 is a schematic layout of a passive resonant bandpass structure in an embodiment corresponding to FIG. 17;

FIG. 19 is a schematic diagram illustrating the arrangement of the first equivalent capacitor layer in the embodiment corresponding to FIG. 17;

fig. 20 is a schematic layout diagram of the equivalent inductor layer in the embodiment corresponding to fig. 17.

Detailed Description

The present invention will be described in further detail with reference to specific embodiments.

The embodiment of the invention provides an active frequency selective surface structure, which comprises: the passive resonance band-pass structure is formed by compounding and overlapping a plurality of passive resonance band-pass structures and at least one reconfigurable active resonance band-pass structure;

as shown in fig. 1, the reconfigurable active resonant bandpass structure 1 is located between the plurality of passive resonant bandpass structures 2, and one end of the non-resonant bandpass structure 3 is compositely overlapped with one of the plurality of passive resonant bandpass structures 2; gaps are arranged between the reconfigurable active resonance band-pass structure 1 and the plurality of passive resonance band-pass structures 2, and no gap is arranged between the non-resonance band-pass structure 3 and the passive resonance band-pass structures 2.

With continued reference to fig. 1, fig. 1 is a schematic side view of an active frequency selective surface structure in an embodiment of the present disclosure, and in this embodiment, only one reconfigurable active resonant bandpass structure 1 is taken as an example.

Wherein, the reconfigurable active resonance band-pass structure 1 is shown in a front view as fig. 2, and the passive resonance band-pass structure 2 is shown in a front view as fig. 3.

Specifically, as shown in fig. 1, in one embodiment of the present specification, the non-resonant bandpass structure 3 includes: the first equivalent capacitor layers 31, the second equivalent capacitor layers 32 and the equivalent inductor layers 33 are compounded and overlapped, and gaps are formed between every two adjacent layers; the first equivalent capacitor layers 31 are distributed at two ends of the non-resonant band-pass structure, the second equivalent capacitor layers 32 are distributed in a staggered manner with the equivalent inductor layers 33, and the first equivalent capacitor layers 31 are adjacent to the equivalent inductor layers 33. Specifically, there is no gap between the first equivalent capacitance layer 31 at one end of the non-resonant bandpass structure 3 and the passive resonant bandpass structure 2 compositely overlapped therewith.

The first equivalent capacitance layer 31 is shown in fig. 4 in a front view, the second equivalent capacitance layer 32 is shown in fig. 5 in a front view, and the equivalent inductance layer 33 is shown in fig. 6 in a front view.

Further, in the non-resonant bandpass structure 3, the single-layer first equivalent capacitance layer 31 includes a dielectric substrate and metamaterial microstructures attached to the dielectric substrate, the single-layer second equivalent capacitance layer 32 includes a dielectric substrate and metamaterial microstructures attached to the dielectric substrate, and the single-layer first equivalent capacitance layer 31 includes a dielectric substrate and metamaterial microstructures attached to the dielectric substrate. The gap between the single-layer medium base materials is 1 mm-2 mm.

Specifically, in one embodiment of the present specification, the thickness of the single-layer dielectric substrate in the non-resonant bandpass structure 3 is about 0.52 mm, the thickness of the single-layer metamaterial microstructure is about 0.018mm, and the gap between the dielectric layers in the non-resonant structure is about 1.12 mm. In addition, in other embodiments of the present disclosure, the air layer of 1.12 mm in the above embodiments may be foam with a dielectric constant of 1.1.

That is, in the above embodiment, the thickness of the dielectric substrate of the single layer of the first equivalent capacitance layer 31 is about 0.52 mm, and the thickness of the metamaterial structure of the single layer of the first equivalent capacitance layer 31 is about 0.018 mm. Similarly, the dielectric substrate of the single-layer second equivalent capacitor layer 32 has a thickness of about 0.52 mm, and the metamaterial structure of the single-layer second equivalent capacitor layer 32 has a thickness of about 0.018 mm. The dielectric substrate of the equivalent inductance layer 33 with a single layer has a thickness of about 0.52 mm, and the metamaterial structure of the equivalent inductance layer 33 with a single layer has a thickness of about 0.018 mm.

In other embodiments in the present description, the thickness of the medium, the dielectric constant, and the air gap between the media can be flexibly adjusted according to different required frequency bands and different passband characteristics.

Further, in an embodiment of the present disclosure, the dielectric substrate of the first equivalent capacitance layer 31, the second equivalent capacitance layer 32 and the equivalent inductance layer 33 is an epoxy resin material with a relative dielectric constant of 2.3.

In another embodiment of the present invention, the dielectric substrate of the reconfigurable active resonance bandpass structure 1 is a ceramic material with a relative dielectric constant of 9.2, and the metamaterial microstructure is a copper layer with a thickness of 0.018 mm.

The metal metamaterial microstructure loading medium substrate can better protect the microstructure, avoid corrosion of the microstructure under severe external conditions and ensure the dielectric property of the radome; and better space impedance matching can be provided, and the passband bandwidth and the incident wave angle stability of the structure are improved.

A reconfigurable active resonance band-pass structure 1 is adopted in the central layer of a multilayer coupling passive resonance band-pass structure 2, a switch type diode is loaded at an opening of the outer ring of the reconfigurable active resonance band-pass structure 1, the on-off of the diode is controlled by adjusting the voltage values at the two ends of the diode, and the reconfiguration of the band-pass structure and the reconfiguration of coupling between band-pass structure layers are realized by utilizing the on-off of the diode, so that the change of the electrical property of the structure is realized.

The specific working principle is as follows: referring to fig. 7 to 15, in particular, fig. 7 is a transmission curve of the reconfigurable active resonance band-pass structure 1 when the PIN tube is powered on in an embodiment of the present disclosure, and fig. 8 is a simulation diagram of transmission curves of the reconfigurable active resonance band-pass structure 1 at different incident angles when the PIN tube is powered on in the above embodiment; fig. 9 is a transmission curve of the reconfigurable active resonant band-pass structure 1 when the PIN tube is powered off in an embodiment of the present disclosure, and fig. 10 is a simulation diagram of transmission curves of the reconfigurable active resonant band-pass structure 1 at different incident angles when the PIN tube is powered off in the above embodiment. In the drawings, f1, f2 and f3 all represent frequencies, S12 represents transmission characteristics of electromagnetic waves in space, fig. 11 is a schematic diagram of an operating principle of the non-resonant bandpass structure 3 in an embodiment of the present disclosure, and fig. 12 is a simulation diagram of transmission curves of the non-resonant bandpass structure 3 in the embodiment under different incident angles of the electromagnetic waves; fig. 13 is a schematic view of the working principle of the active frequency selective surface structure in the above embodiment in a wave-transparent state, and fig. 14 is a simulation diagram of the wave-transparent performance of the active frequency selective surface structure in fig. 13 in a power-on state at different electromagnetic wave incident angles; fig. 15 is a schematic diagram illustrating the working principle of the active frequency selective surface structure in the above embodiment in the shielding state, and fig. 16 is a simulation diagram illustrating the shielding performance of the active frequency selective surface structure in fig. 15 in the power-off state under different electromagnetic wave incident angles.

In fig. 8, a line 1 is a transmission curve of the reconfigurable active resonance band-pass structure when the PIN tube is turned on at an incident angle of 0 °, a line 2 is a transmission curve of the reconfigurable active resonance band-pass structure when the PIN tube is turned on at an incident angle of 30 °, and a line 3 is a transmission curve of the reconfigurable active resonance band-pass structure when the PIN tube is turned on at an incident angle of 60 °.

In fig. 10, a line 1 is a transmission curve of the reconfigurable active resonant band-pass structure when the PIN tube is disconnected and the incident angle is 0 °, a line 2 is a transmission curve of the reconfigurable active resonant band-pass structure when the PIN tube is disconnected and the incident angle is 30 °, and a line 3 is a transmission curve of the reconfigurable active resonant band-pass structure when the PIN tube is disconnected and the incident angle is 60 °.

In fig. 12, a line 1 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 0 °, a line 2 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 10 °, a line 3 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 20 °, a line 4 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 30 °, a line 5 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 40 °, a line 6 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 50 °, a line 7 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 60 °, and a line 8 is a simulation diagram of a transmission curve when an incident angle of an electromagnetic wave is 70 °.

In fig. 14, a line 1 is a simulation diagram of the wave transmission performance of the active frequency selective surface structure at an incident angle of electromagnetic waves in the energized state of 0 °, a line 2 is a simulation diagram of the wave transmission performance of the active frequency selective surface structure at an incident angle of electromagnetic waves in the energized state of 15 °, a line 3 is a simulation diagram of the wave transmission performance of the active frequency selective surface structure at an incident angle of electromagnetic waves in the energized state of 30 °, and a line 4 is a simulation diagram of the wave transmission performance of the active frequency selective surface structure at an incident angle of electromagnetic waves in the energized state of 45 °.

In fig. 16, a line 1 is a simulation diagram of the shielding performance of the active frequency selective surface structure at an electromagnetic wave incident angle of 0 ° in the power-off state, a line 2 is a simulation diagram of the shielding performance of the active frequency selective surface structure at an electromagnetic wave incident angle of 15 ° in the power-off state, a line 3 is a simulation diagram of the shielding performance of the active frequency selective surface structure at an electromagnetic wave incident angle of 30 ° in the power-off state, and a line 4 is a simulation diagram of the shielding performance of the active frequency selective surface structure at an electromagnetic wave incident angle of 45 ° in the power-off state.

In the simulation result, when the PIN tube is turned off, the reconfigurable active resonance bandpass structure 1 forms a broadband bandstop structure in a frequency band wider than f1(GHz) to f2(GHz), and when the PIN tube is turned on, the reconfigurable active resonance bandpass structure 1 becomes a structure of f1(GHz) to f2(GHz) bandpass.

Then, a non-resonant bandpass structure 3 is designed, which is required to form a desired passband at f1(GHz) to f2 (GHz). The structure can form a good passband in the incident angle range of f1(GHz) to f2(GHz) and 0 to 70 degrees.

Specifically, a reconfigurable active resonance band-pass structure 1 capable of realizing power-on band-pass and power-off shielding at f1(GHz) to f2(GHz) is designed, then a non-resonance band-pass structure 3 capable of realizing the f1(GHz) to f2(GHz) band-pass is compounded, wave transmission of f1(GHz) to f2(GHz) is further realized in the power-on state of the PIN tube, and the performance of 0(GHz) to f3(GHz) full-frequency shielding is further realized in the power-off state of the PIN tube.

That is to say, through the combination of a reconfigurable active resonance band-pass structure 1 and a non-resonance band-pass structure 3, active controllability between two states of wave transmission in a certain wave transmission frequency band when the PIN tube is electrified and full frequency shielding when the PIN tube is powered off is realized. At the moment, in a wave-transparent state, the composite structure is equivalent to the superposition of two band-pass filters, so that wave-transparent in a pass band is realized; and under the shielding state, the composite structure is equivalent to the superposition of a band-pass filter and a band-stop filter, thereby realizing the shielding performance in the full frequency band.

The active frequency selective surface structure is only one unit, and in other embodiments of the present invention, a plurality of units may be arranged to remove the edge effect of the metamaterial structure, so as to achieve a better effect. In an embodiment of the present disclosure, the above effects may be achieved by arranging 3 × 3 units, as shown in fig. 17, where fig. 17 is a schematic structural diagram of an arrangement of the reconfigurable active resonance bandpass structures 1 in the 3 × 3 array and a loading manner of the PIN tube in an embodiment of the present disclosure, and the loading manner of the PIN tube is shown as a circle drawn by a dotted line in fig. 17. The arrangement of the passive resonance bandpass structures 2 in the 3 x 3 array is shown in fig. 18, the arrangement of the first equivalent capacitor layer 31 is shown in fig. 19, and the arrangement of the equivalent inductor layer 33 is shown in fig. 20.

Furthermore, in one embodiment of the present invention, 10 × 10 cells can be used to achieve the desired effect.

In the active frequency selective surface structure provided by the embodiment of the invention, the combination of the reconfigurable active resonance band-pass structure 1 and the non-resonance band-pass structure 3 realizes active controllability between a wave-transmitting frequency band and a full-frequency shielding state when the PIN tube is powered on and a wave-transmitting frequency band is realized. At the moment, in a wave-transparent state, the composite structure is equivalent to the superposition of two band-pass filters, so that wave-transparent in a pass band is realized; and under the shielding state, the composite structure is equivalent to the superposition of a band-pass filter and a band-stop filter, thereby realizing the shielding performance in the full frequency band.

And an active device is used for reconstructing a band-pass structure, so that the structure is actively adjustable between the band-pass structure and the broadband band-pass structure, and the band-pass structure is compounded. The active adjustability of full frequency shielding when realizing that broadband band-pass and PIN pipe outage when circular telegram of PIN pipe is adjustable.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.