阅读说明：本技术 一种新型通讯天线散热器 (Novel communication antenna radiator ) 是由 董桂馥 王通 陈泽宇 杨浩 于 2019-10-18 设计创作，主要内容包括：一种新型通讯天线散热器,属于天线领域。包括主体、MIMO芯片和散热片；所述主体顶面安装有MIMO芯片,主体的侧面包括对称设置的端面A和对称设置的端面B,相邻的端面A和端面B之间设有端面C,端面A插接有多个呈竖直方向的散热片,端面B和端面C均设有多个凹槽A,相邻凹槽A间为呈水平方向的片状凸台A,主体底面也设有多个凹槽B,凹槽B间为呈水平方向的片状凸台B,主体的侧面还安装有支撑架,主体和散热片覆有散热膜。本发明材料简单、更换周期长、体积小,散热效率高,采用多层立体铺层设计来散热,大大提高散热效率。(A novel communication antenna radiator belongs to the field of antennas. The MIMO chip comprises a main body, an MIMO chip and a radiating fin; the MIMO chip is installed to the main part top surface, the side of main part is including the terminal surface A that the symmetry set up and the terminal surface B that the symmetry set up, be equipped with terminal surface C between adjacent terminal surface A and the terminal surface B, terminal surface A pegs graft and has a plurality of fin that are vertical direction, terminal surface B and terminal surface C all are equipped with a plurality of recess A, for the slice boss A that is the horizontal direction between adjacent recess A, the main part bottom surface also is equipped with a plurality of recess B, for the slice boss B that is the horizontal direction between recess B, the support frame is still installed to the side of main part, main part and fin cover have the heat dissipation membrane. The invention has simple material, long replacement period, small volume and high heat dissipation efficiency, and adopts the design of multilayer three-dimensional paving layers to dissipate heat, thereby greatly improving the heat dissipation efficiency.)

1. A novel communication antenna radiator is characterized by comprising a main body, an MIMO chip (5) and radiating fins (8); MIMO chip (5) is installed to the main part top surface, terminal surface A (2) that the side of main part set up including the symmetry and terminal surface B (3) that the symmetry set up, be equipped with terminal surface C (4) between adjacent terminal surface A (2) and terminal surface B (3), terminal surface A (2) are pegged graft and are had a plurality of fin (8) that are vertical direction, terminal surface B (3) and terminal surface C (4) all are equipped with a plurality of recess A, for the slice boss A that is the horizontal direction between adjacent recess A, main part bottom surface (1) also is equipped with a plurality of recess B, for the slice boss B that is the horizontal direction between recess B, support frame (6) are still installed to the side of main part, main part and fin (8) cover have the cooling film.

2. The novel communication antenna radiator according to claim 1, wherein the MIMO chips (5) are arranged in a 4X8 lattice, and the MIMO chips (5) are soldered to the main body.

3. The novel communication antenna radiator according to claim 1, wherein the end face a (2) is provided with a placement groove for placing the heat sink (8), the end face of the placement groove is provided with a semicircular slot for inserting the heat sink (8), a gap after the heat sink (8) is inserted into the slot is filled with silicone heat conduction gel, and the outer end face of the heat sink (8) and the end face a (2) are located on the same plane.

4. The novel communication antenna radiator according to claim 1, wherein the end surface C (4) is a curved surface structure.

5. The novel communication antenna radiator according to claim 1, wherein the support frame (6) is a copper tube, the support frame (6) is provided with a plurality of grooves C connected with the sheet-shaped bosses A, and the support frame (6) is connected with the main body through screws.

6. The novel communication antenna radiator of claim 1, wherein the main body is a carbon fiber layer-by-layer stack.

7. A novel radiator for communication antennas according to claim 1, characterized in that said fins (8) are made of copper alloy.

8. The novel communication antenna radiator according to claim 1, wherein the heat dissipation film is a nano-carbon heat dissipation film, and a sunscreen, antirust and temperature-reducing coating is coated on the outside of the heat dissipation film; the thickness of the nano carbon heat dissipation film is 0.03mm-0.1 mm.

9. The novel communication antenna radiator according to claim 1, characterized in that the main body is provided with a threaded hole (7) for mounting and fixing.

Technical Field

The invention relates to the field of antennas, in particular to a novel communication antenna radiator.

Background

Under the background of rapid development in the fields of big data, artificial intelligence, internet of things, unmanned driving and the like, a communication system gradually transitions to a fifth-generation mobile communication technology; with the increasing demand for mobile data and the development of mobile internet, more and more devices need to be accessed into a mobile network, and new services and applications are emerging, so that 5G mobile communication technology comes up, and the performance target of 5G is high data rate, delay reduction, energy saving, cost reduction, system capacity improvement and large-scale device connection, in order to implement the above functions, the core technology of 5G is MIMO technology, which refers to using Multiple transmitting antennas and receiving antennas at a transmitting end and a receiving end, so that signals are transmitted and received through Multiple antennas at the transmitting end and the receiving end, thereby improving communication quality, making full use of space resources, implementing Multiple transmission and Multiple reception through Multiple antennas, and doubly improving system channel capacity without increasing spectrum resources and antenna transmission power, show obvious advantages; generally, a common base station needs to be equipped with 3-plane antennas, a 4G base station needs to be equipped with 2 × 2 planes (i.e. 2 receiving antennas and 2 transmitting antennas), and as 4G continues to evolve to 4.5G and 5G falls to the ground in the future, the large-scale application of masivemimo base stations (128, 256 or more antennas) will promote the number of base station antennas to grow explosively, so that one of the serious challenge problems for 5G Massive MIMO antenna engineering application is the heat dissipation problem; meanwhile, communication base station equipment is developed towards the directions of high capacity, high power and high integration degree, the heat consumption density of a system is increased, the requirement on environmental adaptability is increased, the volume is reduced, and the thermal reliability becomes the bottleneck of reliability design gradually, so that the ventilation and heat dissipation problems of the equipment are solved while the outdoor base station is waterproof and dustproof, and the ventilation and heat dissipation problems become an important subject in the design of an outdoor base station structure system; the heat dissipation problem not only relates to the design problem of the heat dissipation fins, but also is a more important problem of the selection of the heat dissipation fin material, the heat dissipation fins mainly conduct heat energy, the heat dissipation fins have good heat dissipation capacity to enable the machine to keep smooth operation, and meanwhile, redundant heat energy needs to be diffused out, so the material of the heat dissipation fins is particularly important.

Disclosure of Invention

The invention provides a novel communication antenna radiator, aiming at solving the problem that the existing radiator can not meet the radiating requirement of a communication antenna.

In order to achieve the purpose, the invention adopts the technical scheme that: a novel communication antenna radiator comprises a main body, an MIMO chip and radiating fins; the MIMO chip is installed to the main part top surface, the side of main part is including the terminal surface A that the symmetry set up and the terminal surface B that the symmetry set up, be equipped with terminal surface C between adjacent terminal surface A and the terminal surface B, terminal surface A pegs graft and has a plurality of fin that are vertical direction, terminal surface B and terminal surface C all are equipped with a plurality of recess A, for the slice boss A that is the horizontal direction between adjacent recess A, the main part bottom surface also is equipped with a plurality of recess B, for the slice boss B that is the horizontal direction between recess B, the support frame is still installed to the side of main part, main part and fin cover have the heat dissipation membrane.

Furthermore, the MIMO chips are arranged in a 4X8 lattice, and the MIMO chips are connected with the main body in a soldering mode.

Furthermore, the end face A is provided with a placing groove for placing a radiating fin, the end face of the placing groove is provided with a semicircular slot for inserting the radiating fin, a gap formed after the radiating fin is inserted into the slot is filled with organic silicon heat conduction gel, and the outer end face of the radiating fin and the end face A are located on the same plane.

Further, the end face C is a curved surface structure.

Furthermore, the support frame is a copper pipe, a plurality of grooves C connected with the sheet bosses A are formed in the support frame, and the support frame is connected with the main body through screws.

Further, the main body is formed by stacking carbon fibers layer by layer.

Further, the heat radiating fins are made of copper alloy.

Furthermore, the heat dissipation film is a nano-carbon heat dissipation film, and a sun-proof antirust cooling coating is coated outside the heat dissipation film; the thickness of the nano carbon heat dissipation film is 0.03mm-0.1 mm.

Furthermore, the main body is provided with a threaded hole for mounting and fixing.

The invention has the beneficial effects that: the material is simple, the replacement cycle is long, small, and the radiating efficiency is high, adopts the design of multilayer solid shop layer to dispel the heat, improves the radiating efficiency greatly.

Drawings

FIG. 1 is a schematic structural diagram A of the present invention;

FIG. 2 is a schematic structural diagram B of the present invention;

FIG. 3 is a schematic structural diagram C of the present invention;

FIG. 4 is a side view of the present invention;

FIG. 5 is a top view of the present invention;

FIG. 6 is a schematic structural view of the connecting end of the heat sink and the socket according to the present invention;

FIG. 7 is a schematic view of a threaded hole of the present invention;

FIG. 8 is a schematic thermal analysis diagram A of the present invention;

FIG. 9 is a schematic diagram B of a thermal analysis according to the present invention.

In the figure, 1 is a bottom surface, 2 is an end surface A, 3 is an end surface B, 4 is an end surface C, 5 is an MIMO chip, 6 is a support frame, 7 is a threaded hole, and 8 is a radiating fin.

Detailed Description

A novel communication antenna radiator comprises a main body, an MIMO chip 5 and radiating fins 8; the MIMO chip 5 is mounted on the top surface of the main body, the side surface of the main body comprises a symmetrically arranged end surface A2 and a symmetrically arranged end surface B3, an end surface C4 is arranged between the adjacent end surface A2 and the end surface B3, a plurality of radiating fins 8 in the vertical direction are inserted into the end surface A2, a plurality of grooves A are formed in the end surface B3 and the end surface C4, a sheet-shaped boss A in the horizontal direction is arranged between the adjacent grooves A, a plurality of grooves B are also arranged on the bottom surface 1 of the main body, a sheet-shaped boss B in the horizontal direction is arranged between the grooves B, a support frame 6 is further mounted on the side surface of the main body, and radiating films; the main part and the radiating fins 8 mainly radiate heat, the radiating fins 8 are arranged in the vertical direction, and the flaky bosses A are arranged in the horizontal direction to increase the flow area of air, so that the radiating effect is enhanced.

The end face a2 is provided with a placing groove for placing the heat sink 8, the end face of the placing groove is provided with a semicircular slot for inserting the heat sink 8, a gap after the heat sink 8 is inserted into the slot is filled with organic silicon heat-conducting gel for bonding and fixing, the outer end face of the heat sink 8 and the end face a2 are located on the same plane, and one end of the heat sink 8 inserted into the slot is shown in fig. 6; the organic silicon heat-conducting gel can realize high-efficiency heat dissipation of the chip set, has excellent wettability, can ensure low contact resistance to realize heat management, can be processed in various modes, and has low viscosity and good wettability.

The MIMO chip 5 is arranged in a 4X8 lattice, so that the 32 array elements are subjected to range heat dissipation, the effect of rapidly reducing the temperature is achieved, and the MIMO chip 5 is connected with the main body in a soldering mode.

The end face C4 is a curved surface structure.

The support frame 6 is the copper pipe, is equipped with a plurality of recess C of being connected with slice boss A on the support frame 6, and support frame 6 passes through the screw and links to each other with the main part, and support frame 6 plays the effect fixed to the carbon fiber main part.

The main part is the carbon fiber successive layer stack, and the carbon fiber adopts closed die forging's technology to carry out the shaping, and concrete shaping step is: layering, closing a film, injecting a film and demoulding; compared with ABS, glass fiber reinforced plastic and other materials, the carbon fiber has a plurality of excellent performances such as high strength, high modulus, high temperature resistance, wear resistance, fatigue resistance, corrosion resistance, creep resistance, electric conduction, heat conduction and the like, can reduce the weight of a component, and has a plurality of excellent performances which are incomparable with metal, PTC and other electric heating bodies: the electrothermal material has the advantages of rapid temperature rise, high electrothermal conversion efficiency, electric energy saving, stable chemical performance, corrosion resistance, difficult oxidation, no change of mechanical properties when heated to 3000 ℃ in an oxygen-free state, overcoming the defects of low strength and easy oxidation and burning of metal wires, PTC and silicon carbide electrothermal bodies in an electrothermal state, and having long service life.

The heat radiating fin 8 is made of copper alloy, preferably molybdenum-copper alloy, and is formed by injection molding, and the specific process steps are as follows: the W-Cu alloy radiating fin is obtained by determining the components of the alloy, weighing the W powder and the Cu powder, and performing mechanical mixing, ball milling, injection molding and sintering, and has excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance, the thermal conductivity coefficient of 524W/mk, simple processing and universality.

The heat dissipation film adopts a nano-carbon heat dissipation film for efficient heat dissipation, and a sun-proof antirust cooling coating is coated outside the heat dissipation film, so that the heat dissipation efficiency is increased; the thickness of the nano carbon heat dissipation film is 0.03mm-0.1 mm; the nano carbon heat dissipation film is produced by adopting a fused salt electrodeposition method, large-scale equipment and precious materials are not needed, the cost is low, the operation is simple, no dangerous gas is needed in the process, no harmful substance is generated, the environment is protected, and the prepared heat dissipation film is pure, single and uniformly distributed on the surface of the substrate; the heat dissipation film has unique crystal grain orientation, conducts heat uniformly along two directions, the lamellar structure can be well adapted to any surface, the performance of an electronic product is improved while a heat source and a component are shielded, in addition, the nano-carbon heat dissipation film has excellent heat conduction performance, light specific gravity, low heat resistance, flexibility, easy cutting (repeated bending), ultrathin property, and the surface can be combined with other materials such as metal, plastic, adhesive sticker, and the like, more importantly, the cost of the nano-carbon heat dissipation film is not high, the price of the nano-carbon heat dissipation film is far lower than that of artificial graphite in the market, and even the price of the nano-carbon heat dissipation film is lower than that of some natural graphite; the sun-proof antirust cooling coating adopts td2200, and plays a role in protection.

The main body is provided with a threaded hole 7 for mounting and fixing the present embodiment to other members.

The dimensions of the present example are: length is below 68mm, width is below 40mm, height is below 30 mm; the anti-overvoltage protection circuit has the advantages of good electromagnetic compatibility, overvoltage protection, good signal coverage, relatively low technical requirement, energy consumption saving, cost saving, simple material, long equipment replacement period and the like for terminal equipment.

This example was also subjected to thermal analysis by Ansys as shown in fig. 8 and 9, and the model of this example was established and the thermal conductivity of each material was input: carbon fiber: 700w/mk, copper tube: 377w/mk, silicone thermal conductive gel: 0.95w/mk, molybdenum-copper alloy heat sink: 218w/mk, nanocarbon heat dissipation film: 1000-6000 w/mk, the highest temperature of the present embodiment is 214.11 degrees centigrade, and the lowest temperature is 148.58 degrees centigrade under the normal temperature environment, so that the heat dissipation requirement of the MIMO chip 5 is met.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.