阅读说明：本技术 用于数据中心的浸入式冷却系统 (Immersion cooling system for data center ) 是由 高天翼 于 2019-06-17 设计创作，主要内容包括：本公开的实施方式提供用于浸入式冷却的系统设计。该设计采用单冷却回路设计。外部冷却单元,例如间接蒸发冷却(IDEC)系统,用于将热量从冷却回路传送到大气。冷却回路中的流体由集中泵或泵和局部泵驱动。流体被供应到浸入式冷却架或装置。该设计通过添加热回收系统引入了冷却回路基础设施的若干革新。在不同的运行条件下,热回收系统和外部冷却单元都可以连接到主浸入式冷却回路或从主浸入式冷却回路旁通。至少一些优点包括简化的基础设施、整体系统解决方案、高可靠性、快速部署、可行的系统运行调整、成本降低和高运行效率。(Embodiments of the present disclosure provide a system design for immersion cooling. The design uses a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is used to transfer heat from the cooling circuit to the atmosphere. The fluid in the cooling circuit is driven by a centralized pump or a pump and a local pump. The fluid is supplied to an immersion cooling rack or device. This design introduces several innovations in the cooling loop infrastructure by adding heat recovery systems. Under different operating conditions, both the heat recovery system and the external cooling unit may be connected to or bypassed from the main immersion cooling circuit. At least some of the advantages include simplified infrastructure, overall system solutions, high reliability, rapid deployment, feasible system operational tuning, cost reduction, and high operational efficiency.)

1. A data center immersion cooling system, comprising:

a cooling unit having a heat exchanger including a primary loop for circulating a first heat exchange material and a secondary loop for circulating an internal cooling fluid to exchange heat;

a dip tank filled with the internal cooling liquid, the dip tank containing one or more server blades submerged in the internal cooling liquid, wherein the internal cooling liquid is a thermally conductive dielectric liquid to extract heat generated from the server blades; and

a pair of liquid supply lines and liquid return lines coupled between the cooling unit and the immersion tank to circulate the internal cooling liquid between the cooling unit and the immersion tank to form the secondary loop without using a coolant distribution unit between the cooling unit and the immersion tank, wherein the liquid supply lines are to receive the cooling liquid from the heat exchanger and supply the cooling liquid to the immersion tank, and wherein the liquid return lines are to receive the cooling liquid carrying heat exchanged from the immersion tank and return the cooling liquid to the heat exchanger.

2. The data center immersion cooling system of claim 1, further comprising a liquid pump disposed on the liquid supply line to pump the cooling liquid from the heat exchanger and supply the cooling liquid to the immersion tank.

3. The data center immersion cooling system of claim 1, further comprising a liquid pump disposed on the liquid return line to pump the cooling liquid from the immersion tank and return the cooling liquid to the heat exchanger.

4. The data center immersion cooling system of claim 3, further comprising a heat recovery unit disposed on the liquid return line between the heat exchanger of the cooling unit and the immersion tank, wherein the heat recovery unit is configured to recover heat exchanged from the immersion tank and distribute the heat for other heating purposes.

5. The data center immersion cooling system of claim 4, wherein the heat recovery unit includes a heat exchange channel to extract and exchange at least a portion of heat carried by the cooling liquid flowing within the liquid return line using a second heat exchange material.

6. The data center immersion cooling system of claim 5, wherein heat extracted from the liquid return line may be used to heat air or water in a building.

7. The data center immersion cooling system of claim 4, further comprising a first flow control device disposed on the liquid return line between the heat recovery unit and the cooling unit, wherein the first flow control device, when activated, is configured to divert at least a portion of the cooling liquid from the liquid return line to the liquid supply line without passing through the heat exchanger of the cooling unit.

8. The data center immersion cooling system of claim 7, wherein the first flow control device is activated when a temperature of the cooling fluid passing through the heat recovery unit is below a predetermined threshold.

9. The data center immersion cooling system of claim 7, further comprising a second liquid pump disposed on the liquid supply line to pump and supply the cooling liquid to the immersion tank.

10. The data center immersion cooling system of claim 7, further comprising a second flow control device disposed on the liquid return line, wherein the second flow control device, when activated, is configured to divert at least a portion of the cooling liquid from the liquid return line to the heat recovery unit.

11. The data center immersion cooling system of claim 1, wherein the immersion tank is one of a plurality of immersion tanks, each of the immersion tanks coupled to the heat exchanger of the cooling unit by a respective pair of liquid supply and return lines.

12. The data center immersion cooling system of claim 11, further comprising a plurality of local liquid pumps, each of the local liquid pumps disposed on a liquid return line of one of the immersion tanks to pump and extract the cooling liquid from the immersion tanks back to the heat exchanger of the cooling unit.

13. The data center immersion cooling system of claim 1, wherein the heat exchanger is an air-to-liquid (air/liquid) heat exchanger or a liquid-to-liquid (liquid/liquid) heat exchanger.

14. A data center immersion cooling system, comprising:

a cooling unit having a heat exchanger including a primary loop for circulating a first heat exchange material and a secondary loop for circulating an internal cooling fluid to exchange heat; and

a datacenter chamber comprising:

an indoor liquid supply line for receiving the internal cooling liquid from the heat exchanger,

an indoor liquid return line for returning the internal cooling liquid carrying the exchanged heat to the heat exchanger, and

a plurality of data center units coupled to the indoor liquid supply line and the indoor liquid return line, wherein each data center unit comprises:

one or more immersion tanks each containing one or more server blades immersed in the internal cooling liquid, and

one or more local liquid pumps to pump the cooling liquid from the immersion tank to the indoor liquid return line, an

A heat reuse unit coupled to the indoor liquid return line to extract heat from the cooling liquid flowing within the indoor liquid return line to reuse the heat for other purposes.

15. The data center immersion cooling system of claim 14, wherein the data center room further comprises an indoor liquid pump disposed on an indoor liquid supply line to pump the cooling liquid to supply to the data center unit.

16. The data center immersion cooling system of claim 15, wherein each of the data center units further comprises:

a unit supply manifold coupled to the indoor liquid supply line to receive the cooling liquid and supply the cooling liquid to the immersion tank; and

a unit return manifold coupled to the indoor liquid return line to receive and return the cooling liquid from the immersion tank.

17. The data center immersion cooling system of claim 16, wherein each of the local liquid pumps is coupled between a respective immersion tank and the unit return manifold.

18. The data center immersion cooling system of claim 15, wherein the data center room further comprises a first Flow Control Device (FCD) disposed on the room liquid return line, wherein the first FCD, when activated, is configured to transfer at least a portion of the cooling liquid from the liquid return line to the heat reuse unit.

19. The data center immersion cooling system of claim 18, wherein the data center room further comprises a second FCD coupled between the thermal reuse unit and the indoor liquid supply line, wherein the second FCD, when activated, is configured to divert at least a portion of the cooling liquid received from the thermal reuse unit to the indoor liquid supply line to bypass the heat exchanger of the cooling unit.

20. The data center immersion cooling system of claim 19, wherein the second FCD is activated when a temperature of the cooling fluid output from the thermal reuse unit is below a predetermined threshold.

Technical Field

Embodiments of the present disclosure relate generally to data centers. More particularly, embodiments of the present disclosure relate to intrusive cooling for data centers.

Background

Heat dissipation is a prominent factor in computer system and data center design. The number of high-performance electronic components, such as high-performance processors packaged within servers, is steadily increasing, thereby increasing the amount of heat generated and dissipated during the day-to-day operation of the servers. If the environment in which the servers are allowed to operate increases in temperature over time, the reliability of the servers used within the data center will decrease. Maintaining an appropriate thermal environment is critical to the proper operation of these servers in a data center, as well as the performance and useful life of the servers. There is a need for more efficient and effective heat dissipation solutions, particularly in the case of cooling these high performance servers.

Immersion cooling techniques have recently attracted considerable attention. Much effort has been focused on fluid selection, Information Technology (IT) side design, material compatibility, testing and verification, etc. Most solutions utilize existing cooling infrastructure (chilled/cold water) or systems. In some solutions, a Coolant Distribution Unit (CDU) is used to form an external cooling circuit and an internal submerged cooling fluid circuit. The external cooling loop may be adapted to any type of existing data center cooling infrastructure. These solutions may not fully exploit the advantages of immersion cooling.

Disclosure of Invention

According to one aspect of the present application, a data center immersion cooling system is disclosed. The data center immersion cooling system includes: a cooling unit having a heat exchanger including a primary loop for circulating a first heat exchange material and a secondary loop for circulating an internal cooling fluid to exchange heat; a dip tank filled with the internal cooling liquid, the dip tank containing one or more server blades submerged in the internal cooling liquid, wherein the internal cooling liquid is a thermally conductive dielectric liquid to extract heat generated from the server blades; and a pair of liquid supply lines and liquid return lines coupled between the cooling unit and the immersion tank to circulate the internal cooling liquid between the cooling unit and the immersion tank to form the secondary circuit without using a coolant distribution unit between the cooling unit and the immersion tank, wherein the liquid supply lines are configured to receive the cooling liquid from the heat exchanger and supply the cooling liquid to the immersion tank, and wherein the liquid return lines are configured to receive the cooling liquid carrying heat exchanged from the immersion tank and return the cooling liquid to the heat exchanger.

In accordance with another aspect of the present application, a data center immersion cooling system is disclosed. The data center immersion cooling system includes: a cooling unit having a heat exchanger including a primary loop for circulating a first heat exchange material and a secondary loop for circulating an internal cooling fluid to exchange heat; and a data center room. The data center room includes: an indoor liquid supply line for receiving the internal cooling liquid from the heat exchanger, an indoor liquid return line for returning the internal cooling liquid carrying the exchanged heat to the heat exchanger, a plurality of data center units, wherein the data center units are coupled to the indoor liquid supply line and the indoor liquid return line, and a thermal reuse unit coupled to the indoor liquid return line to extract heat from the cooling liquid flowing within the indoor liquid return line for reuse of the heat for other purposes. Wherein each data center unit comprises: one or more immersion tanks, each of the immersion tanks containing one or more server blades immersed in the internal cooling liquid, and one or more local liquid pumps to pump the cooling liquid from the immersion tank to the indoor liquid return line.

Drawings

Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.

FIG. 1 is a block diagram illustrating an example of a data center system with immersion cooling, according to one embodiment.

FIG. 2 is a block diagram illustrating an example of a data center system with immersion cooling in accordance with another embodiment.

FIG. 3 is a block diagram illustrating an example of a data center system with immersion cooling in accordance with another embodiment.

FIG. 4 is a block diagram illustrating an example of a data center system with immersion cooling in accordance with another embodiment.

FIG. 5 is a block diagram illustrating an example of a data center system with immersion cooling in accordance with another embodiment.

Detailed Description

Various embodiments and aspects of the disclosure will be described with reference to details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of the invention and are not to be construed as limiting the disclosure. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or common details are not described in order to provide a concise discussion of embodiments of the present inventions.

Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

Embodiments of the present invention propose an overall system design/solution for IT and data center immersion cooling. Embodiments cover the entire cooling infrastructure design from the ambient environment to IT. Immersion cooling is quite different from conventional air cooling solutions. Therefore, the infrastructure should be innovative to match its respective thermal and mechanical properties. In addition, the cooling infrastructure should have high efficiency, high reliability, be quickly deployable, be easily controlled and maintained, and the like. Since most or all of the heat is extracted into the immersion cooling fluid circuit, there are more opportunities for heat recovery.

Embodiments of the present invention provide a system design for immersion cooling. The design uses a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is used to transfer heat from the cooling circuit to the atmosphere. The fluid in the cooling circuit is driven by a centralized pump or a pump and a local pump. The fluid is supplied to an immersion cooling rack or device. This design introduces several innovations in the cooling loop infrastructure by adding heat recovery systems. Under different operating conditions, both the heat recovery system and the external cooling unit may be connected to or bypassed from the main immersion cooling circuit. At least some of the advantages include simplified infrastructure, overall system solutions, high reliability, rapid deployment, feasible system operational tuning, cost reduction, and high operational efficiency.

According to one aspect of the invention, the infrastructure includes an external cooling unit for exchanging heat from the data center room and/or the data center building to the atmosphere. The external cooling unit is located outside the data center building. The immersion cooling circuit connects the external cooling unit to one or more internal immersion racks. The heat generated in the immersion bath is extracted into the immersion cooling fluid, which is then pumped back to the external cooling unit. There is only one heat transfer circuit between the external cooling unit and the immersion tank.

According to one embodiment, a data center immersion cooling system includes a cooling unit and an immersion tank filled with an internal cooling fluid. The cooling system includes a heat exchanger. The heat exchanger includes a primary loop for circulating a first heat exchange material (e.g., a coolant or cold air) and a secondary loop for circulating an internal coolant. The immersion tank contains one or more server blades (blades) immersed in the internal cooling fluid. Each server blade includes one or more IT components (e.g., processors, memory, storage devices). The internal cooling fluid is a thermally conductive dielectric fluid to extract heat generated from the server blades. The data center immersion cooling system also includes a pair of liquid supply lines and a liquid return line coupled between the cooling unit and the immersion tank to form a secondary loop without the use of a CDU between the external cooling unit and the immersion tank. The liquid supply line is configured to receive the cooling liquid from the cooling unit and distribute the cooling liquid to the immersion tank. The liquid return line is for receiving the cooling liquid carrying heat exchanged from the immersion tank and returning the cooling liquid to the heat exchanger.

In one embodiment, the liquid pump may be provided on the liquid supply line and/or the liquid return line. The data center immersion cooling system may also include a heat recovery unit coupled to the liquid return line between the heat exchanger of the cooling unit and the immersion tank. The heat recovery unit is configured to extract and recover heat from the cooling liquid flowing within the liquid return line for other heating purposes. The heat recovery unit comprises a unit, such as a heat exchanger, which exchanges heat from the immersion coolant flowing in the liquid return line using a second heat exchange material.

In one embodiment, the data center immersion cooling system further comprises a Flow Control Device (FCD) disposed on the liquid return line between the heat recovery unit and the cooling unit. The FCD, when activated, is configured to divert or reroute at least a portion of the cooling liquid from the liquid return line back to the liquid supply line without passing through the heat exchanger of the cooling unit. In another embodiment, another FCD is disposed on the liquid supply line, which when activated is configured to divert or reroute at least a portion of the immersion coolant from the liquid return line to the heat recovery unit.

According to another aspect of the present disclosure, the cooling system design further includes a heat recovery system. Since the immersion cooling system extracts the IT heat load to the fluid, the heat recovery system is designed on the return side of the immersion cooling circuit. The hot fluid first passes through a heat reuse unit before it is returned to the external cooling unit. In the present application, the heat reuse unit may be interchangeable with the heat recovery system. For example, the hot fluid may be used as a heating source for an office building water supply system or an office building air system. For an immersion cooling circuit, the heat recovery unit may be considered as an external cooling source. Thus, if the external cooling source is sufficient, which means that all heat is recovered, then the immersion cooling loop fluid supplied from the heat reuse unit may be returned directly to the immersion cooling loop supply, bypassing the external cooling source. A bypass loop may be used in the design to bypass the heat recovery system when the system does not meet the heat recovery system requirements or the heat recovery system is being serviced, or any other situation where the submerged cooling fluid does not need to pass through the heat reuse unit.

According to one embodiment, a data center immersion cooling system includes a cooling unit having a heat exchanger and a data center including one or more data center chambers. The heat exchanger includes a primary loop for circulating a first cooling material and a secondary loop for circulating an internal cooling fluid for heat exchange. The internal cooling fluid is a thermally conductive dielectric fluid. The data center room also includes a room liquid supply line and a room liquid return line. The indoor liquid supply line is for receiving the cooling liquid from the cooling unit and distributing the internal cooling liquid to the immersion tank. The indoor liquid return line is for receiving the internal cooling liquid carrying heat exchanged from the immersion tank and returning the cooling liquid to the cooling unit. Each chamber is coupled to an indoor liquid supply line and an indoor liquid return line.

Each data center unit includes one or more immersion tanks and one or more local liquid pumps corresponding to the immersion tanks. Each immersion tank contains one or more server blades immersed in an internal cooling liquid filled in the immersion tank. Each server blade includes one or more IT components (e.g., processors, memory, storage devices). A local pump associated with the immersion tank is configured to pump the cooling fluid from the immersion tank and deliver the cooling fluid back to the indoor fluid return line. The data center room also includes a heat reuse unit (also referred to as a heat recovery unit or system) coupled to the indoor liquid return line to extract heat from the cooling liquid flowing within the indoor liquid return line to reuse the extracted heat for other purposes (e.g., thermal cycling).

In one embodiment, each data center unit further includes a unit supply manifold (also referred to as a unit liquid supply line) and a unit return manifold (also referred to as a unit liquid return line) coupled to each immersion tank. The unit supply manifold is coupled to the indoor supply line to receive the cooling liquid and distribute the cooling liquid to the immersion tank. The unit return manifold is for receiving the cooling fluid carrying heat exchanged from the immersion tank and delivering the cooling fluid back to the indoor fluid return line. In one embodiment, each local pump is disposed between a respective immersion tank and the cell return manifold.

In one embodiment, the data center room further includes a first Flow Control Device (FCD) disposed on the liquid return line within the room. The first FCD, when activated, is configured to divert or reroute at least a portion of the cooling liquid from the liquid return line to the thermal reuse unit. In another embodiment, the data center room further comprises a second FCD device coupled between the thermal reuse unit and the indoor liquid supply line. The second FCD, when activated, is configured to divert or reroute at least a portion of the cooling liquid received from the thermal reuse unit to the indoor liquid supply line, bypassing the heat exchanger of the external cooling unit.

FIG. 1 is a block diagram illustrating a data center system according to one embodiment. Referring to FIG. 1, a data center immersion cooling system 100 is referred to as a data center system with immersion cooling. In one embodiment, the data center immersion cooling system 100 includes a data center or data center unit 101 coupled to an external cooling unit 102. The external cooling unit 102 may be an indirect evaporative cooling (IDEC) unit. The cooling unit 102 includes a heat exchanger 105, and the heat exchanger 105 may be a liquid-to-liquid heat exchanger or an air-to-liquid heat exchanger. Generally, heat exchanger 105 includes a primary loop 106 and a secondary loop 107. The main circuit 106 is used to circulate an external cooling material, such as external air or external liquid. The secondary loop 107 is used to circulate an internal cooling fluid in heat exchange relationship with the external cooling material of the primary loop 106.

In one embodiment, data center 101 includes a submersion tank 103 filled with an internal cooling fluid (i.e., submersion cooling fluid). Although one dip tank is shown here, more dip tanks may be included within the data center 101. The immersion tank 103 contains one or more server blades 104, and each server blade includes one or more IT components (e.g., processors, memory, storage devices). The server blades 104 are submerged in the internal cooling fluid. The internal coolant is a thermally conductive dielectric liquid designed to extract heat from the server blades. This cooling technique is called immersion cooling.

Server immersion cooling is a computer cooling practice by which computer components or servers are immersed in a thermally conductive dielectric liquid. Common dielectrics suitable for immersion cooling are typically oil-based. Server immersion cooling is likely to be a popular server cooling solution for green data centers because it allows servers to significantly reduce energy load regardless of their PUEs. Servers and other IT hardware cooled by immersion cooling do not require fans, and therefore the fans are removed.

Referring back to fig. 1, according to one embodiment, the data center 101 includes a liquid supply line 111 and a liquid return line 112, the liquid supply line 111 and the liquid return line 112 coupled to the secondary side of the heat exchanger 105 of the cooling system 102 to form a secondary loop. In addition, a liquid supply line 111 is coupled to an inlet port of the immersion tank 103, and a liquid return line 112 is coupled to an outlet port of the immersion tank 103. The liquid supply line 111 is configured to receive the cooling liquid from the heat exchanger 105 and distribute the cooling liquid to the immersion tank 103. The liquid return line 112 is configured to receive the cooling liquid carrying heat exchanged from the server blades 104 of the immersion tank 103 and return the cooling liquid to the heat exchanger 105 for heat exchange.

Additionally, a liquid pump 115 may be provided on the liquid return line 112 to pump and circulate the cooling liquid to flow within the secondary loop. Furthermore, multiple pumps may be designed into the system (either on the primary supply line 111 or on the primary return line 112 for redundancy purposes). It should be noted that if there are multiple immersion tanks within the data center 101, there will be multiple pairs of liquid supply lines and liquid return lines to couple the immersion tanks with the heat exchangers 105 of the cooling system 102. Unlike conventional cooling systems, the secondary loop 107 via the liquid supply line 111, the immersion tank 103 and the liquid return line 112 is a single heat transfer loop without the use of a CDU therebetween. Typically, the CDU also includes a heat exchanger having a primary loop and a secondary loop therein that will form multiple loops between the cooling system 102 and the immersion tank 103. It should also be noted that the liquid pump 115 may be disposed on the liquid supply line 111 or, alternatively, there may be a plurality of liquid pumps, one disposed on the liquid supply line 111 and another disposed on the liquid return line 112.

Fig. 2 is a block diagram illustrating an example of a data center system according to another embodiment. Referring to FIG. 2, the data center includes a data center room 200, the data center room 200 containing one or more data center units, such as data center unit 101. Data center room 200 includes an indoor liquid supply line 211 coupled to one end of secondary loop 107 of heat exchanger 105 and an indoor liquid return line 212 coupled to the other end of secondary loop 107 of heat exchanger 105. The indoor liquid supply line 211 is coupled to a unit liquid supply line of each data center unit, for example, the unit liquid supply line 111 of the data center unit 101. The indoor liquid return line 212 is coupled to a unit liquid return line of each data center unit, for example, the unit liquid return line 112 of the data center unit 101.

According to one embodiment, a heat reuse unit (also referred to as a heat recovery unit) 201 is coupled to the indoor liquid return line 212. The heat reuse unit 201 includes therein a device similar to a heat exchanger to exchange heat flowing through the indoor liquid return line 212 (e.g., a primary loop) through a pair of heat reuse supply lines 221 and heat reuse return lines 222 (e.g., secondary loops or heat exchange channels) using a second external heat exchange material (e.g., in the form of air or liquid). The heat extracted from the indoor liquid return line 212 may be used for other purposes, such as, for example, heating water of a building or heating a space of a room, etc. The cooling liquid carrying the heat exchanged from the immersion tank 101 first flows through the heat reuse unit 201 and then returns to the heat exchanger 105 of the cooling unit 102.

In one embodiment, one or more liquid pumps (e.g., liquid pump 203) may be disposed on the indoor liquid supply line 211 and/or the indoor liquid return line 212. The liquid pump 203 is configured to pump the cooling liquid from the heat exchanger 105 to the data center unit 101. According to another embodiment, a Flow Control Device (FCD)202 is disposed on the indoor liquid return line 212 between the heat exchanger 105 and the heat reuse unit 201. When FCD 202 is activated, FCD 202 is configured to divert or reroute at least a portion of the cooling liquid from indoor liquid return line 212 to indoor liquid supply line 211 via bypass path 230.

FCD 202 may be a three-way valve and may be configured in a first switch position and a second switch position. The FCD 202 may also be a two-way valve installed on the pipeline 230. When FCD 202 is configured in the first switch position, cooling fluid is allowed to flow through indoor fluid return line 212 to reach heat exchanger 105 from immersion tank 101. When the FCD 202 is configured in the second switch position, the bypass path 230 is open or open and coolant flows through the bypass path 230 to the indoor liquid supply line 211, bypassing the heat exchanger 105. In one embodiment, a temperature sensor may be disposed on the indoor liquid return line 212 (not shown), for example, between the FCD 202 and the thermal reuse unit 201, to sense and monitor the temperature of the cooling liquid flowing within the indoor liquid return line 212 or 230. When the temperature of the coolant drops below a predetermined threshold, the FCD 202 and the bypass path 230 are activated. The basic principle behind this is that when the temperature of the coolant is low, it is not necessary to send the coolant to the heat exchanger 105 for heat exchange. The cooling liquid may be directly recirculated back to the indoor liquid supply line 211.

It should be noted that each data center unit may contain multiple dip tanks, as shown in FIG. 3. Referring now to FIG. 3, in this example, the data center unit 101 includes a plurality of immersion tanks 103A-103D (collectively referred to as immersion tanks 103) and a unit return manifold 112 (also referred to as a unit liquid return line) coupled to a unit supply manifold 111 (also referred to as a unit liquid supply line). The unit liquid supply manifold 111 is configured to receive the cooling liquid from the indoor liquid supply line 211 and distribute the cooling liquid to the immersion tank 103. The unit liquid return manifold 112 is configured to receive cooling liquid carrying heat exchanged from the immersion tank 103 and return to the indoor liquid return line 212.

For each immersion tank 103, a tank liquid supply line (e.g., liquid supply lines 301A-301D, collectively referred to as tank liquid supply lines 301) is coupled to the unit liquid supply manifold 111 to deliver the cooling liquid to the respective immersion tank. Similarly, tank liquid return lines (e.g., liquid return lines 302A-302D, collectively referred to as liquid return lines 302) are coupled to unit liquid return manifold 212 to receive and return cooling liquid from respective immersion tanks to unit liquid return manifold 212. In addition, local pumps, such as pumps 115A-115D, may be utilized to pump the cooling fluid from the immersion tank 103 to the unit fluid return manifold 112. Alternatively, a local pump may be provided on the unit liquid supply manifold 111 and/or the unit liquid return manifold 112.

FIG. 4 is a block diagram illustrating a data center immersion cooling system according to another embodiment. Referring to fig. 4, in this embodiment, an additional FCD240 is provided on the indoor liquid return line 212 to divert or reroute at least a portion of the cooling liquid to the thermal reuse unit 201 via path 213. Thus, the flow of liquid through path 212, path 213, or both may be controlled. That is, when the heat recovery system 201 does not meet the heat recovery system requirements or the heat recovery system is being serviced, or any other situation where the immersion cooling fluid is not required to pass through the heat recovery unit 201, the heat recovery unit 201 may be deactivated by the FCD240 closing the path 213. For example, if the liquid temperature at the output of the thermal reuse unit 201 (between the FCD 202 and the thermal reuse unit 201) is above a predetermined threshold, this means that the heat has not been successfully recovered or reused. Therefore, there is no need to activate the heat reuse unit 201, and the coolant flow should flow to the heat exchanger 105 through the path 212 without passing through the heat reuse unit 201. Similar to the configuration shown in FIG. 3, each data center unit may contain multiple dip tanks, as shown in FIG. 5.

In the foregoing specification, embodiments of the disclosure have been described with reference to specific exemplary embodiments thereof. It will be evident that various modifications may be made thereto without departing from the broader spirit and scope of the disclosure as set forth in the following claims. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.